NL292051A - - Google Patents

Info

Publication number
NL292051A
NL292051A NL292051DA NL292051A NL 292051 A NL292051 A NL 292051A NL 292051D A NL292051D A NL 292051DA NL 292051 A NL292051 A NL 292051A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL292051A publication Critical patent/NL292051A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8114—Guiding structures outside the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/81385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Products (AREA)
  • Die Bonding (AREA)
NL292051D 1962-04-27 NL292051A (US07754670-20100713-C00008.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB16085/62A GB988075A (en) 1962-04-27 1962-04-27 Improvements relating to semiconductor circuit assemblies

Publications (1)

Publication Number Publication Date
NL292051A true NL292051A (US07754670-20100713-C00008.png)

Family

ID=10070909

Family Applications (2)

Application Number Title Priority Date Filing Date
NL292051D NL292051A (US07754670-20100713-C00008.png) 1962-04-27
NL63292051A NL142281B (nl) 1962-04-27 1963-04-26 Samengestelde halfgeleiderinrichting en werkwijze voor het vervaardigen daarvan.

Family Applications After (1)

Application Number Title Priority Date Filing Date
NL63292051A NL142281B (nl) 1962-04-27 1963-04-26 Samengestelde halfgeleiderinrichting en werkwijze voor het vervaardigen daarvan.

Country Status (4)

Country Link
US (1) US3379937A (US07754670-20100713-C00008.png)
CA (1) CA980913A (US07754670-20100713-C00008.png)
GB (1) GB988075A (US07754670-20100713-C00008.png)
NL (2) NL142281B (US07754670-20100713-C00008.png)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3302067A (en) * 1967-01-31 Modular circuit package utilizing solder coated
US3388301A (en) * 1964-12-09 1968-06-11 Signetics Corp Multichip integrated circuit assembly with interconnection structure
US3444381A (en) * 1967-05-22 1969-05-13 Hughes Aircraft Co Silicon photodiode having folded electrode to increase light path length in body of diode
US3521128A (en) * 1967-08-02 1970-07-21 Rca Corp Microminiature electrical component having integral indexing means
GB1167840A (en) * 1967-09-12 1969-10-22 Bosch Gmbh Robert Improvements in Voltage Regulators for Generators.
US3902189A (en) * 1974-04-10 1975-08-26 Hunt Electronics Prefabricated article and methods of maintaining the orientation of parts being bonded thereto
US4565314A (en) * 1983-09-09 1986-01-21 At&T Bell Laboratories Registration and assembly of integrated circuit packages
US4940181A (en) * 1989-04-06 1990-07-10 Motorola, Inc. Pad grid array for receiving a solder bumped chip carrier
DE4004068A1 (de) * 1990-02-10 1991-08-14 Evgenius Stjepanovic Bugajec Verfahren zur montage von halbleiterkristallen
US5172303A (en) * 1990-11-23 1992-12-15 Motorola, Inc. Electronic component assembly
WO1993019487A1 (en) * 1992-03-24 1993-09-30 Unisys Corporation Integrated circuit module having microscopic self-alignment features
US5517752A (en) * 1992-05-13 1996-05-21 Fujitsu Limited Method of connecting a pressure-connector terminal of a device with a terminal electrode of a substrate
US6741085B1 (en) * 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US20020004320A1 (en) * 1995-05-26 2002-01-10 David V. Pedersen Attaratus for socketably receiving interconnection elements of an electronic component
KR0151300B1 (ko) * 1995-07-11 1998-10-15 구자홍 액정표시장치의 패드구조 및 그 제조방법
US6690185B1 (en) 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
US6040618A (en) 1997-03-06 2000-03-21 Micron Technology, Inc. Multi-chip module employing a carrier substrate with micromachined alignment structures and method of forming
AU8280398A (en) 1997-06-30 1999-01-19 Formfactor, Inc. Sockets for semiconductor devices with spring contact elements
US7215131B1 (en) 1999-06-07 2007-05-08 Formfactor, Inc. Segmented contactor
US10468363B2 (en) 2015-08-10 2019-11-05 X-Celeprint Limited Chiplets with connection posts
US11495560B2 (en) 2015-08-10 2022-11-08 X Display Company Technology Limited Chiplets with connection posts

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3148310A (en) * 1964-09-08 Methods of making same
US2570163A (en) * 1948-12-28 1951-10-02 Gen Electric Precision resistance and method of making it
US2557790A (en) * 1949-10-22 1951-06-19 Clarostat Mfg Co Inc Resistance strip
GB732437A (en) * 1951-10-03 1955-06-22 Technograph Printed Circuits L Electric circuit components
US2728835A (en) * 1955-01-17 1955-12-27 Electronics Corp America Radiation-sensitive resistor
BE559732A (US07754670-20100713-C00008.png) * 1956-10-31 1900-01-01
NL251302A (US07754670-20100713-C00008.png) * 1959-05-06
NL251301A (US07754670-20100713-C00008.png) * 1959-05-06 1900-01-01
US2981877A (en) * 1959-07-30 1961-04-25 Fairchild Semiconductor Semiconductor device-and-lead structure
US3119052A (en) * 1959-11-24 1964-01-21 Nippon Electric Co Enclosures for semi-conductor electronic elements
US3114867A (en) * 1960-09-21 1963-12-17 Rca Corp Unipolar transistors and assemblies therefor
NL132800C (US07754670-20100713-C00008.png) * 1960-11-16
US3134935A (en) * 1961-09-06 1964-05-26 Schauer Mfg Corp Semi-conductor device comprising two elongated spaced apart bus electrodes
US3202888A (en) * 1962-02-09 1965-08-24 Hughes Aircraft Co Micro-miniature semiconductor devices

Also Published As

Publication number Publication date
GB988075A (en) 1965-04-07
CA980913A (en) 1975-12-30
US3379937A (en) 1968-04-23
NL142281B (nl) 1974-05-15

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