KR900011398Y1 - Semiconductor pin processing punch - Google Patents

Semiconductor pin processing punch Download PDF

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Publication number
KR900011398Y1
KR900011398Y1 KR2019880022617U KR880022617U KR900011398Y1 KR 900011398 Y1 KR900011398 Y1 KR 900011398Y1 KR 2019880022617 U KR2019880022617 U KR 2019880022617U KR 880022617 U KR880022617 U KR 880022617U KR 900011398 Y1 KR900011398 Y1 KR 900011398Y1
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KR
South Korea
Prior art keywords
punch
blade
pin processing
semiconductor pin
processing punch
Prior art date
Application number
KR2019880022617U
Other languages
Korean (ko)
Other versions
KR900011811U (en
Inventor
김충삼
Original Assignee
주식회사 성우미크론
김충삼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 성우미크론, 김충삼 filed Critical 주식회사 성우미크론
Priority to KR2019880022617U priority Critical patent/KR900011398Y1/en
Publication of KR900011811U publication Critical patent/KR900011811U/en
Application granted granted Critical
Publication of KR900011398Y1 publication Critical patent/KR900011398Y1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/44—Cutters therefor; Dies therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614—Means for mounting the cutting member

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  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Punching Or Piercing (AREA)

Abstract

내용 없음.No content.

Description

반도체 핀의 가공펀치Punching of Semiconductor Pins

제1도는 본 고안의 분해 사시도.1 is an exploded perspective view of the present invention.

제2도는 본 고안의 결합상태 종단면도.Figure 2 is a longitudinal cross-sectional view of the coupled state of the present invention.

제3도는 반도체 핀의 일예를 도시한 평면도.3 is a plan view showing an example of a semiconductor fin.

제4도는 종래의 펀치를 예시한 부분 단면도.4 is a partial cross-sectional view illustrating a conventional punch.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 지지구 2 : 돌출부1: support 2: protrusion

3 : 삽지홈 4 : 펀치날3: shovel groove 4: punch blade

4' : 괘지홈 5 : 괘정봉4 ': Hanging groove 5: Hanging rod

6 : 고정구6: fixture

본 고안은 반도체 핀을 성형하기 위한 펀치에 관한 것으로, 타공 절단기능을 갖는 다수의 펀치날을 분해결합이 용이한 상태로 조합한 것이다.The present invention relates to a punch for forming a semiconductor pin, and combines a plurality of punch blades having a perforation cutting function in a state that is easy to disassemble and bond.

이러한 종류의 종래 기술은 타공기능을 갖는 펀치날을 형성함에 있어서, 제4도와 같이 단일체의 금속덩이를 절삭 가공하여 다수의 펀치날이 돌출되게 하였다.In the prior art of this kind, in forming a punch blade having a perforation function, as shown in FIG.

그러므로 펀치의 사용중 부분적으로 날이 마모되거나, 다수중 일부의 날이 파쇄될 경우에도 부분적인 교체 및 보수가 불가능하여 전체적으로 교환을 해야 되는 비경제적인 페단이 있고, 펀치날의 구성소재는 대부분이 초경합금 등의 강도 높은 재질이므로 절삭가공이 매우 어려운 폐단이 있다.Therefore, even if the blade is worn out or the blade is partially broken during the use of the punch, there is an uneconomical pedan that cannot be partially replaced and repaired. Because of the high strength of the material, there is a closed end which is very difficult to cut.

본 고안은 상기한 종래의 결함을 개선하기 위해 안출한 것으로 가공하기 위한 반도체 핀의 형태에 따라 편치를 구성할 때 다수의 펀치날을 하나의 지지구 상에 분해 결합이 용이하게 조합하여 날의 제작을 용이하게 하고, 사용시 발생되는 보수관리를 간편하게 할 수 있도록 하였다.The present invention devised to improve the above-mentioned conventional defects, and when forming a bias according to the shape of a semiconductor pin for processing, a plurality of punch blades are easily combined on one support to disassemble and manufacture the blade. To facilitate the maintenance and management that occurs during use.

이하 본 고안의 구조를 첨부 도면에 의거하여 설명하면 다음과 같다.Hereinafter, the structure of the present invention will be described with reference to the accompanying drawings.

지지구(1)의 측면 사방으로 돌출부(2)를 일정 간격으로 돌출설치하여 삽지홈(3)을 형성하되 이에 타공용 펀치날(4)을 삽입하고, 펀치날(4)의 일측면으로 요설된 괘지홈(4')에 괘정봉(5)을 결합하여 고정구(6)의 홈(6')에 삽입고정 한 것으로, 도면중 미설명 부호 7은 체결공, 8은 볼트이다.Protruding parts (2) protruding at regular intervals on all sides of the support (1) to form an insertion groove (3), inserting the punching punch blades (4) for this, and is recommended to one side of the punch blade (4) Combining the fixed bar (5) to the fixed groove (4 ') was inserted into the groove (6') of the fixture 6, fixed reference numeral 7 in the figure is a fastening hole, 8 is a bolt.

상술한 구성으로 된 본 고안은 지지구(1)의 삽지홈(3)에 펀치날(4)을 끼우고, 이의 괘지홈(4')에 괘정봉(5)을 결합하여 고정구(6)의 홈(6')에 삽입한 후 체결공(7)을 통해 볼트(8)로 고정한 상태에서 단일체와 같은 견고함을 갖는 펀치가 형성되는데 이때의 작용 및 그 효과는 다음과 같다.The present invention having the above-described configuration inserts the punch blade (4) into the insertion groove (3) of the support (1), by combining the fixed bar (5) to its hanging groove (4 ') of the fixture (6) After inserting into the groove (6 ') is fixed with a bolt (8) through a fastening hole (7) to form a punch having the same rigidity as a monolith, the action and effect thereof are as follows.

지지구(1)의 측면 사방으로 결합된 펀치날(4)은 지지구(1)상단면 보다 돌출된 상태이므로, 금속판에 타공을 가할 수 있게 되며 이때 반도체 핀의 형태에 따라 펀치날(4)을 교환할 수 있게 되어 다양한 형태의 반도체 핀의 제작이 가능하다.Since the punch blades 4 coupled to the four sides of the supporter 1 protrude more than the upper surface of the supporter 1, the punch blades 4 can be perforated on the metal plate. It is possible to exchange the various types of semiconductor pins can be produced.

상기한 타공 과정에서 펀치날(4)의 선단부위에 마모 및 절단이 발생될 경우에는 고정구(6)로부터 지지구(1)를 분리한 상태에서 괘정봉(5)을 이탈시킨 후 결합부위를 선별하여 교체 한다.In the case of abrasion and cutting at the tip of the punch blade 4 in the above-described perforation process, after removing the support bar 5 in a state in which the support 1 is separated from the fixture 6, the coupling site is selected. Replace it.

그러므로 교환수리에 따른 시간의 단축 및 경제적인 이득을 얻을 수 있고, 초경합금으로 된 강도높은 펀치날의 가공으로 인한 불편을 해결할 수 있는 잇점이 있다.Therefore, it is possible to shorten the time and economical benefits of exchange and repair, and to solve the inconvenience caused by machining the hard punch blade made of cemented carbide.

Claims (1)

본 고안은 지지구(1)의 측면 사방으로 돌출부(2)를 일정 간격으로 돌출설치하여 삽지홈(3)을 형성하되 이에 펀치날(4)을 끼우고, 펀치날(4)의 일측면으로 요설된 패지홈(4')에 괘정봉(5)을 결합하여 된 것을 특징으로 한 반도체 핀의 가공펀치.The present invention forms the insertion groove (3) by protruding the projections (2) at regular intervals on all sides of the support (1) to sandwich the punch blade (4), to one side of the punch blade (4) A processing punch for semiconductor fins, characterized in that the ruled bar (5) is coupled to the recessed groove (4 ').
KR2019880022617U 1988-12-30 1988-12-30 Semiconductor pin processing punch KR900011398Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019880022617U KR900011398Y1 (en) 1988-12-30 1988-12-30 Semiconductor pin processing punch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019880022617U KR900011398Y1 (en) 1988-12-30 1988-12-30 Semiconductor pin processing punch

Publications (2)

Publication Number Publication Date
KR900011811U KR900011811U (en) 1990-07-02
KR900011398Y1 true KR900011398Y1 (en) 1990-12-28

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019880022617U KR900011398Y1 (en) 1988-12-30 1988-12-30 Semiconductor pin processing punch

Country Status (1)

Country Link
KR (1) KR900011398Y1 (en)

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Publication number Publication date
KR900011811U (en) 1990-07-02

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