NL1040148C - Packaging method and package. - Google Patents

Packaging method and package.

Info

Publication number
NL1040148C
NL1040148C NL1040148A NL1040148A NL1040148C NL 1040148 C NL1040148 C NL 1040148C NL 1040148 A NL1040148 A NL 1040148A NL 1040148 A NL1040148 A NL 1040148A NL 1040148 C NL1040148 C NL 1040148C
Authority
NL
Grant status
Grant
Patent type
Prior art keywords
method
envelope
sensor
according
preceding
Prior art date
Application number
NL1040148A
Other languages
Dutch (nl)
Inventor
Pascal Ferdinand Antonius Maria Putten
Original Assignee
Putten Instr B V Van
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P5/00Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft
    • G01P5/10Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables
    • G01P5/12Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables using variation of resistance of a heated conductor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24Housings ; Casings for instruments
    • G01D11/245Housings for sensors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through the meter in a continuous flow
    • G01F1/68Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through the meter in a continuous flow by using thermal effects
    • G01F1/684Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through the meter in a continuous flow
    • G01F1/68Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through the meter in a continuous flow by using thermal effects
    • G01F1/684Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G01F1/69Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
    • G01F1/692Thin-film arrangements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08Protective devices, e.g. casings
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00Details of instruments
    • G01P1/02Housings
    • G01P1/026Housings for speed measuring devices, e.g. pulse generator

Description

packaging method and package Introduction

The applicability of sensors, in particular micro-systems in semiconductor technology, has been limited because they are very sensitive to pollution, often directly as a result of the properties of the physical quantity to be measured. Therefore, such sensors are often applicable only in clean, non-corrosive environments. As an example, an air flow sensor may serve, as previously described by van Putten (U.S. Patent No. 4,548,077 and 3,996,799) where the air flow rate a thermal gradient in a silicon sensor, with the aim of inducing the speed or the flow rate of a gas to be determined. In this state the surface of the sensor with the integrated structure is in direct contact with a medium (e.g. a flowing medium having one or parameters that is/are to be detected or measured by the sensor), which makes the sensor is intrinsically sensitive to contamination. Also, by the application of bonding wires between the sensor and the holder, the sensor vulnerable due to the possible presence of particles that can cause damage to bond wires. With the proposed method of packing shall be guided by the first physical quantity, by an otherwise closed hermetic structure, to the actual sensor, where a physical or chemical change that can be induced a defined function of the quantity to be measured. An improved packaging method is claimed in the independent claims of the present patent application. The dependent claims provide further advantageous embodiments of the invention.

An aspect of the invention provides a method for packaging a planar sensor, the method including encapsulating the sensor in an envelope of a packaging material.

According to an embodiment the envelope surrounds the planar sensor on at least five sides and protects the sensor against aggressive environments.

According to an embodiment the envelope has two sides in parallel to each other and to opposite sides of the planar sensor, the two envelope sides particularly having a reduced wall thickness for optimal transfer of the physical parameter to be measured.

According to an embodiment the method includes filing gaps between the planar sensor and the envelope with a curable filler material or encapsulant.

According to an embodiment the sensor is or includes a silicon mass flow sensor.

According to an embodiment, the planar sensor is a mass flow sensor that is also configured for measuring pressure and temperature.

Also, for example, the sensor may be a liquid flow sensor.

According to an embodiment the material of the envelope may be made of steel, particularly stainless steel, more particularly stainless steel 316 or stainless steel 304. Good results are achieved in case the envelope is made of foil material, for example steel foil, particularly stainless steel foil. The entire packaging envelope may be made of such a foil.

According to an embodiment the envelope is made by a sequence of welding processes, and includes one or more welds.

According to an embodiment the envelope is at least partly produced by injection molding.

According to an embodiment the envelope is being post-etched to create the thinnest possible structure around the sensing elements.

According to an embodiment, the envelope is made of two thin side walls, each having a thickness that is smaller than 0.1 mm, the side walls defining an inner space there-between for receiving the planer sensor.

The side walls may be spaced-apart from each other by spacer means.

The side walls and the spacer means may e.g. be connected to each other using welding techniques.

According to an embodiment, the side walls and the spacer means are substantially made of metal or an alloy, for example steel.

Also, the invention provides a package that is made by a method according to the invention.

Further an aspect of the invention provides a packages, including an envelope of foil material, the foil material substantially consisting of a metal or an alloy, the envelope substantially encapsulating a planar sensor.

According to an embodiment, a cured filler material or encapsulant is provided, filling up gaps between opposite sides of the planar sensor and the envelope.

According to an embodiment, the sensor may be located on a planar holder or support element, the planar holder or support element being at least partly encapsulated by the envelope.

For example, there may be provided a packaging method of a sensor, using a package that surrounds the sensor (particularly a planar sensor) on at least five sides. In an embodiment, a single-material envelope may be used (e.g. consisting of a said foil), which entirely surrounds the sensor and protects the sensor against aggressive environments. The envelope may be made of a single material, for example stainless steel, which can be welded, preferably using modern laser welding technology. The envelope may contain two co-planar surfaces, in parallel to the sensor element. Preferably, any gasp between such an envelope and the sensor are filled up, e.g. using a curable filler material.

The sensor can include a sensing structure, e.g. a a flow sensor element, capable of or configured for measuring changes in a defined physical parameter. The sensing structure can be configured to process these physical parameters into electrical signals. Particularly, the physical parameter is being sensed through the envelope shaped package.

By this construction, the sensor is completely separated from a medium which has great advantages in terms of handling and corrosion resistance.

The packaging method is not limited to the internal sensor technology, nor to the parameter to be sensed. It can be applied on all possible systems and sensor manufacturing processes, for example MEMS, thin film technology, RTD sensors, PT 1000 sensors, chip on glass, hybrid circuits.

*

The sensor element can be pre-mounted on a substrate using different standard available technologies, for example wire bonding, wire bonding + glob top, flip chip, flip chip with underfill.

The packaging method is also not limited to the location of the sensor with respect to the processing electronics. As preferred embodiment, we describe a system where the sensor element is separated from the processing electronics,. It is also possible to integrate both sensor element and processing electronics, for example a sensor element with integrated AD converter and microcontroller.

The invention will now be described, referring to the drawings which show a non-limiting embodiment of the invention.

Figure 1 schematically depicts a longitudinal cross-section of an embodiment;

Figure 2 schematically depicts top view of the embodiment shown in Fig. 1; Figure 3 schematically depicts a cross-section over line III-III of Fig. 1; Figure 4 schematically depicts a side view of the embodiment before it is welded into a flange.

Figure 5 schematically depicts a side view of the embodiment after it is welded into a flange.

Figure 6 schematically shows a side view of the embodiment after connection to a probe.

Figure 7 schematically shows a cross section over line IV-IV of fig 6, together with a protective cover, after connection to a probe.

Figure 8 schematically shows a three dimensional view of the embodiement.

A non-limiting example of the invention is described in Figure. 1, 2, 3, 4, 5, 6, 7 and 8. A sensor element (1), in this example manufactured out of silicon, has a circuit on at least one side. The sensor element is placed on a holder , e.g. a planar holder (2), and together with the holder the sensor is placed in a sleeve/envelope (3), in this example e.g. manufactured out of stainless steel 316.

The sleeve width is optimized to have an optimal fit, particularly a tight fit, around the sensor element with the least amount of filling material (if any) between the sensor element and the sleeve. The filling material (4), for example epoxy, preferably fills up any remaining gaps between the sleeve and the sensor element. In figure 2, the sleeve is shown from the top. The present sleeve includes two thin wall sensing surfaces (7) spaced-apart from each other defining a sensor receiving space therebetween , the sleeve walls being interconnected using a spacer means, for example a subframe (5), and connected to the flange (10) using welding technology (6). In figure 3, a cross section of the sleeve (3) is shown, with the welds clearly marked as triangles(9)

In figure 1, the sensor-sleeve assembly is connected with a flange (10) for example using welding (6). The flange is placed in the protective holder (6) made from the same material. The protective holder, flange and sleeve are preferably made from the same materials so they can be joined using welding technology. This ensures a leak tight, single material contact with the medium to be measured.

Figures 4 and 5 provide a side view of the construction before it is welded into the flange, and after welding into the flange. The weld which joins the thin wall sensing surfaces (7) to the subframe (8) is shown. The flange (10) is shown as well. In figure 6, the subassembly is welded onto a round probe of any length L.

Figure 7 shows a schematic cross section over line IV the sensor and the thin wall sensing surfaces, when mounted in a protective cover (11).

Figure 8 shows a three dimensional sketch of the embodiement. The protective cover (11), thin wall sensing surfaces (7), flange (10) and subframe (5) can be seen.

The sleeve may have one or more thin wall sensing surfaces 7 (two, in this example), which are coplanar and parallel to the sensor element sensing surfaces, and with wall thickness is less than or equal to 0.1 mm to provide optimal thermal conductivity between the sensing element and the medium. This ensures that the sensor can measure the physical parameter (in this example flow) without any significant influence of the sleeve, while being protected by the sleeve against external harmful conditions.

The sleeve will be preferably made by laser welding and post-etching to create the smallest possible thickness of the coplanar sensing surfaces.

Applications of the invention are gas and liquid flow measurement of any medium. The sensor element may be a silicon flow sensor (US Patent no. 4548077 en 3996799), where the flow sensor measures the actual mass flow through the sensing surfaces of the sleeve.

The sleeve can be seamlessly integrated in a single material hermetical construction, for example a full stainless steel package where all parts are interconnected by welding. An example is given in figure 7. A three dimensional view is provided in figure 8.

The skilled person will appreciate that the invention is not limited to the described embodiments.

The skilled person will appreciate that the envelope side walls 7 can have various shapes and dimensions. Particularly, each of the envelope side walls 7 at least entirely overlaps the planer sensor that is located therebetween, as is shown in the drawings, to be interconnected along edges, e.g. by a spacer means.

Claims (20)

  1. 1. Verpakkingsmethode van een vlakke sensor, waarbij de sensor in een enveloppe van verpakkingsmateriaal wordt ingepakt. 1. A packaging method of a planar sensor, wherein the sensor is encased in an envelope of packaging material.
  2. 2. Verpakkingsmethode volgens conclusie 1, waarbij de enveloppe de vlakke sensor op zijn minst aan vijf zijden omhult en beschermt tegen agressieve milieus. 2. The packaging method according to claim 1, wherein the envelope encloses the flat sensor at least on five sides and protects against aggressive environments.
  3. 3. Methode, volgens een of meerdere van voorgaande conclusies, waarbij de enveloppe twee zijdes heeft, parallel aan elkaar en de tegenover elkaar liggende zijden van de vlakke sensor, waarbij de twee zijden van de enveloppe in het bijzonder een gereduceerde wanddikte hebben voor optimale overdracht van de fysische parameter die gemeten moet worden. 3. Method, according to one or more of the preceding claims, wherein the envelope has two sides, parallel to each other and the mutually opposite sides of the flat sensor, wherein the two sides of the envelope, in particular, a reduced wall thickness have an optimum transmission of the physical parameter to be measured.
  4. 4. Methode, volgens een of meerdere van voorgaande conclusies, inclusief het opvullen van de openingen tussen de vlakke sensor en de enveloppe met een uithardbaar vulmiddel 4. The method, according to one or more of the preceding claims, including the filling in the gaps between the flat sensor, and the envelope with a curable filler,
  5. 5. Methode, volgens een of meerdere van voorgaande conclusies, waarbij de een silicium flowsensor is of bevat. 5. The method, according to one or more of the preceding claims, wherein the flow sensor is a silicon or contains.
  6. 6. Methode, volgens een of meerdere van voorgaande conclusies, waarbij de sensor een massaflowsensor is welke ook geconfigureerd is voor het meten van druk en temperatuur. 6. The method, according to one or more of the preceding claims, wherein the sensor is a mass flow sensor which is also configured for the measurement of pressure and temperature.
  7. 7. Methode, volgens een of meerdere van voorgaande conclusies 1-5, waar de sensor een vloeistofflowsensor is. 7. The method, according to one or more of the preceding claims 1-5, where the sensor is a fluid flow sensor.
  8. 8. Methode, volgens een of meerdere van voorgaande conclusies, waarbij het materiaal van de enveloppe staal is, in het bijzonder roestvast staal 316 of roestvaststaal 304. 8. The method, according to one or more of the preceding claims, wherein the material of the envelope is steel, especially 316 stainless steel or 304 stainless steel.
  9. 9. Methode, volgens een of meerdere van voorgaande conclusies, waarbij de enveloppe wordt gemaakt door een opeenvolging van lasprocessen en een of meerdere meerdere lassen omvat. 9. The method, according to one or more of the preceding claims, in which the envelope is made by a succession of welding processes, one or more of a plurality of welding.
  10. 10. Methode, volgens een of meerdere van voorgaande conclusies, waarbij de enveloppe gedeeltelijk wordt gemaakt met behulp van spuitgieten. 10. The method, according to one or more of the preceding claims, in which the envelope is made in part by means of injection molding.
  11. 11. Methode, volgens een of meerdere van voorgaande conclusies, waarbij de enveloppe wordt nabehandeld met etstechnieken om een zo dun mogelijke structuur rond de sensorelementen te verkrijgen. 11. The method, according to one or more of the preceding claims, in which the envelope is post-treated with etching techniques in order to obtain a structure as thin as possible around the sensing elements.
  12. 12. Methode, volgens een of meerdere van voorgaande conclusies, waarbij de enveloppe van een foliemateriaal is gemaakt. 12. The method, according to one or more of the preceding claims, in which the envelope of a sheet material is made.
  13. 13. Methode, volgens een of meerdere van voorgaande conclusies, waarbij de enveloppe is gemaakt van twee dunne zijwanden (7), beide met een dikte van kleiner dan 0.1 mm, welke een binnenruimte afbakenen waarin de vlakke sensor kan worden ontvangen. 13. The method, according to one or more of the preceding claims, in which the envelope is made out of two thin side walls (7), both with a thickness of less than 0.1 mm, which define an inner space in which the flat sensor can be provided.
  14. 14. Methode, volgens conclusie 13, waarbij de zijwanden(7) van elkaar worden gehouden door een tussenstuk. 14. The method, as claimed in claim 13, wherein the side walls (7) are held apart by a spacer.
  15. 15. Methode, volgens conclusie 14, waarbij de zijwanden en het tussenstuk met behulp van lastechnieken zijn verbonden. 15. The method, according to claim 14, wherein the side walls and the intermediate piece are connected using welding techniques.
  16. 16. Methode, volgens conclusie 14 of 15, waarbij de zijwanden en het tussenstuk grotendeels gemaakt zijn van metaal of een legering, bijvoorbeeld staal. 16. The method, according to claim 14 or 15, wherein the side walls and the intermediate piece are largely made of metal or an alloy, for example steel.
  17. 17. Een verpakkingsmethode gemaakt volgens een van voorgaande conclusies. 17. A method of packaging made according to any one of the preceding claims.
  18. 18. Een verpakkingsmethode, inclusief een enveloppe van foliemateriaal, waarbij het foliemateriaal grotendeels bestaat uit een metaal of metaallegering en grotendeels een vlakke sensor inpakt. 18. A packaging method, including an envelope of film material, wherein the film material consists largely of a metal or metal alloy, and is largely packing a flat sensor.
  19. 19. Een verpakkingsmethode volgens conclusie 18, waarbij een uithardbaar vulmateriaal wordt gebruikt welke de spleten tussen de vlakke sensor en de enveloppe opvult. 19. A packing method as claimed in claim 18, wherein a curable filler material is used which fills the gaps between the flat sensor, and the envelope.
  20. 20. Een verpakkingsmethode volgens conclusie 18 of 19, waarbij de sensor op een vlakke houder of steunelement is gemonteerd en de vlakke houder of steunelement op zijn minst gedeeltelijk is omhuld door de enveloppe. 20. A packing method as claimed in claim 18 or 19, wherein the sensor holder or on a flat support element is mounted and the planar supporting element holder or at least partially enveloped by the envelope.
NL1040148A 2013-04-04 2013-04-04 Packaging method and package. NL1040148C (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
NL1040148 2013-04-04
NL1040148A NL1040148C (en) 2013-04-04 2013-04-04 Packaging method and package.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1040148A NL1040148C (en) 2013-04-04 2013-04-04 Packaging method and package.

Publications (1)

Publication Number Publication Date
NL1040148C true NL1040148C (en) 2014-10-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
NL1040148A NL1040148C (en) 2013-04-04 2013-04-04 Packaging method and package.

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NL (1) NL1040148C (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040223679A1 (en) * 2002-10-21 2004-11-11 Gary Pickrell Method and apparatus for packaging optical fiber sensors for harsh environments
US20050050955A1 (en) * 2003-09-10 2005-03-10 Honeywell International, Inc. Sensor top hat cover apparatus and method
CN1743795A (en) * 2005-09-30 2006-03-08 大连理工大学 Optical fiber grating displacement sensor
EP1816444A2 (en) * 2006-02-07 2007-08-08 Yamatake Corporation Package structure of sensor and flow sensor having the same
CN101476907A (en) * 2009-01-06 2009-07-08 程星翼 Small-bore target type flow transducer and household gas meter produced by plastic molding process
CN101539403A (en) * 2009-04-22 2009-09-23 东南大学 Fiber grating strain and temperature simultaneously measuring sensor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040223679A1 (en) * 2002-10-21 2004-11-11 Gary Pickrell Method and apparatus for packaging optical fiber sensors for harsh environments
US20050050955A1 (en) * 2003-09-10 2005-03-10 Honeywell International, Inc. Sensor top hat cover apparatus and method
CN1743795A (en) * 2005-09-30 2006-03-08 大连理工大学 Optical fiber grating displacement sensor
EP1816444A2 (en) * 2006-02-07 2007-08-08 Yamatake Corporation Package structure of sensor and flow sensor having the same
CN101476907A (en) * 2009-01-06 2009-07-08 程星翼 Small-bore target type flow transducer and household gas meter produced by plastic molding process
CN101539403A (en) * 2009-04-22 2009-09-23 东南大学 Fiber grating strain and temperature simultaneously measuring sensor

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Effective date: 20160501