MY192764A - Laser processing method, apparatus for sapphire and storage medium - Google Patents

Laser processing method, apparatus for sapphire and storage medium

Info

Publication number
MY192764A
MY192764A MYPI2016703988A MYPI2016703988A MY192764A MY 192764 A MY192764 A MY 192764A MY PI2016703988 A MYPI2016703988 A MY PI2016703988A MY PI2016703988 A MYPI2016703988 A MY PI2016703988A MY 192764 A MY192764 A MY 192764A
Authority
MY
Malaysia
Prior art keywords
sapphire
laser processing
processing method
storage medium
crack
Prior art date
Application number
MYPI2016703988A
Inventor
Yanhua Wang
Changhui Zhuang
Fuhai Li
Wei Zeng
Wei Zhu
Jiangang Yin
Yunfeng Gao
Original Assignee
Hans?S Laser Tech Industry Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hans?S Laser Tech Industry Group Co Ltd filed Critical Hans?S Laser Tech Industry Group Co Ltd
Publication of MY192764A publication Critical patent/MY192764A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10P72/0436—
    • H10P72/0604—
    • H10P74/23—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dicing (AREA)

Abstract

A laser processing method for a sapphire (18) includes: acquiring an image of the sapphire (18) during processing; performing an edge detection to the image to acquire a coordinate of a crack (5, 50); determining an offset parameter according to the coordinate of the crack (5, 50); adjusting a laser processing position according to the offset parameter; and further processing the sapphire (18) in accordance with the adjusted laser processing position.
MYPI2016703988A 2015-05-12 2016-04-29 Laser processing method, apparatus for sapphire and storage medium MY192764A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510239300.XA CN104827191A (en) 2015-05-12 2015-05-12 Laser cutting method for sapphire
PCT/CN2016/080638 WO2016180246A1 (en) 2015-05-12 2016-04-29 Laser machining method and device for sapphires, and storage medium

Publications (1)

Publication Number Publication Date
MY192764A true MY192764A (en) 2022-09-07

Family

ID=53805584

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016703988A MY192764A (en) 2015-05-12 2016-04-29 Laser processing method, apparatus for sapphire and storage medium

Country Status (6)

Country Link
US (1) US10625375B2 (en)
JP (1) JP6371862B2 (en)
CN (1) CN104827191A (en)
DE (1) DE112016000051B4 (en)
MY (1) MY192764A (en)
WO (1) WO2016180246A1 (en)

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CN104827191A (en) 2015-05-12 2015-08-12 大族激光科技产业集团股份有限公司 Laser cutting method for sapphire
CN106256477A (en) * 2016-08-31 2016-12-28 安徽芯瑞达电子科技有限公司 Dark portion determining method laser cutting method
CN106449900B (en) * 2016-08-31 2020-06-05 导装光电科技（深圳）有限公司 Cutting process and device for LED white light chip
JP7123583B2 (en) * 2018-03-14 2022-08-23 株式会社ディスコ Wafer production method and wafer production apparatus
US10562130B1 (en) * 2018-12-29 2020-02-18 Cree, Inc. Laser-assisted method for parting crystalline material
JP7286464B2 (en) * 2019-08-02 2023-06-05 株式会社ディスコ Laser processing equipment
CN112775539A (en) * 2019-11-07 2021-05-11 大族激光科技产业集团股份有限公司 Laser processing method and apparatus
CN111778561B (en) * 2020-06-22 2021-11-02 福建晶安光电有限公司 A kind of sapphire substrate, processing method and preparation method of light emitting diode
JP7657047B2 (en) * 2020-12-18 2025-04-04 株式会社ディスコ Laser processing equipment
CN115377264B (en) * 2022-06-01 2025-12-16 福建晶安光电有限公司 Sapphire substrate, processing method thereof and preparation method of light-emitting diode
CN119928255B (en) * 2025-04-08 2025-07-08 武汉芯享光电科技有限公司 Adhesive film treatment process and device

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Also Published As

Publication number Publication date
US20170151632A1 (en) 2017-06-01
US10625375B2 (en) 2020-04-21
CN104827191A (en) 2015-08-12
JP2017520405A (en) 2017-07-27
DE112016000051T5 (en) 2017-02-16
JP6371862B2 (en) 2018-08-08
DE112016000051B4 (en) 2025-10-23
WO2016180246A1 (en) 2016-11-17

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