KR940007143A - 솔더레지스트용 잉크조성물 - Google Patents

솔더레지스트용 잉크조성물 Download PDF

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KR940007143A
KR940007143A KR1019930018102A KR930018102A KR940007143A KR 940007143 A KR940007143 A KR 940007143A KR 1019930018102 A KR1019930018102 A KR 1019930018102A KR 930018102 A KR930018102 A KR 930018102A KR 940007143 A KR940007143 A KR 940007143A
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meth
ink composition
iii
acrylic acid
polyfunctional
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도시오 아와지
노부아키 오오츠키
모토히로 아라카와
히로미치 다나카
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다나카 쇼소
가부시끼가이샤 닛폰 쇼쿠바이
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    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C08G59/1466—Acrylic or methacrylic acids
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/035—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
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    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching

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Abstract

본 발명의 광경화형 액상솔더레지스트용 잉크조성물은 핵체수가 4이상의 노볼락형에폭시수지에 (메타)아크릴로일기를 도입함과 동시에, 쇄연장제를 사용하여 고분자량화한 충분한 분자량과 (메타)아크릴로일기를 가진 광중합성수지를 주성분으로 한다.
이 조성물은 해상도, 내열성, 밀착성, 내약품성 및 태크프리성이 뛰어난 경화막을 합성할 수 있어서, 광경화형 레지스트용으로 가장 적합하다. 또한, 산무수물을 반응시키면 알칼리현상도 가능하게 된다.

Description

솔더레지스트용 잉크조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (14)

  1. 광중합성수지(A), 광중합개시제(B) 및 희석제(C)를 가진 솔더레지스트용 잉크조성물로서, 광중합성수지(A)의 핵체수가 4이상인 노블락형에폭시수지(Ⅰ)에 (메타)아크릴산(Ⅱ)을 반응시켜, (메타)아크릴산(Ⅱ)의 카르복실기와 에폭시수지(Ⅰ)중의 에폭시기와의 반응에 의하여 에폭시수지(Ⅰ)중에 (메타)아크릴로일기를 도입함과 동시에, 상기 카르복실기와 에폭시기와의 반응에 의하여 생성되는 히드록실기 및/또는 에폭시수지(Ⅰ)중의 에폭시기를 통하여 그 히드록실기 및/또는 그 에폭시기와 반응할 수 있는 관능기를 2개 이상 가진 쇄연장제(Ⅲ)로 에폭시수지(Ⅰ)를 고분자화하여 얻을 수 있는 것을 특징으로 하는 솔더레지스트 잉크조성물.
  2. 제1항에 있어서, 쇄연장제(Ⅲ)가 다가페놀, 다염기산, 다관능아민 및 다가티올로된 군중에서 선택되는 에폭시기와 반응할 수 있는 관능기를 2개 이상가진 화합물인 것을 특징으로 하는 솔더레지스트용 잉크조성물.
  3. 제1항에 있어서, 쇄연장제(Ⅲ)가 다가페놀인 것을 특징으로 하는 솔더레지스트용 잉크조성물.
  4. 제1항에 있어서, 쇄연장제(Ⅲ)가 히드록실기와 반응할 수 있는 관능기를 2개 이상 가진 다관능이소시아네이트인 것을 특징으로 하는 솔더레지스트용 잉크조성물.
  5. 제2항 또는 제3항에 있어서, 노볼락형에폭시수지(Ⅰ)중의 에폭시기 1 화학 당량에 대하여, (메타)아크릴산(Ⅱ)과 쇄연장제(Ⅲ)중의 관능기의 합계가 0.9∼1.1화학 당량이고,더욱이 쇄연장제(Ⅲ)의 사용량이 노볼락형에 폭시수지(Ⅰ) 1몰에 대하여 0.2∼0.8몰인 것을 특징으로 하는 솔더레지스트용 잉크조성물.
  6. 제4항에 있어서, 노볼락형에폭시수지(Ⅰ)중의 에폭시기 1화학 당량에 대하여 (메타)아크릴산(Ⅱ)이 0.9∼1.1몰이고, 쇄연장제(Ⅲ)의 사용량이 노볼락형에폭시수지(Ⅰ) 1몰에 대하여 0.2∼0.8몰인 것을 특징으로 하는 솔더레지스트용 잉크조성물.
  7. 제2항 또는 제3항에 있어서, 광중합성수지(A)가 (메타)아크릴산(Ⅱ)에 더하여, 다시 분자중에 1개의 카르복실기와 2개 이상의 (메타)아크릴로일기를 가진 다관능(메타)아크릴레이트(Ⅳ)를 반응시켜 얻을 수 있는 것을 특징으로 하는 솔더레지스트용 잉크조성물.
  8. 노볼락형에폭시수지(Ⅰ)중의 에폭시기 1화학 당량에 대하여 (메타)아크릴산(Ⅱ), 다관능(메타)아크릴레이트(Ⅳ) 및 쇄연장제(Ⅲ)중의 관능기의 합계가 0.9∼1.1 화학 당량이고, 또한 (메타)아크릴산(Ⅱ)과 다관능(메타)아크릴레이트(Ⅳ)의 화학 당량비가 (9:1)∼(5:5)이고, 더욱이 쇄연장제(Ⅲ)의 사용량이 에폭시수지(Ⅰ) 1몰에 대하여 0.2∼0.8몰인 것을 특징으로 하는 솔더레지스트용 잉크조성물.
  9. 제4항에 있어서, 광중합성수지(A)가 (메타)아크릴산(Ⅱ)에 더하여, 다시 분자중에 1개의 카르복실기와 2개이상의 (메타)아크릴로일기를 가진 다관능(메타)아크릴레이트(Ⅳ)를 반응시켜 얻을 수 있는 것을 특징으로 하는 솔더레지스트용 잉크조성물.
  10. 제9항에 있어서, 노볼락형에폭시수지(Ⅰ)중의 에폭시기 1화학 당량에 대하여, (메타)아크릴산(Ⅱ) 및 다관능(메타)아크릴레이트(Ⅳ)중의 관능기의 합계가 0.9∼1.1 화학 당량이고, 또한 (메타)아크릴산(Ⅱ)과 다관능(메타)아크릴레이트(Ⅳ)의 화학 당량비가 (9:1)∼(5:5)이고, 더욱이 쇠연장제(Ⅲ)의 사용량이 에폭시수지(Ⅰ) 1몰에 대하여 0.2∼0.8몰인 것을 특징으로 하는 솔더레지스트용 잉크조성물.
  11. 제1항에 있어서, 광중합성수지(A)가 다시 분자중에 1개의 이소시아네이트기와 2개 이상의 (메타)아크릴로일기를 가진 다관능(메타)아크릴레이트(Ⅴ)를 반응시켜 얻을 수 있는 것을 특징으로 하는 솔더레지스트용 잉크 조성물.
  12. 제1항에 있어서, 광중합수지(A)가 다시 산무수물(Ⅵ)을 반응시켜 얻을 수 있는 것을 특징으로 하는 솔더레지스트용 잉크조성물.
  13. 제1항에 있어서, 광중합개시제(B)가 솔더레지스트용 잉크조성물 중에 0.5∼25중량% 함유되어 있는 것을 특징으로 하는 솔더레지스트용 잉크조성물.
  14. 제1항에 있어서, 희석제(C)가 광합성수지(A) 100중량부에 대하여 5∼500중량부 함유되어 있는 것을 특징으로 하는 솔더레지스트용 잉크조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930018102A 1992-09-10 1993-09-09 솔더레지스트용 잉크조성물 KR0126118B1 (ko)

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JP24200092 1992-09-10
JP92-242000 1992-09-10
JP93-176787 1993-07-16
JP17678793A JP3288140B2 (ja) 1993-07-16 1993-07-16 ソルダーレジスト用インキ組成物

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GB9708510D0 (en) * 1997-04-25 1997-06-18 Dow Deutschland Inc Nitrogen containing epoxy resins for photocurable coating applications
US6583198B2 (en) * 1997-11-28 2003-06-24 Hitachi Chemical Company, Ltd. Photo curable resin composition and photosensitive element
JP2002533775A (ja) * 1998-12-22 2002-10-08 バンティコ アクチエンゲゼルシャフト フォトレジスト被膜の製造方法
US6553735B1 (en) * 2001-11-06 2003-04-29 Nan Ya Plastics Corporation Joint structure as reinforcing rib to injected frame of door leaf with glass
DE10223313A1 (de) * 2002-05-24 2003-12-11 Bakelite Ag Modifizierte Epoxyacrylate
KR100571366B1 (ko) * 2004-01-27 2006-04-14 주식회사 코오롱 액상 포토 솔더 레지스트 조성물
US20060033793A1 (en) * 2004-08-10 2006-02-16 Webster Grant A Coupling agent patterning
EP2168994A1 (en) 2008-09-25 2010-03-31 Huntsman Advanced Materials (Switzerland) GmbH Photocurable composition

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JPS61243869A (ja) * 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
DE3588111T2 (de) * 1985-06-29 1996-10-31 Asahi Chem Res Lab Kunststoffzusammensetzung für Lötschutztinte
JPH0639518B2 (ja) * 1986-04-28 1994-05-25 東京応化工業株式会社 耐熱性感光性樹脂組成物
JPS63258975A (ja) * 1986-12-26 1988-10-26 Toshiba Corp ソルダーレジストインキ組成物
JPH0717737B2 (ja) * 1987-11-30 1995-03-01 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法
US4980234A (en) * 1987-12-23 1990-12-25 Minnesota Mining And Manufacturing Co. Epoxide resin compositions and method
JPH0359022A (ja) * 1989-07-27 1991-03-14 Nippon Chibagaigii Kk 熱硬化性樹脂
JP2988736B2 (ja) * 1991-03-11 1999-12-13 株式会社アサヒ化学研究所 一液型感光性熱硬化性樹脂組成物
JP2904321B2 (ja) * 1991-10-30 1999-06-14 互応化学工業株式会社 液状レジストインク組成物
US5928839A (en) * 1992-05-15 1999-07-27 Morton International, Inc. Method of forming a multilayer printed circuit board and product thereof

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Publication number Publication date
EP0587189A2 (en) 1994-03-16
DE69333313T2 (de) 2004-09-09
KR0126118B1 (ko) 1997-12-18
EP0587189A3 (en) 1994-08-10
DE69333313D1 (de) 2004-01-08
EP0587189B1 (en) 2003-11-26
US6015651A (en) 2000-01-18

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