KR880009429A - 반도체 소자 고정용 내열 접착필름 - Google Patents

반도체 소자 고정용 내열 접착필름 Download PDF

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Publication number
KR880009429A
KR880009429A KR1019880000060A KR880000060A KR880009429A KR 880009429 A KR880009429 A KR 880009429A KR 1019880000060 A KR1019880000060 A KR 1019880000060A KR 880000060 A KR880000060 A KR 880000060A KR 880009429 A KR880009429 A KR 880009429A
Authority
KR
South Korea
Prior art keywords
heat
adhesive film
resistant adhesive
semiconductor devices
fixing semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019880000060A
Other languages
English (en)
Korean (ko)
Inventor
유끼노리 사꾸모또
아쯔시 고시무라
히로시 마쯔시따
마사끼 쓰시마
Original Assignee
원본미기재
가부시끼 가이샤 도모에 가와세이시쇼
신꼬 덴기 고교 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 원본미기재, 가부시끼 가이샤 도모에 가와세이시쇼, 신꼬 덴기 고교 가부시끼 가이샤 filed Critical 원본미기재
Publication of KR880009429A publication Critical patent/KR880009429A/ko
Priority to KR2019940021708U priority Critical patent/KR940007545Y1/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
KR1019880000060A 1987-01-09 1988-01-08 반도체 소자 고정용 내열 접착필름 Withdrawn KR880009429A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940021708U KR940007545Y1 (ko) 1987-01-09 1994-08-26 반도체 소자 고정용 내열필름(Heat-resistance bonding film for attaching semiconductor device)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1987001075U JPH073636Y2 (ja) 1987-01-09 1987-01-09 半導体素子固定用耐熱接着フイルム
JP?62-1075 1987-01-09

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR2019940021708U Division KR940007545Y1 (ko) 1987-01-09 1994-08-26 반도체 소자 고정용 내열필름(Heat-resistance bonding film for attaching semiconductor device)

Publications (1)

Publication Number Publication Date
KR880009429A true KR880009429A (ko) 1988-09-15

Family

ID=30778641

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880000060A Withdrawn KR880009429A (ko) 1987-01-09 1988-01-08 반도체 소자 고정용 내열 접착필름

Country Status (2)

Country Link
JP (1) JPH073636Y2 (https=)
KR (1) KR880009429A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2668576B2 (ja) * 1989-02-23 1997-10-27 株式会社 巴川製紙所 接着テープ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57102137U (https=) * 1980-12-12 1982-06-23
JPS58169912A (ja) * 1982-03-31 1983-10-06 Hitachi Ltd 半導体装置
JPS59146963U (ja) * 1983-03-22 1984-10-01 凸版印刷株式会社 リ−ドフレ−ム
JPS59231825A (ja) * 1983-06-14 1984-12-26 Toshiba Corp 半導体装置
JPS60167454A (ja) * 1984-02-10 1985-08-30 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
JPH073636Y2 (ja) 1995-01-30
JPS63110034U (https=) 1988-07-15

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