KR920700092A - 금속 표면을 보호하고 납땜성을 향상시키는 방법 및 조성물 - Google Patents
금속 표면을 보호하고 납땜성을 향상시키는 방법 및 조성물Info
- Publication number
- KR920700092A KR920700092A KR1019900702596A KR900702596A KR920700092A KR 920700092 A KR920700092 A KR 920700092A KR 1019900702596 A KR1019900702596 A KR 1019900702596A KR 900702596 A KR900702596 A KR 900702596A KR 920700092 A KR920700092 A KR 920700092A
- Authority
- KR
- South Korea
- Prior art keywords
- compositions
- methods
- metal surfaces
- protecting metal
- improving solderability
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Paints Or Removers (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Nonmetallic Welding Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33617889A | 1989-04-11 | 1989-04-11 | |
JP336178 | 1989-04-11 | ||
PCT/US1990/000876 WO1990011867A1 (en) | 1989-04-11 | 1990-02-23 | Method and composition for protecting and enhancing the solderability of metallic surfaces |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920700092A true KR920700092A (ko) | 1992-02-19 |
KR930006435B1 KR930006435B1 (ko) | 1993-07-16 |
Family
ID=23314909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900702596A KR930006435B1 (ko) | 1989-04-11 | 1990-02-23 | 금속 표면을 보호하고 납땜성을 향상시키는 방법 및 조성물 |
Country Status (14)
Country | Link |
---|---|
EP (1) | EP0423286B1 (ko) |
JP (1) | JPH0822473B2 (ko) |
KR (1) | KR930006435B1 (ko) |
AU (1) | AU612075B2 (ko) |
CA (1) | CA2027570C (ko) |
DE (1) | DE69012941T2 (ko) |
DK (1) | DK0423286T3 (ko) |
ES (1) | ES2060159T3 (ko) |
GR (1) | GR1000702B (ko) |
IL (1) | IL93537A (ko) |
MY (1) | MY105262A (ko) |
NO (1) | NO905310D0 (ko) |
TR (1) | TR25823A (ko) |
WO (1) | WO1990011867A1 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5177134A (en) * | 1990-12-03 | 1993-01-05 | Motorola, Inc. | Tacking agent |
US6796482B2 (en) * | 2002-10-31 | 2004-09-28 | Freescale Semiconductor, Inc. | Phase separated system for fluxing |
DE10314700A1 (de) | 2003-03-31 | 2004-10-14 | Behr Gmbh & Co. Kg | Verfahren zur Herstellung oberflächenmodifizierter Werkstücke |
JP2008062253A (ja) * | 2006-09-05 | 2008-03-21 | Denso Corp | はんだ付け用フラックスおよびはんだペースト組成物 |
JP2014168791A (ja) * | 2013-03-01 | 2014-09-18 | Hitachi Chemical Co Ltd | フラックスフィルム、フリップチップ接続方法、及び半導体装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR879907A (fr) * | 1941-04-15 | 1943-03-09 | Fides Gmbh | Résine synthétique pour soudure |
US2715616A (en) * | 1951-12-20 | 1955-08-16 | Robert M Macintosh | Organic coating for wire |
US2898255A (en) * | 1958-06-30 | 1959-08-04 | Ibm | Soldering flux composition |
GB1050444A (en) * | 1962-06-13 | 1966-12-07 | Libbey-Owens-Ford Glass Co. | Method of soldering and fluxing composition therefor |
JPS4855854A (ko) * | 1971-11-17 | 1973-08-06 | ||
US3977916A (en) * | 1974-12-20 | 1976-08-31 | Chevron Research Company | Wax-flux composition containing alkylaryl sulfonic acid for soldering |
US3960614A (en) * | 1975-01-31 | 1976-06-01 | Chevron Research Company | Wax-flux composition containing a diester of sulfomaleic acid for soldering |
AT356776B (de) * | 1977-09-19 | 1980-05-27 | Herberts & Co Gmbh | Verfahren zur herstellung von elektrisch isolierenden, hochflexiblen und/oder loetfaehigen ueberzuegen |
DE2828197A1 (de) * | 1978-06-27 | 1980-01-03 | Winchester Electronics Gmbh | Halogenfreies flussmittel fuer die weichloetung auf kolophoniumbasis |
JPS5592293A (en) * | 1978-12-28 | 1980-07-12 | Sanwa Kagaku Kogyo Kk | Solid flux for soldering |
JPS5649680A (en) * | 1979-09-27 | 1981-05-06 | Toshiba Electric Equip Corp | Power source device |
DE3205315A1 (de) * | 1982-02-15 | 1983-08-25 | Siemens AG, 1000 Berlin und 8000 München | Flussmittel zur verwendung beim weichloeten |
JPS6216899A (ja) * | 1985-07-15 | 1987-01-26 | Asahi Kagaku Kenkyusho:Kk | 水溶性フラツクス |
GB8628916D0 (en) * | 1986-12-03 | 1987-01-07 | Multicore Solders Ltd | Solder composition |
-
1990
- 1990-02-23 ES ES90906556T patent/ES2060159T3/es not_active Expired - Lifetime
- 1990-02-23 EP EP90906556A patent/EP0423286B1/en not_active Expired - Lifetime
- 1990-02-23 KR KR1019900702596A patent/KR930006435B1/ko not_active IP Right Cessation
- 1990-02-23 DK DK90906556.7T patent/DK0423286T3/da active
- 1990-02-23 JP JP2506087A patent/JPH0822473B2/ja not_active Expired - Lifetime
- 1990-02-23 AU AU54381/90A patent/AU612075B2/en not_active Expired
- 1990-02-23 WO PCT/US1990/000876 patent/WO1990011867A1/en active IP Right Grant
- 1990-02-23 DE DE69012941T patent/DE69012941T2/de not_active Expired - Fee Related
- 1990-02-23 CA CA002027570A patent/CA2027570C/en not_active Expired - Lifetime
- 1990-02-26 IL IL93537A patent/IL93537A/xx not_active IP Right Cessation
- 1990-02-27 MY MYPI90000305A patent/MY105262A/en unknown
- 1990-03-09 GR GR900100172A patent/GR1000702B/el not_active IP Right Cessation
- 1990-04-06 TR TR90/0335A patent/TR25823A/xx unknown
- 1990-12-07 NO NO905310A patent/NO905310D0/no unknown
Also Published As
Publication number | Publication date |
---|---|
NO905310L (no) | 1990-12-07 |
AU612075B2 (en) | 1991-06-27 |
AU5438190A (en) | 1990-11-05 |
DK0423286T3 (da) | 1994-10-24 |
KR930006435B1 (ko) | 1993-07-16 |
IL93537A0 (en) | 1990-11-29 |
CA2027570A1 (en) | 1990-10-12 |
NO905310D0 (no) | 1990-12-07 |
DE69012941T2 (de) | 1995-03-02 |
WO1990011867A1 (en) | 1990-10-18 |
GR1000702B (el) | 1992-10-08 |
JPH0822473B2 (ja) | 1996-03-06 |
MY105262A (en) | 1994-09-30 |
ES2060159T3 (es) | 1994-11-16 |
JPH03505305A (ja) | 1991-11-21 |
EP0423286A1 (en) | 1991-04-24 |
CA2027570C (en) | 1998-05-12 |
IL93537A (en) | 1992-11-15 |
DE69012941D1 (de) | 1994-11-03 |
GR900100172A (en) | 1991-09-27 |
EP0423286B1 (en) | 1994-09-28 |
TR25823A (tr) | 1993-09-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |