KR920003368A - Plasma chemical vapor deposition method and apparatus therefor - Google Patents

Plasma chemical vapor deposition method and apparatus therefor Download PDF

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Publication number
KR920003368A
KR920003368A KR1019900010091A KR900010091A KR920003368A KR 920003368 A KR920003368 A KR 920003368A KR 1019900010091 A KR1019900010091 A KR 1019900010091A KR 900010091 A KR900010091 A KR 900010091A KR 920003368 A KR920003368 A KR 920003368A
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KR
South Korea
Prior art keywords
reaction gas
plasma chemical
chemical vapor
thin film
discharge region
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KR1019900010091A
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Korean (ko)
Inventor
송만곤
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김정배
삼성전관 주식회사
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Priority to KR1019900010091A priority Critical patent/KR920003368A/en
Publication of KR920003368A publication Critical patent/KR920003368A/en

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Abstract

내용 없음No content

Description

플라즈마 화학 기상 박막 형성방법 및 그 장치Plasma chemical vapor deposition method and apparatus therefor

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 제1도에 도시된 플라즈마 화학기상 박막 형성장치의 주요부 발췌 측면도.FIG. 2 is a side view of an essential part of the plasma chemical vapor thin film forming apparatus shown in FIG.

제3도는 본 발명에 다른 플라즈마 화학기상 증착방법을 실현하기 위한 성막 장치의 한 실시예를 나타낸 측면도.3 is a side view showing an embodiment of a film forming apparatus for realizing a plasma chemical vapor deposition method according to the present invention.

Claims (3)

플라즈마 방전영역에서의 반응 가스의 반응에 따르는 부산물이 타케트 전극에 설치된 성막대상물에 부착되게 하는 플라즈마 화학기상 박막 형성 방법에 있어서, 상기 방전 영역으로 안내되는 반응가스의 전체 유동역역이 다단계에 걸친 인위적 안내 수단을 통하여 점차 확대하도록 하여, 상기 방전영역 전체에 있어서의 반응가스의 공급밀도가 고르게 될 수 있도록 하는 것을 그 특징으로 하는 플라즈마 화학기상 박막 형성방법.In the plasma chemical vapor deposition method for forming a by-product by the reaction of the reaction gas in the plasma discharge region attached to the deposition object installed on the target electrode, the entire flow area of the reaction gas guided to the discharge region is artificially multistage A method of forming a plasma chemical vapor thin film, characterized in that the supply means of the reaction gas in the entire discharge region can be made uniform by gradually expanding through the guide means. 반응 가스 유입구와 배출구가 마련된 진공 체임버내에, 소오스 전극과 타게트 전극이 소정 간격으로 배치되고, 상기 유입구로부터의 반응가스를 상기 소오스 전극의 분출구로 유동하는 유동결로상에, 다수의 반응가스 안내공을 갖는 중간판이 설치되도록 된 플라즈마 화학 기상 박막 형성 장치에 있어서, 상기 중간판이 둘이상 마련되고, 각 중간판에 형성되는 소정직경의 반응 가스 안내공의 갯수가 반응가스의 유동방향으로 점차 증가되도록 하여서 된 것을 특징으로 하는 플라즈마 화학기상 박막 형성장치.A source electrode and a target electrode are arranged at predetermined intervals in a vacuum chamber provided with a reaction gas inlet and an outlet, and a plurality of reaction gas guide holes are placed on a flow condensate flowing the reaction gas from the inlet to the outlet of the source electrode. In the plasma chemical vapor thin film forming apparatus, which is provided with an intermediate plate having two or more intermediate plates, two or more of the intermediate plates are provided, and the number of reaction gas guide holes having a predetermined diameter formed in each intermediate plate is gradually increased in the flow direction of the reaction gas. Plasma chemical vapor thin film forming apparatus, characterized in that. 제2항에 있어서, 상기 각 중간판의 각 안내공의 직경이 전체적으로 같거나, 또는 반응 가스의 유동 방향으로 소정 비율로 점차 감소, 또는 점차 증가되도록 하여 된 것은 그 특징으로 하는 플라즈마 화학시상 박막 장치.The plasma chemical image thin film device according to claim 2, wherein the diameter of each guide hole of each intermediate plate is equal to the whole, or is gradually decreased or gradually increased in a predetermined ratio in the flow direction of the reaction gas. . ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900010091A 1990-07-04 1990-07-04 Plasma chemical vapor deposition method and apparatus therefor KR920003368A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019900010091A KR920003368A (en) 1990-07-04 1990-07-04 Plasma chemical vapor deposition method and apparatus therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900010091A KR920003368A (en) 1990-07-04 1990-07-04 Plasma chemical vapor deposition method and apparatus therefor

Publications (1)

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KR920003368A true KR920003368A (en) 1992-02-29

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KR1019900010091A KR920003368A (en) 1990-07-04 1990-07-04 Plasma chemical vapor deposition method and apparatus therefor

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