KR20240155931A - 감광성 수지 조성물 및 프린트 배선판의 제조 방법 - Google Patents

감광성 수지 조성물 및 프린트 배선판의 제조 방법 Download PDF

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Publication number
KR20240155931A
KR20240155931A KR1020247032206A KR20247032206A KR20240155931A KR 20240155931 A KR20240155931 A KR 20240155931A KR 1020247032206 A KR1020247032206 A KR 1020247032206A KR 20247032206 A KR20247032206 A KR 20247032206A KR 20240155931 A KR20240155931 A KR 20240155931A
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KR
South Korea
Prior art keywords
photosensitive resin
resin composition
photopolymerization initiator
carboxyl group
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020247032206A
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English (en)
Korean (ko)
Inventor
다이사쿠 스토
신이치로 후쿠다
다이치 오카모토
마사유키 시무라
Original Assignee
다이요 홀딩스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이요 홀딩스 가부시키가이샤 filed Critical 다이요 홀딩스 가부시키가이샤
Publication of KR20240155931A publication Critical patent/KR20240155931A/ko
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
KR1020247032206A 2022-03-29 2023-03-28 감광성 수지 조성물 및 프린트 배선판의 제조 방법 Ceased KR20240155931A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-054426 2022-03-29
JP2022054426 2022-03-29
PCT/JP2023/012393 WO2023190454A1 (ja) 2022-03-29 2023-03-28 感光性樹脂組成物およびプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
KR20240155931A true KR20240155931A (ko) 2024-10-29

Family

ID=88202437

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247032206A Ceased KR20240155931A (ko) 2022-03-29 2023-03-28 감광성 수지 조성물 및 프린트 배선판의 제조 방법

Country Status (4)

Country Link
JP (1) JPWO2023190454A1 (https=)
KR (1) KR20240155931A (https=)
CN (1) CN118974657A (https=)
WO (1) WO2023190454A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001278947A (ja) 2000-03-29 2001-10-10 Taiyo Ink Mfg Ltd 活性エネルギー線硬化性樹脂及びこれを用いた光硬化性・熱硬化性樹脂組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4840865B2 (ja) * 2006-11-07 2011-12-21 太陽ホールディングス株式会社 アルカリ現像可能な感光性樹脂組成物およびそれを用いたプリント配線板
CN103513515A (zh) * 2012-06-29 2014-01-15 太阳油墨（苏州）有限公司 碱显影型感光性树脂组合物、干膜、固化物以及印刷电路板
JP5572737B1 (ja) * 2013-06-04 2014-08-13 太陽インキ製造株式会社 光硬化熱硬化性樹脂組成物、硬化物、及びプリント配線板
JP5882510B2 (ja) * 2014-06-30 2016-03-09 太陽インキ製造株式会社 感光性ドライフィルムおよびそれを用いたプリント配線板の製造方法
JP6383621B2 (ja) * 2014-09-24 2018-08-29 太陽インキ製造株式会社 硬化性組成物、ドライフィルム、硬化物、プリント配線板およびプリント配線板の製造方法
JP6788372B2 (ja) * 2015-06-05 2020-11-25 太陽インキ製造株式会社 アルカリ現像可能な樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP7254511B2 (ja) * 2018-03-28 2023-04-10 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、およびプリント配線板の製造方法
JP7084185B2 (ja) * 2018-03-30 2022-06-14 太陽インキ製造株式会社 硬化性樹脂組成物、そのドライフィルムおよび硬化物、それらを用いたプリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001278947A (ja) 2000-03-29 2001-10-10 Taiyo Ink Mfg Ltd 活性エネルギー線硬化性樹脂及びこれを用いた光硬化性・熱硬化性樹脂組成物

Also Published As

Publication number Publication date
CN118974657A (zh) 2024-11-15
JPWO2023190454A1 (https=) 2023-10-05
WO2023190454A1 (ja) 2023-10-05

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