NL59854C - - Google Patents

Info

Publication number
NL59854C
NL59854C NL59854DA NL59854C NL 59854 C NL59854 C NL 59854C NL 59854D A NL59854D A NL 59854DA NL 59854 C NL59854 C NL 59854C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL59854C publication Critical patent/NL59854C/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Rectifiers (AREA)
NL59854D 1940-07-03 NL59854C (US06534493-20030318-C00166.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL223414X 1940-07-03

Publications (1)

Publication Number Publication Date
NL59854C true NL59854C (US06534493-20030318-C00166.png)

Family

ID=19779494

Family Applications (1)

Application Number Title Priority Date Filing Date
NL59854D NL59854C (US06534493-20030318-C00166.png) 1940-07-03

Country Status (4)

Country Link
BE (1) BE442015A (US06534493-20030318-C00166.png)
CH (1) CH223414A (US06534493-20030318-C00166.png)
FR (1) FR873526A (US06534493-20030318-C00166.png)
NL (1) NL59854C (US06534493-20030318-C00166.png)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1067783A (fr) * 1951-12-18 1954-06-18 Int Standard Electric Corp Surface redresseuse comportant du silicium ou du germanium
JPS5393781A (en) * 1977-01-27 1978-08-17 Toshiba Corp Semiconductor device

Also Published As

Publication number Publication date
FR873526A (fr) 1942-07-10
BE442015A (US06534493-20030318-C00166.png)
CH223414A (de) 1942-09-15

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