NL7204575A - - Google Patents

Info

Publication number
NL7204575A
NL7204575A NL7204575A NL7204575A NL7204575A NL 7204575 A NL7204575 A NL 7204575A NL 7204575 A NL7204575 A NL 7204575A NL 7204575 A NL7204575 A NL 7204575A NL 7204575 A NL7204575 A NL 7204575A
Authority
NL
Netherlands
Application number
NL7204575A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL7204575A priority Critical patent/NL7204575A/xx
Priority to DE19732313327 priority patent/DE2313327A1/de
Priority to CA167,674A priority patent/CA987788A/en
Priority to JP3749173A priority patent/JPS5113994B2/ja
Priority to IT6795373A priority patent/IT980751B/it
Priority to CH475573A priority patent/CH554599A/xx
Priority to GB1590573A priority patent/GB1423868A/en
Priority to FR7312124A priority patent/FR2179104B1/fr
Publication of NL7204575A publication Critical patent/NL7204575A/xx
Priority to HK4177A priority patent/HK4177A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
NL7204575A 1972-04-06 1972-04-06 NL7204575A (fr)

Priority Applications (9)

Application Number Priority Date Filing Date Title
NL7204575A NL7204575A (fr) 1972-04-06 1972-04-06
DE19732313327 DE2313327A1 (de) 1972-04-06 1973-03-17 Verfahren zum befestigen einer mit leiterspuren versehenen isolierenden folie an stromleitern auf einem substrat
CA167,674A CA987788A (en) 1972-04-06 1973-04-02 Method of securing an insulating foil comprising conductor tracks to current conductors on a substrate
JP3749173A JPS5113994B2 (fr) 1972-04-06 1973-04-03
IT6795373A IT980751B (it) 1972-04-06 1973-04-03 Procedimento per collegare una fo glietta isolante comprendente pi ste conduttrici ai conduttori di corrente su un substrato
CH475573A CH554599A (de) 1972-04-06 1973-04-03 Verfahren zum befestigen einer mit leiterspuren versehenen isolierenden folie an stromleitern auf einem substrat.
GB1590573A GB1423868A (en) 1972-04-06 1973-04-03 Forming electrically-conductive solder-connections between current-conductors on a substrate and conductor-tracks of an insulating flexible foil
FR7312124A FR2179104B1 (fr) 1972-04-06 1973-04-04
HK4177A HK4177A (en) 1972-04-06 1977-01-20 Improvements in and relating to forming electrically-conductive solder-connections between current-conductors on a substrate and conductor-tracks of an insulating flexible foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7204575A NL7204575A (fr) 1972-04-06 1972-04-06

Publications (1)

Publication Number Publication Date
NL7204575A true NL7204575A (fr) 1973-10-09

Family

ID=19815787

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7204575A NL7204575A (fr) 1972-04-06 1972-04-06

Country Status (9)

Country Link
JP (1) JPS5113994B2 (fr)
CA (1) CA987788A (fr)
CH (1) CH554599A (fr)
DE (1) DE2313327A1 (fr)
FR (1) FR2179104B1 (fr)
GB (1) GB1423868A (fr)
HK (1) HK4177A (fr)
IT (1) IT980751B (fr)
NL (1) NL7204575A (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156235A (en) * 1976-06-21 1977-12-26 Hitachi Ltd Transistor ignitor
JPS53101268U (fr) * 1977-01-20 1978-08-16
CN107623993B (zh) * 2017-10-31 2020-06-23 Oppo广东移动通信有限公司 一种电路板、电路板制作方法、电子设备及其装配方法
DE102019131950A1 (de) * 2019-11-26 2021-05-27 Landulf Martin Skoda Lötpad und Verfahren zum Löten

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3474297A (en) * 1967-06-30 1969-10-21 Texas Instruments Inc Interconnection system for complex semiconductor arrays

Also Published As

Publication number Publication date
GB1423868A (en) 1976-02-04
DE2313327A1 (de) 1973-10-18
CH554599A (de) 1974-09-30
JPS4917970A (fr) 1974-02-16
HK4177A (en) 1977-01-28
JPS5113994B2 (fr) 1976-05-06
CA987788A (en) 1976-04-20
FR2179104A1 (fr) 1973-11-16
IT980751B (it) 1974-10-10
FR2179104B1 (fr) 1977-12-30

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