KR960043086A - 피처리체 지지보트 - Google Patents

피처리체 지지보트 Download PDF

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Publication number
KR960043086A
KR960043086A KR1019960017832A KR19960017832A KR960043086A KR 960043086 A KR960043086 A KR 960043086A KR 1019960017832 A KR1019960017832 A KR 1019960017832A KR 19960017832 A KR19960017832 A KR 19960017832A KR 960043086 A KR960043086 A KR 960043086A
Authority
KR
South Korea
Prior art keywords
wafer
placement surface
boat
support portion
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019960017832A
Other languages
English (en)
Korean (ko)
Inventor
카츠토시 이시이
이사오 하기노
미츠오 미즈카미
Original Assignee
이노우에 아키라
도쿄 에레쿠토론 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이노우에 아키라, 도쿄 에레쿠토론 가부시키가이샤 filed Critical 이노우에 아키라
Publication of KR960043086A publication Critical patent/KR960043086A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H10P72/123—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterised by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H10P72/127—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterised by the substrate support
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1019960017832A 1995-05-26 1996-05-23 피처리체 지지보트 Ceased KR960043086A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-152677 1995-05-26
JP15267795 1995-05-26

Publications (1)

Publication Number Publication Date
KR960043086A true KR960043086A (ko) 1996-12-23

Family

ID=15545704

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960017832A Ceased KR960043086A (ko) 1995-05-26 1996-05-23 피처리체 지지보트

Country Status (3)

Country Link
US (1) US5820683A (https=)
KR (1) KR960043086A (https=)
TW (1) TW318274B (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6576064B2 (en) * 1997-07-10 2003-06-10 Sandia Corporation Support apparatus for semiconductor wafer processing
US6196211B1 (en) * 1999-04-15 2001-03-06 Integrated Materials, Inc. Support members for wafer processing fixtures
US6225594B1 (en) 1999-04-15 2001-05-01 Integrated Materials, Inc. Method and apparatus for securing components of wafer processing fixtures
US6205993B1 (en) 1999-04-15 2001-03-27 Integrated Materials, Inc. Method and apparatus for fabricating elongate crystalline members
US6455395B1 (en) 2000-06-30 2002-09-24 Integrated Materials, Inc. Method of fabricating silicon structures including fixtures for supporting wafers
US6450346B1 (en) 2000-06-30 2002-09-17 Integrated Materials, Inc. Silicon fixtures for supporting wafers during thermal processing
JP2002270614A (ja) * 2001-03-12 2002-09-20 Canon Inc Ｓｏｉ基体、その熱処理方法、それを有する半導体装置およびその製造方法
US6849131B2 (en) * 2002-10-05 2005-02-01 Taiwan Semiconductor Manufacturing Co., Ltd Truncated dummy plate for process furnace
KR100481476B1 (ko) * 2002-11-19 2005-04-07 주식회사 실트론 어닐 웨이퍼 및 그 제조 방법
WO2005053016A1 (ja) * 2003-11-27 2005-06-09 Hitachi Kokusai Electric Inc. 基板処理装置、基板保持具、及び半導体装置の製造方法
US20050229857A1 (en) * 2004-04-16 2005-10-20 Seh America, Inc. Support fixture for semiconductor wafers and associated fabrication method
JP5545055B2 (ja) * 2010-06-15 2014-07-09 東京エレクトロン株式会社 支持体構造及び処理装置
JP5541274B2 (ja) * 2011-12-28 2014-07-09 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
US11361981B2 (en) 2018-05-02 2022-06-14 Applied Materials, Inc. Batch substrate support with warped substrate capability

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2961167B2 (ja) * 1988-03-18 1999-10-12 東京エレクトロン株式会社 ボート並びにそれを用いた熱処理装置及び方法
US5054418A (en) * 1989-05-23 1991-10-08 Union Oil Company Of California Cage boat having removable slats
JPH04305920A (ja) * 1990-12-04 1992-10-28 Nec Corp 縦型減圧ｃｖｄ装置
JP3190079B2 (ja) * 1991-11-05 2001-07-16 株式会社日立製作所 半導体集積回路装置の製造方法
JPH069139A (ja) * 1992-06-23 1994-01-18 Toshiba Corp 紙葉類集積装置
JPH0622208A (ja) * 1992-06-29 1994-01-28 Canon Inc ビデオカメラの自動露出制御装置
JPH0622262A (ja) * 1992-06-30 1994-01-28 Canon Inc 記録装置
JPH06338459A (ja) * 1993-05-28 1994-12-06 Kokusai Electric Co Ltd 縦型ｃｖｄ装置

Also Published As

Publication number Publication date
US5820683A (en) 1998-10-13
TW318274B (https=) 1997-10-21

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