KR950002744B1 - 반도체소자의 실장방법 - Google Patents

반도체소자의 실장방법 Download PDF

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Publication number
KR950002744B1
KR950002744B1 KR1019910001106A KR910001106A KR950002744B1 KR 950002744 B1 KR950002744 B1 KR 950002744B1 KR 1019910001106 A KR1019910001106 A KR 1019910001106A KR 910001106 A KR910001106 A KR 910001106A KR 950002744 B1 KR950002744 B1 KR 950002744B1
Authority
KR
South Korea
Prior art keywords
mounting
semiconductor device
mounting substrate
bumps
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019910001106A
Other languages
English (en)
Korean (ko)
Inventor
마사노리 니시구찌
아쯔시 미끼
Original Assignee
스미도모덴기고오교오 가부시기가이샤
나까하라 쯔네오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013418A external-priority patent/JPH03218040A/ja
Priority claimed from JP2013419A external-priority patent/JPH03218041A/ja
Application filed by 스미도모덴기고오교오 가부시기가이샤, 나까하라 쯔네오 filed Critical 스미도모덴기고오교오 가부시기가이샤
Application granted granted Critical
Publication of KR950002744B1 publication Critical patent/KR950002744B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1019910001106A 1990-01-23 1991-01-23 반도체소자의 실장방법 Expired - Fee Related KR950002744B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013418A JPH03218040A (ja) 1990-01-23 1990-01-23 半導体素子の実装方法
JP2-13418 1990-01-23
JP2-13419 1990-01-23
JP2013419A JPH03218041A (ja) 1990-01-23 1990-01-23 半導体素子の実装方法

Publications (1)

Publication Number Publication Date
KR950002744B1 true KR950002744B1 (ko) 1995-03-24

Family

ID=26349223

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910001106A Expired - Fee Related KR950002744B1 (ko) 1990-01-23 1991-01-23 반도체소자의 실장방법

Country Status (5)

Country Link
US (2) US5092033A (https=)
EP (1) EP0439136A2 (https=)
KR (1) KR950002744B1 (https=)
AU (1) AU634334B2 (https=)
CA (1) CA2034702A1 (https=)

Families Citing this family (39)

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CA2034703A1 (en) * 1990-01-23 1991-07-24 Masanori Nishiguchi Substrate for packaging a semiconductor device
US5152055A (en) * 1991-04-26 1992-10-06 At&T Bell Laboratories Article alignment method
US5456018A (en) * 1994-02-28 1995-10-10 The Whitaker Corporation Alignment system for planar electronic devices arranged in parallel fashion
TW312079B (https=) * 1994-06-06 1997-08-01 Ibm
FR2725560B1 (fr) * 1994-10-06 1996-12-20 Commissariat Energie Atomique Procede d'echange d'un composant hybride par des billes de soudure
KR0137826B1 (ko) * 1994-11-15 1998-04-28 문정환 반도체 디바이스 패키지 방법 및 디바이스 패키지
JPH08201432A (ja) * 1995-01-25 1996-08-09 Matsushita Electric Ind Co Ltd プローブシート及びその製造方法
US5637835A (en) * 1995-05-26 1997-06-10 The Foxboro Company Automatic test detection of unsoldered thru-hole connector leads
US5661042A (en) * 1995-08-28 1997-08-26 Motorola, Inc. Process for electrically connecting electrical devices using a conductive anisotropic material
KR100201383B1 (ko) * 1995-10-19 1999-06-15 구본준 인터페이스 조립체를 구비한 유에프비지에이 패키지
JP3593833B2 (ja) * 1997-02-10 2004-11-24 富士通株式会社 半導体装置
JPH10284535A (ja) * 1997-04-11 1998-10-23 Toshiba Corp 半導体装置の製造方法及び半導体部品
US6389688B1 (en) 1997-06-18 2002-05-21 Micro Robotics Systems, Inc. Method and apparatus for chip placement
DE19738548A1 (de) * 1997-09-03 1999-03-11 Siemens Ag Chipkarte mit einer ersten und mit einer zweiten elektrischen Baugruppe
JPH11163047A (ja) * 1997-11-27 1999-06-18 Toshiba Corp 半導体装置の製造方法及びその装置
US6046910A (en) * 1998-03-18 2000-04-04 Motorola, Inc. Microelectronic assembly having slidable contacts and method for manufacturing the assembly
JP2000294771A (ja) * 1999-04-02 2000-10-20 Fuji Electric Co Ltd プレーナ型半導体装置
JP3756348B2 (ja) * 1999-06-15 2006-03-15 沖電気工業株式会社 合わせズレ検出パターン
US6142361A (en) * 1999-12-09 2000-11-07 International Business Machines Corporation Chip C4 assembly improvement using magnetic force and adhesive
US6376263B1 (en) * 2000-01-24 2002-04-23 International Business Machines Corporation Non-destructive module placement verification
EP1136960A1 (de) * 2000-03-24 2001-09-26 Infineon Technologies AG Individualanordnung
US7057292B1 (en) * 2000-05-19 2006-06-06 Flipchip International, Llc Solder bar for high power flip chips
KR100429856B1 (ko) * 2001-11-15 2004-05-03 페어차일드코리아반도체 주식회사 스터드 범프가 있는 웨이퍼 레벨 칩 스케일 패키지 및 그 제조 방법
US20050176233A1 (en) * 2002-11-15 2005-08-11 Rajeev Joshi Wafer-level chip scale package and method for fabricating and using the same
US20040191955A1 (en) * 2002-11-15 2004-09-30 Rajeev Joshi Wafer-level chip scale package and method for fabricating and using the same
US20050012225A1 (en) * 2002-11-15 2005-01-20 Choi Seung-Yong Wafer-level chip scale package and method for fabricating and using the same
US7109583B2 (en) * 2004-05-06 2006-09-19 Endwave Corporation Mounting with auxiliary bumps
US20060028228A1 (en) * 2004-08-05 2006-02-09 Bor-Doou Rong Test pads for IC chip
JP4570446B2 (ja) * 2004-11-16 2010-10-27 パナソニック株式会社 半導体ウェハーおよびその検査方法
US20070187844A1 (en) 2006-02-10 2007-08-16 Wintec Industries, Inc. Electronic assembly with detachable components
US7928591B2 (en) * 2005-02-11 2011-04-19 Wintec Industries, Inc. Apparatus and method for predetermined component placement to a target platform
US7728437B2 (en) * 2005-11-23 2010-06-01 Fairchild Korea Semiconductor, Ltd. Semiconductor package form within an encapsulation
US20110222253A1 (en) * 2006-02-10 2011-09-15 Kong-Chen Chen Electronic assembly with detachable components
US20110222252A1 (en) * 2006-02-10 2011-09-15 Kong-Chen Chen Electronic assembly with detachable components
US20110223695A1 (en) * 2006-02-10 2011-09-15 Kong-Chen Chen Electronic assembly with detachable components
US20110228506A1 (en) * 2006-02-10 2011-09-22 Kong-Chen Chen Electronic assembly with detachable components
TWI307406B (en) * 2006-07-06 2009-03-11 Au Optronics Corp Misalignment detection devices
FR2928030B1 (fr) * 2008-02-22 2010-03-26 Commissariat Energie Atomique Procede d'alignement de deux substrats par des microbobines.
CN104779238B (zh) * 2014-01-10 2018-08-21 中芯国际集成电路制造(上海)有限公司 一种晶圆接合质量的检测结构及检测方法

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JPH0746747B2 (ja) * 1986-09-09 1995-05-17 松下電器産業株式会社 半導体レーザのボンディング方法
JPS63150930A (ja) * 1986-12-15 1988-06-23 Shin Etsu Polymer Co Ltd 半導体装置
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Also Published As

Publication number Publication date
US5092033A (en) 1992-03-03
AU6982491A (en) 1991-07-25
CA2034702A1 (en) 1991-07-24
EP0439136A2 (en) 1991-07-31
US5302854A (en) 1994-04-12
EP0439136A3 (https=) 1994-01-05
AU634334B2 (en) 1993-02-18

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