NL2020572B1 - A device for material deposition and a method thereof - Google Patents

A device for material deposition and a method thereof Download PDF

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Publication number
NL2020572B1
NL2020572B1 NL2020572A NL2020572A NL2020572B1 NL 2020572 B1 NL2020572 B1 NL 2020572B1 NL 2020572 A NL2020572 A NL 2020572A NL 2020572 A NL2020572 A NL 2020572A NL 2020572 B1 NL2020572 B1 NL 2020572B1
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Netherlands
Prior art keywords
vessel
temperature
sight
connecting part
connection part
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NL2020572A
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Dutch (nl)
Inventor
Johannes Franciscus Diepens Petrus
Rudolf Zijlmans Wiro
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Smit Thermal Solutions B V
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Publication date
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Priority to NL2020572A priority Critical patent/NL2020572B1/en
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Publication of NL2020572B1 publication Critical patent/NL2020572B1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5873—Removal of material
    • C23C14/588—Removal of material by mechanical treatment

Abstract

1 1 Abstract A device for material deposition comprising a first vessel for processing a first object being at a first temperature at which a material in vapour phase exists in the first vessel. The device further comprises a second vessel provided with a second object, the 5 second object being at a second temperature. The second vessel is connected to the first vessel via a first connection part positioned between the first vessel and the second vessel and outside a fictitious line of sight between the first object and the second object. The device further comprises heat transport device for maintaining the second temperature at a value lower than a condensing temperature of the material. 10

Description

Field of the invention [0001] The invention relates to a device for material deposition, and more particularly, a device comprising a first vessel for processing a first object being at a first temperature at which a material in vapour phase exists in the first vessel.
Background of the invention [0002] When an apparatus, in particular an apparatus for physical vapor deposition or chemical reaction deposition, comprising a vessel (or muffle, chamber) for holding an object running a process at an elevated temperature, the vessel can be polluted with vapours. Vapour pressure inside the vessel increases over time due to a continuous source of vapour. The source can be the heated object. Due to this high vapour pressure, undesired condensation occurs at colder spots inside the vessel such as the colder vessel wall which is exposed to the vapour due to small leaks in the insulation of the vessel, or through porous insulation material, or due to elements which are mounted inside the vessel and are connected to a colder outer atmosphere or the vessel wall, resulting in a colder surface inside the vessel.
[0003] A conventional flush and exhaust system is not capable of reducing the vapour pressure sufficiently inside the vessel. There is therefore a need to provide a more efficient apparatus and method for reducing the vapour pressure in the vessel.
Summary of the invention [0004] According to a first aspect, the invention provides a device for material deposition comprising a first vessel for processing a first object being at a first temperature at which a material in vapour phase exists in the first vessel. The device further comprises a second vessel provided with a second object, the second object being at a second temperature. The second vessel is connected to the first vessel via a first connection part positioned between the first vessel and the second vessel and outside a fictitious line of sight between the first object and the second object. The device further comprises heat transport device for maintaining the second temperature at a value lower than a condensing temperature of the material.
[0005] In this arrangement, advantageously, at the second object the vapour material will condense and the (partial) vapour pressure inside the second vessel becomes lower than that of the first vessel. Thus a diffusion flow of vapour is generated between the fist vessel and the second vessel, and the vapour pressure in the first vessel can be reduced.
[0006] In an embodiment, the second vessel is provided with a cleaning element for removing a condensed material from the second object.
[0007] Advantageously, the second object is more effective in getting condensed material because as the material condense on the second object, the second object gets larger in size and becomes less effective.
[0008] In another embodiment, the second vessel is further connected to the first vessel via a second connection part positioned between the first vessel and the second vessel and outside the fictitious line of sight between the first object and the second object, wherein an end of the first connection part towards the second vessel is positioned higher than an end of the second connection part towards the second vessel, when the device is in an operating state.
[0009] Advantageously, the vapour pressure can be reduced more efficiently due to a flow between the connecting parts.
[0010] In yet another embodiment, the device further comprises a flow accelerator for directing a flow from the first vessel to the second vessel or/and a flow from the second vessel to the first vessel. In this way, the flow can be enhanced actively.
[0011] According to another aspect, the invention provides a method for decreasing a vapour pressure in a material deposition device comprising a first vessel for processing a first object; a second vessel provided with a second object; wherein the second vessel is connected to the first vessel via a first connection part positioned between the first vessel and the second vessel and outside a fictitious line of sight between the first object and the second object; setting the first object at a first temperature at which a material in vapour phase exists in the first vessel; setting the second object at a second temperature; maintaining the second temperature at a value lower than a condensing temperature of the material.
[0012] Further advantageous embodiments are disclosed in the attached claims.
Brief description of the Figures [0013] Embodiments of the present invention will be described hereinafter, by way of example only, with reference to the accompanying drawings which are schematic in nature and therefore not necessarily drawn to scale. Furthermore, like reference signs in the drawings relate to like elements.
[0014] Figure 1 schematically shows a device for material deposition according to an embodiment of the present disclosure.
[0015] Figure 2 schematically shows a device for material deposition according to an embodiment of the present disclosure.
[0016] Figure 3 schematically shows a device for material deposition according to an embodiment of the present disclosure.
[0017] Figure 4 schematically shows a device for material deposition according to an embodiment of the present disclosure
Detailed description [0018] Figure 1 schematically shows a device 100 for material deposition comprising a first vessel 110 and a second vessel 140. The first vessel 110 is for processing a first object 120. The processing can be physical vapor deposition or/and chemical reaction deposition, optionally atomic layer deposition. The first object 120 is hold at a first temperature at which a material 130 in vapour phase exists in the first vessel 110. The second vessel 140 is provided with a second object 150. The second object 150 is hold at a second temperature. Between the first object 120 and the second object 150, a fictitious line of sight 162 can be drawn. The second vessel 140 is connected to the first vessel 110 via a first connection part 160 positioned between the first vessel 110 and the second vessel 140 and outside the fictitious line of sight 162. The device 100 further comprises heat transport device for maintaining the second temperature at a value lower than a condensing temperature of the material 130. This can be done by cooling the second object 150 to the second temperature. The heat transport device can be a cooling device.
[0019] In use, at the second object 150 the vapour material 130 will condense and the (partial) vapour pressure inside the second vessel 140 becomes lower than that of the first vessel 110. Thus a diffusion flow of the vapour material 130 is generated between the first vessel 110 and the second vessel 140, and the (partial) vapour pressure in the first vessel 110 can be reduced. The flow or convection can be from the first vessel 110 to the second vessel 140. Furthermore, because of the position of the first connecting part 160, a thermal contact between the first object 120 and the second object 150 is reduced. That is, radiation from the second object 150 cannot be directly received by the first object 120. The temperature in the first vessel 110 can be higher than the temperature in the second vessel 140. Due to the difference in vapour pressure, a diffusion process is maintained of the vapour material 130 between the first vessel 110 and the second vessel 140, but the thermal contact between the two vessels is reduced.
[0020] Fig. 1 shows the second object 150 having a cylindrical shape. Alternatively, the second object 150 can have any shape, e.g. a sphere.
[0021] The vapour material 130 comprises at least one of the following: selenium, sulphur.
[0022] The first temperature is between 300 °C and 1000 °C depending on the physical vapor deposition or/and chemical reaction deposition or/and atomic layer deposition process. The second temperature is between -200 °C and 300 °C.
[0023] The first vessel 110 comprises a volume between 1 m3 and 100 m3 and optionally can have an elongated shape. The second vessel 140 comprises a volume between 0.01 nT and 10m3.
[0024] Fig. 2 schematically shows a device 200 similar to the device 100 of Fig. 1. The device 200 comprises a second object 250 which is rotatable and the second vessel 240 is provided with a cleaning element, such as a scraper 280 for removing a condensed material 252 from the second object 250. The condensed material 252 originates from the vapour material 230. As vapour material 230 condenses on the second object 250, the second object 250 together with the condensed material 252 can get larger in size or/and loose the cooling effectivity because the condensed material 252 is not a good heat conductor. By (mechanically) scraping the condensed material 252 from the second object 250, the second object 250 is more effective in getting the condensed material, so a service interval/ lifetime of the device 200 can be extended. Alternatively (not shown), the condensed material 252 can also be removed from the second object 250 via a chemical way.
[0025] Fig. 2 shows the second vessel 240 comprising a collector 290 for collecting the scraped condensed material from the second object 250. The collector 290 can be a collecting bin.
[0026] Fig. 3 schematically shows a device 300 similar to the device 200 of Fig. 2. the second vessel 340 is further connected to the first vessel 310 via a second connection part 370 positioned between the first vessel 310 and the second vessel 340 and outside the fictitious line of sight 362 between the first object 320 and the second object 350. In an operation position of the device the first connection part 360 is positioned higher than the second connection part 370. In particular, the first connection part 360 is positioned above the fictitious line of sight 362 and the second connection part 370 is positioned below the fictitious line of sight 362.
[0027] Advantageously, the vapour pressure in the first vessel 310 can be reduced more efficiently due to a circulating flow between the connecting parts. In use, a relatively colder gas will sink towards the bottom of the second vessel 340. The colder gas will flow through the second connecting part 370 to the first vessel 310, where the colder gas will heat up and raise so it can enter the second vessel 340 through the first connecting part 360. This flow enhances the condensing thus the (partial) vapour pressure in the first vessel 310 is more efficiently reduced.
[0028] According to an embodiment, the second vessel 340 is connected to the first vessel 310 via a second connection part 370 positioned between the first vessel 310 and the second vessel 340 and outside the fictitious line of sight 362 between the first object 320 and the second object 350, wherein an end of the first connection part 360 towards the second vessel 340 is positioned higher than an end of the second connection part 370 towards the second vessel 340, when the device is in an operating state. In this way a circulating gas flow is created through the higher first connection part 360 from the first vessel 310 into the second vessel 340, along the second object 350 back into the first vessel 310 via the lower second connection part 370.
[0029] According to an embodiment, the first connection part 360 is positioned above the fictitious line of sight 362 and the second connection part 370 is positioned below the fictitious line of sight 362 when the device is in an operating state or the first connection part 560 is positioned on one side of the fictitious line of sight 562 and the second connection part 570 is positioned on the other side of the fictitious line of sight 562 when the device is in an operating state. In this way, the circulating gas flow is maintained or created by having an entrance flow from the first connection part 360, 560 into the second vessel 340, higher than an exit flow from the second vessel 340 into the second connection part 370, [0030] Fig. 4 schematically shows a device 400 similar to the device 300 of Fig. 3. The device 400 comprises a flow accelerator 490 for enhancing a flow from the second vessel 440 to the first vessel 410 via the second connection part 470. The flow accelerator 490 is at least one of the following: fan, gas mover, pump, venturi. In this way, the flow can be enhanced actively. The venture can for example be a venture tube or a nozzle for generating a flow into the second connection part 470. Alternatively, the flow accelerator 490 can also be connected to the first connection part 460.
[0031] According to an embodiment, the device of Figs. 1 - 4 can comprise a flush and exhaust system connected to the first vessel. This helps to further reduce the vapour pressure in the first vessel.
[0032] The second vessel can be positioned horizontally beside the first vessel in an operating state as shown in Figs. 1 - 4. Alternatively, the second vessel can be positioned in a different position with respect to the first vessel in the operating state. [0033] Fig. 5 schematically shows a device 500 similar to the device 300 of Fig. 3, wherein the second vessel 540 is positioned on top of the first vessel 510 in the operation state. The second vessel 540 is connected to the first vessel 510 via a first connection part 560 positioned between the first vessel 510 and the second vessel 540 and outside a fictitious line of sight 562 between the first object 520 and the second object 550. The second vessel 540 is further connected to the first vessel 510 via a second connection part 570 positioned between the first vessel 510 and the second vessel 540 and outside the fictitious line of sight 562. In particular, an end 564 of the first connection part 560 towards the second vessel 540 is positioned higher than an end 566 of the second connection part 570 towards the second vessel 540, generating the circulating gas flow from the first vessel 510 into the second vessel 540 along the condensing body 550 back into the first vessel 510, when the device is in the operating state. In this way, the vapour pressure can be reduced more efficiently due to a flow between the connecting parts. The connecting parts 560, 570 can comprise isolation elements 568, 569 for reducing heat transfer between different parts within the second vessel 540 or/and the first vessel 510.
[0034] In the foregoing description of the figures, the invention has been described with reference to specific embodiments thereof It will, however, be evident that 5 various modifications and changes may be made thereto without departing from the scope of the invention as summarized in the attached claims.
[0035] In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular 10 embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
[0036] In particular, combinations of specific features of various aspects of the invention may be made. An aspect of the invention may be further advantageously enhanced by adding a feature that was described in relation to another aspect of the 15 invention.

Claims (5)

ConclusiesConclusions 1. Inrichting (100) voor materiaaldepositie omvattende:A device (100) for material deposition comprising: een eerste vat (110) voor het verwerken van een eerste object (120) dat op een eerste temperatuur is waarbij een materiaal (130) in dampfase in het eerste vat bestaat;a first vessel (110) for processing a first object (120) that is at a first temperature at which a vapor phase material (130) exists in the first vessel; een tweede vat (140) voorzien van een tweede object (150), waarbij het tweede object op een tweede temperatuur is;a second vessel (140) provided with a second object (150), wherein the second object is at a second temperature; waarbij het tweede vat verbonden is met het eerste vat via een eerste verbindingsdeel (160) gepositioneerd tussen het eerste vat en het tweede vat en buiten een fictieve zichtlijn (162) tussen het eerste object en het tweede object, en warmtetransportinrichting voor het handhaven van de tweede temperatuur op een waarde die lager is dan een condensatietemperatuur van het materiaal.wherein the second vessel is connected to the first vessel via a first connecting part (160) positioned between the first vessel and the second vessel and outside a fictional line of sight (162) between the first object and the second object, and heat transfer device for maintaining the second temperature at a value lower than a condensing temperature of the material. 2. Inrichting volgens conclusie 1, waarbij het tweede vat is voorzien van een reinigingselement (280) voor het verwijderen van een gecondenseerd materiaal (252) van het tweede voorwerp.The device of claim 1, wherein the second vessel is provided with a cleaning element (280) for removing a condensed material (252) from the second object. 3. Inrichting volgens conclusie 2, waarbij het tweede object roteerbaar is en het reinigingselement (280) een schraper omvat.The device of claim 2, wherein the second object is rotatable and the cleaning element (280) comprises a scraper. 4. Inrichting volgens één van de conclusies 1 - 3, verder omvattende een verzamelaar (290) voor het verzamelen van een gecondenseerd materiaal van het tweede object.The device of any one of claims 1 to 3, further comprising a collector (290) for collecting a condensed material from the second object. 5. De inrichting volgens één van de conclusies 1-4, waarbij het tweede object een cilinder omvatThe device of any one of claims 1-4, wherein the second object comprises a cylinder 6. Inrichting volgens één van de conclusies 1-5, waarbij het tweede vat verder is verbonden met het eerste vat via een tweede verbindingsdeel (370) gepositioneerd tussen het eerste vat en het tweede vat en buiten de fictieve gezichtslijn tussen het eerste voorwerp en het tweede doel, waarbij een einde van het eerste verbindingsdeel naar het tweede vat hoger is gepositioneerd dan een einde van het tweede verbindingsdeel naar het tweede vat, wanneer de inrichting zich in een werkende toestand bevindt.The device of any one of claims 1-5, wherein the second vessel is further connected to the first vessel via a second connecting member (370) positioned between the first vessel and the second vessel and outside the fictional line of sight between the first object and the second target, wherein an end of the first connecting part to the second vessel is positioned higher than an end of the second connecting part to the second vessel when the device is in a working condition. 7. Inrichting volgens conclusie 6, waarbij het eerste verbindingsdeel boven de fictieve zichtlijn is gepositioneerd en het tweede verbindingsdeel onder de fictieve zichtlijn is gepositioneerd wanneer de inrichting zich in een werkende toestand bevindt of het eerste verbindingsdeel aan de ene kant van de fictieve gezichtslijn is gepositioneerd en hetThe device of claim 6, wherein the first connecting part is positioned above the fictional line of sight and the second connecting part is positioned below the fictitious line of sight when the device is in a working condition or the first connecting part is positioned on one side of the fictional line of sight and the 5 tweede verbindingsdeel aan de andere kant van de fictieve gezichtslijn is gepositioneerd, wanneer het apparaat zich in een werkende staat bevindt.The second connecting part is positioned on the other side of the fictional line of sight when the device is in a working state. 8. Inrichting volgens één van de conclusies 6-7, verder omvattende een stroomversneller (490) voor het richten van een stroom van het eerste vat naar het tweede vat of / en eenThe device of any one of claims 6-7, further comprising an accelerator (490) for directing a flow from the first vessel to the second vessel or / and a 10 stroom van het tweede vat naar het eerste vatFlow from the second vessel to the first vessel 9. Inrichting volgens conclusie 8, waarbij de stroomversneller ten minste een van de volgende is: ventilator, gasverplaatser, pomp, venturi.The device of claim 8, wherein the accelerator is at least one of the following: fan, gas displacer, pump, venturi. 1515 10. De inrichting volgens één van de conclusies 1 - 9, waarbij de inrichting voor fysische dampafzetting of / en chemische reactie-afzetting isThe device of any one of claims 1 to 9, wherein the device is for physical vapor deposition or / and chemical reaction deposition 11. Inrichting volgens één van de conclusies 1-10, waarbij het materiaal (130) in de dampfase ten minste een van de volgende omvat: seleen, zwavelThe device of any one of claims 1-10, wherein the vapor phase material (130) comprises at least one of the following: selenium, sulfur 12. Inrichting volgens een van de conclusies 1-11, waarbij het eerste vat een volume tussen 1 nf’ en 100 m3 omvat of / en het tweede vat een volume tussen 0.01 m3 en 10 m3 omvat.Device as claimed in any of the claims 1-11, wherein the first vessel comprises a volume between 1 nf 'and 100 m 3 or / and the second vessel comprises a volume between 0.01 m 3 and 10 m 3 . 25 13. Werkwijze voor het verlagen van een dampdruk in een materiaaldepositie-inrichting omvattende een eerste vat (110) voor het verwerken van een eerste object (120);13. A method for reducing a vapor pressure in a material depositing device comprising a first vessel (110) for processing a first object (120); een tweede vat (140) voorzien van een tweede object (150);a second vessel (140) provided with a second object (150); waarbij het tweede vat verbonden is met het eerste vat via een eerstewherein the second vessel is connected to the first vessel via a first 30 verbindingsdeel (160) gepositioneerd tussen het eerste vat en het tweede vat en buiten een fictieve gezichtslijn tussen het eerste object en het tweede object;Connecting part (160) positioned between the first vessel and the second vessel and outside of a fictional line of sight between the first object and the second object; het instellen van het eerste object bij een eerste temperatuur waarbij een materiaal (130) in dampfase bestaat in het eerste vat;setting the first object at a first temperature at which a vapor phase material (130) exists in the first vessel; het instellen van het tweede object op een tweede temperatuur instellen;setting the second object to a second temperature; het handhaven van de tweede temperatuur op een waarde lager dan een condensatietemperatuur van het materiaal.maintaining the second temperature at a value lower than a condensing temperature of the material. 5 14. Werkwijze volgens conclusie 13, waarbij de eerste temperatuur ligt tussen 300 °C en14. A method according to claim 13, wherein the first temperature is between 300 ° C and 1000 °C of / en de tweede temperatuur ligt tussen -20° C en 300 °C.1000 ° C or / and the second temperature is between -20 ° C and 300 ° C.
NL2020572A 2018-03-12 2018-03-12 A device for material deposition and a method thereof NL2020572B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4147534A (en) * 1976-08-16 1979-04-03 Fumio Hori Method for obtaining Mg and Ca through carbon reduction
US6030458A (en) * 1997-02-14 2000-02-29 Chorus Corporation Phosphorus effusion source

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4147534A (en) * 1976-08-16 1979-04-03 Fumio Hori Method for obtaining Mg and Ca through carbon reduction
US6030458A (en) * 1997-02-14 2000-02-29 Chorus Corporation Phosphorus effusion source

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