KR20250045822A - Substrate procoessing device and substrate procoessing method - Google Patents

Abstract

The present invention relates to a substrate processing device and a substrate processing method. The technical problem to be solved is to provide a substrate processing device and a substrate processing method capable of detecting the contamination state of a chemical solution when the chemical solution for processing a substrate is contaminated.
The substrate processing device of the present invention according to the present invention comprises: a chamber having a processing space; a support unit supporting and rotating a substrate in the processing space; a liquid discharge unit discharging a chemical in a liquid state onto a substrate supported by the support unit; a liquid supply unit supplying the chemical to the liquid discharge unit; and a particle size distribution measuring device connected to the liquid supply unit, which separates particles by size using electrical mobility of particles dispersed and contained in the chemical solution, and then measures the number concentration of particles by size to measure the size distribution of particles.

Description

{SUBSTRATE PROCOESSING DEVICE AND SUBSTRATE PROCOESSING METHOD}

The present invention relates to a substrate processing device and a substrate processing method, and more specifically, to a substrate processing device and a substrate processing method for supplying liquid to a substrate and processing the substrate with liquid.

In order to manufacture semiconductor devices, various processes such as photography, deposition, ashing, etching, and ion implantation are performed. In addition, before and after these processes, a cleaning process is performed to clean the particles remaining on the substrate.

The cleaning process further includes a process of supplying chemicals to a substrate that is supported on a spin head and rotates, a process of supplying a cleaning solution such as deionized water (DIW) to the substrate to remove the chemicals from the substrate, a process of supplying an organic solvent such as isopropyl alcohol (IPA) having a lower surface tension than the cleaning solution to the substrate to replace the cleaning solution on the substrate with the organic solvent, and a drying process of removing the replaced organic solvent from the substrate.

In this case, the organic solvent is connected to components such as filters, pumps, and valves. If the filter, pump, and valve are damaged, the organic solvent becomes contaminated, which can cause problems in handling the substrate with the contaminated organic solvent.

When such a problem occurs, parts including the entire line system through which organic solvents flow must be inspected and analyzed, which causes the problem of excessive inspection time.

The technical problem of the present invention for solving the above-mentioned problem is to provide a substrate processing device and a substrate processing method capable of detecting the contamination status of a chemical solution when the chemical solution for processing a substrate is contaminated.

In addition, another technical task of the present invention is to provide a substrate treatment device and a substrate treatment method capable of monitoring the point at which contamination of a chemical solution for treating a substrate has occurred.

The technical problems to be solved by the present invention are not limited thereto, and those skilled in the art will understand that other technical problems not mentioned can be derived from the configurations used in the specification and drawings below.

In order to achieve the above technical problem, the substrate processing device of the present invention comprises: a chamber having a processing space; a support unit supporting and rotating a substrate in the processing space; a liquid discharge unit discharging a chemical in a liquid state onto a substrate supported by the support unit; a liquid supply unit supplying the chemical to the liquid discharge unit; and a particle size distribution measuring device connected to the liquid supply unit, which separates particles by size using electrical mobility of particles dispersed and contained in the chemical solution, and then measures the number concentration of particles by size to measure the size distribution of particles.

In one embodiment, the liquid supply unit includes a common line section for circulating the chemical liquid; and an individual line section connected between the common line section and the liquid discharge unit for supplying the chemical liquid from the common line section to the liquid discharge unit; and the particle size distribution measuring device is connected to each of the common line section and the individual line sections to receive the chemical liquid respectively and measure the size distribution of the particles.

In one embodiment, the particle size distribution measuring device can measure the size distribution of the particles at a preset cycle.

In one embodiment, the particle size distribution measuring device can generate a liquid contamination alarm when the measured particle size distribution is compared with pre-stored reference distribution data when measuring the particle size distribution and the measured particle size distribution exceeds a preset range of the reference distribution data.

In one embodiment, the particle size distribution measuring device can generate a common line contamination alarm when the common line section is contaminated, and can generate an individual line contamination alarm when the individual line sections are contaminated.

In one embodiment, the substrate processing device further includes a controller that controls the opening and closing of a valve for discharging the chemical liquid among the liquid discharging units; wherein the particle size distribution measuring device transmits the individual line contamination alarm to the controller, and when the controller receives the individual line contamination alarm, it can close the valve for discharging the chemical liquid to prevent the chemical liquid from being discharged.

In one embodiment, the liquid supply unit may include a first heating unit that heats the treatment liquid to a temperature higher than the boiling point of the treatment liquid before the chemical liquid is supplied onto the substrate by the liquid discharge unit; and a second heating unit that heats the treatment liquid heated to a temperature higher than the boiling point to a temperature lower than the boiling point and supplies the heated treatment liquid to the liquid discharge unit.

According to one embodiment, the first heating unit includes a circulation line for circulating the treatment liquid contained in the tank; and a first heater installed on the circulation line for heating the treatment liquid moving inside the circulation line to a temperature higher than the boiling point;

The second heating unit includes a supply line connected to the liquid discharge unit; and a second heater installed on the supply line to heat the treatment liquid moving inside the supply line to a temperature lower than the boiling point; and the treatment liquid supplied onto the substrate by the liquid discharge unit can be provided at a temperature lower than the boiling point.

In one embodiment, the liquid may be formed of isopropyl alcohol (IPA).

Meanwhile, the substrate treatment method of the present invention for achieving the above-described technical task includes a chemical supply step of discharging a chemical onto a substrate through a first nozzle to remove metal foreign substances, organic substances or particles remaining on the substrate; a rinsing step of discharging deionized water (DIW) onto the substrate through a second nozzle to remove chemicals remaining on the substrate; and a substitution step of supplying a drying fluid onto the substrate through a third nozzle to replace the rinsing liquid remaining on the substrate with the drying fluid; wherein, in the substitution step, a particle size distribution measuring device may further include a chemical contamination monitoring step of periodically receiving a preset unit volume of the drying fluid through a common line section and an individual line section, sampling the unit volume of the drying fluid, and measuring and monitoring the size distribution of particles per unit volume.

The present invention has the effect of being able to detect the contamination status of a chemical solution when the chemical solution treating a substrate is contaminated.

In addition, the present invention has the effect of being able to monitor at what point contamination of the chemical solution treating the substrate has occurred.

The effects of the present invention are not limited to the effects described above, and those skilled in the art will understand that other effects not mentioned can be derived from the configurations used in the specification and drawings below.

FIG. 1 is a plan view showing a substrate processing facility according to one embodiment of the present invention.
Figure 2 is a cross-sectional view showing the substrate processing device of Figure 1.
Figure 3 is a schematic drawing showing the liquid supply unit of Figure 2.
Figures 4 and 5 are drawings showing the movement process of the treatment liquid flowing through the liquid supply unit of Figure 3.
Figure 6 is a flow chart showing a process of processing a substrate using the device of Figure 3.
Figure 7 is a graph that superimposes the standard distribution data and the particle size distribution data per unit volume of the dry fluid being sampled.
Figure 8 is a table expressing the graph shown in Figure 7 in numerical values.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the attached drawings. In this case, when a part throughout the specification is said to "include" a certain component, this is considered to mean that other components can be further included, rather than controlling other components unless specifically stated otherwise. In addition, terms such as "... section" described in the specification are considered to mean a unit that processes at least one function or operation when describing electronic hardware or electronic software, and one part, function, purpose, point, or driving element when describing a mechanical device. In addition, in the following, the same or similar components will be described using the same drawing reference numerals, and redundant descriptions of the same components will be omitted.

Additionally, when an element or layer is referred to as being "on," "connected," "bonded," "attached," "adjacent," or "covering" another element or layer, it can be directly on, connected, bonded, attached, adjacent, or covering said other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as being "directly on," "directly connected," or "directly coupled to" another element or layer, it should be understood that no intermediate elements or layers are present. Like reference numerals refer to like elements throughout. The term "and/or" as used herein further includes all combinations and subcombinations of one or more of the listed items.

FIG. 1 is a plan view showing a substrate processing facility according to one embodiment of the present invention. FIG. 2 is a cross-sectional view showing the substrate processing device of FIG. 1. FIG. 3 is a drawing schematically showing the liquid supply unit of FIG. 2. FIGS. 4 and 5 are drawings showing the movement process of the processing liquid flowing through the liquid supply unit of FIG. 3. FIG. 6 is a flow chart showing the process of processing a substrate using the device of FIG. 3.

Referring to FIGS. 1 to 6, the substrate processing equipment (1) has an index module (10) and a process processing module (20), and the index module (10) has a load port (120) and a transfer frame (140). The load port (120), the transfer frame (140), and the process processing module (20) are sequentially arranged in a row. Hereinafter, the direction in which the load port (120), the transfer frame (140), and the process processing module (20) are arranged is referred to as a first direction (12), and when viewed from above, a direction perpendicular to the first direction (12) is referred to as a second direction (14), and a direction perpendicular to a plane including the first direction (12) and the second direction (14) is referred to as a third direction (16).

A carrier (18) containing a substrate (W) is mounted on a load port (120). A plurality of load ports (120) are provided, and they are arranged in a row along the second direction (14). In FIG. 1, four load ports (120) are provided. However, the number of load ports (120) may increase or decrease depending on conditions such as process efficiency and footprint of the process processing module (20). A slot (not shown) is formed on the carrier (18) to support an edge of the substrate. A plurality of slots are provided in the third direction (16), and the substrates are positioned in the carrier so as to be stacked while being spaced apart from each other along the third direction (16). A front opening unified pod (FOUP) can be used as the carrier (18).

The process processing module (20) has a buffer unit (220), a transfer chamber (240), and a process chamber (260, 280). The transfer chamber (240) is arranged such that its longitudinal direction is parallel to the first direction (12). Process chambers (260, 280) are arranged on both sides of the transfer chamber (240) along the second direction (14). The process chambers (260) may be provided to be symmetrical to each other with respect to the transfer chamber (240). Some of the process chambers (260, 280) are arranged along the longitudinal direction of the transfer chamber (240). In addition, some of the process chambers (260, 280) are arranged to be stacked on each other. That is, the process chambers (260, 280) may be arranged in an array of A X B (A and B are each a natural number greater than or equal to 1) on both sides of the transfer chamber (240). Here, A is the number of process chambers (260, 280) provided in a row along the first direction (12), and B is the number of process chambers (260, 280) provided in a row along the third direction (16). When four or six process chambers (260, 280) are provided on each side of the transfer chamber (240), the process chambers (260, 280) may be arranged in a 2 X 2 or 3 X 2 arrangement. The number of process chambers (260, 280) may increase or decrease. Unlike the above, the process chamber (260) may be provided on only one side of the transfer chamber (240). In addition, the process chambers (260, 280) may be provided in a single layer on one side and the other side of the transfer chamber (240). In addition, the process chambers (260, 280) may be provided in various arrangements, unlike the above.

The process chambers (260, 280) of the present embodiment may be divided into a cleaning chamber and a drying chamber. In this case, the cleaning chamber may be a substrate processing device for cleaning a substrate described below, and the drying chamber may be a substrate processing device for drying a substrate.

The buffer unit (220) is arranged between the transfer frame (140) and the transfer chamber (240). The buffer unit (220) provides a space where the substrate (W) stays before the substrate (W) is returned between the transfer chamber (240) and the transfer frame (140). The buffer unit (220) is provided with a slot (not shown) in which the substrate (W) is placed therein, and a plurality of slots (not shown) are provided so as to be spaced apart from each other along the third direction (16). Each of the side of the buffer unit (220) facing the transfer frame (140) and the side facing the transfer chamber (240) is open.

The transfer frame (140) transfers the substrate (W) between the carrier (18) mounted on the load port (120) and the buffer unit (220). The transfer frame (140) is provided with an index rail (142) and an index robot (144). The index rail (142) is provided such that its longitudinal direction is parallel to the second direction (14). The index robot (144) is installed on the index rail (142) and moves linearly in the second direction (14) along the index rail (142). The index robot (144) has a base (144a), a body (144b), and an index arm (144c). The base (144a) is installed so as to be able to move along the index rail (142). The body (144b) is coupled to the base (144a). The body (144b) is provided to be movable along the third direction (16) on the base (144a). In addition, the body (144b) is provided to be rotatable on the base (144a). An index arm (144c) is coupled to the body (144b) and is provided to be movable forward and backward with respect to the body (144b). A plurality of index arms (144c) are provided so as to be individually driven. The index arms (144c) are arranged to be stacked while being spaced apart from each other along the third direction (16). Some of the index arms (144c) may be used when returning a substrate (W) from a process processing module (20) to a carrier (18), and other some may be used when returning a substrate (W) from a carrier (18) to the process processing module (20). This can prevent particles generated from the substrate (W) before processing from being attached to the substrate (W) after processing during the process of the index robot (144) loading and unloading the substrate (W).

The transfer chamber (240) transfers the substrate (W) between the buffer unit (220) and the process chambers (260). The transfer chamber (240) is provided with a guide rail (242) and a main robot (244). The guide rail (242) is arranged so that its longitudinal direction is parallel to the first direction (12). The main robot (244) is installed on the guide rail (242) and moves linearly along the first direction (12) on the guide rail (242). The main robot (244) has a base (244a), a body (244b), and a main arm (244c). The base (244a) is installed so as to be able to move along the guide rail (242). The body (244b) is coupled to the base (244a). The body (244b) is provided so as to be able to move along the third direction (16) on the base (244a). Additionally, the body (244b) is provided to be rotatable on the base (244a). The main arm (244c) is coupled to the body (244b), and is provided to be able to move forward and backward with respect to the body (244b).

Below, a substrate processing device (300) provided in a process chamber (260) is described. In this embodiment, an example in which the substrate processing device (300) performs a liquid processing process on a substrate is described. The liquid processing process further includes a process of cleaning the substrate.

FIG. 2 is a cross-sectional view showing the substrate processing device of FIG. 1. Referring to FIG. 2, the substrate processing device (300) further includes a chamber (310), a processing vessel (320), a spin head (340), an elevating unit (360), a liquid discharge unit (400), an airflow forming unit (500), a liquid supply unit (600), and a controller (900). The chamber (310) provides a processing space (312) in which a process for processing a substrate (W) is performed therein.

The treatment container (320) is positioned in the treatment space (312) and is provided in a cup shape with an open top. It is positioned to overlap the exhaust pipe of the treatment container (320) when viewed from above. The treatment container (320) has an inner recovery tank (322) and an outer recovery tank (326). Each of the recovery tanks (322, 326) recovers different treatment solutions among the treatment solutions used in the process. The inner recovery tank (322) is provided in an annular ring shape that surrounds the spin head (340), and the outer recovery tank (326) is provided in an annular ring shape that surrounds the inner recovery tank (322). The inner space (322a) of the inner recovery tank (322) and the space (326a) between the outer recovery tank (326) and the inner recovery tank (322) function as inlets through which the treatment solution flows into the inner recovery tank (322) and the outer recovery tank (326), respectively. Each recovery tank (322, 326) is connected to a recovery line (322b, 326b) that extends vertically downward from its bottom surface. Each recovery line (322b, 326b) functions as a discharge pipe that discharges the treatment liquid that has flowed in through each recovery tank (322, 326). The discharged treatment liquid can be reused through an external treatment liquid regeneration system (not shown).

A spin head (340) is provided as a substrate support unit (340) that supports and rotates a substrate (W). The spin head (340) is placed inside a processing vessel (320). The spin head (340) supports the substrate (W) and rotates the substrate (W) during a process. The spin head (340) has a body (342), a support pin (344), a chuck pin (346), and a support shaft (348). The body (342) has an upper surface that is provided in a generally circular shape when viewed from above. A support shaft (348) that can be rotated by a motor (349) is fixedly coupled to a lower surface of the body (342). A plurality of support pins (344) are provided. The support pins (344) are placed at an edge portion of the upper surface of the body (342) at a predetermined interval and protrude upward from the body (342). The support pins (334) are arranged to have an overall annular ring shape by combination with each other. The support pins (344) support the rear edge of the substrate (W) so that the substrate (W) is spaced apart from the upper surface of the body (342) by a certain distance. A plurality of chuck pins (346) are provided. The chuck pins (346) are arranged to be further away from the center of the body (342) than the support pins (344). The chuck pins (346) are provided to protrude upward from the body (342). The chuck pins (346) support the side of the substrate (W) so that the substrate (W) does not deviate laterally from a fixed position when the spin head (340) rotates. The chuck pins (346) are provided so as to be linearly movable between a standby position and a support position along the radial direction of the body (342). The standby position is a position further away from the center of the body (342) than the support position. When the substrate (W) is loaded or unloaded on the spin head (340), the chuck pin (346) is positioned in a standby position, and when a process is performed on the substrate (W), the chuck pin (346) is positioned in a support position. In the support position, the chuck pin (346) comes into contact with the side of the substrate (W).

The lifting unit (360) adjusts the relative height between the processing vessel (320) and the spin head (340). The lifting unit (360) moves the processing vessel (320) up and down linearly. As the processing vessel (320) moves up and down, the relative height of the processing vessel (320) with respect to the spin head (340) changes. The lifting unit (360) has a bracket (362), a moving shaft (364), and a driver (366). The bracket (362) is fixedly installed on the outer wall of the processing vessel (320), and a moving shaft (364) that is moved up and down by the driver (366) is fixedly connected to the bracket (362). When the substrate (W) is placed on the spin head (340) or lifted from the spin head (340), the processing vessel (320) is lowered so that the spin head (340) protrudes above the processing vessel (320). In addition, when the process is in progress, the height of the treatment container (320) is adjusted so that the treatment liquid can flow into a preset recovery tank (360) depending on the type of treatment liquid supplied to the substrate (W).

Unlike the above, the lifting unit (360) can move the spin head (340) up and down instead of the processing container (320).

The liquid ejection unit (400) supplies various types of liquids onto the substrate (W). The liquid ejection unit (400) further includes a plurality of nozzles (410 to 430). Each of the nozzles is moved to a process position and a standby position by a nozzle position driver (440). Here, the process position is a position where the nozzles (410 to 430) can eject liquid onto the substrate (W) located within the processing container (320), and the standby position is defined as a position where the nozzles (410 to 430) are out of the process position and standby. In one example, the process position may be a position where the nozzles (410 to 430) can supply liquid to the center of the substrate (W). For example, when viewed from above, the nozzles (410 to 430) may be moved between the process position and the standby position by linearly moving or axially moving. The processing liquid ejected from the liquid ejection unit (400) to the substrate (W) may be a liquid processing liquid. Additionally, in the standby position, a recovery pipe (450) may be placed below the third nozzle (430). The recovery pipe (450) recovers the liquid when the third nozzle (430) discharges the liquid for cleaning.

The plurality of nozzles (410 to 430) discharge different types of liquids. The liquids discharged from the nozzles (410 to 430) may include at least one of a chemical, a rinse liquid, and a drying liquid. Referring to the embodiment of FIG. 2, the first nozzle (410) may be a nozzle that discharges a chemical. The second nozzle (420) may be a nozzle that discharges a rinse liquid. The third nozzle (430) may be a nozzle that discharges a drying liquid. For example, the chemical may be a liquid that can etch a film formed on a substrate (W) or remove particles remaining on the substrate (W). The chemical may be a liquid having the properties of a strong acid or a strong base. The chemical may include sulfuric acid, hydrofluoric acid, or ammonia. The rinse liquid may be a liquid that can rinse a chemical remaining on the substrate (W). For example, the rinse liquid may be pure. The drying fluid may be provided as a liquid capable of replacing the remaining rinse liquid on the substrate (W). The drying fluid may be a liquid having a lower surface tension than the rinse liquid. The drying fluid may be an organic solvent. The drying fluid may be isopropyl alcohol (IPA). The third nozzle (430) may be connected to a liquid supply unit (600) described below.

The airflow forming unit (500) forms a descending airflow in the processing space (312). The airflow forming unit (500) supplies airflow from the upper part of the chamber (310) and exhausts the airflow from the lower part of the chamber (310). The airflow forming unit (500) further includes an airflow supply unit (520) and an exhaust unit (540). The airflow supply unit (520) and the exhaust unit (540) are positioned to face each other vertically.

The airflow supply unit (520) supplies gas in a downward direction. The gas supplied from the airflow supply unit (520) may be air from which impurities have been removed. The airflow supply unit (520) further includes a fan (522), an airflow supply line (524), a supply valve (528), and a filter (526). The fan (522) is installed on the ceiling surface of the chamber (310). When viewed from above, the fan (522) is positioned to face the processing vessel. The fan (522) may be positioned to supply air toward a substrate (W) positioned within the processing vessel. The airflow supply line (524) is connected to the fan (522) to supply air to the fan (522). The supply valve (528) is installed in the airflow supply line (524) to control the supply amount of airflow. The filter (526) is installed in the airflow supply line (524) to filter the air. For example, the filter (526) can remove particles and moisture contained in the air.

The exhaust unit (540) exhausts the processing space (312). The exhaust unit (540) further includes an exhaust pipe (542), a pressure reducing member (546), and an exhaust valve (548). The exhaust pipe (542) is installed on the bottom surface of the chamber (310) and is provided as a pipe for exhausting the processing space (312). The exhaust pipe (542) is positioned so that the exhaust port faces upward. The exhaust pipe (542) is positioned so that the exhaust port communicates with the interior of the processing vessel. That is, the upper end of the exhaust pipe (542) is positioned within the processing vessel. Accordingly, the descending airflow formed within the processing vessel is exhausted through the exhaust pipe (542).

The pressure reducing member (546) reduces the pressure in the exhaust pipe (542). A negative pressure is formed in the exhaust pipe (542) by the pressure reducing member (546), which exhausts the processing vessel. The exhaust valve (548) is installed in the exhaust pipe (542) and opens and closes the exhaust port of the exhaust pipe (542). The exhaust valve (548) controls the exhaust amount.

Figure 3 is a drawing schematically showing the liquid supply unit (600) of Figure 2.

The liquid supply unit (600) includes a common line section (700) and an individual line section (800). Here, the common line section (700) of the liquid supply unit (600) corresponds to a line commonly used by a plurality of substrate processing devices (300) when processing a substrate (W), and the individual line sections (800) are configured in multiple pieces and correspond to lines connecting the common line section (700) and each of the plurality of substrate processing devices (300).

First, referring to FIG. 3, the common line section (700) of the liquid supply unit (600) will be described. The common line section (700) of the liquid supply unit (600) further includes a first tank unit (610), a second tank unit (620), a first heating unit (640), and a second heating unit (660). The liquid supply unit (600) is connected to the liquid discharge unit (400). In more detail, the liquid supply unit (600) is connected to an individual line section (800) to supply a drying fluid to a third nozzle (430) formed in each liquid discharge unit (400).

The first tank unit (610) further includes a first tank (612). The first tank (612) is formed in a cylindrical shape with a receiving space (612a) formed therein. A drying fluid is received inside the first tank (612). Isopropyl alcohol is received in the receiving space (612a) of the first tank (612). A circulation line (641) described later is connected to the first tank (612). A supply line (661) described later may be connected to the first tank (612).

The first tank unit (610) further includes a heater (614). The heater (614) is installed in the receiving space (612a) of the first tank (612). The heater (614) may be installed so as to be immersed in the organic solvent contained in the first tank (612). The third heater (614) may control the temperature of the organic solvent contained in the first tank (612). For example, the heater (614) may heat the temperature of the organic solvent contained in the first tank (612) to a temperature higher than the boiling point of the organic solvent, or to a temperature lower than the boiling point. The heater (614) may be set to have the same temperature as the first heater (642) or the second heater (662) described below.

The first tank unit (610) further includes a vacuum pump (616). The vacuum pump (616) is installed in the first tank (612). The vacuum pump (616) may be installed on a vacuum line (615) connected to the first tank (612). For example, the vacuum line (615) may be connected to an upper wall of the first tank (612). The vacuum pump (616) provides vacuum pressure to the receiving space (612a) through the vacuum line (615) connected to the first tank (612). The vacuum pump (616) provides negative pressure to the receiving space (612a) through the vacuum line (615) connected to the first tank (612). The vacuum pump (616) may maintain the receiving space (612a) of the first tank (612) in a negative pressure atmosphere. Through this, it is possible to prevent the dissolved gas remaining in the receiving space (612a) from penetrating into the organic solvent from which bubbles have been removed through the first heating unit (640).

The first tank unit (610) further includes a discharge unit (617). The discharge unit (617) discharges the drying fluid contained in the first tank (612) to the outside. For example, the discharge unit (617) may discharge the drying fluid contained in the first tank (612) to the outside when the drying fluid is contaminated or when the drying fluid is replaced. The discharge unit (617) further includes a discharge line (617a) and an on-off valve (617b) installed on the discharge line (617a). The discharge line (617a) may be connected to the lower wall of the first tank (612). The discharge line (617a) is a passage for the treatment liquid to be discharged to the outside. The on-off valve (617b) is installed on the discharge line (617a) and controls the discharge amount of the drying fluid contained in the first tank (612). For example, when discharge of the drying fluid contained in the first tank (612) is not required, the on-off valve (617b) may be kept in a closed state, and when the drying fluid contained in the first tank (612) is discharged, the on-off valve (617b) may be kept in an open state.

The second tank unit (620) may have the same structure as the first tank unit (610). The second tank unit (620) and the first tank unit (610) may accommodate the same treatment liquid. Specifically, the second tank unit (620) further includes a first tank (622) having a receiving space (622a), a heater (624) installed in the receiving space (622a), a vacuum pump (626) installed on a vacuum line (625), and a discharge unit (627) including a discharge line (627a) and an on-off valve (627b). Hereinafter, since the second tank unit (620) has the same structure and function as the first tank unit (610), a detailed description of each component of the second tank unit (620) will be omitted, and if necessary, reference may be made to the description of the first tank unit (610).

The first heating unit (640) further includes a circulation line (641). The circulation line (641) is connected to the first tank (612) and circulates the drying fluid contained in the first tank (612). The circulation line (641) is connected to the second tank (622) and circulates the drying fluid contained in the second tank (622). The circulation line (641) further includes a first circulation line (641a) connected to the upper wall of the first tank (612), a second circulation line (641b) connected to the lower wall of the first tank (612), and a third circulation line (641c) connecting the first circulation line (641c) and the second circulation line (641b). In addition, the circulation line (641) further includes a fourth circulation line (641d) connected to the upper wall of the second tank (622) and a fifth circulation line (641e) connected to the lower wall of the second tank (622). At this time, the third circulation line (641c) connects the fourth circulation line (641d) and the fifth circulation line (641e). The first circulation line (641a), the third circulation line (641c), and the fourth circulation line (641d) are joined at the first point (P1), and the second circulation line (641b), the third circulation line (641c), and the fifth circulation line (641e) are joined at the second point (P2). That is, the third circulation line (641c) may be a line connecting the first point (P1) and the second point (P2).

An on-off valve (644) is installed in each of the first circulation line (641a), the second circulation line (641b), the fourth circulation line (641d), and the fifth circulation line (641e). Each of the on-off valves (644) can be selectively turned on or off to form a circulation path of the drying fluid described later. The first circulation line (641a), the second circulation line (641b), and the third circulation line (641c) form a first circulation path through which the drying fluid contained in the receiving space (621a) of the first tank (621) is circulated. The third circulation line (641c), the fourth circulation line (641d), and the fifth circulation line (641e) form a second circulation path through which the drying fluid contained in the receiving space (621a) of the second tank (622) is circulated. When the drying fluid contained in the first tank (621) is circulated through the first circulation path, the drying fluid contained in the second tank (622) is not circulated through the second circulation path. In this case, the opening/closing valves (644) installed on the first and second circulation lines (641a, 641b) can be controlled to open, and the opening/closing valves (644) installed on the fourth and fifth circulation lines (641d, 641e) can be controlled to close. Conversely, when the drying fluid contained in the first tank (612) is not circulated through the first circulation path and the drying fluid contained in the second tank (622) is circulated through the second circulation path, the opening/closing valves (644) installed on the fourth and fifth circulation lines (641d, 641e) can be controlled to open, and the opening/closing valves (644) installed on the first and second circulation lines (641a, 641b) can be controlled to close.

The first heating unit (640) further includes a first heater (642). The first heater (642) is installed on the third circulation line (641c). The first heater (642) heats the drying fluid flowing inside the circulation line (641). The first heater (642) can heat the drying fluid flowing inside the circulation line (641) to a temperature higher than the boiling point of the drying fluid. For example, when the drying fluid is isopropyl alcohol (IPA), the first heater (642) can heat the isopropyl alcohol (IPA) to a temperature higher than 83° C., which is the boiling point of the isopropyl alcohol (IPA). At this time, the isopropyl alcohol (IPA) boils as it is heated above the boiling point, and in this process, dissolved gases dissolved in the isopropyl alcohol (IPA) can be degassed as bubbles and discharged. In this case, the amount of dissolved gas in the isopropyl alcohol (IPA) heated above the boiling point through circulation through the circulation line (641) is maintained at a very small level, and bubbles generated from local pressure changes due to changes in pipe diameter, head difference, passage through a resistor, or surface roughness within the pipe during the subsequent supply process through the supply line (661) can be minimized. Through this, when the isopropyl alcohol (IPA) is discharged onto the substrate (W), the possibility that bubbles will fall onto the substrate (W) together with the isopropyl alcohol (IPA) can be significantly reduced, which can immediately bring about the effect of reducing particles on the substrate (W).

Meanwhile, the first heater (642) can heat the dry fluid flowing inside the circulation line (641) to a temperature above the boiling point for a certain period of time. At this time, the certain period of time may be a certain period of time in which the amount of the solution is not significantly reduced due to artificial boiling through boiling point heating. In addition, the certain period of time may vary depending on the type of solution flowing inside the circulation line (641).

The first heating unit (640) further includes a pump (643). The pump (643) provides power so that the drying fluid contained in the first tank (612) or the second tank (622) can move inside the circulation line (641). For example, the pump (643) may be a pressure reducing pump. The pump (643) may be provided on the third circulation line (641c). In this case, when the drying fluid contained in the first tank (612) is circulated along the first circulation path or when the drying fluid contained in the second tank (622) is circulated along the second circulation path, both can be circulated through one pump (643), which has the effect of simplifying the structure.

The second heating unit (660) further includes a supply line (661). The supply line (661) is connected to the first tank (612) and supplies the drying fluid contained in the first tank (612) onto the substrate (W). The supply line (661) is connected to the second tank (622) and supplies the drying fluid contained in the second tank (622) onto the substrate (W). The supply line (661) further includes a first supply line (661a) connected to the upper wall of the first tank (612), a second supply line (661b) connected to the lower wall of the first tank (612), a third supply line (661c) connected to the upper wall of the second tank (622), and a fourth supply line (661d) connected to the lower wall of the second tank (662). At this time, the first supply line (661a) and the third supply line (661c) join at the third point (P3), and the second supply line (661b) and the fourth supply line (661d) join at the fourth point (P4). In addition, the supply line (661) further includes a fifth supply line (661e) connected to the first and third supply lines (661a, 661c) at the third point (P3), and a sixth supply line (661f) connected to the second and fourth supply lines (661b, 661d) at the fourth point (P4). The fifth supply line (661e) and the sixth supply line (661f) join at one point and are connected to the nozzle (430).

An on-off valve (669) is installed in each of the first supply line (661a), the second supply line (661b), the third supply line (661c), and the fourth supply line (661d). Each of the on-off valves (669) can be selectively turned on or off to form a supply path of the drying fluid described later. The first supply line (661a), the second supply line (661b), the fifth supply line (661e), and the sixth supply line (661f) form a first supply path through which the drying fluid contained in the first tank (612) is supplied onto the substrate (W) through the nozzle (430). The third supply line (661c), the fourth supply line (661d), the fifth supply line (661e), and the sixth supply line (661f) form a second supply path through which the drying fluid contained in the second tank (622) is supplied onto the substrate (W) through the nozzle (430). When the drying fluid contained in the first tank (621) is supplied through the first supply path, the drying fluid contained in the second tank (622) is not supplied through the second supply path*. In this case, the opening/closing valves (669) installed on the first and second supply lines (661a, 661b) can be controlled to open, and the opening/closing valves (669) installed on the third and fourth supply lines (661d, 662e) can be controlled to close. Conversely, when the drying fluid contained in the first tank (612) is not supplied through the first supply path and the drying fluid contained in the second tank (622) is supplied through the second supply path, the opening/closing valve (649) installed on the third and fourth supply lines (661c, 661d) can be controlled to open, and the opening/closing valve (669) installed on the first and second supply lines (661a, 661b) can be controlled to close.

In addition, when the drying fluid contained in the first tank (612) is circulated through the first circulation path, the opening/closing valve (669) installed on the first supply path is controlled to close, and the opening/closing valve (669) installed on the second supply path is controlled to open. Conversely, when the drying fluid contained in the second tank (622) is circulated through the second circulation path, the opening/closing valve (669) installed on the first supply path is controlled to open, and the opening/closing valve (669) installed on the second supply path is controlled to close. That is, the first circulation path and the second supply path operate together, and the second circulation path and the first supply path operate together. Through this, while the drying fluid in the first tank (612) is circulated through the first circulation path and the dissolved gas is degassed into bubbles, the drying fluid in the second tank (622) is supplied onto the substrate (W). At this time, the drying fluid in the second tank (622) may already be heated above the boiling point through circulation and may be in a state where the bubbles are degassed. When the drying fluid in the second tank (622) is completely exhausted, the drying fluid from which the bubbles are degassed contained in the first tank (612) is supplied onto the substrate (W), and the second tank (622) may perform a process of degassing the dissolved gas into bubbles while circulating along the second circulation path after being filled with the drying fluid.

The second heating unit (660) further includes a second heater (662). The second heater (622) heats the drying fluid flowing inside the supply line (661). The second heater (622) heats the drying fluid flowing inside the supply line (661) to a temperature lower than the boiling point of the drying fluid. For example, when the drying fluid is isopropyl alcohol (IPA), the second heater (662) can heat the isopropyl alcohol (IPA) to a temperature lower than the boiling point of 83° C. of isopropyl alcohol (IPA). Preferably, the isopropyl alcohol (IPA) can be heated to 65° C. to 75° C. and supplied onto the substrate (W). In this case, the dry fluid heated to above the boiling point through the first heating unit (640) and from which the dissolved gas is degassed into bubbles can be supplied onto the substrate (W) through the nozzle (430) along the supply line (661) while maintaining a temperature lower than the boiling point by the second heating unit (660). Through this, the dry fluid from which the dissolved gas has already been degassed is prevented from forming bubbles or air bubbles even when there is a local pressure change due to a change in the pipe diameter, a head of water, passage through a resistor, or surface roughness within the pipe, in the flow through the supply line (661), and the effect of reducing particles on the substrate (W) can be observed.

The second heater (662) is installed on the sixth supply line (661f). Referring to FIG. 3, the second heater (662) can be installed upstream from the confluence of the fifth supply line (661e) and the sixth supply line (661f). At this time, upstream means a position adjacent to the discharge port where the treatment liquid is supplied from the first tank (612) or the second tank (622), and downstream means the opposite position. In other words, the direction from upstream to downstream means the direction in which the treatment liquid is supplied from the tank (612, 622) to the discharge nozzle (430), and means the direction away from the discharge port of the tank (612, 622). The discharge port of the first tank (612) is formed in the lower wall of the first tank (612) to which the second supply line (661b) is connected, and the discharge port of the second tank (622) is formed in the lower wall of the second tank (622) to which the fourth supply line (661d) is connected. In addition, the upstream may mean a position adjacent to the fourth point (P4), which is the confluence point of the second supply line (661b) and the fourth supply line (661d).

The second heating unit (660) further includes a pump (663). It provides power so that the drying fluid contained in the first tank (612) or the second tank (622) can move inside the supply line (661). For example, the pump (663) may be a pressure reducing pump. The pump (663) may be installed on the sixth supply line (661f). In this case, when the drying fluid contained in the first tank (612) is supplied along the first supply path or when the drying fluid contained in the second tank (622) is circulated along the second supply path*, both can be circulated through one pump (663), which has the effect of simplifying the structure.

The second heating unit (660) further includes a first pressure sensor (664). The first pressure sensor (664) is provided on the sixth supply line (661f). The first pressure sensor (664) is installed upstream from the confluence of the fifth supply line (661e) and the sixth supply line (661f). The first pressure sensor (664) can sense the flow pressure of the drying fluid before being supplied to the nozzle (430). The first pressure sensor (664) can detect a change in the flow rate of the drying fluid passing through the interior of the sixth supply line (661f). Alternatively, the first pressure sensor (664) can detect a change in the pressure of the drying fluid flowing through the sixth supply line (661f).

The second heating unit (660) further includes a filter (665). The filter (665) is provided on the sixth supply line (661f). The filter (665) is installed upstream from the confluence of the fifth supply line (661e) and the sixth supply line (661f). The filter (665) filters out residual contaminants, particles, etc. remaining in the drying fluid before the drying fluid is supplied to the nozzle (430).

The second heating unit (660) further includes a flow meter (666). The flow meter (666) is provided on the sixth supply line (661f). The flow meter (666) is installed upstream from the confluence of the fifth supply line (661e) and the sixth supply line (661f). The flow meter (666) measures the flow rate of the drying fluid flowing through the supply line (661). For example, the flow meter (666) may measure the flow rate by measuring the change in unit area per hour or the change in mass of the drying fluid flowing through the sixth supply line (661f). However, the present invention is not limited thereto, and various methods for measuring the flow rate flowing through the supply line (661) may be applied.

The pump (663), the second heater (662), the first pressure sensor (664), the filter (665), and the flow meter (666) installed on the sixth supply line (661f) described above may be installed sequentially in a direction from upstream to downstream. However, this is not limited thereto, and some of these configurations may be omitted and implemented. In addition, a bubble cutter (not shown in the drawing) for removing air bubbles remaining in the fluid may be additionally installed between the filter (665) and the flow meter (666).

The second heating unit (660) further includes a second pressure sensor (667). The second pressure sensor (667) is installed on the fifth supply line (661e). The second pressure sensor (667) is installed downstream from the confluence of the fifth and sixth supply lines (661e, 661f). The second pressure sensor (667) measures the pressure when the remaining drying fluid is supplied to the nozzle (430) along the sixth supply line (661f) and flows inside the fifth supply line (661e).

The second heating unit (660) further includes a pressure regulator (668). The pressure regulator (668) is installed on the fifth supply line (661e). The pressure regulator (668) is installed downstream from the confluence of the fifth and sixth supply lines (661e, 661f). The pressure regulator (668) is installed downstream from the second pressure sensor (667) on the fifth supply line (661e). The pressure regulator (668) can adjust the pressure in the entire supply line (661) to be kept constant based on the pressure value measured by the second pressure sensor (667) and the pressure value measured by the first pressure sensor (664).

Next, the individual line section (800) of the liquid supply unit (600) will be described. The individual line section (800) of the liquid supply unit (600) is configured in multiple pieces, each of which is connected to a plurality of substrate processing devices (300). These individual line sections (800) are connected to a plurality of substrate processing devices (300), and each of the substrate processing devices (300) discharges a drying fluid by the control drive of the controller (900).

Accordingly, the individual line section (800) of the liquid supply unit (600) includes an individual line (801), an individual line-side flow meter (802), an individual line-side flow control valve (803), an individual line-side temperature sensor (804), an individual line-side supply control valve (805), an individual line-side recovery line (806), and an individual line-side recovery valve (807).

The individual line (801) is connected to the sixth supply line (661f) at one end and to the nozzle (430) at the other end. The individual line (801) is configured in multiple pieces and is connected to each of the multiple substrate processing devices (300) in a corresponding manner. The individual line (801) forms a path for discharging the drying fluid circulated through the common line section (700) toward the nozzle (430).

The individual line side flow meter (802) is installed in the individual line (801). The individual line side flow meter (802) measures the flow rate of the individual line (801) and provides information on the flow rate of the drying fluid discharged through the individual line (801) to the operator.

The individual line-side flow control valve (803) is installed in the individual line (801). In this case, the individual line-side flow control valve (803) may be installed between the individual line-side flow meter (802) and the nozzle (430). The individual line-side flow control valve (803) controls the flow rate discharged to the nozzle (430) side according to the controlled value. Accordingly, the flow rate discharged from each substrate processing device (300) may be controlled by the individual line-side flow control valve (803) installed in each. In this case, the substrate processing device (300) may control the discharge amount of the drying fluid by controlling the individual line-side flow control valve (803) according to the processing process.

The individual line-side temperature sensor (804) is installed in the individual line (801). The individual line-side temperature sensor (804) can measure the temperature of the drying fluid supplied to each substrate processing device (300) and transmit the measured temperature value to the controller (900). In this case, the controller (900) can receive and monitor the temperature value of the drying fluid from the individual line-side temperature sensor (804), and can generate a warning alarm when the temperature value of the drying fluid supplied through the individual line (801) exceeds a preset value.

The individual line-side supply control valve (805) is installed in the individual line (801). In this case, the individual line-side supply control valve (805) may be installed between the individual line-side flow rate control valve (803) and the nozzle (430). The open/close state of the individual line-side supply control valve (805) may be controlled by the controller (900). In this case, the individual line-side supply control valve (805) may be controlled by the controller (900) to open only while the substrate processing device (300) processes the substrate (W), thereby supplying the drying fluid to the nozzle (430) side, and may be closed when the substrate (W) is not processed so that the drying fluid is not supplied to the nozzle (430) side. In this case, the individual line side supply control valve (805) is formed as a three-way valve so that when the drying fluid is closed so that it is not supplied to the nozzle (430) side, the drying fluid is recovered through the individual line side recovery line (806).

The individual line side recovery line (806) connects between the individual line side supply control valve (805) and the fifth supply line (661e) of the common line section (700). This individual line side recovery line (806) forms a path for recovering the drying fluid to the common line section (700) when the individual line side supply control valve (805) is closed so that the drying fluid is not supplied to the nozzle (430).

The individual line side recovery valve (807) is installed in the individual line side recovery line (806). The opening state of the individual line side recovery valve (807) is controlled by the controller (900), and when a situation occurs such as inspection of the substrate processing device (300) or inspection of the common line section (700), or when a situation occurs in which the drying fluid is discharged more than a certain number of times, or when a task of controlling the flow rate of the drying fluid occurs, the valve can be switched to a closed state so that the drying fluid is not recovered.

The particle size distribution meter (810) (Scanning Mobility Particle Sizer: SMPS) is a device that can continuously measure the size distribution of particles by separating them by size using the electrical mobility of particles dispersed and contained in a dry fluid, and then measuring the number concentration of particles by size. In this case, the particle size distribution meter (810) counts the number of particles by size by aerosolizing and then drying the dry fluid, thereby measuring the size distribution of particles. The particle size distribution meter (810) receives a preset unit inflow amount of the dry fluid discharged from each of the common line section (700) and the individual line sections (800). In this case, the diameter of the particles measured by the particle size distribution meter (810) can be configured to be 1 nm to 10 nm. In addition, the particle size distribution meter (810) can detect both organic particles and inorganic particles, and can detect low-concentration particles.

A particle size distribution measuring device (810) like this is connected to the common line section (700) and receives a drying fluid. For example, the particle size distribution measuring device (810) may be connected to the sixth supply line (661f) of the common line section (700) and receive a drying fluid. In this case, the particle size distribution measuring device (810) is connected by the seventh supply line connected to the sixth supply line (661f), but may receive a drying fluid from the discharge end of the seventh supply line.

In addition, the particle size distribution measuring device (810) is connected to the individual line section (800) to receive a drying fluid. For example, the particle size distribution measuring device (810) may be connected to a recovery pipe (450) installed around the third nozzle (430) of the individual line section (800). Here, as described above, the third nozzle (430) is driven by the liquid discharge unit (400) so that the discharge position is changed between the process position and the standby position, and the recovery pipe (450) is arranged below the third nozzle (430) in the standby position. The third nozzle (430) periodically sprays a drying fluid into the recovery pipe (450) in the standby position to clean the nozzle, and in this case, the particle size distribution measuring device (810) may receive a drying fluid through the recovery pipe (450).

In this way, the particle size distribution measuring device (810) connected to each of the common line section (700) and the individual line sections (800) receives a preset unit capacity from each of the common line section (700) and the individual line sections (800), samples the unit capacity of the dry fluid, and measures the size distribution of the particles per unit capacity. Here, the particle size distribution measuring device (810) can continuously measure the particles in the dry fluid flowing in each of the common line section (700) and the individual line sections (800). For example, the particle size distribution measuring device (810) can measure the size distribution of the particles per unit capacity of the dry fluid once per minute. The particle size distribution measuring device (810) continuously measures the particle distribution in the organic solvent for each of the common line section (700) and the individual line sections (800), and continuously monitors the particle distribution data. Here, the particle size distribution meter (810) includes reference distribution data (DI) having particles whose size is relatively small compared to the drying fluid, such as ultrapure water. The particle size distribution meter (810) compares the particle distribution data of the organic solvent for each of the common line section (700) and the individual line sections (800) with the reference distribution data (DI), and determines that the drying fluid is contaminated if the particle size in the particle distribution data exceeds a preset range. If the particle size distribution meter (810) determines that the drying fluid is contaminated, it generates a chemical liquid contamination alarm. Here, the chemical liquid contamination alarm can generate a common line contamination alarm indicating a state in which the common line section (700) is contaminated and an individual line contamination alarm indicating a state in which the individual line section (800) is contaminated. The common line contamination alarm and the individual line contamination alarm are displayed on a system monitoring a substrate processing device or output as a warning voice to notify a manager that the chemical liquid is contaminated. Here, when the particle size distribution measuring device (810) generates a common line contamination alarm and an individual line contamination alarm, the common line contamination alarm and the individual line contamination alarm are transmitted to the controller (900), and the controller (900) can close the valve so that the drying fluid is not discharged, thereby preventing the drying fluid from being supplied onto the substrate (W).

The substrate processing device (300) further includes a controller (900). The controller (900) controls each of a plurality of opening/closing valves (644) provided on the circulation line (641). The controller (900) controls each of a plurality of opening/closing valves (669) provided on the supply line (661). The controller (900) controls each of the opening/closing valves (644) provided on the first circulation path, the opening/closing valves (644) provided on the second circulation path, the opening/closing valves (669) provided on the first supply path, and the opening/closing valves (669) provided on the second supply path. The controller (900) controls the opening/closing valve (664) provided on the first circulation path and the opening/closing valve (669) provided on the second supply path to open or close simultaneously, and controls the opening/closing valve (664) provided on the second circulation path and the opening/closing valve (669) provided on the first supply path to open or close simultaneously. When the controller (900) controls the opening/closing valves provided on the first circulation path and the second supply path to open, the opening/closing valves provided on the second circulation path and the first supply path are controlled to close. Conversely, when the controller (900) controls the opening/closing valves provided on the second circulation path and the first supply path to open, the opening/closing valves provided on the first circulation path and the second supply path are controlled to close.

Below, the movement process of the treatment liquid flowing in the liquid supply unit (600) is described in detail with reference to FIGS. 4 and 5.

FIG. 4 and FIG. 5 are drawings showing the movement process of the treatment liquid flowing through the liquid supply unit of FIG. 3. More specifically, FIG. 4 is a drawing showing the process of the treatment liquid flowing through the first circulation path and the second supply path in the liquid supply unit (600), and FIG. 5 is a drawing showing the process of the treatment liquid flowing through the second circulation path and the first supply path in the liquid supply unit (600).

Referring to FIGS. 4 and 5, the first circulation line (641a), the second circulation line (641b), and the third circulation line (641c) form a first circulation path through which the drying fluid contained in the receiving space (621a) of the first tank (621) is circulated. The third circulation line (641c), the fourth circulation line (641d), and the fifth circulation line (641e) form a second circulation path through which the drying fluid contained in the receiving space (621a) of the second tank (622) is circulated. In addition, the first supply line (661a), the second supply line (661b), the fifth supply line (661e), and the sixth supply line (661f) form a first supply path. The third supply line (661c), the fourth supply line (661d), the fifth supply line (661e), and the sixth supply line (661f) form the second supply path.

Referring to FIGS. 4 and 5, the drying fluid in the first tank (612) is heated to a temperature higher than the boiling point while circulating along the first circulation path, and during this process, dissolved gases in the drying fluid are degassed as bubbles and discharged. The bubble degassing process through the first circulation path continues for a certain period of time, and the drying fluid from which the degassing process is completed is accommodated in the first tank (612). The first tank (612) has a receiving space (612a) formed into a vacuum atmosphere by a vacuum pump (626), thereby preventing a phenomenon in which another gas is dissolved again in the drying fluid from which the bubbles have been degassed. The drying fluid in the second tank (622) flows to the individual line (801) along the second supply path, and is supplied to the substrate (W) through the nozzle (430) connected to the individual line (801). Here, the individual line-side supply control valve (805) is controlled to be open by the controller (900) so that the drying fluid is discharged toward the nozzle (430). At this time, the drying fluid contained in the second tank (622) may be a drying fluid in a state in which bubbles are removed. The drying fluid in the second tank (622) is supplied to the substrate (W) while maintaining a temperature lower than the boiling point by the second heater (662). Even if a local pressure change (e.g., pressure drop) occurs during the process in which the drying fluid moves along the supply line (661), the drying fluid in a state in which bubbles are already removed generates relatively fewer bubbles than the drying fluid in which the bubbles are not removed. In this case, since the amount of bubbles generated is small, even if the drying fluid is supplied onto the substrate (W), it can lead to a particle reduction effect on the substrate (W). After all of the drying fluid contained in the second tank (622) is supplied onto the substrate (W), the drying fluid waiting in the first tank (612) in a degassed state flows along the first supply path to the individual line (801) and is supplied to the substrate (W) through the nozzle (430) connected to the individual line (801). Here, the supply control valve (805) on the individual line side is controlled to be open by the controller (900) so that the drying fluid is discharged toward the nozzle (430). The drying fluid is supplied again to the emptied second tank (622), and the bubble degassing process is performed through the second circulation path. The bubble degassing process by the second circulation path is performed in the same manner as the bubble degassing process by the first circulation path. At this time, the controller (900) controls the opening/closing valve (644) provided on the first circulation path to close, and controls the opening/closing valve (644) provided on the second circulation path to open. In addition, the controller (900) controls the opening/closing valve (669) provided on the first supply path to open, and controls the opening/closing valve (669) provided on the second supply path to close. In addition, the individual line-side supply control valve (805) is controlled to a closed state by the controller (900) to prevent the drying fluid from being discharged toward the nozzle (430).

Hereinafter, a substrate processing method according to one embodiment of the present invention will be described in detail with reference to the drawings.

Figure 6 is a flow chart showing a process of processing a substrate using the device of Figure 3.

A substrate treatment method according to one embodiment of the present invention further includes a chemical supply step (S100), a rinsing step (S200), a substitution step (S300), and a drying step (S400).

In the chemical supply step (S100), a chemical is discharged onto the substrate (W) through the first nozzle (410) to remove metal foreign substances, organic substances, particles, etc. remaining on the substrate (W). For example, the chemical may be a liquid capable of etching a film formed on the substrate (W) or removing particles remaining on the substrate (W). The chemical may be a liquid having the properties of a strong acid or a strong base. The chemical may include sulfuric acid, hydrofluoric acid, or ammonia. The rinse liquid may be a liquid capable of rinsing chemicals remaining on the substrate (W).

In the rinsing step (S200), pure water (DIW) is ejected onto the substrate (W) through the second nozzle (420) to remove chemicals remaining on the substrate (W).

In the substitution step (S300), a drying fluid is supplied onto the substrate (W) through the third nozzle (430) to replace the rinsing liquid remaining on the substrate (W) with the drying fluid. The drying fluid may be a liquid having a lower surface tension than the rinsing liquid. For example, the drying fluid may be isopropyl alcohol (IPA).

In addition, the substitution step (S300) further includes a first heating step (S320) and a second heating step (S340). The first heating step (S320) heats the drying fluid to a temperature higher than the boiling point of the drying fluid before supplying the drying fluid to the substrate to remove air bubbles from the drying fluid. At this time, the heating of the drying fluid to a temperature higher than the boiling point of the drying fluid is performed while circulating the drying fluid through a circulation line (641) connected to the tank (612, 622).

The second heating step (S340) supplies a drying fluid having a temperature below the boiling point to the substrate after the first heating step (S320). In this case, the individual line-side supply control valve (805) is controlled to be open by the controller (900) so that the drying fluid is discharged toward the nozzle (430). The second heating step (S340) heats the drying fluid secondarily while the drying fluid is supplied to the substrate after degassing bubbles from the drying fluid, and the second heating heats the drying fluid to a temperature lower than the boiling point of the drying fluid. The drying fluid may include isopropyl alcohol. In this case, in the first heating step (S320), the isopropyl alcohol is heated to a temperature higher than 83°C, which is the boiling point of isopropyl alcohol, and in the second heating step (S340), the isopropyl alcohol is heated to a temperature lower than the boiling point of isopropyl alcohol. At this time, the heating temperature in the second heating step (S340) is preferably 65 to 75 ℃.

In the drying step (S400), a drying gas may be supplied to the substrate to remove the organic solvent on the substrate. In this case, in the drying step (S400), the substrate that has been liquid-treated in the cleaning chamber may be transferred to the drying chamber by the main robot (244) to dry the substrate.

Meanwhile, the above-described substitution step (S300) may further include a chemical liquid contamination monitoring step (S350). In the chemical liquid contamination monitoring step (S350), the particle size distribution measuring device (810) periodically receives a preset unit capacity of dry fluid through the common line section (700) and the individual line section (800), samples the unit capacity of dry fluid, and measures and monitors the size distribution of particles per unit capacity. In this case, in the chemical liquid contamination monitoring step (S350), the particle size distribution measuring device (810) compares the reference distribution data (DI) having relatively small particles compared to the dry fluid, such as ultrapure water, with the size distribution data of particles per unit capacity of the continuously sampled dry fluid. Referring further to FIGS. 7 and 8, FIG. 7 is a graph that superimposes the reference distribution data (DI) and the size distribution data of particles per unit capacity of the sampled dry fluid, and FIG. 8 is a table that expresses the graph illustrated in FIG. 7 in numerical values. In Fig. 7, the X-axis is the size distribution of particles, and the Y-axis is the discharge amount. In addition, the reference distribution data (DI) of Fig. 7 is pure water, and the remaining graphs are graphs (D_1, D_2, D_3, D_10) of each damaged period when the diaphragm (Diaphragm) inside the individual line-side supply control valve (805) is damaged, and graphs (O_1, O_2, O_3, O_10) of each damaged period when the O-ring (O-Ring) inside the individual line-side supply control valve (805) is damaged. In this way, it can be seen that when the individual line-side supply control valve (805) is damaged, each of the damage graphs measured by the particle size distribution measuring device (810) forms a particle distribution larger than the reference distribution data (DI) for pure water.

In this way, the particle size distribution measuring device (810) compares the particle distribution data of the drying fluid for each of the common line section (700) and the individual line section (800) with the reference distribution data (DI), and determines that the drying fluid is contaminated if the particle size in the particle distribution data exceeds a preset range. At this time, if the particle size distribution measuring device (810) determines that the drying fluid is contaminated, it generates a liquid contamination alarm.

Here, the liquid contamination alarm may further proceed with a step (S351) of generating a common line contamination alarm indicating a state in which the common line section (700) is contaminated and an individual line contamination alarm indicating a state in which the individual line section (800) is contaminated. When the particle size distribution measuring device (810) generates a common line contamination alarm and an individual line contamination alarm, the common line contamination alarm and the individual line contamination alarm are transmitted to the controller (900), and the controller (900) may further proceed with a step (S352) of closing a valve associated with the liquid discharge of the common line section (700) and the individual line section (800) so that the drying fluid is not discharged so that the drying fluid is not supplied onto the substrate (W).

Thereafter, if a common line contamination alarm occurs, the manager inspects and repairs the systems of the first heating unit (640) and the second heating unit (660), and if an individual line contamination alarm occurs, the manager inspects and repairs the individual line (801), the individual line-side flow meter (802), the individual line-side flow control valve (803), the individual line-side temperature sensor (804), the individual line-side supply control valve (805), the individual line-side recovery line (806), and the individual line-side recovery valve (807). In this way, if the substrate is contaminated with the chemical solution, the supply of the chemical solution is stopped, and at this time, the manager can immediately determine where the problem occurred in the common line section (700) and the individual line section (800) when the chemical solution is contaminated and proceed with the inspection.

As described above, the present invention has been described by specific matters such as specific components, limited examples, and drawings, but these have been provided only to help a more general understanding of the present invention, and the present invention is not limited to the above examples, and those with common knowledge in the field to which the present invention pertains can make various modifications and variations from this description.

Therefore, the idea of the present invention should not be limited to the described embodiments, and all things that are equivalent or equivalent to the claims described below as well as the claims are considered to belong to the scope of the idea of the present invention.

10: Index module 20: Process processing module
310: Chamber 320: Processing vessel
340 : Spin head 360 : Lifting unit
400: Liquid discharge unit 500: Air flow forming unit
600: Liquid supply unit 700: Common line section
800: Individual line section 810: Particle size distribution measuring device
900 : Controller

Claims (10)

In a device for processing a substrate,
A chamber having a processing space;
A support unit that supports and rotates a substrate in the above processing space;
A liquid discharging unit that discharges a liquid in a liquid form onto a substrate supported by the above-mentioned support unit;
A liquid supply unit for supplying a liquid to the above liquid discharge unit; and
A substrate processing device, comprising: a particle size distribution measuring device that is connected to the liquid supply unit and measures the size distribution of particles by separating particles by size using the electrical mobility of particles dispersed and contained in the liquid, and then measuring the number concentration of particles by size.
In the first paragraph,
The above liquid supply unit,
A common line section for circulating the above-mentioned liquid; and
An individual line section connected between the common line section and the liquid discharge unit to supply the liquid from the common line section to the liquid discharge unit;
The above particle size distribution measuring device is a substrate processing device, which is connected to each of the common line section and the individual line sections to receive a chemical solution and measure the size distribution of the particles.
In the second paragraph,
The above particle size distribution measuring device is a substrate processing device that continuously measures the size distribution of the particles at a preset cycle.
In the third paragraph,
The above particle size distribution measuring device is a substrate processing device that generates a liquid contamination alarm when the size distribution of the particles is measured and compared with the stored reference distribution data and the measured particle size distribution exceeds the preset range of the reference distribution data.
In paragraph 4,
A substrate processing device wherein the above particle size distribution measuring device generates a common line contamination alarm when the common line section is contaminated, and generates an individual line contamination alarm when the individual line sections are contaminated.
In paragraph 5,
It further includes a controller that controls the opening and closing of the valve discharging the liquid among the liquid discharging units;
The above particle size distribution measuring device transmits the individual line contamination alarm to the controller,
A substrate processing device, wherein the controller, when receiving the individual line contamination alarm, switches the valve discharging the chemical liquid to a closed state to prevent the chemical liquid from being discharged.
In the first paragraph,
The above liquid supply unit,
A first heating unit that heats the treatment liquid to a temperature higher than the boiling point of the treatment liquid before the treatment liquid is supplied onto the substrate by the liquid discharge unit; and
A substrate processing device, comprising: a second heating unit for heating a processing liquid heated to a temperature higher than a boiling point to a temperature lower than the boiling point and supplying the heated processing liquid to the liquid discharge unit.
In Article 7,
The above first heating unit,
A circulation line for circulating the treatment liquid contained in the tank; and
A first heater installed on the circulation line and heating the treatment liquid moving inside the circulation line to a temperature higher than the boiling point;
The above second heating unit,
a supply line connected to the above liquid discharge unit; and
A second heater installed on the supply line and heating the treatment liquid moving inside the supply line to a temperature lower than the boiling point;
A substrate treatment device, wherein the treatment liquid supplied onto the substrate by the liquid discharge unit is provided at a temperature lower than the boiling point.
In Article 8,
A substrate treatment device wherein the above-mentioned liquid is formed of isopropyl alcohol (IPA).
A chemical supply step for removing metal foreign substances, organic substances, particles, etc. remaining on the substrate by discharging chemicals onto the substrate through the first nozzle;
A rinsing step for removing chemicals remaining on the substrate by ejecting pure water (DIW) onto the substrate through the second nozzle; and
A substitution step for supplying a drying fluid onto the substrate through a third nozzle to replace the rinsing liquid remaining on the substrate with the drying fluid;
A substrate treatment method, wherein in the above substitution step, a particle size distribution measuring device further includes a liquid contamination monitoring step in which the particle size distribution measuring device periodically receives a preset unit capacity of the drying fluid through a common line section and an individual line section, samples the drying fluid in the unit capacity, and measures and monitors the particle size distribution per unit capacity.

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