MY177231A - Cutting apparatus - Google Patents

Cutting apparatus

Info

Publication number
MY177231A
MY177231A MYPI2015000514A MYPI2015000514A MY177231A MY 177231 A MY177231 A MY 177231A MY PI2015000514 A MYPI2015000514 A MY PI2015000514A MY PI2015000514 A MYPI2015000514 A MY PI2015000514A MY 177231 A MY177231 A MY 177231A
Authority
MY
Malaysia
Prior art keywords
vibration
vibration signal
cutting blade
signal
unit
Prior art date
Application number
MYPI2015000514A
Other languages
English (en)
Inventor
Kubo Masahiro
Nakanishi Yuji
Izumi Kuniharu
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of MY177231A publication Critical patent/MY177231A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Turning (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
MYPI2015000514A 2014-03-07 2015-02-27 Cutting apparatus MY177231A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014044996A JP6223239B2 (ja) 2014-03-07 2014-03-07 切削装置

Publications (1)

Publication Number Publication Date
MY177231A true MY177231A (en) 2020-09-09

Family

ID=54023050

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015000514A MY177231A (en) 2014-03-07 2015-02-27 Cutting apparatus

Country Status (5)

Country Link
JP (1) JP6223239B2 (zh)
KR (1) KR102157402B1 (zh)
CN (1) CN104889870B (zh)
MY (1) MY177231A (zh)
TW (1) TWI647056B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6699930B2 (ja) * 2016-04-07 2020-05-27 株式会社ディスコ 切削装置
JP6815770B2 (ja) * 2016-07-13 2021-01-20 株式会社ディスコ 切削装置
JP6866217B2 (ja) * 2017-04-21 2021-04-28 株式会社ディスコ 切削装置
JP7138452B2 (ja) * 2018-03-01 2022-09-16 株式会社ディスコ フランジ機構
CN108873814A (zh) * 2018-06-25 2018-11-23 深圳精匠云创科技有限公司 监测系统、监测方法及存储设备
JP2020113641A (ja) * 2019-01-09 2020-07-27 株式会社ディスコ 切削装置
KR102463249B1 (ko) 2021-01-07 2022-11-07 (주) 카스윈 빌트인 방식의 초음파 스핀들 및 이를 이용한 가진 방법
KR20220104901A (ko) 2021-01-19 2022-07-26 (주) 카스윈 자가 발전 방식의 초음파 스핀들 가공 장치
KR20220104899A (ko) 2021-01-19 2022-07-26 (주) 카스윈 외부 전원 공급 방식의 초음파 스핀들 가공 장치
CN115401524A (zh) * 2022-08-19 2022-11-29 上汽通用五菱汽车股份有限公司 一种刀具振动信号监控方法、系统及介质

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS474816Y1 (zh) 1967-03-30 1972-02-21
US4514797A (en) * 1982-09-03 1985-04-30 Gte Valeron Corporation Worn tool detector utilizing normalized vibration signals
JPS6062464A (ja) * 1983-09-10 1985-04-10 Kawasaki Steel Corp 回転砥石による金属帯の側端研削装置
JPH0499946A (ja) * 1990-08-20 1992-03-31 Sanko Control Kk 砥石の切れ味測定方法及び装置
JPH05154833A (ja) * 1991-12-09 1993-06-22 Nikko Kyodo Co Ltd ダイシングマシン
JP3534338B2 (ja) * 1999-10-07 2004-06-07 松下電器産業株式会社 切削加工装置
JP2002066879A (ja) * 2000-09-04 2002-03-05 Bosch Automotive Systems Corp 工作機械用アコースティック・エミッション検出装置
JP4149691B2 (ja) * 2001-08-31 2008-09-10 株式会社東芝 半導体製造装置用回転機の寿命予測方法及び半導体製造装置
JP4658730B2 (ja) * 2005-07-28 2011-03-23 株式会社ディスコ 切削装置
EP1977857A1 (en) * 2006-01-12 2008-10-08 Tokyo Seimitsu Co.,Ltd. Working system, contact detecting method, and ae contact detecting device
JP4552883B2 (ja) * 2006-04-19 2010-09-29 株式会社デンソー 振動検出方法
JP2008290203A (ja) * 2007-05-25 2008-12-04 Nissan Diesel Motor Co Ltd 研削加工監視システム及び研削加工監視方法
JP2009032726A (ja) * 2007-07-24 2009-02-12 Disco Abrasive Syst Ltd ウエーハの分割方法
JP5258921B2 (ja) * 2011-03-31 2013-08-07 株式会社小松製作所 工作機械及びその加工制御装置
JP5764031B2 (ja) * 2011-10-06 2015-08-12 株式会社ディスコ 切削装置
JP5943578B2 (ja) * 2011-10-11 2016-07-05 株式会社東京精密 ウェーハ面取り装置、および面取り用砥石の表面状態または面取り用砥石によるウェーハの加工状態の検出方法
TW201332704A (zh) * 2012-02-10 2013-08-16 中原大學 刃口積屑監控方法

Also Published As

Publication number Publication date
JP6223239B2 (ja) 2017-11-01
TW201544229A (zh) 2015-12-01
KR102157402B1 (ko) 2020-09-17
KR20150105223A (ko) 2015-09-16
JP2015170745A (ja) 2015-09-28
CN104889870A (zh) 2015-09-09
TWI647056B (zh) 2019-01-11
CN104889870B (zh) 2019-06-14

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