MY177231A - Cutting apparatus - Google Patents
Cutting apparatusInfo
- Publication number
- MY177231A MY177231A MYPI2015000514A MYPI2015000514A MY177231A MY 177231 A MY177231 A MY 177231A MY PI2015000514 A MYPI2015000514 A MY PI2015000514A MY PI2015000514 A MYPI2015000514 A MY PI2015000514A MY 177231 A MY177231 A MY 177231A
- Authority
- MY
- Malaysia
- Prior art keywords
- vibration
- vibration signal
- cutting blade
- signal
- unit
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Turning (AREA)
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014044996A JP6223239B2 (ja) | 2014-03-07 | 2014-03-07 | 切削装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY177231A true MY177231A (en) | 2020-09-09 |
Family
ID=54023050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2015000514A MY177231A (en) | 2014-03-07 | 2015-02-27 | Cutting apparatus |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6223239B2 (zh) |
KR (1) | KR102157402B1 (zh) |
CN (1) | CN104889870B (zh) |
MY (1) | MY177231A (zh) |
TW (1) | TWI647056B (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6699930B2 (ja) * | 2016-04-07 | 2020-05-27 | 株式会社ディスコ | 切削装置 |
JP6815770B2 (ja) * | 2016-07-13 | 2021-01-20 | 株式会社ディスコ | 切削装置 |
JP6866217B2 (ja) * | 2017-04-21 | 2021-04-28 | 株式会社ディスコ | 切削装置 |
JP7138452B2 (ja) * | 2018-03-01 | 2022-09-16 | 株式会社ディスコ | フランジ機構 |
CN108873814A (zh) * | 2018-06-25 | 2018-11-23 | 深圳精匠云创科技有限公司 | 监测系统、监测方法及存储设备 |
JP2020113641A (ja) * | 2019-01-09 | 2020-07-27 | 株式会社ディスコ | 切削装置 |
KR102463249B1 (ko) | 2021-01-07 | 2022-11-07 | (주) 카스윈 | 빌트인 방식의 초음파 스핀들 및 이를 이용한 가진 방법 |
KR20220104901A (ko) | 2021-01-19 | 2022-07-26 | (주) 카스윈 | 자가 발전 방식의 초음파 스핀들 가공 장치 |
KR20220104899A (ko) | 2021-01-19 | 2022-07-26 | (주) 카스윈 | 외부 전원 공급 방식의 초음파 스핀들 가공 장치 |
CN115401524A (zh) * | 2022-08-19 | 2022-11-29 | 上汽通用五菱汽车股份有限公司 | 一种刀具振动信号监控方法、系统及介质 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS474816Y1 (zh) | 1967-03-30 | 1972-02-21 | ||
US4514797A (en) * | 1982-09-03 | 1985-04-30 | Gte Valeron Corporation | Worn tool detector utilizing normalized vibration signals |
JPS6062464A (ja) * | 1983-09-10 | 1985-04-10 | Kawasaki Steel Corp | 回転砥石による金属帯の側端研削装置 |
JPH0499946A (ja) * | 1990-08-20 | 1992-03-31 | Sanko Control Kk | 砥石の切れ味測定方法及び装置 |
JPH05154833A (ja) * | 1991-12-09 | 1993-06-22 | Nikko Kyodo Co Ltd | ダイシングマシン |
JP3534338B2 (ja) * | 1999-10-07 | 2004-06-07 | 松下電器産業株式会社 | 切削加工装置 |
JP2002066879A (ja) * | 2000-09-04 | 2002-03-05 | Bosch Automotive Systems Corp | 工作機械用アコースティック・エミッション検出装置 |
JP4149691B2 (ja) * | 2001-08-31 | 2008-09-10 | 株式会社東芝 | 半導体製造装置用回転機の寿命予測方法及び半導体製造装置 |
JP4658730B2 (ja) * | 2005-07-28 | 2011-03-23 | 株式会社ディスコ | 切削装置 |
EP1977857A1 (en) * | 2006-01-12 | 2008-10-08 | Tokyo Seimitsu Co.,Ltd. | Working system, contact detecting method, and ae contact detecting device |
JP4552883B2 (ja) * | 2006-04-19 | 2010-09-29 | 株式会社デンソー | 振動検出方法 |
JP2008290203A (ja) * | 2007-05-25 | 2008-12-04 | Nissan Diesel Motor Co Ltd | 研削加工監視システム及び研削加工監視方法 |
JP2009032726A (ja) * | 2007-07-24 | 2009-02-12 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
JP5258921B2 (ja) * | 2011-03-31 | 2013-08-07 | 株式会社小松製作所 | 工作機械及びその加工制御装置 |
JP5764031B2 (ja) * | 2011-10-06 | 2015-08-12 | 株式会社ディスコ | 切削装置 |
JP5943578B2 (ja) * | 2011-10-11 | 2016-07-05 | 株式会社東京精密 | ウェーハ面取り装置、および面取り用砥石の表面状態または面取り用砥石によるウェーハの加工状態の検出方法 |
TW201332704A (zh) * | 2012-02-10 | 2013-08-16 | 中原大學 | 刃口積屑監控方法 |
-
2014
- 2014-03-07 JP JP2014044996A patent/JP6223239B2/ja active Active
-
2015
- 2015-02-05 TW TW104103906A patent/TWI647056B/zh active
- 2015-02-27 MY MYPI2015000514A patent/MY177231A/en unknown
- 2015-03-04 KR KR1020150030229A patent/KR102157402B1/ko active IP Right Grant
- 2015-03-06 CN CN201510100376.4A patent/CN104889870B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP6223239B2 (ja) | 2017-11-01 |
TW201544229A (zh) | 2015-12-01 |
KR102157402B1 (ko) | 2020-09-17 |
KR20150105223A (ko) | 2015-09-16 |
JP2015170745A (ja) | 2015-09-28 |
CN104889870A (zh) | 2015-09-09 |
TWI647056B (zh) | 2019-01-11 |
CN104889870B (zh) | 2019-06-14 |
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