KR20260003757A - 프로브 - Google Patents
프로브Info
- Publication number
- KR20260003757A KR20260003757A KR1020257039040A KR20257039040A KR20260003757A KR 20260003757 A KR20260003757 A KR 20260003757A KR 1020257039040 A KR1020257039040 A KR 1020257039040A KR 20257039040 A KR20257039040 A KR 20257039040A KR 20260003757 A KR20260003757 A KR 20260003757A
- Authority
- KR
- South Korea
- Prior art keywords
- probe
- protrusion
- support member
- axis direction
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2023-090723 | 2023-06-01 | ||
| JP2023090723A JP2024172768A (ja) | 2023-06-01 | 2023-06-01 | プローブ |
| PCT/JP2024/019035 WO2024247885A1 (ja) | 2023-06-01 | 2024-05-23 | プローブ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20260003757A true KR20260003757A (ko) | 2026-01-07 |
Family
ID=93657947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257039040A Pending KR20260003757A (ko) | 2023-06-01 | 2024-05-23 | 프로브 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20260079179A1 (https=) |
| JP (1) | JP2024172768A (https=) |
| KR (1) | KR20260003757A (https=) |
| CN (1) | CN121241261A (https=) |
| TW (1) | TWI880760B (https=) |
| WO (1) | WO2024247885A1 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021063782A (ja) | 2019-10-17 | 2021-04-22 | 株式会社日本マイクロニクス | 検査プローブ、検査プローブの製造方法および検査装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4932499B2 (ja) * | 2005-01-14 | 2012-05-16 | 株式会社日本マイクロニクス | 通電試験用プローブ |
| JP2010261718A (ja) * | 2009-04-29 | 2010-11-18 | Japan Electronic Materials Corp | プローブ、複数のプローブが実装されたプローブカード、およびプローブカードにプローブを実装する際のプローブの位置決め方法 |
| JP5412685B2 (ja) * | 2009-07-24 | 2014-02-12 | 日本電子材料株式会社 | プローブ、およびプローブの製造方法 |
| JP5487049B2 (ja) * | 2010-08-19 | 2014-05-07 | 株式会社日本マイクロニクス | プローブカード |
| US8970238B2 (en) * | 2011-06-17 | 2015-03-03 | Electro Scientific Industries, Inc. | Probe module with interleaved serpentine test contacts for electronic device testing |
| WO2014087906A1 (ja) * | 2012-12-04 | 2014-06-12 | 日本電子材料株式会社 | 電気的接触子 |
| JP7471778B2 (ja) * | 2019-03-29 | 2024-04-22 | 株式会社日本マイクロニクス | プローブカード |
| KR102261798B1 (ko) * | 2020-04-03 | 2021-06-07 | (주)화이컴 | 프로브 카드 제조용 지그, 이를 포함하는 프로브 정렬 시스템 및 이를 이용하여 제조된 프로브 카드 |
| JP7626693B2 (ja) * | 2021-11-22 | 2025-02-04 | 株式会社日本マイクロニクス | プローブ格納治具、プローブ格納システムおよびプローブ格納方法 |
-
2023
- 2023-06-01 JP JP2023090723A patent/JP2024172768A/ja active Pending
-
2024
- 2024-05-23 WO PCT/JP2024/019035 patent/WO2024247885A1/ja not_active Ceased
- 2024-05-23 KR KR1020257039040A patent/KR20260003757A/ko active Pending
- 2024-05-23 CN CN202480036224.XA patent/CN121241261A/zh active Pending
- 2024-05-29 TW TW113119874A patent/TWI880760B/zh active
-
2025
- 2025-11-24 US US19/398,492 patent/US20260079179A1/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021063782A (ja) | 2019-10-17 | 2021-04-22 | 株式会社日本マイクロニクス | 検査プローブ、検査プローブの製造方法および検査装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN121241261A (zh) | 2025-12-30 |
| US20260079179A1 (en) | 2026-03-19 |
| TWI880760B (zh) | 2025-04-11 |
| WO2024247885A1 (ja) | 2024-12-05 |
| TW202503280A (zh) | 2025-01-16 |
| JP2024172768A (ja) | 2024-12-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| D11 | Substantive examination requested |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D11-EXM-PA0201 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P11 | Amendment of application requested |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13 | Application amended |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| Q12 | Application published |
Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE) |