KR20240076334A - Camera module and electronic device including the same - Google Patents

Abstract

According to an embodiment of the present disclosure, a camera module and/or an electronic device including the same may include a first carrier configured to perform an image stabilization operation, the camera module being disposed on the first carrier, and the camera module and/or an electronic device including the same with at least a portion of the first carrier. A second carrier configured to move horizontally with respect to the image sensor and perform a focusing operation by moving along the optical axis direction with respect to the first carrier, and connecting the second carrier to the first carrier, and It may include at least one elastic member configured to support or guide the movement of the second carrier. In one embodiment, the elastic member includes a first fixing part supported on the first carrier, a first elastic part extending from the first fixing part, and provided at an end of the first elastic part and supported on the second carrier. a second fixing part, at least one second elastic part extending from the first elastic part between the first fixing part and the second fixing part, and provided at an end of the second elastic part and attached to the first carrier. It may include a supported third fixing part. In addition, various embodiments may be possible.

Description

Camera module and electronic device including the same {CAMERA MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME}

Embodiment(s) of the present disclosure relate to electronic devices, for example, a camera module and/or an electronic device including the same.

As electronic, information, and communication technologies develop, various functions are being integrated into a single electronic device. For example, a smart phone includes communication functions as well as functions such as a sound reproduction device, an imaging device, or an electronic notebook, and a wider variety of functions can be implemented in the smart phone by additionally installing applications. In addition to executing installed applications or stored files, electronic devices can receive various information in real time by connecting to servers or other electronic devices in a wired or wireless manner.

As various functions are implemented in one electronic device (e.g. smart phone), electronic devices such as audio playback devices that perform designated functions have already been replaced by smart phones, and the areas of video playback devices and filming devices are also gradually being replaced by smart phones. It is becoming. Since optical performance may be limited in miniaturized electronic devices, the quality of captured images or videos can be improved by implementing a photographing function using multiple cameras or multiple image sensors. For example, electronic devices such as smart phones are replacing compact cameras, and it is expected that they will be able to replace high-performance cameras such as single-lens reflex cameras in the future.

The above information may be provided as background technology for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may apply as prior art with respect to the present disclosure.

According to an embodiment of the present disclosure, a camera module and/or an electronic device including the same may include an image sensor configured to generate an electrical signal by receiving light incident from the optical axis direction. In one embodiment, the camera module and/or the electronic device including the same may include a first carrier configured to move at least partially horizontally relative to the image sensor on a plane perpendicular to the optical axis. In one embodiment, the camera module and/or the electronic device including the same is disposed on the first carrier and moves horizontally with respect to the image sensor with at least a portion of the first carrier and moves the optical axis with respect to the first carrier. It may include a second carrier configured to move along the direction. In one embodiment, the camera module and/or the electronic device including the same is disposed on the second carrier and moves along the optical axis direction with respect to the first carrier together with the second carrier, and transmits light incident in the optical axis direction. It may include a lens unit configured to guide or focus light to the image sensor. In one embodiment, the camera module and/or the electronic device including the same is configured to connect the second carrier to the first carrier and support or guide the movement of the second carrier with respect to the first carrier. It may include one elastic member. In one embodiment, the elastic member may include a first fixing part supported on the first carrier. In one embodiment, the elastic member may include a first elastic part extending from the first fixing part. In one embodiment, the elastic member may include a second fixing part provided at an end of the first elastic part and supported on the second carrier. In one embodiment, the elastic member may include at least one second elastic part extending from the first elastic part between the first fixing part and the second fixing part. In one embodiment, the elastic member may include a third fixing part provided at an end of the second elastic part and supported on the first carrier.

According to an embodiment of the present disclosure, an electronic device may include a camera module as described above, and a processor configured to acquire an image of a subject using the camera module.

The above-described or other aspects, configurations and/or advantages of an embodiment of the present disclosure may become clearer through the following detailed description with reference to the accompanying drawings.
1 is a block diagram showing an electronic device in a network environment, according to an embodiment of the present disclosure.
Figure 2 is a perspective view showing the front of an electronic device according to an embodiment of the present disclosure.
FIG. 3 is a perspective view showing the back of the electronic device shown in FIG. 2 according to an embodiment of the present disclosure.
FIG. 4 is an exploded perspective view showing the front of the electronic device shown in FIG. 2 according to an embodiment of the present disclosure.
FIG. 5 is an exploded perspective view showing the rear of the electronic device shown in FIG. 2 according to an embodiment of the present disclosure.
Figure 6 is an exploded perspective view showing a camera module of an electronic device according to an embodiment of the present disclosure.
FIG. 7 is an assembled perspective view showing the camera module cut along line A-A' of FIG. 6 according to an embodiment of the present disclosure.
8 is a diagram showing the elastic member(s) of a camera module according to an embodiment of the present disclosure.
Figure 9 is a perspective view showing the elastic member(s) of the camera module according to an embodiment of the present disclosure arranged on the first carrier.
Figure 10 is a diagram showing the second carrier disposed on the first carrier through the elastic member(s) of the camera module according to an embodiment of the present disclosure.
FIG. 11 is a perspective view showing the first carrier and/or elastic member(s) cut along line B-B' of FIG. 10 according to an embodiment of the present disclosure.
FIG. 12 is a cutaway view of the first carrier and/or elastic member(s) along line B-B' of FIG. 10, according to an embodiment of the present disclosure.
Figure 13 is a perspective view showing the elastic member(s) of the camera module arranged on the first carrier according to an embodiment of the present disclosure.
FIG. 14 is a cut-away perspective view of the first carrier and/or elastic member(s) of FIG. 13 according to an embodiment of the present disclosure.
Figure 15 is a diagram showing the second carrier disposed on the first carrier through the elastic member(s) of the camera module according to an embodiment of the present disclosure.
FIG. 16 is a cut-away perspective view of the first carrier and/or elastic member(s) of FIG. 15 according to an embodiment of the present disclosure.
Figure 17 is a diagram showing the second carrier disposed on the first carrier through the elastic member(s) of the camera module according to an embodiment of the present disclosure.
FIG. 18 is a perspective view showing the first carrier and/or the elastic member(s) cut away before the damping member(s) are disposed on the first carrier of FIG. 17, according to an embodiment of the present disclosure.
FIG. 19 is a cut-away perspective view of the first carrier and/or elastic member(s) of FIG. 17 according to an embodiment of the present disclosure.
Figure 20 is a perspective view showing the first carrier and/or the elastic member(s) cut away before the damping member(s) are disposed on the first carrier of the camera module according to an embodiment of the present disclosure.
Figure 21 is a perspective view showing a cutaway first carrier and/or elastic member(s) of a camera module according to an embodiment of the present disclosure.
Throughout the accompanying drawings, like parts, components and/or structures may be assigned similar reference numbers.

As the use of miniaturized, easily portable electronic devices such as smart phones and tablet PCs becomes widespread, user demand for the price and performance of electronic devices may increase. Through an appropriate combination of image sensor and lens(s) or implementation of stable focusing operation, and/or through processing/processing of acquired image data, the optical performance of the camera module and/or electronics can be stabilized or improved. there is. Recently, the quality of images acquired from camera modules and/or electronic devices can be further improved by incorporating an image stabilization function that can prevent image quality from deteriorating due to user's hand shaking. The hand shake correction function may be implemented through a mechanical operation that moves (or vibrates) the lens(s) relative to the image sensor. As camera modules and/or electronic devices become smaller, the precision of various components increases and the assembly process becomes more complex when implementing a mechanical structure for image stabilization operations. For example, by incorporating an image stabilization function, the quality of images acquired from a camera module and/or electronic device may increase, but production costs and/or user purchase costs may increase.

One embodiment of the present disclosure is intended to solve at least the above-mentioned problems and/or disadvantages and provide at least the advantages described later, and is a camera module capable of obtaining images of improved quality while suppressing an increase in production or purchase costs. and/or an electronic device including the same may be provided.

One embodiment of the present disclosure can provide a camera module and/or an electronic device including the same, which has a simple structure and is equipped with an image stabilization function and/or a focus control function.

The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by those skilled in the art from the description below. There will be.

The following description in conjunction with the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and corresponding content. The example embodiments disclosed in the following description include numerous specific details to aid understanding, but are considered to be one of a variety of example embodiments. Accordingly, a person skilled in the art will understand that various changes and modifications to the various implementations described in this document can be made without departing from the scope and technical spirit of the disclosure. Additionally, for clarity and conciseness, descriptions of well-known functions and configurations may be omitted.

The terms and words used in the following description and claims are not limited to a referential meaning and may be used to clearly and consistently describe an embodiment of the present disclosure. Accordingly, it will be clear to those skilled in the art that the following description of various implementations of disclosures is provided for illustrative purposes and not for the purpose of limiting the scope of rights and disclosures stipulating equivalents.

Unless the context clearly dictates otherwise, the singular forms "a", "an", and "the" shall be understood to include plural meanings. Thus, for example, “component surface” may be understood to include one or more of the surfaces of the component.

1 is a block diagram of an electronic device 1001 in a network environment 1000, according to an embodiment of the present disclosure. Referring to FIG. 1, in a network environment 1000, an electronic device 1001 communicates with an electronic device 1002 through a first network 1098 (e.g., a short-range wireless communication network) or a second network 1099. It is possible to communicate with at least one of the electronic device 1004 or the server 1008 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 1001 may communicate with the electronic device 1004 through the server 1008. According to one embodiment, the electronic device 1001 includes a processor 1020, a memory 1030, an input module 1050, an audio output module 1055, a display module 1060, an audio module 1070, and a sensor module ( 1076), interface (1077), connection terminal (1078), haptic module (1079), camera module (1080), power management module (1088), battery (1089), communication module (1090), subscriber identification module (1096) , or may include an antenna module 1097. In one embodiment, at least one of these components (eg, the connection terminal 1078) may be omitted, or one or more other components may be added to the electronic device 1001. In one embodiment, some of these components (e.g., sensor module 1076, camera module 1080, or antenna module 1097) are integrated into one component (e.g., display module 1060). It can be.

The processor 1020, for example, executes software (e.g., program 1040) to operate at least one other component (e.g., hardware or software component) of the electronic device 1001 connected to the processor 1020. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 1020 stores commands or data received from another component (e.g., sensor module 1076 or communication module 1090) in volatile memory 1032. The commands or data stored in the volatile memory 1032 can be processed, and the resulting data can be stored in the non-volatile memory 1034. According to one embodiment, the processor 1020 is a main processor 1021 (e.g., a central processing unit or an application processor), or an auxiliary processor 1023 (e.g., a graphics processing unit, a neural network processing unit) that can operate independently or together with the main processor 1021. (NPU; neural processing unit), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device 1001 includes a main processor 1021 and a auxiliary processor 1023, the auxiliary processor 1023 may be set to use lower power than the main processor 1021 or be specialized for a designated function. You can. The auxiliary processor 1023 may be implemented separately from the main processor 1021 or as part of it.

The auxiliary processor 1023 may, for example, act on behalf of the main processor 1021 while the main processor 1021 is in an inactive (e.g., sleep) state, or while the main processor 1021 is in an active (e.g., application execution) state. ), together with the main processor 1021, at least one of the components of the electronic device 1001 (e.g., the display module 1060, the sensor module 1076, or the communication module 1090) At least some of the functions or states related to can be controlled. According to one embodiment, coprocessor 1023 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 1080 or communication module 1090). there is. According to one embodiment, the auxiliary processor 1023 (eg, neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. This learning may be performed, for example, in the electronic device 1001 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 1008). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 1030 may store various data used by at least one component (eg, the processor 1020 or the sensor module 1076) of the electronic device 1001. Data may include, for example, input data or output data for software (e.g., program 1040) and instructions related thereto. Memory 1030 may include volatile memory 1032 or non-volatile memory 1034.

The program 1040 may be stored as software in the memory 1030 and may include, for example, an operating system 1042, middleware 1044, or application 1046.

The input module 1050 may receive commands or data to be used in a component of the electronic device 1001 (e.g., the processor 1020) from outside the electronic device 1001 (e.g., a user). The input module 1050 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 1055 can output sound signals to the outside of the electronic device 1001. The sound output module 1055 may include, for example, a speaker or receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 1060 can visually provide information to the outside of the electronic device 1001 (eg, a user). The display module 1060 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 1060 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 1070 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 1070 acquires sound through the input module 1050, the sound output module 1055, or an external electronic device (e.g. : Sound can be output through an electronic device 1002 (e.g., speaker or headphone).

The sensor module 1076 detects the operating state (e.g., power or temperature) of the electronic device 1001 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 1076 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 1077 may support one or more designated protocols that can be used to connect the electronic device 1001 to an external electronic device (eg, the electronic device 1002) directly or wirelessly. According to one embodiment, the interface 1077 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 1078 may include a connector through which the electronic device 1001 can be physically connected to an external electronic device (eg, the electronic device 1002). According to one embodiment, the connection terminal 1078 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 1079 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 1079 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 1080 can capture still images and videos. According to one embodiment, the camera module 1080 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 1088 can manage power supplied to the electronic device 1001. According to one embodiment, the power management module 1088 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 1089 may supply power to at least one component of the electronic device 1001. According to one embodiment, the battery 1089 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 1090 provides a direct (e.g., wired) communication channel or wireless communication channel between the electronic device 1001 and an external electronic device (e.g., the electronic device 1002, the electronic device 1004, or the server 1008). can support the establishment of and communication through established communication channels. Communication module 1090 operates independently of processor 1020 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 1090 may be a wireless communication module 1092 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1094 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 1098 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 1099 (e.g., legacy It can communicate with external electronic devices through telecommunication networks such as cellular networks, 5G networks, next-generation communication networks, the Internet, or computer networks (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 1092 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 1096 to communicate within a communication network, such as the first network 1098 or the second network 1099. The electronic device 1001 can be confirmed or authenticated.

The wireless communication module 1092 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access to multiple terminals (massive machine type communications (mMTC)), or ultra-reliable and low-latency (URLLC). -latency communications)) can be supported. The wireless communication module 1092 may support high frequency bands (e.g., mmWave bands), for example, to achieve high data rates. The wireless communication module 1092 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive MIMO (multiple-input and multiple-output), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 1092 may support various requirements specified in the electronic device 1001, an external electronic device (e.g., electronic device 1004), or a network system (e.g., second network 1099). According to one embodiment, the wireless communication module 1092 supports peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 1097 may transmit or receive signals or power to or from the outside (e.g., an external electronic device). According to one embodiment, the antenna module may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 1097 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 1098 or the second network 1099 is, for example, connected to the plurality of antennas by the communication module 1090. can be selected. Signals or power may be transmitted or received between the communication module 1090 and an external electronic device through the selected at least one antenna. According to one embodiment, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 1097.

According to one embodiment, the antenna module 1097 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 1001 and the external electronic device 1004 through the server 1008 connected to the second network 1099. Each of the external electronic devices 1002 or 1004 may be of the same or different type as the electronic device 1001. According to one embodiment, all or part of the operations performed in the electronic device 1001 may be executed in one or more of the external electronic devices 1002, 1004, or 1008. For example, when the electronic device 1001 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 1001 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 1001. The electronic device 1001 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 1001 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device 1004 may include an Internet of Things (IoT) device. Server 1008 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 1004 or server 1008 may be included in the second network 1099. The electronic device 1001 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Electronic devices according to the embodiment(s) of the present disclosure may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The embodiment(s) of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. In this document, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited. One (e.g. first) component is said to be "coupled" or "connected" to another (e.g. second) component, with or without the terms "functionally" or "communicatively". Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document are software (e.g., a program) that includes one or more instructions stored in a storage medium (e.g., internal memory or external memory) that can be read by a machine (e.g., an electronic device). It can be implemented as: For example, a processor (eg, processor) of a device (eg, electronic device) may call at least one instruction among one or more instructions stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves). This term refers to cases where data is stored semi-permanently in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments of the present disclosure may be included and provided in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or via an application store (e.g. Play Store ^TM ) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smartphones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately arranged in other components. . According to embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component of the plurality of components prior to the integration. . According to embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.

Figure 2 is a perspective view showing the front of the electronic device 100 according to an embodiment of the present disclosure. FIG. 3 is a perspective view showing the rear of the electronic device 100 shown in FIG. 2 according to an embodiment of the present disclosure.

Referring to FIGS. 2 and 3, the electronic device 100 (e.g., the electronic device 1001 of FIG. 1) according to an embodiment has a first side (or front) 110A and a second side (or back). It may include a housing 110 including (110B), and a side (110C) surrounding the space between the first surface (110A) and the second surface (110B). In one embodiment (not shown), housing 110 may refer to a structure that forms part of the first side 110A of FIG. 2, the second side 110B and the side surfaces 110C of FIG. 3. there is. According to one embodiment, the first surface 110A may be formed at least in part by a substantially transparent front plate 102 (eg, a glass plate including various coating layers, or a polymer plate). The second surface 110B may be formed by a substantially opaque back plate 111. The back plate 111 is formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. It can be. The side surface 110C is joined to the front plate 102 and the back plate 111 and may be formed by a side structure (or “side bezel structure”) 118 including metal and/or polymer. In one embodiment, the back plate 111 and the side structure 118 may be integrally formed and include the same material (eg, a metallic material such as aluminum).

Although not shown, the front plate 102 may include a region(s) that is curved toward the rear plate 111 at least part of an edge and extends seamlessly. In one embodiment, the front plate 102 (or the rear plate 111) is curved toward the rear plate 111 (or the front plate 102) to form only one of the extended areas on the first surface ( 110A) can be included on one edge. Depending on the embodiment, the front plate 102 or the rear plate 111 may have a substantially flat shape, and in this case, may not include a curved extended area. When it includes a curved and extended area, the thickness of the electronic device 100 in the part containing the curved and extended area may be smaller than the thickness of other parts.

According to one embodiment, the electronic device 100 includes a display 101, an audio module (e.g., microphone hall 103, external speaker hall 107, call receiver hall 114), and a sensor module (e.g., First sensor module 104, second sensor module (not shown), third sensor module 119), camera module (e.g., first camera device 105, second camera device 112, flash 113) )), a key input device 117, a light emitting element 106, and a connector hole (eg, a first connector hole 108 and a second connector hole 109). In one embodiment, the electronic device 100 may omit at least one of the components (eg, the key input device 117 or the light emitting device 106) or may additionally include another component.

For example, the display 101 may output a screen or be visually exposed through a significant portion of the first side 110A (eg, the front plate 102). In one embodiment, at least a portion of the display 101 may be visually exposed through the front plate 102 forming the first surface 110A or through a portion of the side surface 110C. In one embodiment, the edges of the display 101 may be formed to be substantially the same as the adjacent outer shape of the front plate 102. In one embodiment (not shown), in order to expand the area to which the display 101 is visually exposed, the distance between the outer edge of the display 101 and the outer edge of the front plate 102 may be formed to be substantially the same.

In one embodiment (not shown), a recess or opening is formed in a portion of the screen display area of the display 101, and an audio module (e.g., for a call) is aligned with the recess or opening. It may include at least one of a receiver hole 114), a sensor module (e.g., first sensor module 104), a camera module (e.g., first camera device 105), and a light emitting element 106. . In one embodiment (not shown), an audio module (e.g., call receiver hole 114), a sensor module (e.g., first sensor module 104), and a camera are located on the back of the screen display area of the display 101. It may include at least one of a module (eg, the first camera device 105), a fingerprint sensor (not shown), and a light emitting device 106. In one embodiment (not shown), the display 101 is coupled to or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen. can be placed. In one embodiment, when the front plate 102 or the rear plate 111 includes a bent and extended area(s), the sensor module (e.g., the first sensor module 104, the third sensor module 119) ), and/or at least a portion of the key input device 117 may be bent and disposed in the extended area(s).

The audio modules 103, 107, and 114 may include a microphone hole 103 and a speaker hole (eg, an external speaker hole 107 and a call receiver hole 114). A microphone for acquiring external sound may be placed inside the microphone hole 103, and in one embodiment, a plurality of microphones may be placed to detect the direction of the sound. The speaker hole may include an external speaker hole 107 and a receiver hole 114 for a call. In one embodiment, the speaker hall (e.g., external speaker hall 107, call receiver hall 114) and microphone hole 103 are implemented as one hall, or the speaker hall (e.g., external speaker hall 107, call receiver hall 114) is implemented as one hall. A speaker may be included (e.g., a piezo speaker) without a receiver hole (114).

The sensor module may generate an electrical signal or data value corresponding to the internal operating state of the electronic device 100 or the external environmental state. The sensor module may include, for example, a first sensor module 104 (e.g., a proximity sensor) and/or a second sensor module (not shown) (e.g., a fingerprint) disposed on the first side 110A of the housing 110. sensor), and/or a third sensor module 119 disposed on the second surface 110B of the housing 110. The second sensor module (not shown) (e.g., fingerprint sensor) may be disposed on the first side 110A (e.g., display 101) as well as the second side 110B or side 110C of the housing 110. You can. The electronic device 100 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor. It may include at least one more.

The camera module includes a first camera device 105 disposed on the first side 110A of the electronic device 100, a second camera device 112 disposed on the second side 110B, and/or a flash ( 113) may be included. The camera devices (eg, the first camera device 105 and the second camera device 112) may include one or more lenses, an image sensor, and/or an image signal processor. The flash 113 may include, for example, a light emitting diode or a xenon lamp. In one embodiment, one or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 100. In one embodiment, the flash 113 may emit infrared rays, and the infrared rays emitted by the flash 113 and reflected by the subject may be received through the third sensor module 119. The electronic device 100 or a processor of the electronic device 100 (e.g., processor 1020 in FIG. 1) may detect depth information of the subject based on the point in time when infrared rays are received from the third sensor module 119. .

The key input device 117 may be disposed on the side 110C of the housing 110. In one embodiment, the electronic device 100 may not include some or all of the key input devices 117 mentioned above, and the key input devices 117 not included may be other than soft keys on the display 101. It can be implemented in the form In one embodiment, the key input device may include a sensor module disposed on the second side 110B of the housing 110.

For example, the light emitting device 106 may be disposed on the first surface 110A of the housing 110. For example, the light emitting device 106 may provide status information of the electronic device 100 in the form of light. In one embodiment, the light emitting device 106 may provide a light source that is linked to the operation of a camera module (eg, the first camera device 105). The light emitting device 106 may include, for example, an LED, an IR LED, and a xenon lamp.

Connector holes (e.g., first connector hole 108, second connector hole 109) are connectors for transmitting and receiving power and/or data with an external electronic device (e.g., electronic device 1002 of FIG. 1). A first connector hole 108 capable of accommodating a USB connector), and/or a second connector hole 108 capable of accommodating a connector for transmitting and receiving audio signals to and from an external electronic device (e.g. an earphone jack). )(109).

FIG. 4 is an exploded perspective view showing the front of the electronic device 200 shown in FIG. 2 according to an embodiment of the present disclosure. FIG. 5 is an exploded perspective view showing the rear of the electronic device 200 shown in FIG. 2 according to an embodiment of the present disclosure.

Referring to FIGS. 4 and 5, the electronic device 200 (e.g., the electronic device 1001, 1002, 1004, 100 of FIGS. 1, 2, or 3) includes a side structure 210 and a first support member. 211 (e.g., bracket), front plate 220 (e.g., front plate 102 in FIG. 2), display 230 (e.g., display 101 in FIG. 2), printed circuit board (or board assembly) ) 240, battery 250, second support member 260 (e.g., rear case), antenna, camera assembly 207, and rear plate 280 (e.g., rear plate 111 in FIG. 3). It can be included. In one embodiment, the electronic device 200 may omit at least one of the components (e.g., the first support member 211 or the second support member 260) or may additionally include another component. . At least one of the components of the electronic device 200 may be the same or similar to at least one of the components of the electronic device 100 of FIG. 2 or 3, and overlapping descriptions will be omitted below.

The first support member 211 may be disposed inside the electronic device 200 and connected to the side structure 210, or may be formed integrally with the side structure 210. The first support member 211 may be formed of, for example, a metallic material and/or a non-metallic (eg, polymer) material. When formed at least partially of a metal material, a portion of the side structure 210 or the first support member 211 may function as an antenna. The first support member 211 may have a display 230 coupled to one side and a printed circuit board 240 to the other side. The printed circuit board 240 includes a processor (e.g., processor 1020 in FIG. 1), memory (e.g., memory 1030 in FIG. 1), and/or an interface (e.g., interface 1077 in FIG. 1). Can be installed. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

According to various embodiments, the first support member 211 and the side structure 210 may be combined and referred to as a front case or housing 201. According to one embodiment, the housing 201 may be generally understood as a structure for housing, protecting, or disposing the printed circuit board 240 or the battery 250. In one embodiment, the housing 201 includes a structure that can be visually or tactilely recognized by the user on the exterior of the electronic device 200, for example, a side structure 210, a front plate 220, and/or It may be understood as including a rear plate 280. In one embodiment, 'the front or rear of the housing 201' may mean the first side 110A of FIG. 2 or the second side 110B of FIG. 3. In one embodiment, the first support member 211 includes a front plate 220 (e.g., first side 110A in FIG. 2) and a back plate 280 (e.g., second side 110B in FIG. 3). It is disposed between them and may function as a structure for arranging electrical/electronic components such as a printed circuit board 240 or a camera assembly 207.

The display 230 may include a display panel 231 and a flexible printed circuit board 233 extending from the display panel 231. For example, the flexible printed circuit board 233 may be understood as being at least partially disposed on the rear side of the display panel 231 and electrically connected to the display panel 231. In one embodiment, reference number '231' may be understood as a protection sheet disposed on the rear of the display panel. For example, unless otherwise specified in the detailed description below, the protection sheet may be understood as being a part of the display panel 231. In one embodiment, the protective sheet may function as a buffering structure that absorbs external force (eg, a low-density elastomer such as a sponge) or an electromagnetic shielding structure (eg, a copper sheet (CU sheet)). According to one embodiment, the display 230 may be disposed on the inner side of the front plate 220, and may include a light emitting layer to display the screen through at least a portion of the first side 110A of FIG. 2 or the front plate 220. can be output. As mentioned above, the display 230 may output a screen substantially through the entire area of the first side 110A or the front plate 220 of FIG. 2 .

Memory may include, for example, volatile memory or non-volatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. For example, the interface may electrically or physically connect the electronic device 200 to an external electronic device and may include a USB connector, SD card/MMC connector, or audio connector.

The second support member 260 may include, for example, an upper support member 260a and a lower support member 260b. In one embodiment, the upper support member 260a may be disposed to surround the printed circuit board 240 together with a portion of the first support member 211. Circuit devices (e.g., processors, communication modules, or memory) or various electrical/electronic components implemented in the form of integrated circuit chips may be placed on the printed circuit board 240. Depending on the embodiment, the printed circuit board 240 An electromagnetic shielding environment can be provided from the upper support member 260a. In one embodiment, the lower support member 260b may be utilized as a structure for placing electrical/electronic components such as a speaker module and an interface (e.g., USB connector, SD card/MMC connector, or audio connector). In one embodiment, electrical/electronic components such as speaker modules and interfaces (eg, USB connectors, SD card/MMC connectors, or audio connectors) may be placed on additional printed circuit boards, not shown. In this case, the lower support member 260b may be arranged to surround an additional printed circuit board together with another part of the first support member 211. The speaker module or interface disposed on the additional printed circuit board or lower support member 260b, not shown, may be connected to the audio module of FIG. 2 (e.g., microphone hole 103 or speaker hole (e.g., external speaker hole 107), call It may be disposed corresponding to the receiver hole 114) or the connector hole (eg, the first connector hole 108 and the second connector hole 109).

The battery 250 is a device for supplying power to at least one component of the electronic device 200 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 250 may be disposed, for example, on substantially the same plane as the printed circuit board 240 . The battery 250 may be placed integrally within the electronic device 200, or may be placed to be detachable from the electronic device 200.

Although not shown, the antenna may include a conductor pattern implemented on the surface of the second support member 260 through, for example, a laser direct structuring (LDS) method. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of the thin film, and the antenna in the form of a thin film may be disposed between the rear plate 280 and the battery 250. Antennas may include, for example, near field communication (NFC) antennas, wireless charging antennas, and/or magnetic secure transmission (MST) antennas. For example, the antenna can perform short-distance communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by part or a combination of the side structure 210 and/or the first support member 211.

Camera assembly 207 may include at least one camera module. Inside the electronic device 200, the camera assembly 207 may receive at least a portion of the light incident through the optical hole or the camera window 212, 213, and 219. In one embodiment, camera assembly 207 may be placed on first support member 211 at a location adjacent printed circuit board 240 . In one embodiment, the camera module(s) of camera assembly 207 may be generally aligned with any one of camera windows 212, 213, 219 and at least partially aligned with second support member 260 (e.g., It can be wrapped around the upper support member (260a).

2 to 5 illustrating the above electronic device 200, the Please note that For example, the orthogonal coordinate system of the embodiments of FIGS. 2 to 5 and/or the embodiments described later is for convenience of explanation, and may be orthogonal according to the structure and specifications of the electronic device to be actually manufactured or according to the user's usage habits. The coordinate system may be defined differently from that illustrated in the drawing.

FIG. 6 is an exploded perspective view showing the camera module 300 of an electronic device (e.g., the electronic devices 1001, 1002, 1004, 100, and 200 of FIGS. 1 to 5) according to an embodiment of the present disclosure. FIG. 7 is an assembled perspective view showing the camera module 300 cut away along line A-A' of FIG. 6 according to an embodiment of the present disclosure.

Referring to FIGS. 6 and 7 , a camera module 300 (e.g., at least one of the camera modules included in the camera assembly 207 of FIG. 4 or 5) and/or an electronic device 200 including the same An image sensor 302, a first carrier 303 for an image stabilization operation, a second carrier 304 for a focus adjustment operation, a lens unit 321 including at least one lens, and/or a first carrier ( It may include an elastic member 305 connecting the 303) and the second carrier 304. In one embodiment, the elastic member 305 may be configured to support or guide the movement of the second carrier 304 along the optical axis (O) direction with respect to the first carrier 303. In one embodiment, the lens unit 321 may guide or focus incident light along the optical axis (O) direction to the image sensor 302. In one embodiment, by the image stabilization operation of the first carrier 303, the second carrier 304 and/or the lens unit 321 are aligned with the image sensor 302 in a plane substantially perpendicular to the optical axis (O) direction. You can move about. In one embodiment, the lens unit 321 may move along the optical axis (O) direction by the focus adjustment operation of the second carrier 304.

According to one embodiment, the camera module 300 and/or the electronic device 200 including the same may further include a casing 301 and/or a driving unit 306. The casing 301 is, for example, a component that accommodates at least a portion of the image sensor 302, the first carrier 303, the second carrier 304, and/or the lens unit 321, and the image sensor 302 ), a mechanical structure for arranging the first carrier 303, the second carrier 304, and/or the lens unit 321, or an electromagnetic shielding environment may be provided. For example, the casing 301 includes a first casing 301a that provides a structure for mounting the image sensor 302 or the first carrier 303, a first carrier 303, a second carrier 304, and /Or it may include a second casing (301b) coupled to the first casing (301a) to surround at least a portion of the lens unit 321. The second casing 301b may function, for example, as an electromagnetic shielding structure.

According to one embodiment, the driving unit 306 may include a voice coil motor in which coils 361a and 361b (s) and magnets 363 (s) are combined, and the coils (361a, Electromagnetic force can be generated by applying an electric signal to 361b). For example, the driving unit 306 may receive an electric signal and provide driving force to move the first carrier 303 or the second carrier 304. 'Movement of the first carrier 303' can be understood as movement relative to the image sensor 302 in, for example, an image stabilization operation, and 'movement of the second carrier 304' can be understood as movement of the image sensor 302, for example, in focus control. In operation, it may be understood as movement with respect to the image sensor 302 and/or the first carrier 303. For example, by the driving force generated by the driving unit 306, the first carrier 303 can move horizontally in a plane substantially perpendicular to the optical axis (O) direction (or a plane parallel to the The carrier 304 may reciprocate in the direction of the optical axis O with respect to the first carrier 303. In this way, the driving unit 306 can generate driving forces that act in a plurality of different directions.

In the illustrated embodiment, among the driving units 306, four first coils 361a and four magnets 363 are combined to provide driving force to move the first carrier 303 in the X-axis direction and/or the first carrier. It can provide a driving force to move (303) in the Y-axis direction, and the combination of the second coil (361b) and the four magnets 363 can provide a driving force to move the second carrier 304 in the Z-axis direction. You can. For example, the first coil(s) 361a is disposed substantially in the casing 301 (e.g., the first casing 301a), the magnet 363 is disposed in the first carrier 303, and the first coil(s) 361a is disposed in the first carrier 303. 2 Coils 361b may be placed on the second carrier 304. In one embodiment, the first carrier 303 may move horizontally on the casing 301 as an electrical signal is applied to the first coil(s) 361a. In one embodiment, as an electric signal is applied to the second coil 361b, the second carrier 304 may reciprocate in the direction of the optical axis O on the first carrier 303. In this way, by the driving force provided by the driving unit 306 (e.g., the first coil(s) 361a and the magnet 363(s)), the first carrier 303 is cased substantially parallel to the XY plane. It may move horizontally with respect to (301) and/or the image sensor (302). In one embodiment, by the driving force provided by the driving unit 306 (e.g., the second coil 361b and the magnet 363(s)), the second carrier 304 is connected to the image sensor 302 and/or the second carrier 304. 1 It can reciprocate along the optical axis (O) direction with respect to the carrier 303.

According to one embodiment, the image sensor 302 may be disposed on one side of the casing 301 (eg, the first casing 301a) through the bracket 329. In one embodiment, the image sensor 302 may be substantially disposed on the lower surface of the casing 301, and an active area that receives external light may be visually exposed inside the casing 301. In one embodiment, the camera module 300 and/or the electronic device 200 including it (e.g., the processor 1020 of FIG. 1) includes a first carrier 303, a second carrier 304, and/or By moving the lens unit 321 with respect to the image sensor 302, an image stabilization operation and/or an autofocus operation may be performed. For example, the processor 1020 may apply an electrical signal to the driver 306 based on external force or vibration detected through the sensor module 1076 of FIG. 1, and the driver 306 may respond to the applied electrical signal. By generating a driving force accordingly, an image stabilization operation and/or an automatic focus adjustment operation can be performed. In one embodiment, the elastic member 305(s) mechanically connects the first carrier 303 and the second carrier 304, relative to the first carrier 303 in an autofocus operation. The second carrier 304 may support or guide movement along the optical axis (O) direction. In one embodiment, the elastic member 305(s) mechanically connects the first carrier 303 to the casing 301 (e.g., first casing 301a) while being connected to the casing 301 in an image stabilization operation. In relation to this, the horizontal movement of the first carrier 303 may be supported or guided.

According to one embodiment, the first carrier 303 may include a first guide member 303a and a second guide member 303b. This can provide a structure to facilitate placing or assembling the second carrier 304 inside the first carrier 303. For example, the camera module 300 can more stably support the reciprocating movement of the second carrier 304 by further including a second elastic member 359. In one embodiment, when disposing the second carrier 304 using the second elastic member 359, the first carrier 303 includes a first guide member 303a and a second guide member 303b. By doing so, it can be easy to place the second carrier 304 inside the first carrier 303. In one embodiment, when the structure is capable of stabilizing the reciprocating movement of the second carrier 304 even if the second elastic member 359 is not disposed, the second elastic member 359 may be omitted. When the second elastic member 359 is omitted, the first guide member 303a and the second guide member 303b can be manufactured substantially integrally.

According to one embodiment, the second elastic member 359 is disposed on the first guide member 303a and may be connected to the +Z direction end of the second carrier 304. After the second carrier 304 is assembled to the first guide member 303a through the second elastic member 359, the elastic member 305 is connected to the second guide member 303b and the second guide member 303b at an end in the -Z direction. The carrier 304 can be connected. This assembly sequence may change depending on the specifications or assembly structure of the camera module 300 to be actually manufactured. For example, the rail structure can be used to guide or support the reciprocating movement of the second carrier 304. In this case, the second elastic member 359 is omitted and the first guide member 303a and the second guide are used. The member 303b may be manufactured as one piece. When the first guide member 303a and the second guide member 303b are manufactured as one piece, the elastic member 305 connects the second guide member 303b and the second carrier 304 at the end in the -Z direction. By doing so, the second carrier 304 can be substantially placed or assembled on the first carrier 303 (eg, the second guide member 303b).

According to one embodiment, the first guide member 303a is disposed on, for example, the first casing 301a and reciprocates with respect to the first casing 301a along either the X-axis direction or the Y-axis direction. The second guide member 303b can reciprocate with respect to the first guide member 303a along the X-axis direction and/or the Y-axis direction together with the first guide member 303a. In one embodiment, the elastic member 305(s) may support or guide the reciprocating motion in the X-axis direction and the reciprocating motion in the Y-axis direction of the first carrier 303. When the first carrier 303 (e.g., the first guide member 303a and the second guide member 303b) reciprocates, there is at least one space between the first casing 301a and the first guide member 303a. By providing the ball 339, the reciprocating movement of the first carrier 303 can be smoothed. In one embodiment, the first casing 301a and/or the first guide member 303a may include a guide groove 319 that accommodates the ball 339. For example, the balls 339(s) can move relative to the first casing 301a within an area or range specified by the guide groove 319, and thus the horizontal movement range of the first carrier 303 can be determined. You can.

According to one embodiment, the first carrier 303 (e.g., the first guide member 303a and the second guide member 303b) can move substantially horizontally with respect to the image sensor 302, thereby allowing the first carrier 303 303 can implement hand shake correction operation. For example, an electronic device (e.g., the processor 1020 of FIG. 1) uses the sensor module 1076 of FIG. 1 to detect vibration (e.g., vibration of the electronic device 200) caused by an external force (e.g., a user's hand tremor). ), and by applying an electric signal to the drive unit 306 (e.g., the first coil 361a(s)) based on the detected vibration, the first carrier 303 (e.g., the first guide member 303a ) and/or the second guide member 303b) may be horizontally moved (or vibrated) with respect to the image sensor 302. As a result, it is possible to suppress deterioration in the quality of captured images due to external forces such as hand shaking. The hand shake correction operation using the driving unit 306 and the guidance structure using the ball 339(s) in the hand shake correction operation are disclosed in Republic of Korea Patent No. 2,255,295 (registered on May 17, 2021) (US Patent No. 10, 571, No. 713, registered on February 25, 2020) may be referenced. In one embodiment, the first carrier 303 (e.g., the first guide member 303a and the second guide member 303b) is disposed on the casing 301 in a horizontally movable state by the elastic member 305. It can be. For example, the horizontal movement of the first carrier 303 may be made more stable through a guiding structure using at least one ball 339, but the embodiment(s) of the present disclosure is not limited thereto, and the elastic member ( Depending on the specifications or structure of 305), the guidance structure using the balls 339(s) may be omitted.

According to one embodiment, the second carrier 304 is connected to the first carrier 303 (e.g., the second guide member 303b and the second guide member 303b) through the elastic member 305 (and/or the second elastic member 359). It may be connected to the first guide member 303a). For example, when the first carrier 303 moves horizontally, the second carrier 304 may move horizontally with respect to the image sensor 302 together with the first carrier 303. In one embodiment, according to the driving force generated in the driving portion 306 (e.g., between the second coil 361b and the magnet 363(s)), the second carrier 304 moves relative to the first carrier 303. It can reciprocate along the optical axis (O) direction. Depending on the position of the second carrier 304, the elastic member 305(s) (and/or the second elastic member 359) may be at least partially deformed while guiding or supporting the second carrier 304. . In one embodiment, the elastic force accumulated in the elastic member 305(s) (and/or the second elastic member 359) due to deformation may act as a driving force to return the second carrier 304 to its initial position. . For example, when an electric signal is not applied to the driving unit 306 (e.g., the second coil 361b), the accumulated energy in the elastic member 305(s) (and/or the second elastic member 359) The second carrier 304 may be disposed at a location where elastic force is minimal.

Although not shown, a rail structure is provided between the first carrier 303 (e.g., the second guide member 303b) and the second carrier 304, so that the linear movement of the second carrier 304 (e.g., the optical axis) (reciprocating motion along the O) direction) and can prevent the second carrier 304 from moving in a different direction with respect to the first carrier 303. This rail structure can be implemented by providing the second carrier 304 in the shape of a polygonal column and the second guide member 303b providing a space corresponding to the shape of the second carrier 304. In one embodiment, protruding structure(s) are provided on the outer wall of the second carrier 304 and rail groove(s) extending parallel to the optical axis O direction are provided on the inner wall of the second guide member 303b. A rail structure can be implemented. Allow linear movement of the second carrier 304 with respect to the first carrier 303, and suppress movement of the second carrier 304 with respect to the first carrier 303 in a direction other than the optical axis (O) direction. If possible, the rail structure may be implemented in a form other than the mentioned structure. Meanwhile, as the second carrier 304 moves smoothly in the direction of the optical axis O, a specified gap may be provided in the rail structure (or between the second guide member 303b and the second carrier 304), This gap may allow the second carrier 304 to tilt or move in a direction other than the optical axis O. As previously mentioned, when such a rail structure is provided, the second elastic member 359 may be omitted.

According to one embodiment, the elastic member 305(s) (and/or second elastic member 359) mechanically connects the second carrier 304 to the first carrier 303 while The movement of the second carrier 304 relative to 303 may be supported or guided. In one embodiment, the elastic member 305(s) mechanically connects the first carrier 303 to the casing 301 (e.g., the first casing 301a) while providing the first casing for the image sensor 302. The horizontal movement of the carrier 303 can be supported or guided. In one embodiment, at least one ball 339 is further provided to support or guide the horizontal movement of the first carrier 303 together with the elastic member 305(s). In one embodiment, the elastic member 305(s) is an elastic portion (e.g., elastic portions 353a, 353b, 353c, 353d in FIG. 8) extending in a meanderline shape generally on one plane. ) may include. Depending on the shape of the elastic member 305 and/or the elastic portions 353a, 353b, 353c, and 353d, one camera module 300 may be provided with a plurality of elastic members 305. In one embodiment, one elastic member 305 may be provided with a plurality of elastic parts 353a, 353b, 353c, and 353d. In this case, one elastic member 305 is provided in one camera module 300. A structure in which is placed can be implemented. For convenience of explanation, it is referred to as an 'elastic portion', but in the embodiment described later, some of the elastic portions 353a, 353b, 353c, and 353d are a structure connecting two other adjacent elastic portions, or a first carrier ( 303) or may function as a structure fixed on the second carrier 304. For example, some of the elastic parts 353a, 353b, 353c, and 353d described later may refer to mechanical connection structures or fixed structures, and in this case, the elastic part(s) substantially accumulate elastic force. or it may not provide elasticity. Examples of these elastic members 305(s) will be discussed with reference to FIGS. 8 to 10.

FIG. 8 is a diagram illustrating the elastic member 305(s) of a camera module (e.g., the camera module 300 of FIG. 6 or FIG. 7) according to an embodiment of the present disclosure. Figure 9 is a perspective view showing the elastic member 305(s) of the camera module 300 arranged on the first carrier 303 (e.g., the second guide member 303b) according to an embodiment of the present disclosure. am. FIG. 10 is a diagram showing the second carrier 304 disposed on the first carrier 303 through the elastic member 305(s) of the camera module 300 according to an embodiment of the present disclosure.

In the structure illustrated in FIGS. 8 to 10, one elastic member 305 is a structure including two first elastic portions 353a, and the two elastic members 305 having substantially the same shape form one elastic member 305. It may be placed in the camera module 300. In the illustrated embodiment, the elastic member 305 includes a fourth elastic portion 353d connecting two adjacent second fixing portions 351b, and one camera module 300 includes two fourth elastic portions. Part 353d may be disposed. For example, based on the state shown in FIG. 8, the fourth elastic portion 353d is disposed on the upper and lower sides of the lens area LA (e.g., the area where the lens unit 321 in FIG. 6 is disposed). You can. Although not shown, the camera module 300 includes an additional fourth elastic part connecting the second fixing part 351b located on the left/upper side and the second fixing part 351b located on the left/lower side, and /Or, it may further include an additional fourth elastic part connecting the second fixing part 351b located on the right/upper side and the second fixing part 351b located on the right/lower side. For example, the additional fourth elastic portion may be disposed on the left and/or right side of the lens area LA, respectively. When including these additional fourth elastic portion(s), one elastic member 305 may be understood as a structure including four first elastic portions 353a. In this case, one elastic member 305 is disposed in one camera module 300, and a structure substantially the same as the elastic members 305 illustrated in FIG. 8 can be implemented. For example, the number and shape of the elastic members 305 and/or elastic portions 353a, 353b, 353c, and 353d mentioned in this embodiment are merely exemplary and do not limit the embodiment(s) of the present disclosure. Pay attention to In one embodiment, the fourth elastic portion 353d may be fixed on the second carrier 304 without substantially accumulating elastic force.

8 to 10, the elastic member 305(s) includes a first fixing part 351a, a first elastic part 353a, and/or a second fixing part 351b, thereby forming a second fixing part 351b. The carrier 304 may be connected to the first carrier 303. In one embodiment, the elastic member 305(s) includes a second elastic portion 353b and a third fixing portion 351c, thereby generating an elastic force accumulated in the first elastic portion 353a, or the first elastic portion 353a. The movement of the second carrier 304 can be controlled by the elastic force of 353a. For example, in a hand shake correction operation of the first carrier 303, an external force may act on the second carrier 304 in a direction different from the direction of the optical axis O. Even if the rail structure is provided to suppress movement of the second carrier 304 in directions other than linear movement in the optical axis (O) direction, in implementing smooth linear movement, the second carrier (304) in the optical axis (O) direction 304) tilt movement (e.g., tilt phenomenon) may occur. The second elastic unit 353b suppresses the tilt phenomenon of the second carrier 304 (and/or the lens unit 321), thereby suppressing distortion of the focus adjustment state of the camera module 300 in the image stabilization operation. You can.

According to one embodiment, as mentioned above, the elastic member 305(s) includes elastic portions 353a, 353b, 353c, and 353d extending in a meandering shape on one plane, and the fixing portion (351a, 351b, 351c, 351d)(s) may be disposed in the first carrier 303, the second carrier 304, and/or the casing 301 (e.g., the first casing 301a). For example, the elastic member 305(s) mechanically connects the first carrier 303, the second carrier 304, and/or the casing 301 while supporting an image stabilization operation and/or a focus adjustment operation. Or you can guide. In one embodiment, the first fixing part 351a is supported on the first carrier 303 (e.g., the second guide member 303b), and the first elastic part 353a is connected from the first fixing part 351a. It may be extended. In one embodiment, the second fixing part 351b may be provided at an end of the first elastic part 353a and supported on the second carrier 304. For example, the first elastic portion 353a substantially connects the first carrier 303 and the second carrier 304, and the second carrier 304 is aligned with the optical axis O with respect to the first carrier 303. Movement along a direction can be permitted or guided.

According to one embodiment, when viewed along the optical axis O direction, a plurality of first elastic parts 353a may be arranged along the circumferential direction of the lens unit 321 and/or the lens area LA. For example, the plurality of first elastic parts 353a may be arranged at equiangular intervals along the circumferential direction of the lens unit 321. In one embodiment, in a structure in which at least one pair of first elastic parts 353a are arranged, the first elastic parts 353a may be arranged symmetrically about the lens part 321. In a structure in which a plurality of first elastic parts 353a are arranged along the circumferential direction of the lens unit 321, one first elastic part 353a is moved from one of the first fixing parts 351a to another adjacent elastic part 353a. It may extend in a direction toward the first fixing part 351a.

According to one embodiment, the second elastic part 353b may extend from the first elastic part 353a between the first fixing part 351a and the second fixing part 351b. The third fixing part 351c is provided at the end of the second elastic part 353b and may be supported on the first carrier 303 at a different position from the first fixing part 351a. The second elastic unit 353b can suppress external force applied to the second carrier 304 during the hand shake correction operation. For example, the horizontal movement (or oscillation) of the first carrier 303, the inertia of the second carrier 304 that moves horizontally (or oscillation) together with the first carrier 303, and/or the timing of the change in direction of vibration. Incongruity with the moving direction of the second carrier 304 may cause deformation of the first elastic portion 353a in a direction different from the optical axis O direction. The elastic force accumulated due to the deformation of the first elastic part 353a causes vibration (e.g., tilt phenomenon) of the second carrier 304 with respect to the first carrier 303 even after the hand shake correction operation is completed (hereinafter referred to as 'nth resonance). ') can cause. According to one embodiment, the second elastic unit 353b suppresses movement of the second carrier 304 with respect to the first carrier 303 in a direction different from the optical axis O direction in the hand shake correction operation, thereby preventing the first carrier 304 from moving. Deformation of the elastic portion 353a can be suppressed. For example, the guidance structure of the hand shake correction operation can be simplified by using the elastic member 305 instead of the ball 339(s), and the hand shake correction operation can be simplified by using the second elastic portion 353b. Interference with the focus control function that may occur due to secondary resonance can be suppressed.

According to one embodiment, similarly to connecting the second carrier 304 with the first carrier 303 using the first elastic portion 353a, the elastic member 305(s) is connected to the third elastic portion 353a. The first carrier 303 can be connected to the casing 301 (eg, the first casing 301a) using 353c. For example, the third elastic part 353c extends from the first fixing part 351a, and the fourth fixing part 351d provided at the end of the third elastic part 353c is on the first casing 301a. It can be supported. According to one embodiment, the third elastic portion 353c mechanically connects the first carrier 303 (e.g., the second guide member 303b) to the first casing 301a, and the first carrier 303 may be allowed or guided to move horizontally in a plane substantially perpendicular to the optical axis O. For example, when referring to the state shown in FIG. 8, the first carrier 303 may move (or vibrate) in the up and down and/or left and right directions with respect to the casing 301 or the image sensor 302. .

In the embodiment shown in FIG. 8, two elastic members 305 may be provided in one camera module 300, and one elastic member 305 includes two first elastic portions 353a and/or It may include two second fixing parts 351b. In this case, the elastic member 305 may further include a fourth elastic part 353d, and the fourth elastic part 353d may extend from one of the second fixing parts 351b and be connected to the other one. . When the fourth elastic part 353d is omitted in the embodiment of FIG. 8, it can be understood that four elastic members 305 are disposed in one camera module 300. In the embodiment of FIG. 8, an additional fourth elastic part connecting the left/upper second fixing part 351b and the left/lower second fixing part 351b (or the right/upper second fixing part 351b and the right When an additional fourth elastic part connecting the lower second fixing part 351b) is provided, it may be understood that one elastic member 305 is disposed in one camera module 300. For example, note that the number and shape of the elastic members 305 described above or shown in the drawings are merely exemplary, and the embodiments of the present disclosure are not limited thereto.

FIG. 11 is a perspective view showing the first carrier 303 and/or the elastic member 305(s) cut along line B-B' of FIG. 10 according to an embodiment of the present disclosure. FIG. 12 is a cutaway view of the first carrier 303 and/or the elastic member 305(s) along line B-B' of FIG. 10, according to an embodiment of the present disclosure.

11 and 12, the camera module (e.g., the camera module 300 of FIG. 6 or 7) and/or the first carrier 303 (e.g., the second guide member 303b) has a support protrusion ( 331a) may be further included. For example, the support protrusion 331a protrudes from one surface (e.g., upper surface) of the first carrier 303 (e.g., the second guide member 303b), and the third fixing part 351c is disposed or supported. It can function as a structure. In one embodiment, when the third fixing part 351c is positioned corresponding to the support protrusion 331a, the second elastic part 353b may be at least partially positioned on one surface of the first carrier 303. . In one embodiment, in order to be more stably disposed on the first carrier 303, the third fixing part 351c may have a width that is at least partially greater than that of the second elastic part 353b. For example, by further expanding the contact area with the first carrier 303, the third fixing part 351c can be stably supported on the first carrier 303. When the second carrier 304 moves in the optical axis O direction with respect to the first carrier 303, the second elastic portion 353b may be deformed in the Z-axis direction with respect to the support protrusion 331a. To prevent mechanical interference or contact when the second elastic portion 353b is deformed, the first carrier 303 may further include an avoidance groove 333 recessed on one side. For example, the avoidance groove 333 may be provided as a space that allows deformation of the second elastic portion 353b.

According to one embodiment, in a state in which no external force is applied (e.g., in a state in which an electric signal is not applied to the second coil 361b in FIG. 6), the second elastic portion 353b is already preloaded in a curved or curved shape. It may be in a (pre-loaded) state. When viewed in the cross-sectional view of FIG. 12, the second elastic part 353b and/or the third fixing part 351c may be disposed in a preloaded state in the +Z direction with respect to the support protrusion 331a. In one embodiment, the second elastic portion 353b may be disposed in a non-preloaded state. For example, whether the second elastic part 353b is preloaded depends on the specifications of the camera module 300 to be actually manufactured, the behavior of the second carrier 304 generated in the hand shake correction operation, and/or the vibration peak of the nth resonance. ) can be determined by considering.

In the following, when examining the embodiment(s) of the present disclosure, the same reference numbers in the drawings may be assigned or omitted for configurations that can be easily understood through previous embodiments, and detailed descriptions thereof may also be omitted. The configuration of the above-described embodiment may be applied mutatis mutandis to the configuration omitted in the embodiment described later. The position of the incision line or incision surface in the embodiment described later may be the embodiment of FIG. 10.

FIG. 13 shows that the elastic member 305(s) of the camera module (e.g., the camera module 300 of FIG. 6 or FIG. 7) according to an embodiment of the present disclosure is connected to the first carrier 303 (e.g., the second guide). This is a perspective view showing the arrangement on the member 303b. FIG. 14 is a cut-away perspective view of the first carrier 303 (eg, second guide member 303b) and/or elastic member 305 (s) of FIG. 13 according to an embodiment of the present disclosure.

Referring to FIGS. 13 and 14, the camera module 300 and/or the first carrier 303 includes a first damping member 331b that replaces the support protrusion (e.g., the support protrusion 331a of FIG. 11 or FIG. 12). ) may further be included. The first damping member 331b may include a sheet of elastic material or double-sided tape. In one embodiment, when the first damping member 331b made of an elastic material is disposed, the vibration peak of the nth order resonance can be further suppressed. For example, when the second carrier 304 is tilted due to an image stabilization operation, when the first damping member 331b is disposed, the vibration peak in the secondary resonance is suppressed by approximately 3 to 5 dB, and in the tertiary resonance, the vibration peak is suppressed by approximately 3 to 5 dB. It was confirmed that it was suppressed by approximately 1 to 2 dB. For example, by disposing the second elastic part 353b, the tilt phenomenon of the second carrier 304 and/or the lens part 321 can be suppressed during the hand shake correction operation, and by disposing the first damping member 331b, the tilt phenomenon can be suppressed. It is possible to suppress the nth order resonance and/or vibration peak that may occur due to the phenomenon.

FIG. 15 shows that the second carrier 304 is connected to the first carrier ( 303) (e.g., the second guide member 303b). FIG. 16 is a cut-away perspective view of the first carrier 303 and/or the elastic member 305(s) of FIG. 15 according to an embodiment of the present disclosure.

15 and 16, the camera module 300 and/or the elastic member 305 includes a plurality (e.g., a pair) of second elastic parts 353b extending from one first elastic part 353a. ) may include. For example, a pair of second elastic parts 353b each extend from different positions on one first elastic part 353a, and form one support protrusion (e.g. : Can be supported or disposed on the support protrusion 331a of FIG. 11) and/or one first damping member 331b. In one embodiment (not shown), the third fixing part 351c may be provided as one, and the ends of the pair of second elastic parts 353b may be provided with a support protrusion ( For example, it may be supported or disposed on the support protrusion 331a of FIG. 11) and/or one first damping member 331b. In this way, the application of the support protrusion 331a or the first damping member 331b, or the number of second elastic parts 353b (or third fixing parts 351c) depends on the specifications of the camera module 300 to be actually manufactured. It can be appropriately selected depending on.

FIG. 17 shows that the second carrier 304 is connected to the first carrier ( 303) (e.g., the second guide member 303b). FIG. 18 shows the first carrier 303 and/or the elastic member 305 before the damping members 331b and 431a(s) are disposed on the first carrier 303 of FIG. 17, according to an embodiment of the present disclosure. It is a perspective view showing )(s) cut out. FIG. 19 is a cut-away perspective view of the first carrier 303 and/or the elastic member 305(s) of FIG. 17 according to an embodiment of the present disclosure. 20 shows the first carrier 303 and/or the elastic member 305 before the damping member 431a(s) is disposed on the first carrier 303 of the camera module 300 according to an embodiment of the present disclosure. It is a perspective view showing )(s) cut out. FIG. 21 is a cut-away perspective view of the first carrier 303 and/or the elastic member 305(s) of the camera module 300 according to an embodiment of the present disclosure.

Referring to FIGS. 17 to 21 , the camera module 300 may further include a second damping member 431a. The second damping member 431a may, for example, support a portion of the third elastic portion 353c to the first carrier 303 (eg, the second guide member 303b). For example, when the third elastic unit 353c is deformed, which may occur during an image stabilization operation and/or a focus control operation, or when nth resonance occurs due to elastic force accumulated in the third elastic unit 353c, The second damping member 431a may suppress the n-th resonance or the vibration peak at the n-th order resonance. Since the function or operation of the second damping member 431a may be similar to the function of the first damping member 331b, detailed description thereof will be omitted.

According to one embodiment, the second damping member 431a may be provided in a gel form. The gel-shaped second damping member 431a may have an appropriate viscosity in consideration of durability and suppressing force against n-th order resonance. In one embodiment, in disposing the first damping member 331b and/or the second damping member 431a, the camera module 300 and/or the first carrier 303 (e.g., the second guide member 303b )) may further include receiving grooves 433(s). The receiving groove(s) 433(s) may be provided, for example, at a position or area where the first damping member 331b and/or the second damping member 431a are disposed. In one embodiment, when the first carrier 303 is provided with an avoidance groove 333, the first damping member 331b or the second damping member 431a may be disposed in a partial area of the avoidance groove 333. .

Camera module (e.g., camera module 1080, 300 of FIGS. 1, 6, or 7) and/or electronic device including the same (e.g., electronic device of FIGS. 1 to 5) according to the embodiment(s) of the present disclosure The devices 1001, 1002, 1004, 100, and 200) use an elastic member implemented in a planar form (e.g., the elastic member 305 of FIGS. 6 to 11) in a hand shake correction operation and/or a focus adjustment operation. By providing a guidance structure, improved image quality can be provided while having a concise structure. For example, a camera module and/or an electronic device including the same according to the embodiment(s) of the present disclosure can provide images of improved quality while reducing production costs or user purchase costs. In one embodiment, the elastic member may include a second elastic part (e.g., the second elastic part 353b in FIGS. 8 to 12) and/or a damping member (e.g., the support protrusion 331a in FIG. 9, the second elastic part 353b in FIG. 13). 1 By including the damping member 331b and/or the second damping member 431a of FIG. 19, the nth order resonance or vibration peak that may occur in the image stabilization operation and/or the focus adjustment operation is suppressed. can do. For example, control of image stabilization operations and/or focusing operations may be facilitated, and image quality captured by the camera module and/or electronic device may be further improved.

The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be understood by those skilled in the art from the description of the above-described embodiment(s). You will be able to understand it clearly.

According to an embodiment of the present disclosure, a camera module (e.g., the camera module 1080, 300 of FIGS. 1, 6, or 7) and/or an electronic device including the same (e.g., the electronic device of FIGS. 1 to 5) (1001, 1002, 1004, 100, 200)) is an image sensor (e.g., the image sensor in FIG. 6) set to generate an electrical signal by receiving light incident on the optical axis (e.g., the optical axis (O) in FIG. 6). (302)), a first carrier configured to move at least partially horizontally with respect to the image sensor on a plane substantially perpendicular to the optical axis (e.g., first carrier 303 in FIG. 6), disposed on the first carrier A second carrier (e.g., the second carrier 304 in FIG. 6) configured to move horizontally with respect to the image sensor together with at least a portion of the first carrier and to move along the optical axis direction with respect to the first carrier, A lens unit (e.g., FIG. Lens unit 321 of 6), and at least one elastic member (e.g., It may include the elastic member 305 of FIGS. 6 to 12). In one embodiment, the elastic member includes a first fixing part (e.g., first fixing part 351a in FIG. 8) supported on the first carrier, and a first elastic part (e.g., extending from the first fixing part). : the first elastic part 353a in FIG. 8), the second fixing part provided at the end of the first elastic part and supported on the second carrier (e.g., the second fixing part 351b in FIG. 8), the second fixing part 351b in FIG. 1 At least one second elastic part (e.g., second elastic part 353b in FIG. 8) extending from the first elastic part between the fixing part and the second fixing part, and provided at an end of the second elastic part and may include a third fixing part (eg, the third fixing part 351c in FIG. 8) supported on the first carrier.

According to one embodiment, the first elastic part may be configured to allow or guide the second carrier to move along the optical axis direction with respect to the first carrier.

According to one embodiment, when viewed along the optical axis direction, at least one pair of the first elastic parts may be arranged symmetrically about the lens unit.

According to one embodiment, when viewed along the optical axis direction, the plurality of first elastic parts may be arranged at equiangular intervals along the circumferential direction of the lens unit.

According to one embodiment, the plurality of first elastic parts may extend from the first fixing part in a direction toward another adjacent first fixing part.

According to one embodiment, the pair of second elastic parts may each extend from the first elastic part.

According to one embodiment, the third fixing part may have a width that is at least partially greater than that of the second elastic part.

According to one embodiment, the camera module and/or the electronic device including the same includes a first damping member (e.g., Figure 13 or Figure 13) disposed between the first carrier and the third fixing part. It may further include 14 first damping members 331b.

According to one embodiment, the pair of second elastic parts may each extend from the first elastic part, and the pair of third fixing parts may be disposed on one of the first damping members.

According to one embodiment, the camera module and/or the electronic device including the same may further include a receiving groove (e.g., the receiving groove 433 in FIG. 18 or 20) provided in the first carrier. . In one embodiment, the first damping member may be at least partially received in the receiving groove.

According to one embodiment, the camera module and/or the electronic device including the same further includes a support protrusion (e.g., the support protrusion 331a in FIG. 11 or 12) protruding from the surface of the first carrier. can do. In one embodiment, the third fixing part may be supported on the support protrusion.

According to one embodiment, a pair of the second elastic parts each extend from the first elastic part, and a pair of the third fixing parts may be disposed on one of the support protrusions.

According to one embodiment, the camera module and/or the electronic device including the same includes a casing (e.g., a casing) that at least partially accommodates the first carrier in a horizontally movable state in a plane perpendicular to the optical axis. It may further include the casing 301 of FIG. 6).

According to one embodiment, the elastic member includes a third elastic part (e.g., third elastic part 353c in FIG. 8) extending from the first fixing part, and an end of the third elastic part, and is provided on the casing. It may further include a fourth fixing part (e.g., the fourth fixing part 351d in FIG. 8) supported on. In one embodiment, the third elastic portion may be configured to allow or guide the first carrier to move in a plane perpendicular to the optical axis with respect to the casing.

According to one embodiment, the camera module and/or the electronic device including the same includes a second damping member (e.g., Figure 17, Figure 19 or Figure 19) disposed between a portion of the third elastic part and the first carrier. It may further include 21 second damping members 431a). In one embodiment, a portion of the third elastic portion may be supported on the first carrier through the second damping member.

According to one embodiment, the first carrier may be configured to move horizontally along a first direction perpendicular to the optical axis and a second direction perpendicular to the optical axis and the first direction.

According to an embodiment of the present disclosure, an electronic device (e.g., the electronic devices 1001, 1002, 1004, 100, and 200 of FIGS. 1 to 5) uses a camera module as described above, and the camera module. It may include a processor (eg, processor 1020 in FIG. 1) configured to acquire an image of the subject.

According to one embodiment, the processor may be set to perform an image stabilization operation by horizontally moving the first carrier in a plane perpendicular to the optical axis.

According to one embodiment, the processor may be set to perform a focus adjustment operation by moving the second carrier along the optical axis direction with respect to the first carrier.

According to one embodiment, the electronic device as described above may further include a sensor module (eg, the sensor module 1076 in FIG. 1) configured to detect vibration of the electronic device due to an external force. In one embodiment, the processor may be set to horizontally move the first carrier in a plane perpendicular to the optical axis based on vibration detected by the sensor module.

Although the present disclosure has been described by way of example with respect to one embodiment, it should be understood that the one embodiment is for illustrative purposes rather than limiting the present disclosure. It will be apparent to those skilled in the art that various changes may be made in the format and detailed structure of the present disclosure, including the appended claims and their equivalents, without departing from the overall scope of the present disclosure. For example, in the above-described embodiments, a 'meandering shape' is mentioned with respect to the shape of the elastic member(s) and/or elastic portion(s), but the embodiment(s) of the present disclosure may not be limited thereto. . Considering manufacturing conditions such as the movement range of the first carrier or the second carrier and the weight of the first carrier or the second carrier in the actual manufactured state, the shape and/or shape of the elastic member(s) and/or elastic portion(s) Alternatively, the modulus of elasticity (e.g. material) may be changed appropriately.

1001, 1002, 1004, 100, 200: Electronic devices
210: side structure 211: first support member
207: camera assembly 101, 230: display
300: Camera module 301: Casing
302: Image sensor 321: Lens unit
303: first carrier 304: second carrier
305: elastic member 353a: first elastic portion
353b: second elastic portion 331a: support projection
331b: first damping member

Claims (20)

In the camera module (1080; 300),
An image sensor 302 configured to receive light incident from the optical axis (O) direction and generate an electrical signal;
a first carrier (303) configured to move at least partially horizontally relative to the image sensor on a plane perpendicular to the optical axis;
a second carrier (304) disposed on the first carrier and configured to move horizontally with respect to the image sensor together with at least a portion of the first carrier, and to move along the optical axis direction with respect to the first carrier;
a lens unit 321 disposed on the second carrier and moving along the optical axis direction with respect to the first carrier together with the second carrier, and configured to guide or focus light incident from the optical axis direction to the image sensor; and
At least one elastic member (305) connects the second carrier to the first carrier and is configured to support or guide movement of the second carrier relative to the first carrier,
The elastic member is,
a first fixing part 351a supported on the first carrier;
a first elastic part (353a) extending from the first fixing part;
a second fixing part (351b) provided at an end of the first elastic part and supported on the second carrier;
at least one second elastic part (353b) extending from the first elastic part between the first fixing part and the second fixing part; and
A camera module including a third fixing part (351c) provided at an end of the second elastic part and supported on the first carrier.
The camera module of claim 1, wherein the first elastic part is configured to allow or guide the second carrier to move along the optical axis direction with respect to the first carrier.
The camera module according to any one of claims 1 to 2, wherein when viewed along the optical axis direction, at least one pair of the first elastic parts are arranged symmetrically about the lens part.
The camera module according to any one of claims 1 to 3, wherein when viewed along the optical axis direction, the plurality of first elastic parts are arranged at equiangular intervals along the circumferential direction of the lens unit.
The camera module of claim 4, wherein the plurality of first elastic parts extend from the first fixing part in a direction toward another adjacent first fixing part.
The camera module according to any one of claims 1 to 5, wherein a pair of second elastic parts each extend from the first elastic part.
The camera module according to any one of claims 1 to 6, wherein the third fixing part has a width at least partially greater than that of the second elastic part.
The method according to any one of claims 1 to 7,
A camera module further comprising a first damping member (331b) disposed between the first carrier and the third fixing part.
The camera module of claim 8, wherein the pair of second elastic parts each extend from the first elastic part, and the pair of third fixing parts are disposed on one of the first damping members.
According to any one of claims 8 to 9,
Further comprising a receiving groove 433 provided in the first carrier,
The first damping member is at least partially received in the receiving groove.
The method according to any one of claims 1 to 10,
It further includes a support protrusion (331a) protruding from the surface of the first carrier,
A camera module wherein the third fixing part is supported on the support protrusion.
The camera module of claim 11, wherein a pair of second elastic parts each extend from the first elastic part, and a pair of third fixing parts are disposed on one of the support protrusions.
The method according to any one of claims 1 to 12,
A camera module further comprising a casing (301) that at least partially accommodates the first carrier in a horizontally movable state in a plane perpendicular to the optical axis.
The method of claim 13, wherein the elastic member is:
a third elastic part 353c extending from the first fixing part; and
It further includes a fourth fixing part (351d) provided at an end of the third elastic part and supported on the casing,
The third elastic portion is configured to allow or guide the first carrier to move in a plane perpendicular to the optical axis with respect to the casing.
According to claim 14,
It further includes a second damping member (431a) disposed between a portion of the third elastic portion and the first carrier,
A camera module in which a portion of the third elastic portion is supported on the first carrier through the second damping member.
The camera according to any one of claims 1 to 15, wherein the first carrier is configured to move horizontally along a first direction perpendicular to the optical axis and a second direction perpendicular to the optical axis and the first direction. module.
In the electronic device (1001; 1002; 1004; 100; 200),
A camera module 300 according to any one of claims 1 to 16; and
An electronic device including a processor (1020) configured to acquire an image of a subject using the camera module.
The electronic device of claim 17, wherein the processor is configured to perform an image stabilization operation by horizontally moving the first carrier in a plane perpendicular to the optical axis.
The electronic device according to any one of claims 17 to 18, wherein the processor is configured to perform a focusing operation by moving the second carrier along the optical axis direction with respect to the first carrier.
The method according to any one of claims 17 to 19,
It further includes a sensor module 1076 configured to detect vibration of the electronic device due to external force,
The processor is configured to horizontally move the first carrier in a plane perpendicular to the optical axis based on vibration detected by the sensor module.

Images