MY184276A - Device and method for conveying and flipping a component - Google Patents

Device and method for conveying and flipping a component

Info

Publication number
MY184276A
MY184276A MYPI2015700477A MYPI2015700477A MY184276A MY 184276 A MY184276 A MY 184276A MY PI2015700477 A MYPI2015700477 A MY PI2015700477A MY PI2015700477 A MYPI2015700477 A MY PI2015700477A MY 184276 A MY184276 A MY 184276A
Authority
MY
Malaysia
Prior art keywords
flipping
component
arms
actuating means
nozzles
Prior art date
Application number
MYPI2015700477A
Inventor
Heng Lee Lee
Original Assignee
Exis Tech Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Exis Tech Sdn Bhd filed Critical Exis Tech Sdn Bhd
Priority to MYPI2015700477A priority Critical patent/MY184276A/en
Priority to SG10201504677WA priority patent/SG10201504677WA/en
Priority to US14/737,891 priority patent/US20160240416A1/en
Priority to CN201510329968.3A priority patent/CN105895567B/en
Priority to PH1/2015/000202A priority patent/PH12015000202B1/en
Priority to TW105104229A priority patent/TWI627115B/en
Publication of MY184276A publication Critical patent/MY184276A/en

Links

Classifications

    • H10P72/30—
    • H10P72/3211—
    • H10P72/3212—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Specific Conveyance Elements (AREA)
  • Mechanical Engineering (AREA)
  • Automatic Assembly (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Attitude Control For Articles On Conveyors (AREA)
  • Manipulator (AREA)

Abstract

The present invention relates to a device (1) and method for conveying and flipping a component (10) for use in conjunction with a rotary turret module (30). The device (1) includes at least a pair of spaced apart flipping arms, a first and second flipping arms (100 and 300) mounted on a platform (500). Each of the flipping arms (100, 300) is provided with one nozzle (110, 310) having one end (111) configured to pick the component (10) and another end (311) fixedly mounted on a shaft (130, 330) supported on the flipping arm (100, 300) and is operatively connected to a rotary actuating means (150, 350). The rotary actuating means (150, 350) is adapted to be capable of affecting a rotational motion of the shaft (130, 330), thereby rotating the nozzles (110, 310) in a counter direction by substantially 90 degrees. The device is also provided with a linear actuating means (400) suitably mounted on the platform (500). The linear actuating means (400) is operatively connected to at least one of to the flipping arms (100, 300 or 100 and 300) and is adapted to be capable of moving the flipping arm (100, 300) or arms (100 and 300) in a horizontal direction so as to position the nozzles (110, 310) substantially proximate to each other for transferring of the component (10) between the nozzles (110, 310) and thereby, flipping the component (10) at 180 degrees. FIG. 1
MYPI2015700477A 2015-02-16 2015-02-16 Device and method for conveying and flipping a component MY184276A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
MYPI2015700477A MY184276A (en) 2015-02-16 2015-02-16 Device and method for conveying and flipping a component
SG10201504677WA SG10201504677WA (en) 2015-02-16 2015-06-12 Device and method for conveying and flipping a component
US14/737,891 US20160240416A1 (en) 2015-02-16 2015-06-12 Device and method for conveying and flipping a component
CN201510329968.3A CN105895567B (en) 2015-02-16 2015-06-15 Apparatus and method for conveying and flipping parts
PH1/2015/000202A PH12015000202B1 (en) 2015-02-16 2015-06-15 Device and method for conveying and flipping a component
TW105104229A TWI627115B (en) 2015-02-16 2016-02-15 Apparatus and method for transmitting and flipping components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2015700477A MY184276A (en) 2015-02-16 2015-02-16 Device and method for conveying and flipping a component

Publications (1)

Publication Number Publication Date
MY184276A true MY184276A (en) 2021-03-30

Family

ID=56622451

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015700477A MY184276A (en) 2015-02-16 2015-02-16 Device and method for conveying and flipping a component

Country Status (6)

Country Link
US (1) US20160240416A1 (en)
CN (1) CN105895567B (en)
MY (1) MY184276A (en)
PH (1) PH12015000202B1 (en)
SG (1) SG10201504677WA (en)
TW (1) TWI627115B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6727568B2 (en) * 2018-10-16 2020-07-22 上野精機株式会社 Electronic component transport facility
US11201065B2 (en) * 2019-10-31 2021-12-14 Texas Instruments Incorporated Testing semiconductor components
CN110817434A (en) * 2019-11-25 2020-02-21 广州市心鉴智控科技有限公司 Watch lens turnover device
CN114509670B (en) * 2022-04-20 2022-07-05 博坤机电（苏州）有限公司 Rowing machine key test equipment and test method
CN119160636A (en) * 2024-10-10 2024-12-20 山东理工大学 An intelligent frozen sand mold handling device with environmental perception function suitable for frozen casting production line

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11254367A (en) * 1998-03-13 1999-09-21 Shibuya Kogyo Co Ltd Processing head
GB2347741A (en) * 1998-11-05 2000-09-13 Cyberoptics Corp Electronics assembly apparatus with improved imaging system
SG104292A1 (en) * 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor
DE10203601A1 (en) * 2002-01-30 2003-08-14 Siemens Ag Chip removal device, chip removal system, placement system and method for removing chips from a wafer
JP2005014894A (en) * 2003-06-06 2005-01-20 Aprica Kassai Inc Wheel simultaneous braking mechanism, caster rotation prevention mechanism, and baby carriage
JP4595740B2 (en) * 2005-08-16 2010-12-08 パナソニック株式会社 Chip inversion device, chip inversion method, and chip mounting device
DE102007005151A1 (en) * 2007-02-01 2008-08-07 Siemens Ag Multiple placement head with collective rotary drive and movable lifting drive for component holding devices
SG195237A1 (en) * 2011-06-03 2013-12-30 Orion Systems Integration Pte Ltd Method and systems for semiconductor chip pick & transfer and bonding
KR20130124070A (en) * 2012-05-04 2013-11-13 삼성전자주식회사 Apparatus of fabricating flip-chip packages and fabricating methods using the same
KR101566714B1 (en) * 2013-07-25 2015-11-13 한미반도체 주식회사 Flip chip bonding device
US9783372B2 (en) * 2015-01-28 2017-10-10 Kla-Tencor Corporation Flipping apparatus, system and method for processing articles

Also Published As

Publication number Publication date
TWI627115B (en) 2018-06-21
TW201632440A (en) 2016-09-16
CN105895567B (en) 2019-04-16
PH12015000202B1 (en) 2023-03-03
SG10201504677WA (en) 2016-09-29
US20160240416A1 (en) 2016-08-18
PH12015000202A1 (en) 2017-01-09
CN105895567A (en) 2016-08-24

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