NL7113968A - - Google Patents

Info

Publication number
NL7113968A
NL7113968A NL7113968A NL7113968A NL7113968A NL 7113968 A NL7113968 A NL 7113968A NL 7113968 A NL7113968 A NL 7113968A NL 7113968 A NL7113968 A NL 7113968A NL 7113968 A NL7113968 A NL 7113968A
Authority
NL
Netherlands
Application number
NL7113968A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7113968A publication Critical patent/NL7113968A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Packaging Frangible Articles (AREA)
NL7113968A 1970-10-22 1971-10-12 NL7113968A (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US8287270A 1970-10-22 1970-10-22

Publications (1)

Publication Number Publication Date
NL7113968A true NL7113968A (https=) 1972-04-25

Family

ID=22173983

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7113968A NL7113968A (https=) 1970-10-22 1971-10-12

Country Status (7)

Country Link
US (1) US3691289A (https=)
JP (1) JPS5116257B1 (https=)
CA (1) CA939830A (https=)
FR (1) FR2111767B1 (https=)
GB (1) GB1341454A (https=)
IT (1) IT939645B (https=)
NL (1) NL7113968A (https=)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3930115A (en) * 1971-05-19 1975-12-30 Philips Corp Electric component assembly comprising insulating foil bearing conductor tracks
US3766639A (en) * 1972-01-20 1973-10-23 Us Air Force Method for testing electronic circuits using variable liquid dielectric constant testing media
US3919602A (en) * 1972-03-23 1975-11-11 Bosch Gmbh Robert Electric circuit arrangement and method of making the same
US3936928A (en) * 1973-10-04 1976-02-10 Motorola, Inc. Method for providing mounting assemblies for a plurality of transistor integrated circuit chips
US4005288A (en) * 1975-09-19 1977-01-25 Honeywell Inc. Photodetector mounting and connecting
US4142203A (en) * 1976-12-20 1979-02-27 Avx Corporation Method of assembling a hermetically sealed semiconductor unit
US4147889A (en) * 1978-02-28 1979-04-03 Amp Incorporated Chip carrier
US4246697A (en) * 1978-04-06 1981-01-27 Motorola, Inc. Method of manufacturing RF power semiconductor package
JPS6013078B2 (ja) * 1978-09-05 1985-04-04 日本特殊陶業株式会社 金メツキされた電子部品及びその製法
USRE34484E (en) * 1978-09-05 1993-12-21 Ngk Spark Plug Co., Ltd. Gold-plated electronic components
US4236777A (en) * 1979-07-27 1980-12-02 Amp Incorporated Integrated circuit package and manufacturing method
US4470507A (en) * 1980-03-24 1984-09-11 National Semiconductor Corporation Assembly tape for hermetic tape packaging semiconductor devices
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
GB2124433B (en) * 1982-07-07 1986-05-21 Int Standard Electric Corp Electronic component assembly
US4567545A (en) * 1983-05-18 1986-01-28 Mettler Rollin W Jun Integrated circuit module and method of making same
US4627533A (en) * 1984-10-29 1986-12-09 Hughes Aircraft Company Ceramic package for compensated crystal oscillator
DE3619636A1 (de) * 1986-06-11 1987-12-17 Bosch Gmbh Robert Gehaeuse fuer integrierte schaltkreise
WO1988006348A1 (en) * 1987-02-20 1988-08-25 Lsi Logic Corporation Integrated circuit package assembly
US4853826A (en) * 1988-08-01 1989-08-01 Rogers Corporation Low inductance decoupling capacitor
US5310055A (en) * 1990-08-21 1994-05-10 National Semiconductor Corporation Magazine and shipping tray for lead frames
US5177032A (en) * 1990-10-24 1993-01-05 Micron Technology, Inc. Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
US5140404A (en) * 1990-10-24 1992-08-18 Micron Technology, Inc. Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
US5419946A (en) * 1993-09-30 1995-05-30 Hitachi Chemical Co., Ltd. Adhesive for printed wiring board and production thereof
US5717163A (en) * 1994-12-02 1998-02-10 Wu; Conny Plastic material pouring device for forming electronic components
US5836454A (en) * 1996-01-17 1998-11-17 Micron Technology, Inc. Lead frame casing
JP2000239542A (ja) * 1999-02-18 2000-09-05 Matsushita Electric Ind Co Ltd 粉体組成物及びその製造方法、並びに、熱伝導基板及びその製造方法
US6373125B1 (en) 2000-02-23 2002-04-16 International Business Machines Corporation Chip scale package with direct attachment of chip to lead frame
US6675755B2 (en) * 2000-04-06 2004-01-13 Visteon Global Technologies, Inc. Integrated powertrain control system for large engines
DE10228593A1 (de) * 2002-06-26 2004-01-15 Infineon Technologies Ag Elektronisches Bauteil mit einer Gehäusepackung
US20060131616A1 (en) * 2004-12-21 2006-06-22 Devaney Douglas E Copperless flexible circuit
US20060262452A1 (en) * 2005-05-18 2006-11-23 Samsung Electronics Co., Ltd. Method of making hermetically sealed hard disk drive by encapulation

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4322387Y1 (https=) * 1968-02-22 1968-09-19

Also Published As

Publication number Publication date
CA939830A (en) 1974-01-08
IT939645B (it) 1973-02-10
DE2153015A1 (de) 1972-05-04
US3691289A (en) 1972-09-12
FR2111767A1 (https=) 1972-06-09
GB1341454A (en) 1973-12-19
JPS5116257B1 (https=) 1976-05-22
FR2111767B1 (https=) 1977-06-03
DE2153015B2 (de) 1976-12-30

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