MXPA01000411A - Sujetador de disipador de calor y ensamble de disipador de calor que lo utiliza. - Google Patents

Sujetador de disipador de calor y ensamble de disipador de calor que lo utiliza.

Info

Publication number
MXPA01000411A
MXPA01000411A MXPA01000411A MXPA01000411A MXPA01000411A MX PA01000411 A MXPA01000411 A MX PA01000411A MX PA01000411 A MXPA01000411 A MX PA01000411A MX PA01000411 A MXPA01000411 A MX PA01000411A MX PA01000411 A MXPA01000411 A MX PA01000411A
Authority
MX
Mexico
Prior art keywords
heat sink
same
retainer
assembly
sink assembly
Prior art date
Application number
MXPA01000411A
Other languages
English (en)
Inventor
E Regnier Kent
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Publication of MXPA01000411A publication Critical patent/MXPA01000411A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1429—Housings for circuits carrying a CPU and adapted to receive expansion cards
    • H05K7/1431—Retention mechanisms for CPU modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
MXPA01000411A 2000-01-11 2001-01-11 Sujetador de disipador de calor y ensamble de disipador de calor que lo utiliza. MXPA01000411A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/481,214 US6557626B1 (en) 2000-01-11 2000-01-11 Heat sink retainer and Heat sink assembly using same

Publications (1)

Publication Number Publication Date
MXPA01000411A true MXPA01000411A (es) 2003-08-20

Family

ID=23911087

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA01000411A MXPA01000411A (es) 2000-01-11 2001-01-11 Sujetador de disipador de calor y ensamble de disipador de calor que lo utiliza.

Country Status (7)

Country Link
US (1) US6557626B1 (es)
EP (1) EP1117284A3 (es)
JP (1) JP3502985B2 (es)
CN (1) CN1252560C (es)
MX (1) MXPA01000411A (es)
MY (1) MY124943A (es)
TW (1) TW491513U (es)

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* Cited by examiner, † Cited by third party
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US7225859B2 (en) * 2000-09-01 2007-06-05 Sharp Kabushiki Kaisha Heat exchanger element and heat exchanger member for a stirling cycle refrigerator and method of manufacturing such a heat exchanger member
MXPA02010790A (es) * 2001-03-03 2004-02-26 Zalman Tech Co Ltd Disipador termico y dispositivo para la disipacion de calor que utiliza el mismo.
EP1412979B1 (en) * 2001-06-05 2005-09-07 Heat Technology, Inc. Heatsink assembly and method of manufacturing the same
CA2456992A1 (en) 2001-08-09 2003-02-20 Amy Elise Allen Electronics cooling subassembly
US7124806B1 (en) 2001-12-10 2006-10-24 Ncr Corp. Heat sink for enhanced heat dissipation
US6615910B1 (en) * 2002-02-20 2003-09-09 Delphi Technologies, Inc. Advanced air cooled heat sink
TW588828U (en) * 2003-01-15 2004-05-21 Hon Hai Prec Ind Co Ltd Fan cover
JP2005197303A (ja) * 2003-12-26 2005-07-21 Nippon Densan Corp ヒートシンクファン
US7055577B2 (en) * 2004-02-12 2006-06-06 Hon Hai Precision Ind. Co., Ltd. Heat dissipation device for electronic device
JP2005303015A (ja) * 2004-04-12 2005-10-27 Nippon Densan Corp ヒートシンクファン
US20060011324A1 (en) * 2004-07-13 2006-01-19 Rogers C J Wound, louvered fin heat sink device
TW200635490A (en) * 2005-03-25 2006-10-01 Tai Sol Electronics Co Ltd Combining method of heat dissipating device and conductivity bump and the combination assembly thereof
JP2006278411A (ja) * 2005-03-28 2006-10-12 Nippon Densan Corp ヒートシンクファン
GB0511692D0 (en) * 2005-06-08 2005-07-13 Digital Projection Ltd Heat transfer apparatus
CN100574595C (zh) * 2006-04-14 2009-12-23 鸿富锦精密工业（深圳）有限公司 散热装置
US8365811B2 (en) * 2007-12-07 2013-02-05 Nidec Corporation Heat sink fan
US9228732B2 (en) 2008-07-08 2016-01-05 Us Vaopto, Inc. Modular LED lighting systems, including flexible, rigid, and waterproof lighting strips and connectors
US7972040B2 (en) 2008-08-22 2011-07-05 Virginia Optoelectronics, Inc. LED lamp assembly
US7972037B2 (en) 2008-11-26 2011-07-05 Deloren E. Anderson High intensity replaceable light emitting diode module and array
CH705088A1 (de) * 2011-05-31 2012-12-14 Regent Beleuchtungskoerper Ag Kühlsystem für eine Leuchte.
EP2738456A1 (en) * 2012-11-28 2014-06-04 Chao-Chin Yeh Combination led lamp and heat sink structure
GB201513415D0 (en) * 2015-07-30 2015-09-16 Senior Uk Ltd Finned coaxial cooler
CN108131652B (zh) * 2017-12-06 2020-05-19 梁栋 散热装置及其制造方法
US11665858B2 (en) 2018-04-03 2023-05-30 Raytheon Company High-performance thermal interfaces for cylindrical or other curved heat sources or heat sinks
US11150025B2 (en) 2018-05-10 2021-10-19 Raytheon Company Heat exchangers for multi-axis gimbal pointing or targeting systems
WO2020224777A1 (de) * 2019-05-08 2020-11-12 Siemens Aktiengesellschaft Kühlkörper
TWD210771S (zh) * 2020-04-09 2021-04-01 宏碁股份有限公司 散熱鰭片
CN118049875B (zh) * 2024-04-16 2024-06-18 四川力泓电子科技有限公司 环板式热管、散热机构以及散热系统

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Publication number Priority date Publication date Assignee Title
DE44339C (de) J. BRUUN in Kopenhagen Neuerung an der durch Patent Nr. 43296 geschützten Schmierpumpe mit festem Spiralring und rotirender Flachschiebersteuerung
US2161417A (en) 1936-11-16 1939-06-06 Frederick T Holmes Water heater
US2396216A (en) 1943-04-03 1946-03-05 Stevenson Jordan & Harrison In Method for making air-cooled cylinders
US2413179A (en) 1943-09-20 1946-12-24 Westinghouse Electric Corp Radiator
DE1156173B (de) * 1956-07-11 1963-10-24 Bosch Gmbh Robert Leistungstransistor
USRE25184E (en) 1959-08-03 1962-06-12 Mcadam
NL260951A (es) 1960-03-07
US3185756A (en) 1960-05-02 1965-05-25 Cool Fin Electronics Corp Heat-dissipating tube shield
US3152217A (en) 1960-12-01 1964-10-06 Rca Corp Heat dissipating shield for electronic components
US3187082A (en) 1961-02-01 1965-06-01 Cool Fin Electronics Corp Heat dissipating electrical shield
US3239003A (en) 1962-11-30 1966-03-08 Wakefield Engineering Co Inc Heat transfer
FR1462160A (fr) * 1963-05-28 1966-04-15 Chausson Usines Sa Procédé de fabrication d'un élément échangeur de chaleur, élément obtenu par ce procédé et application de cet élément à la constitution d'échangeurs de chaleur particuliers
US3372733A (en) 1964-02-11 1968-03-12 Russell J. Callender Method of maintaining electrical characteristics of electron tubes and transistors an structure therefor
US3280907A (en) 1964-09-01 1966-10-25 Hoffman Sidney Energy transfer device
US3566958A (en) 1968-12-18 1971-03-02 Gen Systems Inc Heat sink for electrical devices
JPS5989443A (ja) * 1982-11-15 1984-05-23 Nec Corp 放熱翼のろう付方法
US4607685A (en) 1984-07-06 1986-08-26 Burroughs Corporation Heat sink for integrated circuit package
US4753290A (en) 1986-07-18 1988-06-28 Unisys Corporation Reduced-stress heat sink device
US4715438A (en) 1986-06-30 1987-12-29 Unisys Corporation Staggered radial-fin heat sink device for integrated circuit package
US4682651A (en) 1986-09-08 1987-07-28 Burroughs Corporation (Now Unisys Corporation) Segmented heat sink device
US4745456A (en) 1986-09-11 1988-05-17 Thermalloy Incorporated Heat sink clip assembly
US4716494A (en) 1986-11-07 1987-12-29 Amp Incorporated Retention system for removable heat sink
US4733293A (en) 1987-02-13 1988-03-22 Unisys Corporation Heat sink device assembly for encumbered IC package
US5132780A (en) * 1988-01-07 1992-07-21 Prime Computer, Inc. Heat sink apparatus with an air deflection member
JPH088493A (ja) 1994-06-20 1996-01-12 Nippon Steel Corp 半導体レーザ装置における放熱構造
US5597034A (en) 1994-07-01 1997-01-28 Digital Equipment Corporation High performance fan heatsink assembly
JPH08264693A (ja) 1995-03-20 1996-10-11 Calsonic Corp 電子部品用冷却装置
US5561338A (en) * 1995-04-13 1996-10-01 Ilc Technology, Inc. Packaged arc lamp and cooling assembly in a plug-in module
US5810554A (en) 1995-05-31 1998-09-22 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
JP3058818B2 (ja) 1995-10-05 2000-07-04 山洋電気株式会社 電子部品冷却用ヒートシンク
US5785116A (en) 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
US5794685A (en) 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths
US5828551A (en) 1997-03-04 1998-10-27 Hoshino Kinzoku Koygo Kabushiki Kaisha Heat sink apparatus for an electronic component
ATE248344T1 (de) * 1997-08-19 2003-09-15 Grueter Elektroapp Ag Extruderrohr mit einem wärmetauscher
US5927385A (en) 1998-01-21 1999-07-27 Yeh; Ming Hsin Cooling device for the CPU of computer
US6851467B1 (en) * 1999-08-30 2005-02-08 Molex Incorporated Heat sink assembly

Also Published As

Publication number Publication date
JP2001251073A (ja) 2001-09-14
US6557626B1 (en) 2003-05-06
CN1252560C (zh) 2006-04-19
CN1304068A (zh) 2001-07-18
EP1117284A2 (en) 2001-07-18
JP3502985B2 (ja) 2004-03-02
TW491513U (en) 2002-06-11
EP1117284A3 (en) 2003-03-19
MY124943A (en) 2006-07-31

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Legal Events

Date Code Title Description
FG Grant or registration