KR910001929A - 웨이퍼(wafer) 형상목적물, 특히 반도체웨이퍼를 수납하는 체결장치 및 그 처리방법 - Google Patents

웨이퍼(wafer) 형상목적물, 특히 반도체웨이퍼를 수납하는 체결장치 및 그 처리방법 Download PDF

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Publication number
KR910001929A
KR910001929A KR1019900008759A KR900008759A KR910001929A KR 910001929 A KR910001929 A KR 910001929A KR 1019900008759 A KR1019900008759 A KR 1019900008759A KR 900008759 A KR900008759 A KR 900008759A KR 910001929 A KR910001929 A KR 910001929A
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KR
South Korea
Prior art keywords
wafer
fastening device
fastening
frame
semiconductor wafers
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KR1019900008759A
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English (en)
Inventor
아돌프 거버 한스
호호게상 게오르그
파르두비츠키 알프레드
쉬머들린들 만프레드
지프 베르너
쉬바이고퍼 아터
Original Assignee
로버트 뢰머
바커-헤미트로닉 게셀샤프트 퓌르 엘렉트로닉-그룬드스토페엠베하
하인즈 실버나겔
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Application filed by 로버트 뢰머, 바커-헤미트로닉 게셀샤프트 퓌르 엘렉트로닉-그룬드스토페엠베하, 하인즈 실버나겔 filed Critical 로버트 뢰머
Publication of KR910001929A publication Critical patent/KR910001929A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

내용 없음

Description

웨이퍼(wafer)형상목적물, 특히 반도체웨이퍼를 수납하는 체결장치 및 그 처리방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 및 제2도는 본 발명에 의한 체결장치의 실시예를 나타낸 것으로, 제1도는 체결구성요소(holding elemnets)로서 서모바이메탈(thermo-bimetal)로 구성된 스프링텅(spring tonque)를 가진 체결장치를 나타내며.
제2도는 열작용결과, 접촉하는 와이어에 의해 체결위치에서 이탈위치로 변환시킬수 있는 체결구성요소를 가진 체결장치를 나타낸다.

Claims (10)

  1. 특정의 반도체웨이퍼(particular semiconductor)에 웨이퍼형상목적물(wafer-like objects)을 수납하고, 그 웨이퍼를 접촉없이 적어도 부분적으로 포위하는 프레임(frame)과 그 프레임에 의해 그 웨이퍼에 작동하는 체결 구성요소를 구비하는 체결장치(holding device)에 있어서, 상기 웨이퍼(1)와 공동으로 이동시키며, 적어도 3개의 체결구성요소(holding elements) (3)를 가저 그 웨이퍼(1)의 외주(outside circumference)에서 접선방향 및/ 또는 반경방향으로 향하도록 하여, 체결위치(holding position)에서 이탈위치(release position)로 변환시킬수 있도록 한 프레임(frame) (2)을 구성함을 특징으로 하는 상기 체결장치.
  2. 제1항에 있어서, 상기 체결장치는 6~10개의 체결구성요소를 구성함을 특징으로 하는 상기 체결장치.
  3. 제1항에 있어서, 상기 프레임(2)은 환형(annular)의 형상으로 구성함을 특징으로 하는 상기 체결장치.
  4. 제1항에 있어서, 상기 웨이퍼와 접촉하는 체결구성요소의 표면에는 상기 웨이퍼를 구성하는 반도체 재질(semiconductor material)로 된 지지편(supporting pieces) (4)으로 구성함을 특징으로 하는 상기 체결장치.
  5. 제1항에 있어서, 상기 체결구성요소로는 스프링텅(spring tonques)을 구성함을 특징으로 하는 상기 체결장치.
  6. 제5항에 있어서, 전류작용에 의해 체결장치에서 이탈위치로 변환시킬수 있는 상기 스프링텅은 체결구성요소로서 구성함을 특징으로 하는 상기 체결장치.
  7. 반도체웨이퍼(semiconductor wafers)를 처리하는 방법에 있어서, 상기 웨이퍼가 하나 또는 그 이상의 이동조작으로 구성하는 일연의 처리공정 또는 적어도 하나의 처리공정을 통과시켜 하나 또는 다수의 이동조작을 할때 청구범위 제1항 내지 제5항에서 청구한 결착장치내에서 상기 웨이퍼를 결착시킴을 특징으로 하는 상기 방법.
  8. 제7항에 있어서, 적어도 하나 또는 다수의 처리공정을 밟을때 상기 웨이퍼는 상기 체결장치내에 있도록 함을 특징으로 하는 상기 방법.
  9. 제8항에 있어서, 적어도 하나의 처리공정은 광표면검사(optical surface examination)공정임을 특징으로 하는 상기 방법.
  10. 제8항에 있어서, 상기의 적어도 하나의 처리공정은 레이저빔(laser beam)에 의한 상기 웨이퍼의 색임(in-scription)공정임을 특징으로 하는 상기 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900008759A 1989-06-15 1990-06-14 웨이퍼(wafer) 형상목적물, 특히 반도체웨이퍼를 수납하는 체결장치 및 그 처리방법 KR910001929A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP3919611.9 1989-06-15
DE3919611A DE3919611A1 (de) 1989-06-15 1989-06-15 Haltevorrichtung zur aufnahme von scheibenfoermigen gegenstaenden, insbesondere halbleiterscheiben, und verfahren zu deren behandlung

Publications (1)

Publication Number Publication Date
KR910001929A true KR910001929A (ko) 1991-01-31

Family

ID=6382814

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900008759A KR910001929A (ko) 1989-06-15 1990-06-14 웨이퍼(wafer) 형상목적물, 특히 반도체웨이퍼를 수납하는 체결장치 및 그 처리방법

Country Status (5)

Country Link
US (1) US5093550A (ko)
EP (1) EP0402900B1 (ko)
JP (1) JPH0325949A (ko)
KR (1) KR910001929A (ko)
DE (2) DE3919611A1 (ko)

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EP0405301B1 (en) * 1989-06-29 1995-08-30 Applied Materials, Inc. Apparatus for handling semiconductor wafers
DE4136342A1 (de) * 1991-11-05 1993-05-06 Leybold Ag, 6450 Hanau, De Vorrichtung zur halterung und zum transport von substraten in vakuumanlagen
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JPH09320999A (ja) * 1996-05-31 1997-12-12 Komatsu Electron Metals Co Ltd 半導体ウェハ貼付プレートの付着物除去装置
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Also Published As

Publication number Publication date
DE59007983D1 (de) 1995-01-26
EP0402900A2 (de) 1990-12-19
US5093550A (en) 1992-03-03
EP0402900B1 (de) 1994-12-14
JPH0325949A (ja) 1991-02-04
DE3919611A1 (de) 1990-12-20
EP0402900A3 (de) 1991-12-11

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