KR930014920A - 반도체 장치 어셈블리 - Google Patents

반도체 장치 어셈블리 Download PDF

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KR930014920A
KR930014920A KR1019920024885A KR920024885A KR930014920A KR 930014920 A KR930014920 A KR 930014920A KR 1019920024885 A KR1019920024885 A KR 1019920024885A KR 920024885 A KR920024885 A KR 920024885A KR 930014920 A KR930014920 A KR 930014920A
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semiconductor device
frame opening
substrate
opening
window frame
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KR960002490B1 (ko
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알. 톰슨 케네쓰
바너지 킹슈크
다 코스타 앨베스 프랜시스코
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제임스 더블유. 길맨
모토로라 인코포레이티드
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Abstract

내용 없음

Description

반도체 장치 어셈블리
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 기판에 부착된 플립-칩의 등단면도.
제2도는 본 발명에 따른 기판에 땜납된 다이(die)의 제1도의 2-2를 따라 자른 단면도.
제3도는 언더필(underfill) 물질의 응용후에 면 2-2를 통해 자른 제1도의 단면도.
제4도는 본 발명의 다른 실시예의 등면도.
* 도면의 주요부분에 대한 부호의 설명
12 : 활성 14 : 돌출부
28 : 개구 34 : 홀

Claims (11)

  1. 반도체 장치 어셈블리에 있어서, 주변과 활성면을 갖는 반도체 장치와, 금속화 패턴을 갖는 기판과, 제1면과 금속화 패턴을 실제로 덮는 중합 필름을 포함하며, 상기 반도체 장치 장착영역을 갖는 중합 필름은, 반도체 장치와 거의 같은 형태이며 상기 장치 주변보다 더 큰 상기 기판 부분에 노출하는 제1개구와, 상기 제1개구내에 위치하여 집중되는 거의 같은 형태이면서 장착 영역내에서 윈도우 프레임 개구를 발생하는 제1개구보다 작은 중합 필름의 부분을 구비하며, 상기 반도체 장치는 기판과 대향한 활성면을 가진 금속화 패턴에 전기적으로 접촉되며, 상기 장치와 기판 사이에 위치된 점착성 물질을 구비하고, 상기 점착성 물질은 상기 장치 활성면과 기판 사이의 보이드를 거의 채우고 상기 윈도우 필름 개구에 가로로 연장되는 반도체 장치 어셈블리.
  2. 제1항에 있어서, 상기 윈도우 프레임 개구는 대략 0.1㎜와 0.5㎜ 사이이며 상기 반도체 장치로부터 대략 0.3㎜와 2.5㎜ 사이에 있는 반도체 장치 어셈블리.
  3. 제1항에 있어서, 상기 점착성 물질은 윈도우 프레임 개구로 연장되며, 거의 윈도우 프레임 개구를 채우는 반도체 장치 어셈블리.
  4. 제1항에 있어서, 상기 중합 필름 부분내에 위치하여 집중되고, 상기 중합 필름 부분보다 작게 거의 같은 형태의 제2개구를 더 하는 반도체 장치 어셈블리.
  5. 반도체 장치 어셈블리에 있어서, 다수의 금속 충돌부에 의해 부착된 플립 칩을 갖는 기판을 구비하며, 상기 기판은 상기 기판 면을 거의 덮는 땜납 마스크를 갖고, 필름 칩 장착 영역을 갖는 땜납 마스크와, 상기 기판 부분에 플립 칩과 거의 같은 형태이며 플립 칩보다 더 큰 제1개구와, 상기 제1개구내에 위치하고 집중되는 것의 같은 형태이면서 장착 영역내의 윈도우 프레임 개구를 발생하고, 제1개구보다 작은 땜납 마스크 부분과, 상기 플립칩과 기판 사이에 제공되고 윈도우 프레임 개구에 대해 플립 칩 주변 넘어로 연장되고, 개구 넘어로는 연장되지 않는 점착성 언더필 물질을 구비하는 반도체 장치 어셈블리.
  6. 제5항에 있어서, 상기 윈도우 프레임 개구는 대략 0.1㎜에서 0.5㎜ 폭 사이이며, 상기 플립 칩으로부터 떨어져 대략 0.3㎜와 2.5㎜ 사이에 있는 반도체 장치 어셈블리.
  7. 제5항에 있어서, 상기 언더필 물질은 윈도우 프레임 개구내로 연장되며, 윈도우 프레임 개구를 거의 채우는 반도체 장치 어셈블리.
  8. 전자 어셈블리에 있어서, 몸체를 갖는 반도체 패케이지와, 제1표면과 제1표면상의 금속화 패턴을 갖는 회로 캐링 기판과, 상기 제1면과 금속화 패턴을 거의 덮는 중합 필름과, 상기 중합 필름에 한정된 윈도우-프레임 개구를 포함하며, 상기 개구는 패케이지 몸체와 같은 형태이며 상기 장치 패케이지보다 크며, 상기 제1면에 노출하도록 상기 플립을 통해 연장되며, 상기 반도체 장치 패케이지는, 상기 금속 패턴에 전기적으로 부착되고, 상기 패케이지와 기판 사이의 공간을 제공하도록 상기 프레임 개구내에 위치되며, 상기 패케이지 몸체와 회로 캐링 기판 사이에 위치되고 상기 공간을 거의 채우며 상기 윈도우-프레임 개구의 제한내에서 억제되는 언더필 물질을 포함하는 전자 어셈블리.
  9. 제8항에 있어서, 상기 윈도우 프레임 개구는 대략 0.1㎜와 0.5㎜ 폭 사이에 있는 전자 어셈블리.
  10. 제8항에 있어서, 상기 윈도우 프레임 개구는 내부 주변과 외부 주변을 가지며 대략 0.3㎜ 및 2.5㎜ 사이에 있는 상기 내부 주변은 상기 패케이지 주변보다 큰 전자 어셈블리.
  11. 제8항에 있어서, 상기 언더필 물질은 윈도우 프레임 개구내에서 연장되며 상기 윈도우 프레임 개구를 거의 채우는 전자 어셈블리.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920024885A 1991-12-23 1992-12-21 반도체 장치 어셈블리 KR960002490B1 (ko)

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US07/811,841 US5218234A (en) 1991-12-23 1991-12-23 Semiconductor device with controlled spread polymeric underfill
US811,841 1991-12-23

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