NL7007353A - - Google Patents
Info
- Publication number
- NL7007353A NL7007353A NL7007353A NL7007353A NL7007353A NL 7007353 A NL7007353 A NL 7007353A NL 7007353 A NL7007353 A NL 7007353A NL 7007353 A NL7007353 A NL 7007353A NL 7007353 A NL7007353 A NL 7007353A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacture Of Motors, Generators (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US82721569A | 1969-05-23 | 1969-05-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7007353A true NL7007353A (https=) | 1970-11-25 |
Family
ID=25248604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7007353A NL7007353A (https=) | 1969-05-23 | 1970-05-21 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3647585A (https=) |
| BE (1) | BE750564A (https=) |
| DE (1) | DE2024494B2 (https=) |
| ES (1) | ES380665A1 (https=) |
| FR (1) | FR2044816B1 (https=) |
| GB (1) | GB1308477A (https=) |
| NL (1) | NL7007353A (https=) |
| SE (1) | SE353439B (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3850710A (en) * | 1972-11-06 | 1974-11-26 | Rca Corp | Method of making a quasi-monolithic integrated circuit structure |
| US4026759A (en) * | 1975-12-11 | 1977-05-31 | International Business Machines Corporation | Method of making ingrown lead frame with strain relief |
| NL7608901A (nl) * | 1976-08-11 | 1978-02-14 | Philips Nv | Werkwijze ter vervaardiging van een halfge- leiderinrichting en halfgeleiderinrichting vervaardigd door middel van een dergelijke werkwijze. |
| US4106050A (en) * | 1976-09-02 | 1978-08-08 | International Business Machines Corporation | Integrated circuit structure with fully enclosed air isolation |
| NL181611C (nl) * | 1978-11-14 | 1987-09-16 | Philips Nv | Werkwijze ter vervaardiging van een bedradingssysteem, alsmede een halfgeleiderinrichting voorzien van een dergelijk bedradingssysteem. |
| ATE5115T1 (de) * | 1980-04-17 | 1983-11-15 | The Post Office | Gold-metallisierung in halbleiteranordnungen. |
| IT1184723B (it) * | 1985-01-28 | 1987-10-28 | Telettra Lab Telefon | Transistore mesfet con strato d'aria tra le connessioni dell'elettrodo di gate al supporto e relativo procedimento difabbricazione |
| US4847445A (en) * | 1985-02-01 | 1989-07-11 | Tektronix, Inc. | Zirconium thin-film metal conductor systems |
| JPS61188997A (ja) * | 1985-02-18 | 1986-08-22 | オ−ケ−プリント配線株式会社 | プリント配線基板およびその製造方法 |
| US4751349A (en) * | 1986-10-16 | 1988-06-14 | International Business Machines Corporation | Zirconium as an adhesion material in a multi-layer metallic structure |
| JPH02220464A (ja) * | 1989-02-22 | 1990-09-03 | Toshiba Corp | 半導体装置及びその製造方法 |
| US4920639A (en) * | 1989-08-04 | 1990-05-01 | Microelectronics And Computer Technology Corporation | Method of making a multilevel electrical airbridge interconnect |
| JP2856778B2 (ja) * | 1989-09-07 | 1999-02-10 | 株式会社東芝 | 半導体装置の配線構造 |
| JP2516314Y2 (ja) * | 1990-10-15 | 1996-11-06 | 日本シイエムケイ株式会社 | 電磁波シールドプリント配線板 |
| US5181874A (en) * | 1991-03-26 | 1993-01-26 | Hughes Aircraft Company | Method of making microelectronic field emission device with air bridge anode |
| US5324683A (en) * | 1993-06-02 | 1994-06-28 | Motorola, Inc. | Method of forming a semiconductor structure having an air region |
| US5976917A (en) | 1998-01-29 | 1999-11-02 | Micron Technology, Inc. | Integrated circuitry fuse forming methods, integrated circuitry programming methods, and related integrated circuitry |
| US6521970B1 (en) * | 2000-09-01 | 2003-02-18 | National Semiconductor Corporation | Chip scale package with compliant leads |
| US7696089B1 (en) * | 2004-05-11 | 2010-04-13 | Johnson Research & Development Co., Inc. | Passivated thin film and method of producing same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1333007A (fr) * | 1962-02-16 | 1963-07-19 | Intermetall | Procédé de fabrication de transistors à haute fréquence et transistors conformesà ceux ainsi obtenus |
| NL134170C (https=) * | 1963-12-17 | 1900-01-01 | ||
| FR1535233A (fr) * | 1966-11-02 | 1968-08-02 | Western Electric Co | Procédé pour former deux couches conductrices rapprochées sans court-circuit par piqûres |
-
1969
- 1969-05-23 US US827215A patent/US3647585A/en not_active Expired - Lifetime
-
1970
- 1970-05-14 SE SE06627/70A patent/SE353439B/xx unknown
- 1970-05-19 BE BE750564D patent/BE750564A/xx unknown
- 1970-05-20 DE DE19702024494 patent/DE2024494B2/de active Pending
- 1970-05-21 ES ES380665A patent/ES380665A1/es not_active Expired
- 1970-05-21 NL NL7007353A patent/NL7007353A/xx unknown
- 1970-05-21 GB GB2456370A patent/GB1308477A/en not_active Expired
- 1970-05-22 FR FR7018840A patent/FR2044816B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2044816B1 (https=) | 1973-11-16 |
| FR2044816A1 (https=) | 1971-02-26 |
| DE2024494A1 (de) | 1970-12-10 |
| SE353439B (https=) | 1973-01-29 |
| DE2024494B2 (de) | 1971-08-15 |
| GB1308477A (en) | 1973-02-21 |
| ES380665A1 (es) | 1972-10-16 |
| US3647585A (en) | 1972-03-07 |
| BE750564A (fr) | 1970-11-03 |