MX2012010354A - Photovoltaic module with stabilized polymer. - Google Patents
Photovoltaic module with stabilized polymer.Info
- Publication number
- MX2012010354A MX2012010354A MX2012010354A MX2012010354A MX2012010354A MX 2012010354 A MX2012010354 A MX 2012010354A MX 2012010354 A MX2012010354 A MX 2012010354A MX 2012010354 A MX2012010354 A MX 2012010354A MX 2012010354 A MX2012010354 A MX 2012010354A
- Authority
- MX
- Mexico
- Prior art keywords
- poly
- vinyl butyral
- layer
- benzotriazole
- photovoltaic device
- Prior art date
Links
- 229920000642 polymer Polymers 0.000 title description 9
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims abstract description 73
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052709 silver Inorganic materials 0.000 claims abstract description 15
- 239000004332 silver Substances 0.000 claims abstract description 15
- 239000012964 benzotriazole Substances 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 79
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 38
- 239000010409 thin film Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 14
- 230000001681 protective effect Effects 0.000 claims description 14
- 239000002648 laminated material Substances 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000002530 phenolic antioxidant Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 229910052793 cadmium Inorganic materials 0.000 claims description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 239000011133 lead Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052703 rhodium Inorganic materials 0.000 claims description 2
- 239000010948 rhodium Substances 0.000 claims description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- 239000011229 interlayer Substances 0.000 claims 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims 1
- -1 poly(vinyl butyral) Polymers 0.000 abstract description 6
- 238000004383 yellowing Methods 0.000 abstract description 4
- 230000004888 barrier function Effects 0.000 abstract description 2
- 239000004014 plasticizer Substances 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 14
- 239000000654 additive Substances 0.000 description 12
- 239000011521 glass Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- JOADGALWHMAAKM-UHFFFAOYSA-L magnesium;2-ethylbutanoate Chemical compound [Mg+2].CCC(CC)C([O-])=O.CCC(CC)C([O-])=O JOADGALWHMAAKM-UHFFFAOYSA-L 0.000 description 5
- 239000013047 polymeric layer Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 230000010287 polarization Effects 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- VFBJXXJYHWLXRM-UHFFFAOYSA-N 2-[2-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]ethylsulfanyl]ethyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCSCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 VFBJXXJYHWLXRM-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical class OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 159000000003 magnesium salts Chemical class 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical compound CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 2
- 229910004613 CdTe Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- NTYJJOPFIAHURM-UHFFFAOYSA-N Histamine Chemical compound NCCC1=CN=CN1 NTYJJOPFIAHURM-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- FRQDZJMEHSJOPU-UHFFFAOYSA-N Triethylene glycol bis(2-ethylhexanoate) Chemical compound CCCCC(CC)C(=O)OCCOCCOCCOC(=O)C(CC)CCCC FRQDZJMEHSJOPU-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 2
- 238000006359 acetalization reaction Methods 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- SHZIWNPUGXLXDT-UHFFFAOYSA-N caproic acid ethyl ester Natural products CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- OJXOOFXUHZAXLO-UHFFFAOYSA-M magnesium;1-bromo-3-methanidylbenzene;bromide Chemical compound [Mg+2].[Br-].[CH2-]C1=CC=CC(Br)=C1 OJXOOFXUHZAXLO-UHFFFAOYSA-M 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000012768 molten material Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- 239000000326 ultraviolet stabilizing agent Substances 0.000 description 2
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- DLZBUNUDESZERL-UHFFFAOYSA-N 1-o-heptyl 6-o-nonyl hexanedioate Chemical compound CCCCCCCCCOC(=O)CCCCC(=O)OCCCCCCC DLZBUNUDESZERL-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- GCDUWJFWXVRGSM-UHFFFAOYSA-N 2-[2-(2-heptanoyloxyethoxy)ethoxy]ethyl heptanoate Chemical compound CCCCCCC(=O)OCCOCCOCCOC(=O)CCCCCC GCDUWJFWXVRGSM-UHFFFAOYSA-N 0.000 description 1
- JEYLQCXBYFQJRO-UHFFFAOYSA-N 2-[2-[2-(2-ethylbutanoyloxy)ethoxy]ethoxy]ethyl 2-ethylbutanoate Chemical compound CCC(CC)C(=O)OCCOCCOCCOC(=O)C(CC)CC JEYLQCXBYFQJRO-UHFFFAOYSA-N 0.000 description 1
- SSKNCQWPZQCABD-UHFFFAOYSA-N 2-[2-[2-(2-heptanoyloxyethoxy)ethoxy]ethoxy]ethyl heptanoate Chemical compound CCCCCCC(=O)OCCOCCOCCOCCOC(=O)CCCCCC SSKNCQWPZQCABD-UHFFFAOYSA-N 0.000 description 1
- GOJUJUVQIVIZAV-UHFFFAOYSA-N 2-amino-4,6-dichloropyrimidine-5-carbaldehyde Chemical group NC1=NC(Cl)=C(C=O)C(Cl)=N1 GOJUJUVQIVIZAV-UHFFFAOYSA-N 0.000 description 1
- LGYNIFWIKSEESD-UHFFFAOYSA-N 2-ethylhexanal group Chemical group C(C)C(C=O)CCCC LGYNIFWIKSEESD-UHFFFAOYSA-N 0.000 description 1
- FLFWJIBUZQARMD-UHFFFAOYSA-N 2-mercapto-1,3-benzoxazole Chemical compound C1=CC=C2OC(S)=NC2=C1 FLFWJIBUZQARMD-UHFFFAOYSA-N 0.000 description 1
- MHCVYAFXPIMYRD-UHFFFAOYSA-N 2-phenylsulfanylethylsulfanylbenzene Chemical compound C=1C=CC=CC=1SCCSC1=CC=CC=C1 MHCVYAFXPIMYRD-UHFFFAOYSA-N 0.000 description 1
- GUOVBFFLXKJFEE-UHFFFAOYSA-N 2h-benzotriazole-5-carboxylic acid Chemical compound C1=C(C(=O)O)C=CC2=NNN=C21 GUOVBFFLXKJFEE-UHFFFAOYSA-N 0.000 description 1
- HCILJBJJZALOAL-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)-n'-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyl]propanehydrazide Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 HCILJBJJZALOAL-UHFFFAOYSA-N 0.000 description 1
- YYGNSEHPYQFDLN-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoic acid;ethenylsulfanylethene Chemical compound C=CSC=C.CC(C)(C)C1=CC(CCC(O)=O)=CC(C(C)(C)C)=C1O.CC(C)(C)C1=CC(CCC(O)=O)=CC(C(C)(C)C)=C1O YYGNSEHPYQFDLN-UHFFFAOYSA-N 0.000 description 1
- LRUDIIUSNGCQKF-UHFFFAOYSA-N 5-methyl-1H-benzotriazole Chemical compound C1=C(C)C=CC2=NNN=C21 LRUDIIUSNGCQKF-UHFFFAOYSA-N 0.000 description 1
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- GPZYYYGYCRFPBU-UHFFFAOYSA-N 6-Hydroxyflavone Chemical compound C=1C(=O)C2=CC(O)=CC=C2OC=1C1=CC=CC=C1 GPZYYYGYCRFPBU-UHFFFAOYSA-N 0.000 description 1
- JAWZFTORYMQYDT-UHFFFAOYSA-N 6-hexoxy-6-oxohexanoic acid Chemical compound CCCCCCOC(=O)CCCCC(O)=O JAWZFTORYMQYDT-UHFFFAOYSA-N 0.000 description 1
- OIUGWVWLEGLAGH-UHFFFAOYSA-N 6-nonoxy-6-oxohexanoic acid Chemical class CCCCCCCCCOC(=O)CCCCC(O)=O OIUGWVWLEGLAGH-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- ZNZYKNKBJPZETN-WELNAUFTSA-N Dialdehyde 11678 Chemical compound N1C2=CC=CC=C2C2=C1[C@H](C[C@H](/C(=C/O)C(=O)OC)[C@@H](C=C)C=O)NCC2 ZNZYKNKBJPZETN-WELNAUFTSA-N 0.000 description 1
- PYGXAGIECVVIOZ-UHFFFAOYSA-N Dibutyl decanedioate Chemical compound CCCCOC(=O)CCCCCCCCC(=O)OCCCC PYGXAGIECVVIOZ-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 239000004262 Ethyl gallate Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- MQHWFIOJQSCFNM-UHFFFAOYSA-L Magnesium salicylate Chemical compound [Mg+2].OC1=CC=CC=C1C([O-])=O.OC1=CC=CC=C1C([O-])=O MQHWFIOJQSCFNM-UHFFFAOYSA-L 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
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- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 1
- 125000004036 acetal group Chemical group 0.000 description 1
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- 229920000180 alkyd Polymers 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
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- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
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- ZZEMEJKDTZOXOI-UHFFFAOYSA-N digallium;selenium(2-) Chemical compound [Ga+3].[Ga+3].[Se-2].[Se-2].[Se-2] ZZEMEJKDTZOXOI-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
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- 239000003063 flame retardant Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229960001340 histamine Drugs 0.000 description 1
- HNDVDQJCIGZPNO-UHFFFAOYSA-N histidine Natural products OC(=O)C(N)CC1=CN=CN1 HNDVDQJCIGZPNO-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
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- 150000002460 imidazoles Chemical class 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
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- 239000004611 light stabiliser Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229940072082 magnesium salicylate Drugs 0.000 description 1
- LBYCWLBCHNSWFE-UHFFFAOYSA-L magnesium;pyridine-3-carboxylate Chemical compound [Mg+2].[O-]C(=O)C1=CC=CN=C1.[O-]C(=O)C1=CC=CN=C1 LBYCWLBCHNSWFE-UHFFFAOYSA-L 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000011020 pilot scale process Methods 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- LJXQPZWIHJMPQQ-UHFFFAOYSA-N pyrimidin-2-amine Chemical compound NC1=NC=CC=N1 LJXQPZWIHJMPQQ-UHFFFAOYSA-N 0.000 description 1
- HBCQSNAFLVXVAY-UHFFFAOYSA-N pyrimidine-2-thiol Chemical compound SC1=NC=CC=N1 HBCQSNAFLVXVAY-UHFFFAOYSA-N 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- VLLMWSRANPNYQX-UHFFFAOYSA-N thiadiazole Chemical compound C1=CSN=N1.C1=CSN=N1 VLLMWSRANPNYQX-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
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- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10678—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer comprising UV absorbers or stabilizers, e.g. antioxidants
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- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10761—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
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- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
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- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
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- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0376—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including amorphous semiconductors
- H01L31/03762—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including amorphous semiconductors including only elements of Group IV of the Periodic System
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/075—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PIN type
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- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The present invention provides a photovoltaic device comprising metal and a poly(vinyl butyral) layer that incorporates a suitable amount of lH-benzotriazole. When electrical bias is applied to the photovoltaic device, lH-benzotriazole forms a barrier layer at the metal/poly(vinyl butyral) interface, which, for example, unexpectedly virtually eliminated the yellowing of poly(vinyl butyral) in photovoltaic devices comprising silver components.
Description
PHOTOVOLTAIC MODULE WITH STABILIZED POLYMER
FIELD OF THE INVENTION
The present invention belongs to the field of photovoltaic modules and, specifically, the present invention pertains to the field of thin film photovoltaic modules that incorporate a polymeric layer and a photovoltaic device on a suitable thin film photovoltaic substrate.
BACKGROUND OF THE INVENTION
Currently there are two common types of photovoltaic (solar) modules in use. The first type of photovoltaic module uses a semiconductor wafer as a substrate and the second type of photovoltaic module uses a thin semiconductor film which is deposited on a suitable substrate.
The semiconductor wafer type photovoltaic modules typically comprise the crystalline silicon wafers which are commonly used in various solid state electronic devices, such as computer memory chips and computer processors.
Thin-film photovoltaic modules can incorporate one or more conventional semiconductors, such as amorphous silicon, onto a suitable substrate. Unlike chip applications, in which a chip is cut from an ingot, thin film photovoltaic modules are formed using comparatively simple deposition techniques such as spray coating, physical vapor deposition (PVD), by their acronyms in English) or chemical vapor deposition (CVD, for its acronym in English).
Thin film photovoltaic modules typically incorporate a layer of ethylene-vinyl acetate copolymer (EVA) or a layer of poly (vinyl butyral) (PVB) to seal and protect the underlying photovoltaic device. The reliable long-term operation of the photovoltaic module is, of course, extremely important and, therefore, the stability of the polymer layer is a fundamental factor for any specific photovoltaic device.
Although EVA has been used extensively in photovoltaic modules, the use of poly (vinyl butyral) is very desirable because it does not present the same disadvantages as EVA, such as degradation by acetic acid, as detailed in the United States Patent Publication.
2007/0259998.
Although it is often preferable to employ poly (vinyl butyral), it has been found that the poly (vinyl butyral) turns yellow when in contact with silver-containing elements.
Accordingly, poly (vinyl butyral) compositions that are suitable for long-term stable use in photovoltaic modules containing metallic elements are needed in the art.
SUMMARY OF THE INVENTION
The present invention provides a photovoltaic device comprising metal and a layer of poly (vinyl butyral) which incorporates a suitable amount of 1H benzotriazole. When electric polarization is applied to the photovoltaic device, the 1H benzotriazole forms a barrier layer at the metal / poly (vinyl butyral) interface, which, for example, unexpectedly virtually eliminates the yellowing of poly (vinyl butyral) in photovoltaic devices that They comprise silver components.
BRIEF DESCRIPTION OF THE DRAWINGS
Figure 1 represents a schematic cross-sectional view of a thin film photovoltaic device of the present invention.
DETAILED DESCRIPTION
The thin film photovoltaic devices of the present invention include a layer of poly (vinyl butyral) formulated according to the description herein, which provides excellent adhesion, strength, sealing, processability and durability to the photovoltaic device and comprising 1H benzotriazole.
One embodiment of a thin film photovoltaic module of the present invention is shown in Figure 1 generally as 10. As shown in the Figure, a photovoltaic device 14 is formed on a base substrate 12, which may be, for example, glass or plastic. A protective substrate 18 is attached to the photovoltaic device 14 with a layer of poly (vinyl butyral) 16.
As used herein, "1H benzotriazole" refers to the compound shown in the following formula:
1 H benzotriazole may be included in the poly (vinyl butyral) layer in any suitable amount and, in various embodiments, 1 H benzotriazole is included, as a percentage by weight, of 0.001 to 5%, 0.01 to 5%, 0, 1 to 5%, 1 to 5%, 2 to 5% or 0.1 to 0.4%.
The 1H benzotriazole is preferably included in the poly (vinyl butyral) at the time of formation of a polymeric layer through the melting composition of the 1H benzotriazole with the poly (vinyl butyral) resin and any other additive. The 1H benzotriazole may also be provided in the form of a salt, for example, sodium, potassium and ammonium.
1H benzotriazole is a known corrosion inhibitor for copper, silver, cobalt, aluminum and zinc. It is marketed by PMC Specialties Group and sold under the trademark Cobratec 99. Other corrosion inhibitors that are useful for photovoltaic devices of the present invention include: 1H-benzotriazole derivatives such as 5-methyl-1H-benzotriazole, 5-carboxybenzotriazole and other alkyl derivative of 1H benzotriazole; imidazole and imidazole derivatives such as benzimidizole, 5,6-dimethylbenzimdiazole, 2-mercaptobenzoimidazole and fatty acid derivatives of 4,5-dihydro-? imidazole; thiadiazole and thiadiazole alkyl derivatives such as 2-mercaptobenzothiazole, 1,2-bis (phenylthio) ethane, 2,5-bis (n-octyldithio) -1,4,4-thiadiazole, 2-amino, 5-mercapto, 1,3,4-thiadizole, 2 mercaptopyrimidine, 2-mercaptobenzoxazole; histamine; histidine; and 2 aminopyrimidine.
Additional additives
Additional additives that may be included in polymer layers of the present invention to improve stability and performance include metal passivators such as Irganox MD 1024® (CAS 32687 78 8) and Naugard XL 1® (CAS 70331 94 1), light stabilizers blocked amine such as Tinuvin 123® (CAS129757 67 1) and phenolic antioxidants such as Anox 70® (2,2'-thiodiethylene bis [3 (3,5-di-t-butyl-4-hydroxyphenyl) propionate] CAS 41484 35 9).
It is expected that the combination of any of the above polymeric stabilizers with benzotriazole will achieve additional stability of poly (vinyl butyral) at the poly (vinyl butyral) -metal interface and within the polymer. Experimental data have suggested that the addition of benzotriazole and Anox 70® in a poly (vinyl butyral) formulation in fact further reduces polymeric discoloration and protects the structure of thin-film solar panels. In various embodiments of the present invention, 1 H benzotriazole and a phenolic antioxidant are incorporated into a layer of poly (vinyl butyral) and, in some embodiments, 1 H benzotriazole and 2,2'-tiodiethylene bis [3- (3, 5 -di-t-butyl-4-hydroxyphenyl) propionate to a layer of poly (vinyl butyral).
Poly (vinyl butyral) layer
The thin film photovoltaic modules of the present invention utilize a layer of poly (vinyl butyral) as the lamination adhesive that is used to seal the photovoltaic device to a protective substrate, thereby forming the photovoltaic module of the present invention.
The poly (vinyl butyral) of the present invention can be produced by acetalization processes, such as are known in the art (see, for example, U.S. Patent Nos. 2,282,057 and 2,282,026). In one embodiment, the solvent method described in Vinyl Acetal Polymers, in the Encyclopedia of Polymer Science & Technology, 3rd edition, Volume 8, pages 381-399, by B.E. Wade (2003). In another embodiment, the aqueous method described therein can be used. Poly (vinyl butyral) is commercially available in various forms, for example, from Solutia Inc., St. Louis, Mo., as Butvar ™ resin.
In various embodiments, the poly (vinyl butyral) comprises 10 to 35 weight percent (% p.) Of hydroxyl groups calculated as poly (vinyl alcohol), 13 to 30% p. of hydroxyl groups calculated as poly (vinyl alcohol) or 15 to 22% p. of hydroxyl groups calculated as poly (vinyl alcohol). The polymeric layer resin may also comprise less than 15% p. of residual ester groups, 13% p.; ll% p., 9% p., 7% p., 5% p. or less than 3% p. of residual ester groups calculated as polyvinyl acetate, the remainder being an acetal, preferably butyraldehyde acetal, but optionally including other acetal groups in lesser amount, for example, a 2-ethyl hexanal group (see, for example, U.S. Pat. No. 5,137,954).
In various embodiments, the poly (vinyl butyral) has a molecular weight of at least 30,000, 40,000, 50,000, 55,000, 60,000, 65,000, 70,000, 120,000, 250,000 or at least 350,000 grams per mole (g / mol or Daltons). Small amounts of a dialdehyde or trialdehyde may also be added during the acetalization step to increase the molecular weight to at least 350,000 g / mol (see, for example, U.S. Patent Nos. 4,902,464; 4,874,814; 4,814,529; and 4,654,179). As used herein, the term "molecular weight" means the weight average molecular weight.
Various adhesion control agents can be used in the polymeric layers of the present invention, including sodium acetate, potassium acetate and magnesium salts. Magnesium salts that can be used with these embodiments of the present invention include, but are not limited to, those disclosed in U.S. Patent No. 5,728,472, such as magnesium salicylate, magnesium nicotinate, di- (2 magnesium di- (3-hydroxy-2-naptoate) and magnesium bis (2-ethyl butyrate) (chemical abstract number 79992-76-0). In various embodiments of the present invention the magnesium salt is magnesium bis (2-ethyl butyrate).
In various polymeric layer embodiments of the present invention, the polymeric layers may comprise 20 to 60, 25 to 60, 20 to 80, 10 to 70 or 10 to 100 parts of phr plasticizer. Obviously, other quantities may be used, as appropriate for the specific application. In some embodiments, the plasticizer has a hydrocarbon segment of less than 20, less than 15, less than 12, or less than 10 carbon atoms. The amount of plasticizer can be adjusted to affect the vitreous transition temperature (Tg) of the poly (vinyl butyral) layer. In general, larger amounts of plasticizer are added to lower the Tg.
Any suitable plasticizer can be added to the polymer resins of the present invention to form the polymer layers. The plasticizers used in the polymeric layers of the present invention can include esters of a polybasic acid or a polyhydric alcohol, among others. Suitable plasticizers include, for example, triethylene glycol di- (2-ethylbutyrate), triethylene glycol di- (2-ethylhexanoate), triethylene glycol diheptanoate, tetraethylene glycol diheptanoate, dihexyl adipate, dioctyl adipate, hexyl cyclohexyldipate, mixtures of heptyl and nonyl adipates, diisononyl adipate, heptylnonyl adipate, dibutyl sebacate, polymeric plasticizers such as oil-modified sebacic alkyds, phosphate and adipate mixtures such as those disclosed in U.S. Patent No. 3,841,890 , adipates such as those disclosed in U.S. Patent No. 4,144,217 and mixtures and combinations of the foregoing. Other plasticizers that can. used are mixed adipates made from C4 to C9 alkyl alcohols and C4 to CIO cycloalcohols, such as disclosed in U.S. Patent No. 5,013,779 and C6 to C8 adipate esters, such as hexyl adipate. In various embodiments, the plasticizer used is dihexyl adipate and / or triethylene glycol di-2-ethylhexanoate.
The poly (vinyl butyral) polymer, the plasticizer and any additive can be thermally processed and shaped into a sheet according to methods known to those skilled in the art. An exemplary method for forming a poly (vinyl butyral) sheet comprises extruding molten poly (vinyl butyral) comprising resin, plasticizer and additives, by passing the molten material through a matrix (e.g., a matrix having an aperture that is substantially greater in one dimension than in a perpendicular dimension).
Another exemplary method for forming a poly (vinyl butyral) sheet comprises casting the molten material of a matrix on a roll, solidifying the resin and subsequently removing the solidified resin as a sheet. In various embodiments, the polymer layers may have a thickness of, for example, 0.1 to 2.5 millimeters, 0.2 to 2.0 millimeters, 0.25 to 1.75 millimeters, and 0.3 to 1.5 millimeters. millimeters
The poly (vinyl butyral) layers of the present invention may include low molecular weight epoxy additives. Any suitable epoxy agents can be used in the present invention, such as are known in the art (see, for example, U.S. Patent Nos. 5,529,848 and 5,529,849).
Other additives may be incorporated into the polymeric sheet to improve its performance in a final product. Such additives include, but are not limited to, dyes, pigments, stabilizers (eg, ultraviolet stabilizers), antioxidants, anti-blocking agents, additional IR absorbers, flame retardant, combinations of the foregoing additives and the like, as are known in the art. .
Typical ultraviolet stabilizers include substituted 2H-benzotriazoles, such as those marketed by Ciba Specialty Company under the trademark Tinuvin®, for example, Tinuvin 328®, as shown in Formula II:
Formula i)
Substrate base
The base substrates of the present invention, which are shown as element 12 in Figure 1, can be any suitable substrate on which the photovoltaic devices of the present invention can be formed. Examples include, but are not limited to, glass and rigid plastic glazing materials that provide "rigid" thin film modules and thin plastic films such as poly (ethylene terephthalate), polyimides, fluoropolymers, and the like, which provide thin film modules " flexible " It is generally preferred that the base substrate allows the transmission of most of the incident radiation in the range of 350 to 1200 nanometers, but those skilled in the art will recognize that there are possible variations, including variations in which light enters the photovoltaic device through the protective substrate.
Thin film photovoltaic device
The thin film photovoltaic devices of the present invention, which are shown as the element 14 in Figure 1, are formed directly on the base substrate. Typical fabrication of the device involves the deposition of a first conductive layer, etching of the first conductive layer, deposition and etching of semiconductor layers, deposition of a second conductive layer, etching of the second conductive layer and application of conductors for bars and protective layers , depending on the application. Optionally, an electrically insulating layer can be formed on the base substrate between the first conductive layer and the base substrate. This optional layer can be, for example, a layer of silicon.
Although the 1H benzotriazole agent of the present invention can be added to polymeric layers for use in silver-free photovoltaic devices, in preferred embodiments, the 1H benzotriazole is used in a layer of poly (vinyl butyral) which is used in a photovoltaic module which it has a photovoltaic device comprising silver. Examples of silver components include, but are not limited to, layers or conductive elements (such as wire grid) or reflective layers (see, for example, US2006 / 0213548).
In other embodiments, the 1H benzotriazole agent of the present invention may be added to the polymeric layers for use in photovoltaic devices comprising other metals that are subject to degradation, including, for example, bismuth, copper, cadmium, lead, tin, zinc , gold, indium, palladium, platinum, aluminum, antimony, chromium, iron, nickel, rhodium, tantalum, titanium or vanadium.
Those skilled in the art will recognize that the foregoing description of the manufacture of the device is only one known method and is only one embodiment of the present invention. Many different types of thin film photovoltaic devices are within the scope of the present invention. Examples of training methods and devices include those described in U.S. Patent Documents 2003/0180983, 7,074,641, 6,455,347, 6,500,690, 2006/0005874,
2007/0235073, 7,271,333 and 2002/0034645.
The various components of the thin film photovoltaic device can be formed by any suitable method. In various embodiments, chemical vapor deposition (CVD), physical vapor deposition (PVD), and / or spraying can be used.
The two conductive layers described above serve as electrodes for carrying the current generated by the interleaved semiconductor material. One of the electrodes is typically transparent to allow solar radiation to reach the semiconductor material. Obviously, both conductors can be transparent or one of the conductors can be reflective, resulting in reflection of the light that has passed through the semiconductor material back into the semiconductor material. The conductive layers can comprise any suitable conductive oxide material, such as tin oxide or zinc oxide or if the transparency is not fundamental, such as for "background" electrodes, metal or metal alloy layers, such as the metal layers, can be used. which comprise aluminum or silver. In other embodiments, the metal oxide layer can be combined with the metal layer to form an electrode, and the metal oxide layer can be doped with boron or aluminum and deposited using chemical vapor deposition at low pressure. The conductive layers may have, for example, 0.1 to 10 micrometers in thickness.
The photovoltaic region of the thin film photovoltaic device may comprise, for example, hydrogenated amorphous silicon in a conventional PI or PN structure. The silicon typically can be up to about 500 nanometers thick, typically comprising a layer p having a thickness of 3 to 25 nanometers (a layer i of 20 to 450 nanometers and a layer n of 20 to 40 nanometers). luminescent discharge in silane or a mixture of silane and hydrogen, as described, for example, in U.S. Patent No. 4,064,521.
Alternatively, the semiconductor material can be micromorph silicon, cadmium telluride (CdTe or CdS / CdTe), indium copper diselenide, (CuInSe2 or "CIS" or CdS / CuInSe2), copper, indium and gallium selenide (CuInGaSe2 or "CIGS"). ") or other photovoltaically active materials. The photovoltaic devices of this invention may have additional semiconductor layers or combinations of the preceding semiconductor types and may have a serial, triple junction or heterounion structure.
The engraving of the layers to form the individual components of the device can be carried out using any conventional semiconductor manufacturing technique, including, but not limited to, screen printing with resistant stencils, etching with positive or negative photoresists, mechanical plotting, tracing by unloading electrical, chemical engraving or laser engraving. The etching of the various layers will typically result in the formation of individual photocells within the device. Said devices can be electrically connected to other devices using busbars that are inserted or formed at any suitable stage of the manufacturing process.
Optionally, a protective layer can be formed on the photocells before assembly with the poly (vinyl butyral) layer and the protective substrate. The protective layer can be, for example, powdered aluminum.
The electrically interconnected photocells formed from the optional insulating layer, the conductive layers, the semiconductor layers and the optional protective layer form the photovoltaic device of the present invention.
Protective substrate
The protective substrates of the present invention, which are shown as the element 18 in Figure 1, can be any suitable substrate that can be used to bind to the polymeric layer and sufficiently protect the underlying device. The examples include, not limited to, glass, rigid plastic and thin plastic films such as poly (ethylene terephthalate), polyimides, fluoropolymers and the like. In general, it is preferred that the protective substrate allow the transmission of most of the incident radiation in the range of 350 to 1200 nanometers, but those skilled in the art will recognize that there are possible variations, including variations in which light enters the photovoltaic device through the base substrate. In these embodiments, it is not necessary that the protective substrate be transparent or for the most part not and can be, for example, a reflective film that prevents light from leaving the photovoltaic module through the protective substrate.
Ensamblaj e
The final assembly of the thin film photovoltaic modules of the present invention involves arranging a layer of poly (vinyl butyral) in contact with a thin film photovoltaic device, with bus bars, if applicable, that has been formed on a base substrate, arranging a protective substrate in contact with the poly (vinyl butyral) layer and laminating the assembly to form the module.
Although the main body of this application has been described with the preferred embodiment exemplified, the present invention includes within its scope all photovoltaic devices comprising a silver and poly (vinyl butyral) component, including standard photovoltaic devices (without thin film). ), as well as other multilayer laminated materials comprising a polyvinyl butyral sheet in contact with a degradable metal component (e.g., solar glass and mirrors), which are known in the art.
The present invention includes poly (vinyl butyral) sheets having any of the components described herein and incorporating 1 H benzotriazole and, optionally, any additional additives as described herein.
The present invention includes a method for manufacturing a photovoltaic module, comprising the steps of providing a base substrate, forming a photovoltaic device of the present invention thereon and laminating the photovoltaic device with a protective substrate using a layer of poly (vinyl butyral) ) of the present invention.
The present invention includes photovoltaic modules comprising polymeric layers of the present invention.
EXAMPLES
Example 1
Using a small extruder on a laboratory scale, 750 grams of poly (vinyl butyral) resin with a vinyl alcohol content of about 18.7% and a vinyl acetate residue of 0.5-4% p with 285 were mixed. grams of di- (2 ethylhexanoate) of triethylene glycol as a plasticizer, 2.63 grams of the Tinuvin 328® UV absorber, 0.19 grams of magnesium (2-ethylbutyrate) as an adhesion control salt and various additives as shown in Table 1 and extruded in sheets 0.76 millimeters thick.
The sheets were used to laminate a thin-film solar cell (15x15 centimeters). The laminates were exposed to 85 ° C with 85% relative humidity at 1000 volts of polarization for 1000 hours. The yellowness indexes of the laminated materials after the exposure of 1000 hours were measured. The yellowness index typical of laminate materials before exposure of approximately 12 (between 11 and 13).
Example 2
Sheets (1.14 mm thick) were prepared in the following manner in a pilot-scale extruder: for every 100 grams of poly (vinyl butyral) resin, se. they added 38 grams of di- (2-ethylhexanoate) of triethylene glycol as a plasticizer, 0.35 grams of Tinuvin 328®, 0.025 grams of magnesium (2-ethylbutyrate) and various additives as shown in Table 2. Glass was used coated with silver and other layers to prepare the laminated materials of poly (vinyl butyral). The size of the coated glass is 7x9 centimeters. The laminated materials were tested for 670 hours at 85 ° C, with 85% relative humidity (RH) and 1,000 volts of electric polarization.
Table 1
Table 2
Example 3
The concentration of silver in Control No. 2 and Sample 4 of Example 1 was determined after exposure for 1000 hours. The samples were delaminated. The plasticizer was removed from the layers by wetting and stirring in a mixture of 75:25 hexane / ethyl acetate. The recovered poly (vinyl butyral) resin retained the color and was then dissolved in acid and analyzed for silver content using a Perkin Elmer Optima 3300 DV instrument. A standard sheet of poly (vinyl butyral) was also analyzed to determine the silver content.
Table 3
The "yellowness index" was measured on intact glass laminate material. The sample was measured by hemispherical reflectance with the specular component excluded according to the sample method of ASTM E 1331 and where the clear surface of the glass is oriented towards the light source. Using the reflectance values throughout the visible spectrum, the value of the yellowness index was calculated using column "C, 1931" of "Coefficients of the Equations for Yello ness Index" presented in table 1 of the method ASTM E 313"Standard Test Method for Yellowness Index of Plastics ".
The evaluation under polarization is achieved by first forming the following construct: electrode / glass layer / photovoltaic film / electrode / poly (vinyl butyral) / glass layer. A voltage of 1,000 direct current is then applied, resulting in a current of approximately 0.1 milliamperes.
As shown in the examples, the addition of Tinuvin 328®, a substituted 2H-benzotriazole derivative shown in Formula II, does not prevent yellowing, highlighting the resounding success of 1H benzotriazole.
By virtue of the present invention, it is now possible to provide thin film photovoltaic modules which have excellent stability of poly (vinyl butyral) and resistance to yellowing when used with photovoltaic devices containing silver.
Although the invention has been described with reference to the exemplary embodiments, those skilled in the art will understand that various changes may be made and the equivalents may be replaced by elements thereof without departing from the scope of the invention. Additionally, many modifications can be made to adapt a specific situation or material to the teachings of the invention without departing from the essential scope thereof. Accordingly, it is intended that the invention not be limited to the specific embodiments disclosed as the best form contemplated for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims.
Furthermore, it will be understood that any ranges, values or features provided for a single component of the present invention can be used interchangeably with any ranges, values or features provided for any of the other components of the invention, when compatible, to form a modality that has defined values for each of the components, such as are provided throughout the present. For example, thin film modules can comprise combinations of poly (vinyl butyral) and photovoltaic elements to form many permutations that are within the scope of the present invention, but which would be extremely cumbersome to list.
Any reference numbers of Figures provided within the summary or any claims are for illustrative purposes only and are not to be construed as limiting the claimed invention to any specific embodiment in any figure.
The figures are not drawn to scale unless otherwise indicated.
Each reference, including newspaper articles, patents, applications and books, mentioned herein are incorporated by reference herein in their entirety.
Claims (19)
1. A photovoltaic module comprising: a base substrate; a photovoltaic device arranged in contact with the base substrate, wherein the photovoltaic device comprises a metal component; a layer of poly (vinyl butyral) disposed in contact with the photovoltaic device, wherein the layer of poly (vinyl butyral) comprises IH benzotriazole or salt of IH benzotriazole; and a protective substrate disposed in contact with the poly (vinyl butyral) layer.
2. The module according to claim 1, characterized in that the photovoltaic device is a thin film photovoltaic device.
3. The module according to claim 2, characterized in that the poly (vinyl butyral) layer comprises 0.001 to 5 weight percent of IH benzotriazole.
4. The module according to claim 2, characterized in that the layer of poly (vinyl butyral) comprises 0.1 to 0.4 weight percent of IH benzotriazole.
5. The module according to claim 2, characterized in that the poly (vinyl butyral) layer comprises 1 to 5 weight percent of IH benzotriazole.
6. The module according to claim 2, characterized in that the poly (vinyl butyral) layer further comprises a phenolic antioxidant.
7. The module according to claim 2, characterized in that the metal is bismuth, copper, cadmium, lead, tin, zinc, silver, gold, indium, palladium, platinum, aluminum, antimony, chromium, iron, nickel, rhodium, tantalum, titanium or vanadium.
8. The module according to claim 2, characterized in that the metal is silver.
9. The module according to claim 2, characterized in that the metallic component is used as the conductive layer.
10. A polymeric interlayer layer comprising a poly (vinyl butyral) sheet comprising 0.001 to 5 weight percent of 1H benzotriazole.
11. The interleaved layer according to claim 10, characterized in that the poly (vinyl butyral) sheet comprises 0.1 to 0.4 weight percent of 1H benzotriazole.
12. The interleaved layer according to claim 10, characterized in that the poly (vinyl butyral) sheet comprises 1 to 5 weight percent of 1H benzotriazole.
13. The interleaved layer according to claim 10, characterized in that the poly (vinyl butyral) sheet further comprises a phenolic antioxidant.
14. A multilayer laminate material comprising a first substrate; a metal component disposed in contact with the first substrate; a layer of poly (vinyl butyral) disposed in contact with the metal component, wherein the layer of poly (vinyl butyral) comprises 1 H benzotriazole or 1 H benzotriazole salt; and a second substrate disposed in contact with the poly (vinyl butyral) layer.
15. The multilayer laminate material according to claim 14, characterized in that the poly (vinyl butyral) sheet comprises 0.1 to 0.4 weight percent of 1H benzotriazole.
16. The multilayer laminate material according to claim 14, characterized in that the poly (vinyl butyral) sheet comprises 1 to 5 weight percent of 1H benzotriazole.
17. The multilayer laminate material according to claim 14, characterized in that the poly (vinyl butyral) sheet comprises 0.001 to 5 weight percent of 1H benzotriazole.
18. The multilayer laminate material according to claim 14, characterized in that the poly (vinyl butyral) sheet further comprises a phenolic antioxidant.
19. A method for manufacturing a photovoltaic module, comprising: providing a base substrate; forming a photovoltaic device on the base substrate, wherein the photovoltaic device comprises a metal component; arranging a layer of poly (vinyl butyral) in contact with the photovoltaic device, wherein the layer of poly (vinyl butyral) comprises 1 H benzotriazole or 1 H benzotriazole salt; arranging a protective substrate in contact with the poly (vinyl butyral) layer; and laminating the base substrate, the photovoltaic device, the poly (vinyl butyral) layer and the protective substrate to form the module.
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PCT/US2010/027976 WO2011115628A1 (en) | 2010-03-19 | 2010-03-19 | Photovoltaic module with stabilized polymer |
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JP (1) | JP2013522904A (en) |
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JP2012516061A (en) | 2009-01-22 | 2012-07-12 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Poly (vinyl butyral) encapsulant containing a chelating agent for solar cell modules |
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WO2016032837A1 (en) * | 2014-08-25 | 2016-03-03 | Solutia Inc. | Thin film photovoltaic module with stabilized polymer |
EP3185309A1 (en) * | 2015-12-23 | 2017-06-28 | Amcor Flexibles Transpac | Heat reflective solar module |
RU168774U1 (en) * | 2016-03-04 | 2017-02-17 | Валентин Петрович Пивнов | REFLECTIVE FILM |
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KR20130010889A (en) | 2013-01-29 |
BR112012022911A2 (en) | 2019-09-24 |
RU2012144439A (en) | 2014-04-27 |
CA2791015A1 (en) | 2011-09-22 |
AU2010348376A1 (en) | 2012-09-27 |
RU2528397C2 (en) | 2014-09-20 |
EP2547516A1 (en) | 2013-01-23 |
WO2011115628A1 (en) | 2011-09-22 |
SG183430A1 (en) | 2012-09-27 |
JP2013522904A (en) | 2013-06-13 |
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