KR960006966B1 - Bonding wire inspection apparatus - Google Patents

Bonding wire inspection apparatus Download PDF

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Publication number
KR960006966B1
KR960006966B1 KR1019920020005A KR920020005A KR960006966B1 KR 960006966 B1 KR960006966 B1 KR 960006966B1 KR 1019920020005 A KR1019920020005 A KR 1019920020005A KR 920020005 A KR920020005 A KR 920020005A KR 960006966 B1 KR960006966 B1 KR 960006966B1
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KR
South Korea
Prior art keywords
ring
shaped
wire
illuminator
irradiation angle
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KR1019920020005A
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Korean (ko)
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KR930009006A (en
Inventor
겐지 스가하라
Original Assignee
가부시끼가이샤 신가와
아라이 가즈오
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Publication of KR960006966B1 publication Critical patent/KR960006966B1/en

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    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
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    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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Abstract

내용 없음.No content.

Description

본딩와이어 검사장치Bonding wire inspection device

제 1 도는 본 발명의 1실시예에 의한 본딩와이어 검사장치의 구성을 예시하는 개략적인 설명도.1 is a schematic explanatory diagram illustrating a configuration of a bonding wire inspection apparatus according to an embodiment of the present invention.

제 2 도는 제1도의 링 형상 조명수단의 단면도.2 is a cross-sectional view of the ring shaped luminaire of FIG.

제 3 도는 제2도의 링 형상 조명수단의 배치설명도.3 is an explanatory view of the arrangement of the ring-shaped lighting means of FIG.

제 4 도는 조명전환 회로의 블록도.4 is a block diagram of an illumination switching circuit.

제 5 도는 와이어본딩된 반도체장치의 평면도.5 is a plan view of a wire bonded semiconductor device.

제 6 도는 제5도의 정면도.6 is a front view of FIG.

제 7 도는 본딩와이어의 확대정면 설명도.7 is an enlarged front explanatory diagram of a bonding wire.

제 8 도는 제7도의 평면도.8 is a plan view of FIG.

제9도는 종래의 본딩와이어 검사장치의 구성도.9 is a block diagram of a conventional bonding wire inspection apparatus.

제10도는 종래의 본딩와이어 검사장치에 의한 와이어의 검사방법 설명도.10 is an explanatory view of a wire inspection method by a conventional bonding wire inspection device.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

5,5A : 와이어 5a : 볼부5,5A: wire 5a: ball part

5b : 크레센트 6 : 시료5b: Crescent 6: Sample

12 : CCD 카메라 12a : 광축중심12: CCD camera 12a: optical axis center

20 : 수직조명수단 30 : 링 형상 조명수단20: vertical lighting means 30: ring-shaped lighting means

32 : LED 33 : 고조사각도 링 형상 조명기32: LED 33: high irradiation angle ring shape illuminator

34 : LED 35 : 저조사각도 링 형상 조명기34: LED 35: low irradiation angle ring shape illuminator

[산업상의 이용 분야][Industrial use]

본 발명은 반도체 칩의 패드와 리이드프레임의 리이드 사이에 본딩된 와이어의 검사장치에 관한 것이며, 특히 조명구조에 관한 것이다.The present invention relates to a device for inspecting wires bonded between a pad of a semiconductor chip and a lead of a lead frame, and more particularly to an illumination structure.

[종래의 기술][Prior art]

제 5 도 및 제 6 도에 도시한 바와 같이, 반도체 칩(1)의 패드(2)와 리이드 프레임(3)의 리이드사이에 본딩된 와이어(5)의 검사장치로서, 예컨대 일본국 특개평 3-76137호 공보가 알려져 있다.As shown in FIGS. 5 and 6, an inspection apparatus of a wire 5 bonded between a pad 2 of a semiconductor chip 1 and a lead of a lead frame 3, for example, Japanese Patent Laid-Open No. 3 -76137 is known.

이 구조는 제 9 도에 도시한 바와 같이, 제 5 도 및 제 6 도와 같이 본딩된 시료(6)를 적재하는 검사대(10)와, 시료(6)를 조명하는 복수개의 전구(11)와, 조명된 와이어(5) 상을 결상하여 영상신호를 출력하는 CCD 카메라(12) 및 이 CCD 카메라(12)의 영상신호를 처리하여 와이어 형상의 인식 및 와이어(5)의 본딩 위치를 계측하는 화상처리 연산장치(13)와, 상기 CCD 카메라(12)를 이동시키는 XY테이블(14)을 구비하고 있다.As shown in FIG. 9, the structure includes a test table 10 for loading a sample 6 bonded as shown in FIGS. 5 and 6, a plurality of light bulbs 11 for illuminating the sample 6, CCD camera 12 which forms an image on illuminated wire 5 and outputs an image signal, and processes image signals of CCD camera 12 to recognize wire shapes and to measure the bonding position of wire 5. The computing device 13 and the XY table 14 which moves the said CCD camera 12 are provided.

그래서 시료(6)를 복수개의 전구(11)로 조명하고, XY테이블(14)을 구동하여 CCD 카메라(12)를 검사대상물 윗쪽에 위치시키고, CCD 카메라(12)로 잡은 검사대상물의 영상신호를 화상처리 연산장치(13)를 사용하여 노이즈제거, 검사부분의 에지강조, 영상의 확대 또는 축소등을 행하여 검사대상부분의 영상을 보기쉽도록 하기 위한 개선(복원) 작업을 행한 후, 검사측적을 실시한다.Thus, the sample 6 is illuminated with a plurality of light bulbs 11, the XY table 14 is driven to position the CCD camera 12 above the inspection object, and the image signal of the inspection object captured by the CCD camera 12 is After performing the improvement (restore) operation to make the image of the inspection target part easy to see by performing noise removal, edge enhancement of the inspection portion, enlargement or reduction of the image, etc. using the image processing arithmetic unit 13, Conduct.

[발명이 해결하려고 하는 과제][Problems that the invention tries to solve]

상기 종래기술로서는, 상기한 영상신호의 개선(복원)에는 한계가 있고, 개선(복원) 화상과 검사대상물인 시료(6)로서는 크게 상이하며 개선(복원)작업에 시간이 소요되는 동시에, 신뢰성이 있는 검사측정 결과를 얻을 수 없다고 하는 문제점이 있었다.In the prior art, there is a limit to the improvement (restoration) of the video signal described above. The improvement (restoration) of the video signal differs greatly from that of the sample 6, which is an inspection object, and the improvement (restoration) takes time and the reliability is high. There was a problem that a test result could not be obtained.

이하 이와 같은 내용을 다시 상세하게 설명한다.This will be described in detail below.

제 5 도 및 제 6 도에 도시한 바와 같이, 반도체 칩(1)은 리이드프레임(3)에 에폭시수지등의 페이스트(7)로 접착되어 있고, 반도체 칩(1)의 주변에는 페이스트(7)가 비어져나오고 있다. 그래서 예컨대 와이어(5A)에 대하여 검사측정할 경우, 제10도에 도시한 바와 같이 전구(11)로 조명하면 조사방향(A)으로부터의 광선의 조사에 의해 페이스트(7)로부터의 난반사광이 CCD 카메라(12)에 들어와, 와이어(5A) 표면의 밝기와 페이스트(7)로부터의 난반사광과의 밝기가 거의 같게 된다.As shown in FIGS. 5 and 6, the semiconductor chip 1 is bonded to the lead frame 3 with a paste 7 such as an epoxy resin, and the paste 7 around the semiconductor chip 1. Is coming out. Thus, for example, in the case of inspection measurement with respect to the wire 5A, when the light bulb 11 is illuminated as shown in FIG. 10, the diffused light from the paste 7 is irradiated by the light beam from the irradiation direction A. The brightness of the surface of the wire 5A and the diffuse reflection light from the paste 7 is almost the same as entering the camera 12.

이 때문에 페이스트(7)상에서의 와이어(5A) 자신의 영상을 CCD 카메라(12)로 잡기란 대단히 곤란하며, 와이어(5A)가 없는 상태로 보이로 만다.For this reason, it is very difficult to catch the image of the wire 5A itself on the paste 7 with the CCD camera 12, and it appears to be in a state without the wire 5A.

또, 제7도 및 제 8 도에 도시한 바와 같이, 패드(2)에는 본딩장치의 모세관의 선단으로부터 뻗은 와이어선단에 형성된 볼일 망쳐져서 본딩되나, 이 본딩된 볼 부(5a)의 형상(에지),또 리이드(4)에 본딩된 와이어(5)의 크레센트(56)의 형상(에지)은, 상기 종래 기술의 조명방법으로는 볼 부(5a) 및 크레센트(5b)의 에지를 강조하여 영상화할 수 없었다.In addition, as shown in FIGS. 7 and 8, the pads 2 are spoiled and bonded to the pads formed at the tip of the wire extending from the tip of the capillary of the bonding apparatus, but the shape of the bonded ball portion 5a (edge) In addition, the shape (edge) of the crescent 56 of the wire 5 bonded to the lead 4 is imaged by emphasizing the edges of the ball portion 5a and the crescent 5b by the conventional illumination method. I could not.

본 발명의 목적은, 본딩된 와이어, 패드상의 볼 부 및 리이드상의 크레센트를 선명하게 영상화 할 수 있고, 신뢰성이 있는 검사측정을 행할 수 있는 본딩와이어 검사장치를 제공하는 것에 있다.An object of the present invention is to provide a bonding wire inspection apparatus capable of vividly imaging a bonded wire, a ball portion on a pad and a crescent on a lead, and capable of performing a reliable inspection measurement.

[과제를 해결하기 위한 수단][Means for solving the problem]

상기 목적을 달성하기 위한 본 발명의 구성은, 검사대상물을 촬영하는 카메라와, 이 카메라의 아래쪽에 설정되어, 검사대상물에 수직으로 조명을 조사하는 수직조명수단과, 이 수직조명수단의 아래쪽에 설정되어 다수의 LED가 링 형상으로, 또한 상기 카메라의 광축중심에 향하여 경사하여 배열설정된 링 형상 조명수단을 구비한 것을 특징으로 한다.The configuration of the present invention for achieving the above object is a camera for photographing an inspection object, a vertical illumination means which is set below the camera, and irradiates light perpendicularly to the inspection object, and set below the vertical illumination means. And a plurality of LEDs are provided in a ring shape and have ring-shaped lighting means arranged inclined toward the optical axis center of the camera.

[작용][Action]

볼 부를 검사하는 경우는, 링 형상 조명수단의 조명을 OFF로 하고, 수직조명수단만을 ON으로 한다. 수직조명수단의 조명은 볼 부에 수직으로 조사된다. 볼 부의 주변 패드는 일반적으로 증착알루미늄으로 그 표면상태로부터의 난반사가 많고, 또 볼 부의 표면은 Au 거울면 상태로 그 형상으로부터의 난반사가 적다. 이것에 의해 볼 부는 그 주변보다 어둡게 비쳐지며, 볼 부의 형상이 카메라에 의해 선명하게 영사된다.When the ball part is inspected, the illumination of the ring-shaped lighting means is turned off, and only the vertical lighting means is turned on. The illumination of the vertical lighting means is irradiated perpendicular to the ball part. The pads around the ball are generally vapor-deposited aluminum, with many diffuse reflections from their surface state, and the surface of the ball portion with Au mirror surface state, with little diffuse reflection from its shape. As a result, the ball portion is made darker than its surroundings, and the shape of the ball portion is clearly projected by the camera.

크레센트를 검사하는 경우는 수직조명수단 및 링 형상 조명수단을 ON으로 한다. 수직조명수단의 수직조명으로 조명한 경우, 크레센트는 리이드보다 난반사가 적으므로 크레센트는 어둡게 영사된다. 그러나 리이드에는 요철이 있으므로 수직조명 수단에 의한 수직조명에서는 리이드의 밝기에 얼룩이 발생한다.When inspecting the crescent, turn on the vertical lighting means and the ring-shaped lighting means. In the case of illumination with the vertical illumination of the vertical lighting means, the crescent is projected dark because the diffuse is less diffuse than the lead. However, since there are irregularities in the lead, unevenness occurs in the brightness of the lead in the vertical illumination by the vertical illumination means.

그래서 링 형상 조명수단으로 경사된 방향에서 크레센트를 조명하면, 상기한 수직 조명에 의한 리이드의 밝기에 얼룩이 없어진다. 그러나 검사하는 크레센트가 본딩되거나 리이드 방향으로부터의 일 형상 조명수단에 의한 조명은, 크레센트의 일부를 밝게하고 말아, 올바른 크레센트형상이 영상되지 않는다.Thus, when the crescent is illuminated in the inclined direction by the ring-shaped luminaire, the brightness of the lead by the vertical illumination is eliminated. However, the crescent to be inspected is bonded or the illumination by the one-shaped luminaire from the lead direction brightens a part of the crescent so that the correct crescent shape is not imaged.

그래서 본딩되거나 리이드방향으로부터의 LED만을 OFF로 한다. 이것에 의해 크레센트가 카메라에 의해 선명하게 영상된다. 실험결과 크레센트검사의 경우, 상기 링 형상 조명수단의 LED경사각은 약 45도가 가장 적절하였다.So only the LEDs that are bonded or from the lead direction are turned OFF. As a result, the crescent is clearly imaged by the camera. As a result of the crescent test, the LED tilt angle of the ring-shaped luminaire was about 45 degrees.

와이어를 검사하는 경우는 수직조명수단을 OFF로 하고, 링 형상 조명수단을 ON으로 하여 행한다. 수직조명수단을 ON으로 하면 와이어 보다도 그 주변(반도체 칩, 리이드, 페이스트)의 반사광이 카메라에 들어가 주변이 밝게되며, 와이어가 밝게 보이지 않게 된다.When the wire is inspected, the vertical lighting means is turned off and the ring-shaped lighting means is turned on. When the vertical lighting means is turned ON, the reflected light of the surroundings (semiconductor chips, leads, pastes) enters the camera and becomes brighter than the wires, and the surroundings become bright, and the wires do not look bright.

이것은 와이어 표면이 Au 거울면 상태이기 때문이다. 와이어 주변에는 밝은 곳, 어두운곳등 여러가지 이므로 와이어를 검사하는 경우는, 이 주변을 모두 어둡게 하고 와이어만을 밝게하는 것이 검사정밀도를 높이기 위해서도 필요하다. 와이어 만을 밝게 영사하기 위해서는 실험결과, 약 10도의 입사각의 조명이 가장 적합하였다. 이와 같이 입사각이 작으면 와이어 이외에서의 난반사광은 대단히 적어진다.This is because the wire surface is in the Au mirror plane state. Since there are various things around the wire, such as light and dark, it is necessary to darken all the areas and light only the wire in order to improve the inspection accuracy. In order to project only the wire brightly, the illumination of the incident angle of about 10 degrees was most suitable. In this manner, when the incident angle is small, diffusely reflected light other than the wire is very small.

그러나 저강도의 링 형상 조명수단의 LED로 와이어를 조명한 경우, 페이스트로 와이어의 일부가 보이지 않게 된다. 따라서 검사하는 와이어가 본딩되거나 리이드 방향의 LED군을 끄면, 와이어가 카메라에 의해 선명하게 영사된다.However, when the wire is illuminated by the LED of the low intensity ring-shaped luminaire, a part of the wire is not visible by the paste. Therefore, when the wire to be inspected is bonded or the LED group in the lead direction is turned off, the wire is clearly projected by the camera.

[실시예]EXAMPLE

이하 본 발명의 1실시예를 제 1 도 내지 제 4 도에 의해 설명된다. 또한 제 5 도 내지 제10도와 동일 부재는 동일 부호를 붙여 그 상세한 설명은 생략한다.One embodiment of the present invention will now be described with reference to FIGS. In addition, the same member is attached | subjected to FIG. 5 thru | or 10, The detailed description is abbreviate | omitted.

제1도에 도시한 바와 같이 CCD 카메라(12)에서는 이 CCD 카메라(12)의 아래쪽에 배열설치된 수직조명수단(20)이 부착되어 있다. 수직조명수단(20)의 조명박스(21)내에는 CCD 카메라(12)의 아래쪽에 하아프미러(22)가 배열설치되고, 하아프미러(22)의 옆쪽에는 콘덴서렌즈(23) 및 전구(24)가 배열설치되어 있다.As shown in FIG. 1, in the CCD camera 12, vertical illumination means 20 arranged below the CCD camera 12 is attached. In the illumination box 21 of the vertical lighting means 20, a half mirror 22 is arranged below the CCD camera 12, and a condenser lens 23 and a light bulb (2) are provided on the side of the half mirror 22. 24) are arranged.

상기 수직조명수단(20)는 이 수직조명수단(20)의 아래쪽에 배열설치된 링 형상 조명수단(30)이 부착되어 있다. 이 형상 조명수단(30)은 제 2 도 및 제 3 도에 도시한 바와 같이, 조명유지판(31)의 개구부(31a)의 주위에 다수개의 LED(32)가 링 형상으로 배열설치되어 부착된 고조사각도 링 형상 조명기(33)와, 이 고조사각도 링 형상 조명기(33)로부터 큰직경 부분에 다수개의 LED(34)가 링 형상으로 배열설치되여 부착된 저조사각도 링 형상 조명기(35)를 갖는다.The vertical lighting means 20 is attached to the ring-shaped lighting means 30 arranged below the vertical lighting means (20). As shown in FIGS. 2 and 3, the shape lighting means 30 is provided with a plurality of LEDs 32 arranged in a ring shape around the opening 31a of the light holding plate 31. The high irradiation angle ring-shaped illuminator 33 and the low irradiation angle ring-shaped illuminator 35 in which a plurality of LEDs 34 are arranged in a ring shape and attached to a large diameter portion from the high irradiation angle ring-shaped illuminator 33. Has

고조사각도 링 형상 조명기(33) 및 저조사각도 링 형상 조명기(35)의 각 LED(32,34)는, 각각 CCD 카메라(12)의 광축중심(12a)의 방향에 항해 있고, 고조사각도 링 형상 조명기(33)의 수평면에 대한 경사각은 약 45도, 저조각도 링 형상 조명기(35)의 수평선에 대한 경사각은 약 10도로 되어있다.Each of the LEDs 32 and 34 of the high irradiation angle ring-shaped illuminator 33 and the low irradiation angle ring-shaped illuminator 35 sails in the direction of the optical axis center 12a of the CCD camera 12, respectively. The inclination angle with respect to the horizontal plane of the ring-shaped illuminator 33 is about 45 degrees, and the inclination angle with respect to the horizontal line of the low fragment ring-shaped illuminator 35 is about 10 degrees.

상기 조명유지판(31)상에는 지주(36)를 통하여 부착판(37)이 적치되고, 조명유지판(31)은 지주(36)에 삽입된 나사(38)에 의해 부착판(37)에 고정되어 있다. 또 지주(36)에는 스페이서(39)가 삽입되며, 스페이서(39)와 부착판(37) 사이에는 차광판(40) 및 커버(41)가 배열설치 되어있다.The mounting plate 37 is placed on the lighting holding plate 31 through the support 36, and the lighting holding plate 31 is fixed to the mounting plate 37 by a screw 38 inserted into the support 36. It is. A spacer 39 is inserted into the strut 36, and a light shielding plate 40 and a cover 41 are arranged between the spacer 39 and the attachment plate 37.

또한 제 2 도에 있어서, LED (32,34)는 좌측 및 우측만을 도시하였다. 또 제 3 도에 있어서 LED(32,34)를 점선으로 표시하고 일부 생략하여 도시하였다.Also in FIG. 2, the LEDs 32 and 34 only show the left side and the right side. In FIG. 3, the LEDs 32 and 34 are indicated by dotted lines and partially omitted.

상기 고조사각도 링 형상 조명기(33) 및 저주사각도 링 형상 조명기(35)의 각 LED(32,34)는 제 4 도에 도시하는 전환회로에 의해 점등된다. 각 LED (32,34)는 한쪽 끝이 저항(50)을 통하여 프로그래멀 정전압회로(51)에 접속되고 다른 끝이 트랜지스터(52)의 콜렉터에 접속되어 있다. 트랜지스터(52)의 에미터는 점지되고 트랜지스터(52)이 베이스는 래치용 레지스터군(53)을 통하여 시프트 레지스터군(54)에 접속되어 있다.Each LED 32, 34 of the high irradiation angle ring-shaped illuminator 33 and the low scanning angle ring-shaped illuminator 35 is turned on by the switching circuit shown in FIG. Each of the LEDs 32 and 34 has one end connected to the programmatic constant voltage circuit 51 via a resistor 50 and the other end connected to the collector of the transistor 52. The emitter of the transistor 52 is occupied and the base of the transistor 52 is connected to the shift register group 54 via the latch register group 53.

상기 래치용 레지스터군(53)에는 로우드신호(55)가 입력되고, 상기 시프트 레지스터군(54)에는 하이ㆍ로우(H.L)의 입력신호(65)가 입력되며, 시프트 래지스터군(54)의 각 시프트 레지스터에는 잠금신호(57)가 입력된다.A low signal 55 is input to the latch register group 53, and an input signal 65 of high and low HL is input to the shift register group 54, and the shift register group 54 is input. The lock signal 57 is input to each shift register of.

다음에 제 5 도 내지 제 8 도를 참조하면서 작용에 대하여 설명한다.Next, the operation will be described with reference to FIGS. 5 to 8.

먼저, 볼 부(5a)검사에 대하여 설명한다. 이 경우는 XY 테이블(14)을 구동시켜 카메라(12)의 광축중심(12a)을 와이어(5A)에 일치시킨다. 그리고 링 형상 조명수단(30)의 조명을 OFF로 하고 수직조명수단(20)만을 ON으로 한다.First, ball | bowl part 5a test | inspection is demonstrated. In this case, the XY table 14 is driven to match the optical axis center 12a of the camera 12 with the wire 5A. Then, the illumination of the ring-shaped lighting means 30 is turned off and only the vertical lighting means 20 is turned on.

수직조명수단(20)의 조명은, 전구(24)의 조사관이 콘덴서렌즈(23) 및 하아프미러(22)를 통과하여 볼 부(5a)에 수직으로 조사된다. 볼 부(5a)의 주변패드(2)는, 일반적으로 증착알루미늄으로 그 표면상태로부터의 난반사가 많고, 또 볼 부(5a)의 표면은 Au거울면 상태로 그 형상으로부터도 난반사가 적다. 이것에 의해 볼 부(5a)는 그 주변보다 어둡게 영사되며, 볼 부(5a)의 형상이 CCD 카메라(12)에 의해 선명하게 영사된다.In the illumination of the vertical lighting means 20, the irradiation tube of the electric bulb 24 passes through the condenser lens 23 and the lower mirror 22, and is irradiated perpendicularly to the ball part 5a. In general, the peripheral pad 2 of the ball portion 5a is vapor-deposited aluminum, and has a large amount of diffuse reflection from its surface state, and the surface of the ball portion 5a is Au-mirror state, and its diffuse reflection is small from its shape. As a result, the ball portion 5a is projected darker than its periphery, and the shape of the ball portion 5a is clearly projected by the CCD camera 12.

다음에 크레센트(5b)의 검사에 대하여 설명한다. 이 경우는 XY테이블(14)을 구동시켜 CCD 카메라(12)의 광축중심(12a)을 크레센트(5b)에 일치시킨다. 그리고 수직조명수단(20) 및 링 형상 조명수단(30)의 고조사각도 링 형상 조명기(33)를 ON으로 하고, 저조사각도 링 형상 조명기(35)는 OFF로 한다.Next, the inspection of the crescent 5b will be described. In this case, the XY table 14 is driven to match the optical axis center 12a of the CCD camera 12 with the crescent 5b. And the high irradiation angle ring-shaped illuminator 33 of the vertical illumination means 20 and the ring-shaped illuminating means 30 is turned ON, and the low irradiation angle ring-shaped illuminator 35 is turned OFF.

수직조명수단(20)의 전구(24)에 의한 수직조명으로 조명한 경우, 크레센트(5b)는 리이드(4) 보다 난반사가 적으므로 크레센트(5b)는 어둡게 영상된다. 그러나 리이드(4)에는 요철이 있으므로 수직조명수단(20)에 의한 수직조명에서는 리이드(4)의 밝기에 얼룩이 발생한다.When illuminated by the vertical light by the bulb 24 of the vertical lighting means 20, since the crescent 5b has less diffuse reflection than the lead 4, the crescent 5b is darkly imaged. However, since the lead 4 has irregularities, unevenness occurs in the brightness of the lead 4 in the vertical illumination by the vertical illumination means 20.

그래서 링 형상 조명수단(30)의 고조사각도 링 형상 조명기(33)로 약 45도의 방향에서 크레센트(5b)를 조명하면, 상기한 수직조명에 의한 리이드(4)로 밝기의 얼룩이 없어진다.Therefore, when the crescent 5b is illuminated in the direction of about 45 degrees with the high irradiation angle ring-shaped illuminator 33 of the ring-shaped illuminating means 30, unevenness of brightness is eliminated by the lead 4 by the above-mentioned vertical illumination.

그러나 화살표시(A)방향(검사하는 크레센트가 본딩된 리이드 4측)으로부터의 고조사각도 링 형상 조명기(33)에 의한 조명은, 크레센트(5b)의 일부를 밝게 하고 말아 올바른 크레센트(5b)형상이 영사되지 않는다. 그래서 화살표시(A)방향으로부터의 LED(32)만을 OFF, 즉 제 3 도에 도시하는 LED군(32A)을 OFF로 한다.However, the illumination by the high irradiation angle ring-shaped illuminator 33 from the direction of the arrow A (the four sides of the lead to which the crescent to be inspected is bonded) brightens a part of the crescent 5b to form a correct crescent 5b. This is not projected. Therefore, only the LED 32 from the arrow A direction is turned off, that is, the LED group 32A shown in FIG. 3 is turned off.

이것은 제 4 도에 도시하는 조명전환 회로에 있어서 시프트레지스터군(54)의 각 시프트레지스터를 잠금신호(57)로 순차적으로 전환시켜, 그때마다 하이(ON) 또는 로우(OFF)의 입력신호(56)를 넣고, 시프트레지스터군(54)을 래치용 레지스터군(53)에 넣어 로우드신호(55)를 입력함으로써, 화살표시(A) 방향의 LED군(32A)을 OFF로 할 수 있다.This sequentially switches each shift register of the shift register group 54 to the lock signal 57 in the illumination switching circuit shown in FIG. 4, and inputs the high (ON) or low (OFF) input signal 56 each time. ), The shift register group 54 is put in the latch register group 53, and the low-frequency signal 55 is input, whereby the LED group 32A in the direction of the arrow A can be turned OFF.

이 조작은 검사측정하는 검사대상에 의해 어느 LED(32)를 OFF로 할 것인가는 미리 도시하지 않은 제어회로에 프로그램해둔다. 이것에 의해 크레센트(5B)가 CCD 카메라(12)에 의해 선명하게 영사된다.This operation is programmed in a control circuit (not shown) which LED 32 is turned off by the inspection target to be inspected and measured. As a result, the crescent 5B is clearly projected by the CCD camera 12.

다음은 와이어(5A)의 검사에 대하여 설명한다. 이 경우는 XY테이블(14)을 구동시켜 CCD 카메라(12)의 광축중심(12a)을 와이어(5)에 일치시킨다. 그리고 수직조명수단(20) 및 링 형상 조명수단(30)의 고조사각도 링 형상 조명기(33)를 OFF로 하고, 저조사각도 링 형상 조명기(35)만을 ON으로 하여 행한다.Next, the inspection of the wire 5A will be described. In this case, the XY table 14 is driven to match the optical axis center 12a of the CCD camera 12 with the wire 5. The high illumination angle ring illuminator 33 of the vertical illumination means 20 and the ring illuminator 30 is turned off, and only the low irradiation angle ring illuminator 35 is turned on.

수직조명수단(20)을 ON으로 하면, 와이어(5A) 보다도 그 주변(반도체 칩 1, 리이드 4, 페이스트 7)의 반사광이 CCD 카메라(12)에 들어가 주변이 밝게되어, 와이어(5)가 밝게 보이지 않게 된다. 이것은 와이어(5) 표면이 Au거울면 상태이기 때문이다.When the vertical lighting means 20 is turned ON, the reflected light of its surroundings (semiconductor chip 1, lead 4, paste 7) enters the CCD camera 12 rather than the wire 5A, and the surroundings become brighter, and the wire 5 becomes brighter. Invisible This is because the surface of the wire 5 is in a Au state.

와이어(5) 주변에는 밝은곳, 어두운 곳등 여러가지이므로, 와이어(5)를 검사할 경우는 이 주변을 모두 어둡게하고 와이어(5)만을 밝게하는 것이 검사정일도를 높이기 위해서도 필요하다.Since there are various places around the wire 5, such as a bright place and a dark place, when inspecting the wire 5, it is necessary to darken all the periphery and light only the wire 5 to increase the inspection accuracy.

또 고조사각도 링 형상 조명기(33)의 LED(32)의 입사각은 약 45도로 크므로 역시 와이어(5A) 이외의 반사광이 많아진다. 와이어(5A)만을 밝게 영사하기 위해서는, 실험결과 약 10도의 입사각조명이 최적이었다. 이와 같이 입사각이 작으면, 와이어(5A) 이외에서의 직접 방사광은 대단히 적어진다.Further, since the incident angle of the LED 32 of the high irradiation angle ring-shaped illuminator 33 is about 45 degrees, the reflected light other than the wire 5A increases. In order to project only the wire 5A brightly, the incident angle illumination of about 10 degrees was optimal. If the incidence angle is small in this manner, the direct radiation light except for the wire 5A is very small.

그러나 저각도의 저조사각도 링 형상 조명기(35)의 LED(34)로 와이어(5A)를 조명한 경우, 페이스트(7)로 와이어(5A)의 일부가 보이지 않게된다. 따라서 화살표시(A)방향(검사하는 와이어 5A)가 본딩된 리이드 4측)의 LED군(34A)을, 상기한 크레센트(5b)의 검사방법으로 설명한 바와 같은 조작에 의해 끄면, 와이어(5A)가 CCD 카메라(12)에 의해 선명하게 영사된다.However, when the wire 5A is illuminated by the LED 34 of the low angle low irradiation angle ring-shaped illuminator 35, a part of the wire 5A is not visible by the paste 7. Therefore, when the LED group 34A in the direction (A) of the arrow (the lead 4 side bonded with the inspection wire 5A) is turned off by the operation described in the inspection method of the crescent 5b described above, the wire 5A Is clearly projected by the CCD camera 12.

이와 같이 검사측정할 검사대상물에 의해 수직조명수단(20), 링 형상 조명수단(30)의 고조사각도 링 형상 조명기(33) 및 저조사각도 링 형상 조명기(35)를 ONㆍOFF 및 고조사각도 링 형상 조명기(33) 및 저조사각도 링 형상 조명기(35)의 일부를 OFF로 함으로써, 검사대상물을 선명하게 영사할 수 있게 된다.Thus, the high illumination angle ring-shaped illuminator 33 and the low irradiation angle ring-shaped illuminator 35 of the vertical illumination means 20, the ring-shaped illuminating means 30 are turned ON, OFF, and the high irradiation angle by the inspection object to be inspected and measured. By turning off some of the degree ring illuminator 33 and the low irradiation angle ring illuminator 35, the inspection object can be projected clearly.

또한 상기 실시예는 링 형상 조명수단(30)을 고조사각도 링 형상 조명기(33)와 저조사각도 링 형상 조명기(35)의 2중으로 설정하였으나, 3중 또는 4중으로 설명하여도 무방하다. 또 와이어(5) 또는 크레센트(5b)의 어느 한쪽을 검사측정하는 경우에는, 고조사각도 링 형상 조명기(33) 및 저조사각도 링 형상 조명기(35)는 어느 한쪽만으로도 무방하다.In addition, in the above embodiment, the ring-shaped illuminator 30 is set to a double of the high irradiation angle ring-shaped illuminator 33 and the low irradiation angle ring-shaped illuminator 35, but may be described as triple or quadruple. In the case of inspecting and measuring either the wire 5 or the crescent 5b, the high irradiation angle ring-shaped illuminator 33 and the low irradiation angle ring-shaped illuminator 35 may be used alone.

[발명의 효과][Effects of the Invention]

본 발명의 의하면, 검사대상물을 촬영하는 카메라와, 이 카메라의 아래쪽에 설정되어 검사대상물에 수직으로 조명을 조사하는 수직조명수단과, 이 수직조명수단의 아래쪽에 설정되고, 다수의 LED가 링 형상으로 또한 상기 카메라의 광축중심으로 향하여 경사되게 배열설치된 링 형상 조명수단을 구비한 구성으로 형성되므로, 본딩된 와이어, 패드상의 볼 부 및 리이드상의 크레센트를 선명하게 영사할 수 있고, 신뢰성 있는 검사측정을 행할 수 있다.According to the present invention, a camera for photographing an inspection object, a vertical lighting means set below the camera to irradiate light perpendicularly to the inspection object, and set below the vertical lighting means, and a plurality of LEDs are ring-shaped. In addition, since it is formed in a configuration having a ring-shaped illumination means arranged inclined toward the optical axis center of the camera, it is possible to clearly project the bonded wire, the ball portion on the pad and the crescent on the lead, and the reliable inspection measurement I can do it.

Claims (3)

검사대상물을 촬영하는 카메라와, 이 카메라의 아래쪽에 설정되어 검사대상물에 수직으로 조명을 조사하는 수직조명수단과, 이 수직조명수단의 아래쪽에 설정되어 다수의 LED가 형상으로, 또한 상기 카메라의 광축 중심에 향하여 경사하여 배열설치된 링 형상 조명수단을 구비한 것을 특징으로 하는 본딩와이어 검사장치.A camera for photographing the inspection object, a vertical lighting means set under the camera to irradiate light perpendicularly to the inspection object, and a plurality of LEDs set under the vertical lighting means to form a plurality of LEDs, and an optical axis of the camera. Bonding wire inspection device comprising a ring-shaped lighting means arranged inclined toward the center. 제 1 항에 있어서, 링 형상 조명수단은 안쪽과 바깥쪽에 링 형상으로 2중으로 배열설치된 고조사각도 링 형상 조명기와 저조사각도 링 형상 조명기로 형성되고, 안쪽의 고조사각도 링 형상 조명기의 LED 보다 바깥쪽의 저조사각도 링 형상 조명기 LED의 경사각이 작은 것을 특징으로 하는 본딩와이어 검사장치.2. The ring-shaped illuminating means according to claim 1, wherein the ring-shaped illuminating means is formed of a high-irradiation angle ring-shaped illuminator and a low-irradiation angle ring-shaped illuminator arranged in a ring shape on the inner side and the outer side of the ring shape, and more than the LED of the inner high-irradiation angle ring-shaped illuminator. Bonding wire inspection device, characterized in that the inclination angle of the low-illumination ring-shaped illuminator LED of the outside. 제 2 항에 있어서, 고조사각도 링 형상 조명기의 LED의 경사각은 약 45도로, 저조사각도 링 형상 조명기의 LED의 경사각은 약 10도인 것을 특징으로 하는 본딩 와이어 검사장치.3. The bonding wire inspection apparatus according to claim 2, wherein the inclination angle of the LED of the high irradiation angle ring-shaped illuminator is about 45 degrees and the inclination angle of the LED of the low irradiation angle ring-shaped illuminator is about 10 degrees.
KR1019920020005A 1991-10-29 1992-10-29 Bonding wire inspection apparatus KR960006966B1 (en)

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