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Application filed by Mi Equipment M Sdn BhdfiledCriticalMi Equipment M Sdn Bhd
Priority to MYPI2018702511ApriorityCriticalpatent/MY191836A/en
Publication of MY191836ApublicationCriticalpatent/MY191836A/en
Testing Or Measuring Of Semiconductors Or The Like
(AREA)
Abstract
A method for prevention and detection of electronic component defect during die sorting (1), comprising the step of loading at least one wafer into at least one die sorting machine before performing wafer angle correction (101); performing die-to-die gap inspection (103) at at least one portion of said wafer by at least one vision system (201); performing ejector imprint (301) inspection (105) by at least one vision system (201). (The most illustrative figure is FIG 1)
MYPI2018702511A2018-07-182018-07-18Prevention and detection method for electric component defect during die sorting
MY191836A
(en)
Method for the automatic process monitoring and process diagnosis of a piece-based process (batch production), in particular an injection-molding process, and machine that performs the process or set of machines that performs the process.