NL269346A - - Google Patents
Info
- Publication number
- NL269346A NL269346A NL269346DA NL269346A NL 269346 A NL269346 A NL 269346A NL 269346D A NL269346D A NL 269346DA NL 269346 A NL269346 A NL 269346A
- Authority
- NL
- Netherlands
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/923—Physical dimension
- Y10S428/924—Composite
- Y10S428/926—Thickness of individual layer specified
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/931—Components of differing electric conductivity
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12681—Ga-, In-, Tl- or Group VA metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12896—Ag-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5717360A | 1960-09-20 | 1960-09-20 | |
| US131415A US3306784A (en) | 1960-09-20 | 1961-08-14 | Epitaxially bonded thermoelectric device and method of forming same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL269346A true NL269346A (US20080293856A1-20081127-C00150.png) |
Family
ID=26736157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL269346D NL269346A (US20080293856A1-20081127-C00150.png) | 1960-09-20 |
Country Status (5)
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3413156A (en) * | 1963-12-18 | 1968-11-26 | Gulf General Atomic Inc | Thermoelectric device |
| US3447233A (en) * | 1966-09-30 | 1969-06-03 | Webb James E | Bonding thermoelectric elements to nonmagnetic refractory metal electrodes |
| US3452423A (en) * | 1966-09-30 | 1969-07-01 | Webb James E | Segmenting lead telluride-silicon germanium thermoelements |
| GB1202199A (en) * | 1966-11-22 | 1970-08-12 | G V Planer Ltd | Improvements in or relating to thermoelectric devices |
| US3650844A (en) * | 1968-09-19 | 1972-03-21 | Gen Electric | Diffusion barriers for semiconductive thermoelectric generator elements |
| US3988171A (en) * | 1971-06-07 | 1976-10-26 | Rockwell International Corporation | Bonded electrical contact for thermoelectric semiconductor element |
| WO2010125411A1 (en) * | 2009-04-27 | 2010-11-04 | Szenergia Kft. | Procedure for producing a device containing metal and intermetallic semiconductor parts joined together with an electrically conductive and heat conducting connection, especially a rod suitable for use with thermoelectric modules |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2373117A (en) * | 1944-07-17 | 1945-04-10 | Bundy Tubing Co | Method of uniting metals |
| US2555001A (en) * | 1947-02-04 | 1951-05-29 | Bell Telephone Labor Inc | Bonded article and method of bonding |
| BE500302A (US20080293856A1-20081127-C00150.png) * | 1949-11-30 | |||
| BE506280A (US20080293856A1-20081127-C00150.png) * | 1950-10-10 | |||
| DE966906C (de) * | 1953-04-09 | 1957-09-19 | Siemens Ag | Verfahren zur sperrfreien Kontaktierung von Flaechengleichrichtern oder -transistoren mit einem eine p-n-Schichtung aufweisenden Halbleitereinkristall |
| DE1018558B (de) * | 1954-07-15 | 1957-10-31 | Siemens Ag | Verfahren zur Herstellung von Richtleitern, Transistoren u. dgl. aus einem Halbleiter |
| NL98125C (US20080293856A1-20081127-C00150.png) * | 1954-08-26 | 1900-01-01 | ||
| BE543673A (US20080293856A1-20081127-C00150.png) * | 1954-12-15 | |||
| BE547698A (US20080293856A1-20081127-C00150.png) * | 1955-05-10 | 1900-01-01 | ||
| BE558881A (US20080293856A1-20081127-C00150.png) * | 1956-07-06 | 1900-01-01 | ||
| US2997514A (en) * | 1958-03-11 | 1961-08-22 | Whirlpool Co | Refrigerating apparatus |
| US3000092A (en) * | 1959-12-10 | 1961-09-19 | Westinghouse Electric Corp | Method of bonding contact members to thermoelectric material bodies |
| US3037064A (en) * | 1960-12-12 | 1962-05-29 | Rca Corp | Method and materials for obtaining low resistance bonds to thermoelectric bodies |
| NL278359A (US20080293856A1-20081127-C00150.png) * | 1961-05-12 |
-
0
- NL NL269346D patent/NL269346A/xx unknown
-
1961
- 1961-08-14 US US131415A patent/US3306784A/en not_active Expired - Lifetime
- 1961-09-12 GB GB32773/61A patent/GB972368A/en not_active Expired
- 1961-09-19 DE DEG33160A patent/DE1262388B/de active Pending
- 1961-09-20 CH CH1091661A patent/CH411065A/de unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US3306784A (en) | 1967-02-28 |
| CH411065A (de) | 1966-04-15 |
| DE1262388B (de) | 1968-03-07 |
| GB972368A (en) | 1964-10-14 |
