KR20260003441A - 광경화성 열경화성 수지 조성물, 드라이 필름, 경화물 및 당해 경화물을 갖는 전자 부품 - Google Patents

광경화성 열경화성 수지 조성물, 드라이 필름, 경화물 및 당해 경화물을 갖는 전자 부품

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Publication number
KR20260003441A
KR20260003441A KR1020257043730A KR20257043730A KR20260003441A KR 20260003441 A KR20260003441 A KR 20260003441A KR 1020257043730 A KR1020257043730 A KR 1020257043730A KR 20257043730 A KR20257043730 A KR 20257043730A KR 20260003441 A KR20260003441 A KR 20260003441A
Authority
KR
South Korea
Prior art keywords
resin composition
photocurable thermosetting
thermosetting resin
resin
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257043730A
Other languages
English (en)
Korean (ko)
Inventor
신이치로 후쿠다
츠요시 우치야마
가요코 도쿠미츠
히데카즈 미야베
Original Assignee
다이요 홀딩스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이요 홀딩스 가부시키가이샤 filed Critical 다이요 홀딩스 가부시키가이샤
Publication of KR20260003441A publication Critical patent/KR20260003441A/ko
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
KR1020257043730A 2020-09-04 2021-09-03 광경화성 열경화성 수지 조성물, 드라이 필름, 경화물 및 당해 경화물을 갖는 전자 부품 Pending KR20260003441A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020148967 2020-09-04
JPJP-P-2020-148967 2020-09-04
KR1020237010932A KR102907739B1 (ko) 2020-09-04 2021-09-03 광경화성 열경화성 수지 조성물, 드라이 필름, 경화물 및 당해 경화물을 갖는 전자 부품
PCT/JP2021/032395 WO2022050372A1 (ja) 2020-09-04 2021-09-03 光硬化性熱硬化性樹脂組成物、ドライフィルム、硬化物および当該硬化物を有する電子部品

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020237010932A Division KR102907739B1 (ko) 2020-09-04 2021-09-03 광경화성 열경화성 수지 조성물, 드라이 필름, 경화물 및 당해 경화물을 갖는 전자 부품

Publications (1)

Publication Number Publication Date
KR20260003441A true KR20260003441A (ko) 2026-01-06

Family

ID=80492239

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020257043730A Pending KR20260003441A (ko) 2020-09-04 2021-09-03 광경화성 열경화성 수지 조성물, 드라이 필름, 경화물 및 당해 경화물을 갖는 전자 부품
KR1020237010932A Active KR102907739B1 (ko) 2020-09-04 2021-09-03 광경화성 열경화성 수지 조성물, 드라이 필름, 경화물 및 당해 경화물을 갖는 전자 부품

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020237010932A Active KR102907739B1 (ko) 2020-09-04 2021-09-03 광경화성 열경화성 수지 조성물, 드라이 필름, 경화물 및 당해 경화물을 갖는 전자 부품

Country Status (4)

Country Link
JP (2) JP7781759B2 (https=)
KR (2) KR20260003441A (https=)
CN (1) CN115989456A (https=)
WO (1) WO2022050372A1 (https=)

Families Citing this family (4)

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Publication number Priority date Publication date Assignee Title
CN117820559B (zh) * 2022-09-29 2025-12-30 苏州铼赛智能科技有限公司 辐射可固化的树脂组合物及其制备方法
CN119717390A (zh) * 2023-09-28 2025-03-28 太阳油墨（苏州）有限公司 无三聚氰胺碱性显影型树脂组合物、干膜、固化物和具有该固化物的电子部件
CN120161672A (zh) * 2023-12-15 2025-06-17 太阳油墨（苏州）有限公司 感光性热固性树脂组合物、干膜、固化物和具有该固化物的电子部件
CN118981145B (zh) * 2024-08-01 2025-03-21 韶关市远望涂料厂有限公司 一种感光性干膜材料及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5688116B2 (ja) 2013-05-13 2015-03-25 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200417294A (en) * 2002-11-28 2004-09-01 Taiyo Ink Mfg Co Ltd Photo- and thermo-setting resin composition and printed wiring boards made by using the same
JP5043516B2 (ja) 2007-06-04 2012-10-10 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びそれを用いて得られるプリント配線
JP5147820B2 (ja) 2009-12-24 2013-02-20 株式会社タムラ製作所 スプレー塗装用白色ソルダーレジスト組成物
JP6359814B2 (ja) 2013-09-17 2018-07-18 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP5722418B1 (ja) * 2013-12-02 2015-05-20 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6788372B2 (ja) * 2015-06-05 2020-11-25 太陽インキ製造株式会社 アルカリ現像可能な樹脂組成物、ドライフィルム、硬化物およびプリント配線板
WO2018123695A1 (ja) 2016-12-28 2018-07-05 太陽インキ製造株式会社 硬化性組成物、主剤および硬化剤、ドライフィルム、硬化物、および、プリント配線板
JP6759323B2 (ja) * 2018-03-28 2020-09-23 太陽インキ製造株式会社 感光性樹脂組成物、２液型感光性樹脂組成物、ドライフィルムおよびプリント配線板
CN111868628B (zh) * 2018-03-30 2024-09-03 太阳控股株式会社 碱显影型光固化性热固化性树脂组合物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5688116B2 (ja) 2013-05-13 2015-03-25 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Also Published As

Publication number Publication date
TW202219169A (zh) 2022-05-16
JP2026035670A (ja) 2026-03-04
CN115989456A (zh) 2023-04-18
KR102907739B1 (ko) 2026-01-05
JPWO2022050372A1 (https=) 2022-03-10
KR20230061448A (ko) 2023-05-08
WO2022050372A1 (ja) 2022-03-10
JP7781759B2 (ja) 2025-12-08

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