KR20260003757A - 프로브 - Google Patents

프로브

Info

Publication number
KR20260003757A
KR20260003757A KR1020257039040A KR20257039040A KR20260003757A KR 20260003757 A KR20260003757 A KR 20260003757A KR 1020257039040 A KR1020257039040 A KR 1020257039040A KR 20257039040 A KR20257039040 A KR 20257039040A KR 20260003757 A KR20260003757 A KR 20260003757A
Authority
KR
South Korea
Prior art keywords
probe
protrusion
support member
axis direction
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257039040A
Other languages
English (en)
Korean (ko)
Inventor
도시나가 다케야
야스타카 기시
Original Assignee
가부시키가이샤 니혼 마이크로닉스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 니혼 마이크로닉스 filed Critical 가부시키가이샤 니혼 마이크로닉스
Publication of KR20260003757A publication Critical patent/KR20260003757A/ko
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • G01R1/06738Geometry aspects related to tip portion
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • G01R1/06727Cantilever beams
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755Material aspects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2896Testing of IC packages; Test features related to IC packages

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
KR1020257039040A 2023-06-01 2024-05-23 프로브 Pending KR20260003757A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2023-090723 2023-06-01
JP2023090723A JP2024172768A (ja) 2023-06-01 2023-06-01 プローブ
PCT/JP2024/019035 WO2024247885A1 (ja) 2023-06-01 2024-05-23 プローブ

Publications (1)

Publication Number Publication Date
KR20260003757A true KR20260003757A (ko) 2026-01-07

Family

ID=93657947

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257039040A Pending KR20260003757A (ko) 2023-06-01 2024-05-23 프로브

Country Status (6)

Country Link
US (1) US20260079179A1 (https=)
JP (1) JP2024172768A (https=)
KR (1) KR20260003757A (https=)
CN (1) CN121241261A (https=)
TW (1) TWI880760B (https=)
WO (1) WO2024247885A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021063782A (ja) 2019-10-17 2021-04-22 株式会社日本マイクロニクス 検査プローブ、検査プローブの製造方法および検査装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4932499B2 (ja) * 2005-01-14 2012-05-16 株式会社日本マイクロニクス 通電試験用プローブ
JP2010261718A (ja) * 2009-04-29 2010-11-18 Japan Electronic Materials Corp プローブ、複数のプローブが実装されたプローブカード、およびプローブカードにプローブを実装する際のプローブの位置決め方法
JP5412685B2 (ja) * 2009-07-24 2014-02-12 日本電子材料株式会社 プローブ、およびプローブの製造方法
JP5487049B2 (ja) * 2010-08-19 2014-05-07 株式会社日本マイクロニクス プローブカード
US8970238B2 (en) * 2011-06-17 2015-03-03 Electro Scientific Industries, Inc. Probe module with interleaved serpentine test contacts for electronic device testing
WO2014087906A1 (ja) * 2012-12-04 2014-06-12 日本電子材料株式会社 電気的接触子
JP7471778B2 (ja) * 2019-03-29 2024-04-22 株式会社日本マイクロニクス プローブカード
KR102261798B1 (ko) * 2020-04-03 2021-06-07 (주)화이컴 프로브 카드 제조용 지그, 이를 포함하는 프로브 정렬 시스템 및 이를 이용하여 제조된 프로브 카드
JP7626693B2 (ja) * 2021-11-22 2025-02-04 株式会社日本マイクロニクス プローブ格納治具、プローブ格納システムおよびプローブ格納方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021063782A (ja) 2019-10-17 2021-04-22 株式会社日本マイクロニクス 検査プローブ、検査プローブの製造方法および検査装置

Also Published As

Publication number Publication date
CN121241261A (zh) 2025-12-30
US20260079179A1 (en) 2026-03-19
TWI880760B (zh) 2025-04-11
WO2024247885A1 (ja) 2024-12-05
TW202503280A (zh) 2025-01-16
JP2024172768A (ja) 2024-12-12

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