MXPA99001497A - Chip card module, combined chip card containing the module, and manufacturing process - Google Patents

Abstract

The invention relates to a chip card module (1) comprising a supporting plate (2) which has a first contact plane (3) and a semiconductor chip (4) and electrically conductive connections (5) between the semiconductor chip and the first contact plane. Apart from the first contact plane, the chip card module has, on the reverse side of the supporting plate (2), another connection plane (6) also electrically connected to the semiconductor chip (4). The other connection plane may be used, for example, for turning on a built-in induction coil inside the chip body for non-contacting data transfer. The invention relates also to a combined chip card for contacting and non-contacting data transfer, which contains said chip card module (1), and manufacturing thereof.

Description

CHIP CARD MODULE, COMBINED CHIP CARD CONTAINING THE MANUFACTURING MODULE AND PROCESS FIELD OF THE INVENTION The invention relates to a method for manufacturing a chip card module, a chip card module manufactured using said method and a combined chip card containing the chip card module.

BACKGROUND OF THE INVENTION By combined chip card (or, in short, combined card) it is to be understood in the following a chip card in which data and information can be exchanged both in a usual way by means of access to galvanic contacts or else without contact, by inductive means, with a card reading / writing device. This type of combination cards can be used, for example, as exchange bag or to control the access of people with registration. For the usual data transfer, linked to contact, chip cards present contact areas on their surface, which usually comply with ISO 7810 or 7816 standards, and which are read by means of survey contacts. The contact areas for the transfer of data linked to contact are hereinafter referred to in general as the first contact plane or, in a simplified manner, as ISO contact areas. A chip module for a conventional chip card such as this one is described, for example, in German Patent DE-A-39 24 439. For the inductive data transfer, an antenna is integrated in the chip card. Normally, an electrical coil is arranged in the body of the chip card, so that it can not be viewed from the outside. Suitable, for example, coils with a carrier frequency in an open industrial band, for example, 13.56 MHz. Next, the invention is described with the example of an electric coil, without being limited to this special configuration of an antenna. The chip card module (CC) manufactured in accordance with the invention is also suitable in principle for the contact of other elements to be contacted from a chip card. If the two data transfer systems described above must be combined in a chip card, it is necessary to provide electrically conductive connections from the semiconductor chip to both the ISO contacts and the coil. The manufacture of the ISO contacts is usually carried out in such a way that a chip card module is first manufactured, which is then disposed (implanted) in a recess in the card support plate. The chip card module consists of a flexible carrier material, for example, an epoxy sheet reinforced with fiberglass, on one side of which the semiconductor chip is disposed, and on the other, the ISO contact areas. These generally consist of a copper layer with a surface refinement of a layer of nickel and a layer of gold. The ISO contact areas and the semiconductor chip are connected in a conductive manner with connecting wires through recesses in the carrier film of the module. In theory, it would be conceivable to have the other connections necessary for the electrical contact of the coil on the ISO contact areas, that is, to extend the ISO contact areas by two additional fields. However, such an arrangement would have the disadvantage that the connection points would be located on the surface of the chip card and, thus, would be accessible to negative influences and manipulations. By touching the contact areas and / or physical contacts with metal objects and the short circuits that this causes, for example, a displacement of the own frequency can occur. The consequence would be operational failures or the complete absence of operation. To exclude this type of perturbations and manipulations of the information by inductively transferring, another way of contact between the semiconductor chip and the coil should be found. In the German Patent DE-A-195 00 925discloses a chip card for data transfer both contactless and also linked to contact, in which the chip module integrated in the card body has two connection planes opposite each other for data exchange linked to contact, or, for the connection of an antenna. In addition, German Patent DE-A-195 00 925 describes procedures on how these chip modules can be integrated into the bodies of the cards and make the necessary contacts. The methods used up to now for the manufacture of chip card modules contain numerous steps, such as, for example, the separate structuring of one or more connection planes (for example, by corrosion), or, of the band of the carrier of the chip. module (by punching or punching) and, therefore, they require a lot of time and are expensive.

OBJECTIVES AND ADVANTAGES OF THE INVENTION Therefore, the objective of the invention was to provide a method for the manufacture of a CC module, which allows a simple and inexpensive way to connect an antenna (induction coil) or other components to contact a card of chip, the influence of disturbances or manipulations on the connections must be largely excluded in the CC module manufactured according to said method. In addition, the method according to the invention must lead to a CC module, which can be implanted in a card body using usual procedures. The achievement of this objective is achieved with the method for the manufacture of a CC module according to claim 1. The invention also relates to the CC module according to claim 6 manufactured according to claim 1, as well as, of In accordance with the foregoing, the invention relates to a method for the manufacture of a CC module, which includes a plate support and, disposed thereon, a first contact plane (ISO contact areas) and a semiconductor chip. The CC module can be configured in the usual manner. For example, the support plate can be a plastic sheet, in particular an epoxy sheet reinforced with glass fiber, which has recesses for the semiconductor chip and for the junction wires, with which the semiconductor chip connects to the contact close-up (ISO contact areas). These may consist of a copper layer, which is coated with layers of nickel and gold. The contact areas normally comply with ISO standards 7810 or 7816. The CC module manufactured according to the method according to the invention has another connection plane, which is arranged on the side of the support plate of the module opposite the first plane contact. The additional contact plane is, therefore, usually on the same side of the support plate as the semiconductor chip. The additional connection plane conveniently consists of metal. In order to provide the same bonding capacity as the first contact plane, it is preferably configured in the same way as this one. For example, it consists of a copper layer, which is coated with layers of nickel and gold. The other contact plane is structured to obtain the required number of connection points to the induction coil or other components to be contacted from a chi card. Preferably, the structuring of the other connection plane is effected by punching or the like. It is carried out according to the method according to the invention, together with the punching of the recess for the semiconductor chip, the perforations for the connecting wires and, optionally, the transport opening on the support plate of the module. In this way, the manufacture of the other connection plane can be considerably simplified. Therefore, the other connection plane or, at least, its base layer is applied on the support plate of the module before structuring it. If the other connection plane consists of a sequence of Cu-Ni-Au layers, for example, first a copper strip is laminated on one side of the module support plate, preferably at the center. Subsequently, the structuring of the module support plate is carried out by means of punching or the like. Then the nickel and gold layers are galvanized. In a particularly preferred manner, the galvanization is carried out together with the galvanic coating of the ISO contact areas (of the first contact plane), which are located on the other side of the module support plate. Then, the semiconductor chip is fixed in a manner known per se in the CC module. Later, the electrically conductive connections to the first connection plane (the ISO contact areas) and to the additional connection points of the other connection plane are established, for example, using gold junction wires. If desired, to protect the semiconductor chip in the CC module, a support ring surrounding the semiconductor chip can be provided. Conveniently, this support ring simultaneously serves as the lateral limit for the plastic mass covering the chip. Preferably, the support ring consists of an elastic material, for example made of metal, in particular copper. To avoid short circuits between the support ring and the other connection plane, a dielectric agent is conveniently arranged between them. This can be, for example, the glue with which the support ring is fixed to the module. Preferably a pressure sensitive glue is used. The DC module (with or without support ring) manufactured according to the method according to the invention can be implemented in a manner known per se, using conventional methods, in the body of the chip card. For example, in the body of the card, normally a sheet of plastic, for example, of polycarbonate, a cavity is milled, whose shape and size agree with the module CC to be implanted. It sticks in said cavity, usually using a hot or fusible glue (the so-called Hotmelt process). It is particularly preferred that the antenna (induction coil), which must be connected to the additional connection plane of the CC module, is integrated or arranged on the card support plate. If the induction coil is a coil of copper wire, which is inserted from the outside into the body of the card, so that it can not be seen, the contact points are released before the CC module is implanted, for example, by milling the surface of the card body. In a particularly preferred manner, the release of the contact points is carried out together with the milling of the cavity for the CC module. The electrically conductive connections between the other connection plane of the CC module and the induction coil connections are made either by applying soft solder or with the help of an anisotropic conductive plastic.

BRIEF DESCRIPTION OF THE DRAWINGS Next, the invention is illustrated in more detail with reference to a drawing. It shows: Figure 1, schematically, a cross section through a CC module manufactured according to the method according to the invention. Figure 2, schematically, a card body for receiving the CC module manufactured according to the method according to the invention, in a plan view. And Figure 3, schematically, a cross section through the card body according to Figure 2, along the line A-A.

DETAILED DESCRIPTION OF THE INVENTION In detail, Figure 1 shows an example of a module CC 1 manufactured according to the method according to the invention, with a support plate of module 2, which may consist, for example, of a sheet of plastic, like an epoxy sheet reinforced with fiberglass. On the underside of the support plate 2, a first contact plane 3 is laminated by means of an adhesive 7. The first contact plane usually consists of contact areas, which comply with ISO 7810 or 7816 standards. contact themselves may consist, for example, of a copper foil coated with nickel and gold layers. On the opposite side of the support plate to the first contact plane 3, in accordance with the invention another connection plane 6 is provided, which consists, for example, of metal and in particular of a copper foil coated with nickel and gold, laminated with glue 7. The other connection plane includes a right and a left connection point. A semiconductor chip 4 is disposed in a recess of the support plate 2, which is electrically conductively connected to the first contact plane 3 and the other connection plane 6. In the present case, only the junctions 5 are shown. to the first contact plane 3, which are made with junction wires, for example, gold and pass through other perforations in the support plate 2. The unions not shown of the semiconductor chip and the other connection plane 6 (is say, right and left connection point) can be achieved in the same way as in the first contact plane 3, ie, for example, also with junction wires. To protect the semiconductor chip 4, in the other connection plane 6 a support ring 8 is arranged, which surrounds the semiconductor chip. The support ring 8 conveniently consists of an elastic material and, in particular, of metal, for example copper. To avoid short circuits between the connection points of the other connection plane 6 and the support ring 8, a dielectric material 9 is inserted between them. Preferably, the support ring 8 is glued. Conveniently, the glue functions as a dielectric material. In a particularly preferred manner, a pressure sensitive adhesive is used. The support ring 8 can also act simultaneously as a lateral limit for the plastic mass 10, for example a silicone lacquer or epoxy resin, with which the semiconductor chip 4 is covered. The CC 1 module is manufactured with the aid of the method according to the invention, which includes the following steps: - laminar as the other connection plane (6), a metal band in longitudinal direction on a first side of a module carrier band, - structuring the metal band to obtain individual connection points of the other connection plane (6), - to laminate a sheet of metal on the other side of the module carrier band and to structure the first contact plane (3), to structure the module carrier band by making perforations for the semiconductor chip (4) and / or for electrically conductive connections (5), - optionally galvanically coating the first contact plane (3) and / or the other connection plane (6) , - possibly place a support ring (8) on the other connection plane (6), - mount the semiconductor chip (4) and contact the first contact plane (3) and the other connection plane (6), - coat the semiconductor chip (4) with plastic, and - separate the chip card modules (1) . The above steps should not all be performed in the indicated sequence. In the method according to the invention, however, it is provided that the lamination of the metal strip for the other connection plane and its structuring to obtain individual connection points, are carried out before the lamination and the structuring of the first plane of contact, and the structuring of the other connection plane is carried out together with the structuring of the module carrier band. In this case, therefore, first a copper strip is laminated, which may have, for example, a width of 200 μm to 1 mm, essentially in the center and in the longitudinal direction on the module carrier web. The term "module carrier band" refers in this context to a carrier sheet for a series of successive module units. In the case of an arrangement essentially in the center of the metal strip, it is therefore also in the finished module essentially in its central area. However, this definition also includes carrier sheets of a greater width, in which, for example, several series of module units parallel to each other occur. In this case, a metal strip is laminated by a series of modules. After placing the metal band, it is structured in a next step, so that individual connection points are obtained. The structuring can be effected conveniently by puncturing the separation surfaces in the metal band. The structuring is done together with the structuring of the support plate of the module 2. By punching the recesses for the semiconductor chip 4, the perforations for the wires 5 for the contact of the semiconductor chip with the first contact plane and for the transport openings, separating surfaces and thus isolated connection points are simultaneously formed on the other connection plane. The placement of the first contact plane is carried out in a manner known per se, namely after laminating the other connection plane, that is, in the case of a Cu-Ni-Au metallization layer, after the copper layer has been laminated . To achieve the same bonding capacity of the first and the second contact plane, the other connection plane can also be surface refined, for example, by nickel-plating and gold-plating. Conveniently, the galvanic coating is carried out after structuring and, in particular, together with the galvanic coating of the first contact plane. Subsequently, to protect the semiconductor chip, a support ring 8 can still be placed, conveniently by gluing it with a pressure-sensitive adhesive. The plastic coating 10 of the semiconductor chip 4 is carried out in the usual manner. The support ring 8 can act as the lateral limit of the plastic mass.

The invention also relates to a combined card for contactless, contact-linked data transfer, which includes a CC 1 module manufactured according to the method according to the invention. The CC module manufactured according to the method according to the invention has the advantage that it can be implanted not only in the card body using the usual process steps, but also in a common manner. That is, in a known manner a cavity is made in the card body, usually a polycarbonate plastic sheet, whose shape and size are adjusted to the CC module to be implanted. The CC module can be implanted using the widely disseminated Hotmelt procedure. In order to obtain the electrically conductive connection between the connection points of the other connection plane 6 of the CC 1 module and an antenna integrated in the card body, or, in general, a means for non-contact data transfer, in such a way that in the cavity that must house the CC module, connection point is released. Particularly preferably, the connection points are released together with the milling of the cavity. For this purpose, the cavity can receive, for example, a ladder type profile, as indicated in Figures 2 and 3. Figure 2 shows a card body 12 with a cavity 13, in which two connection points are released of the antenna 11. Figure 3 shows a section along the line AA in Figure 2, where the ladder profile of the cavity 13 can be recognized. When implanting, the first contact plane 3 of the module CC is above, and the connection points of the other connection plane 6 are on the connection points released from the antenna 11. The electrically conductive connection in this area, is obtained, for example, when in the area of the points of connection is applied solder soft or anisotropic conductive glue. In order to be able to use a Hotmelt process, the soft solder conveniently has a softening point of around 110 ° C. The CC module manufactured according to the method according to the invention has, in addition to a first contact plane (ISO contact areas), another connection plane, which is secured from outside against disturbances and manipulations. The CC module can be implanted in a card body using common procedures, so that also the manufacture of chip cards is possible simply and economically.

Claims (11)

NOVELTY OF THE INVENTION Having described the above invention, it is considered as a novelty, and therefore, the content of the following is claimed as property: CLAIMS

1. A method for manufacturing a chip card module, which includes a support plate with a first contact plane and a semiconductor chip, as well as electrically conductive connections between the semiconductor chip and the first contact plane, and which , on the side of the support plate opposite the first contact plane, includes another connection plane, which is connected to the semiconductor chip in an electrically conductive manner, characterized in that, independently of the sequence, it includes the following steps: as the other connection plane, a metal band in a longitudinal direction on a first side of a module carrier band, - structuring the metal band to obtain individual connection points from the other connection plane, - laminating a sheet of metal on the other side of the module carrier band and structuring the first contact plane, structuring the module carrier band or perforations for the semiconductor chip and / or for electrically conductive connections, - mount the semiconductor chip and contact the first contact plane and the other connection plane, - coat the semiconductor chip with plastic, and - separating the chip card modules, - carrying out the lamination of the metal strip for the other connection plane and its structuring to obtain individual connection points, before the lamination and structuring of the first contact plane, and - carrying out the structuring of the other connection plane together with the structuring of the module carrier band. A method according to claim 1, characterized in that it also includes at least one of the following steps: - galvanically coating the first contact plane and / or the other connection plane, - placing a support ring on the other connection plane. 3. A method according to claim 1 or 2, characterized in that the module strip is essentially laminated at the center on a first side of the module carrier strip. 4. An electronic data processing circuit method in one of claims 1 to 3, characterized in that the galvanic coating of the first contact plane and the other connection plane is carried out together. 5. A method according to claim 1, characterized in that a support ring is glued on the other connection plane, in particular using a pressure-sensitive glue. 6. A chip card module, manufactured using the method according to claim 1 of claim 1, characterized in that the other connection plane consists of metal and, in particular, of copper. 7. A chip card module according to claim 6, characterized in that the copper is provided with a galvanic coating of nickel followed by a galvanic coating of gold. 8. A chip card module according to claim one of claims 6 or 7, characterized in that the other connection plane has two connection points for connection with an antenna, in particular an induction coil, for the inductive data transfer. 9. A chip card module according to claim one of claims 6 to 8, characterized in that the first contact plane is formed by ISO contact areas. A chip card module according to claim 1 of claim 6, characterized in that it includes a support ring of an elastic material, such as metal, and in particular, copper. 11. A combined card for the transfer of contactless and contact-linked data, characterized in that it includes a chip card module in accordance with the claim in one of claims 6 to 10.