KR960002727A - B.G.A (BALL GRID ARRAY) Magazine Off-loader Device of SINGLATION System of Integrated Circuit Package - Google Patents

B.G.A (BALL GRID ARRAY) Magazine Off-loader Device of SINGLATION System of Integrated Circuit Package Download PDF

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Publication number
KR960002727A
KR960002727A KR1019940014331A KR19940014331A KR960002727A KR 960002727 A KR960002727 A KR 960002727A KR 1019940014331 A KR1019940014331 A KR 1019940014331A KR 19940014331 A KR19940014331 A KR 19940014331A KR 960002727 A KR960002727 A KR 960002727A
Authority
KR
South Korea
Prior art keywords
loader
tray
packaged
integrated circuit
circuit package
Prior art date
Application number
KR1019940014331A
Other languages
Korean (ko)
Other versions
KR0131394B1 (en
Inventor
이영화
김종환
Original Assignee
황인길
아남산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 황인길, 아남산업 주식회사 filed Critical 황인길
Priority to KR1019940014331A priority Critical patent/KR0131394B1/en
Publication of KR960002727A publication Critical patent/KR960002727A/en
Application granted granted Critical
Publication of KR0131394B1 publication Critical patent/KR0131394B1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084Containers and magazines for components, e.g. tube-like magazines
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards

Abstract

본 발명은 B.G.A 집적회로패키지의 싱글레이션 시스템의 오프로더장치에 관한 것으로서, 싱글레이션 된 패키지제품을 오프로더장치(2)의 양품 및 불량트레이(7)(8)에 선별적으로 수납되도록 오프로더장치(2)에 X-Y축 버큠피커(4)를 이송시킬 수 있는 로보트(3)를 설치하고, 버큠피커(4)에는 패키지제품(14)의 양품 및 불량을 선별하는 센서(5)를 구비하여 이 로보트(3) 하부에 양품트레이(7)와 불량트레이(8)와 빈트레이(9)가 순차적으로 설치되는 트레이부(6)를 구비하므로서 작업성을 향상시키고 패키지제품의 불량을 선별할 수 있도록 한 것이다.The present invention relates to an off-loader device of a singulation system of a BGA integrated circuit package, wherein the off-loader device (2) is configured to selectively store the singulated packaged product in the good and defective trays (7) (8) of the off-loader device (2). ), A robot (3) capable of conveying the XY axis picker (4) is installed, and the picker (4) is provided with a sensor (5) for sorting the good or bad of the packaged product (14). 3) In order to improve the workability and to sort out the defects of the packaged product by having a tray (6) in which a good quality tray (7), a defective tray (8), and a bin tray (9) are sequentially installed. .

Description

B.G.A(BALL GRID ARRAY) 집적회로패키지의 싱글레이션(SINGULATION) 시스템의 매거진 오프로더(OFF LOADER) 장치B.G.A (BALL GRID ARRAY) Magazine Off-loader Device of SINGULATION System of Integrated Circuit Package

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명의 싱글레이션 시스템의 전체 구성 정면도.1 is a front view of an overall configuration of a singulation system of the present invention.

제2도는 본 발명의 싱글레이션 시스템의 전체 구성 평면도.2 is a plan view of the overall configuration of the singulation system of the present invention.

제3도는 본 발명의 제1도 A부 확대도로서 로봇의 버큠피커의 요부상세도.3 is an enlarged view of a portion A of the present invention, and details of the main picker of the robot.

Claims (1)

B.G.A 집적회로패키지의 싱글레이션시스템(1)의 싱글레이션부(18)에서 스트립에 패키지 몰드된 자재를 분리시켜 된 패키지제품(14)이 이송장치(19)의 아이들죤(15)에서 트레이에 수납되도록 하는 오프로더장치(2)에 있어서, 상기 오프로더장치(2)에 X-Y축으로 버큠피커(4)를 이송시킬 수 있는 로보트(3)를 설치하고, 버큠피커(4)에는 패키지제품(14)의 양품 및 불량을 선별하는 센서(5)를 구비하며, 상기 로보트(3)의 하부에는 로보트(3)의 버큠피커(4)에 흡착 이송되는 패키지제품(14)을 선별적으로 수납하는 양품트레이(7)와 불량트레이(8)와 빈트레이(9)가 순차적으로 설치된 트레이부(6)를 구비하여 된 것을 특징으로 하는 B.G.A 집적회로패키지의 싱글레이션시스템의 오프로더장치.The packaged product 14 obtained by separating the material packaged on the strip from the unitization unit 18 of the unitization system 1 of the BGA integrated circuit package is received in the tray in the idle zone 15 of the transfer device 19. In the off-loader device 2, a robot 3 capable of transferring the push picker 4 to the XY-axis is provided in the off-loader device 2, and the pick-up picker 4 is provided with a packaged product 14. Sensor (5) for sorting good and defective goods, and the lower part of the robot (3) for receiving a package product 14 for selectively storing the packaged product (14) that is suction-transferred to the vacuum picker (4) of the robot ( 7) and the tray unit 6 in which the bad tray 8 and the bin tray 9 are provided in this order. The offloader apparatus of the singulation system of the BGA integrated circuit package characterized by the above-mentioned. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940014331A 1994-06-22 1994-06-22 Off loader apparatus of ball grid array integrated circuit package singulation system KR0131394B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940014331A KR0131394B1 (en) 1994-06-22 1994-06-22 Off loader apparatus of ball grid array integrated circuit package singulation system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940014331A KR0131394B1 (en) 1994-06-22 1994-06-22 Off loader apparatus of ball grid array integrated circuit package singulation system

Publications (2)

Publication Number Publication Date
KR960002727A true KR960002727A (en) 1996-01-26
KR0131394B1 KR0131394B1 (en) 1998-04-14

Family

ID=19386003

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940014331A KR0131394B1 (en) 1994-06-22 1994-06-22 Off loader apparatus of ball grid array integrated circuit package singulation system

Country Status (1)

Country Link
KR (1) KR0131394B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100481297B1 (en) * 1997-10-27 2005-07-07 삼성전자주식회사 Semiconductor packaging system and packaging method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100345438B1 (en) * 2001-03-13 2002-07-26 서우테크놀로지 주식회사 A sigulation system for separating a chip package of semiconductor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100481297B1 (en) * 1997-10-27 2005-07-07 삼성전자주식회사 Semiconductor packaging system and packaging method

Also Published As

Publication number Publication date
KR0131394B1 (en) 1998-04-14

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