KR20230131107A - Apparatus and method for manufacturing fine pattern of high-aspect-ratio - Google Patents

Abstract

A high aspect ratio fine pattern manufacturing device according to an embodiment of the present invention includes a transparent substrate, a photocurable resin applied to one surface of the transparent substrate, a light source that generates light for curing the photocurable resin, and the light source and It is disposed between the transparent substrates and radiates light from the light source toward the other side of the transparent substrate in a preset irradiation pattern to form a fine pattern corresponding to the irradiation pattern. Provided is a digital optical unit that cures a high aspect ratio structure in resin.

Description

High aspect ratio fine pattern manufacturing device and manufacturing method using the same {APPARATUS AND METHOD FOR MANUFACTURING FINE PATTERN OF HIGH-ASPECT-RATIO}

The present invention relates to a high aspect ratio fine pattern manufacturing device and a manufacturing method using the same, and more specifically, to controlling the light irradiation pattern in the SPPW (self-propagating photopolymer waveguide) process for manufacturing high aspect ratio structures with fine patterns. It relates to a high-aspect-ratio micropattern manufacturing device that can manufacture micropatterns of high-aspect-ratio structures into various types of patterns by fusing digital optical technology for high-aspect ratio structures, and a manufacturing method using the same.

In general, micropatterns with a high-aspect-ratio can implement excellent physical/chemical properties due to structural effects such as high specific surface area and optoelectronic behavior control.

The characteristics of high-aspect-ratio micropatterns as described above correspond to a core technology that can overcome the performance limitations of key devices in various fields such as future mobility, energy/environment, and nanobio.

For example, high-aspect-ratio fine patterns are being applied to improve the sensitivity of biosensors and gas sensors, or to improve the energy efficiency of solar panels, etc., due to their large specific surface areas.

Alternatively, in recent years, the need for products with special functions such as water repellency, oil repellency, anti-fouling, and anti-icing has been increasing day by day. By creating a fine pattern of a high aspect ratio structure on the surface of the film, structural properties such as water repellency and oil repellency are increasing. Functional films are also being produced. Functional films such as water-repellent or oil-repellent as described above provide an omniphobic surface with superhydrophobic and superoil-repellent properties that repel all types of liquids.

However, the fine patterns of existing high-aspect-ratio structures are manufactured at the micro-scale through various processes such as photolithography, etching, and 3D printing. The situation is very difficult.

US Patent No. 9116428 (registered on August 25, 2015)

Embodiments of the present invention can manufacture fine patterns of high aspect ratio structures in various types of patterns by combining the SPPW process for manufacturing fine patterns of high aspect ratio structures and digital optical technology for freely controlling the light irradiation pattern. Provides a high aspect ratio fine pattern manufacturing device and a manufacturing method using the same.

In addition, in an embodiment of the present invention, the irradiation pattern of light irradiated to the photocurable resin can be freely changed by applying a digital optical processor (DLP) to the SPPW process, and using this, the fine pattern of the high aspect ratio structure can be formed at the nano level. Provided is a high aspect ratio fine pattern manufacturing device that can be smoothly manufactured in various shapes and a manufacturing method using the same.

According to one embodiment of the present invention, a transparent substrate, a photocurable resin applied to one surface of the transparent substrate, a light source that generates light for curing the photocurable resin, and disposed between the light source and the transparent substrate, By irradiating light from the light source toward the other side of the transparent substrate in a preset irradiation pattern, a high aspect ratio structure is cured in the photocurable resin according to a self-propagating polymer waveguide (SPPW) process with a fine pattern corresponding to the irradiation pattern. Provided is a high aspect ratio fine pattern manufacturing device including a digital optical unit.

Preferably, the digital optical unit operates in one of a plurality of processing modes corresponding to the light irradiation patterns to process the light irradiation pattern irradiated on the other surface of the transparent substrate into a desired pattern. It may be provided as a processor (DLP: digital light process).

Preferably, the high aspect ratio fine pattern manufacturing device according to an embodiment of the present invention may further include a control unit that controls the operation of the digital optical processor by selecting one of the processing modes of the digital optical processor. You can.

The control unit may select any one of the processing modes of the digital optical processor, and the digital optical processor operates according to the processing mode selected by the control unit to determine an irradiation pattern of the light irradiated to the transparent substrate. You can.

Preferably, the digital optical processor is operated according to a processing mode selected by the control unit and includes a digital mirror device (DMD) provided as a fine reflector assembly to irradiate light from the light source in an irradiation pattern corresponding to the processing mode. ), a first lens unit disposed between the digital reflective indicator and the light source and receiving light from the light source and transmitting it to the digital reflective indicator, and a first lens unit disposed between the digital reflective indicator and the transparent substrate and the digital reflective indicator It may include a second lens unit that transmits the reflected light to the other surface of the transparent substrate.

Preferably, the digital reflection indicator operates according to a processing mode selected by the control unit to reflect light from the light source transmitted from the first lens unit to the other surface of the transparent substrate according to an irradiation pattern corresponding to the processing mode. It can be handled.

Here, the control unit can continuously change the processing mode of the digital reflective indicator at regular intervals. The digital reflective indicator can continuously change the irradiation pattern of the light irradiated to the other surface of the transparent substrate at regular intervals.

Alternatively, the transparent substrate may be formed to have a larger area than the irradiation pattern of the light emitted from the digital optical unit. The digital optical unit may be moved along the other side of the transparent substrate to form the high aspect ratio structure on the entire one side of the transparent substrate.

Preferably, the first lens unit and the second lens unit may each be formed in a structure that combines a plurality of lenses.

The second lens unit may further refine the fine pattern of the high aspect ratio structure by focusing light transmitted from the digital reflective indicator onto the transparent substrate.

Preferably, the light source may be equipped with a collimation lens so that the light irradiated to the digital optical unit travels straight.

According to another aspect of the present invention, irradiating light from a light source to a digital optical unit, irradiating light from the light source to a transparent substrate according to a preset irradiation pattern by the digital optical unit, and irradiating light from the light source to the transparent substrate. Transferring the photocurable resin applied to one side of the transparent substrate, and curing the high aspect ratio structure on the photocurable resin according to the SPPW process with a fine pattern corresponding to the irradiation pattern of light irradiated on the photocurable resin. It provides a method for manufacturing a fine pattern with a high aspect ratio including.

Here, in the step where the digital optical unit radiates light to the transparent substrate according to the irradiation pattern, the irradiation pattern of light can be changed at regular intervals by controlling the processing mode of the digital optical processor.

In the step of curing the high aspect ratio structure in the photocurable resin, different types of high aspect ratio structures can be formed in the photocurable resin according to micropatterns corresponding to changes in the light irradiation pattern.

Meanwhile, in the method of manufacturing a high aspect ratio fine pattern according to another aspect of the present invention, when the step of curing the high aspect ratio structure in the photocurable resin is completed, the operation of the light source and the digital optical unit is stopped and the transparent substrate is The step of moving to another area and irradiating light from the light source to the digital optical unit may be further included.

A high aspect ratio fine pattern manufacturing device and a manufacturing method using the same according to an embodiment of the present invention combine the SPPW process for manufacturing a high aspect ratio fine pattern and digital optical technology for freely controlling the light irradiation pattern. Structures can be smoothly manufactured into nano-sized micropatterns, and micropatterns of high aspect ratio structures can be easily manufactured in various forms through digital optical technology.

In addition, the high aspect ratio fine pattern manufacturing device and manufacturing method using the same according to an embodiment of the present invention can freely change the irradiation pattern of light irradiated to the photocurable resin by applying a digital optical processor (DLP) to the SPPW process. , it is possible to easily produce high-aspect-ratio fine patterns in various types of patterns according to high-aspect-ratio structures by adjusting the light irradiation pattern with a simple control method that adjusts the operation of the digital optical processor accordingly.

In addition, the high aspect ratio fine pattern manufacturing device and manufacturing method using the same according to an embodiment of the present invention can irradiate light from a light source into a nano-sized fine pattern on the photocurable resin using a digital optical processor (DLP). , one of the processing modes of the digital optical processor can be freely selected to set various irradiation patterns for irradiating the light from the light source onto the photocurable resin.

In addition, the high aspect ratio fine pattern manufacturing device and manufacturing method using the same according to an embodiment of the present invention are structured to move the digital optical processor and the light source along the transparent substrate while the operation is stopped, so the light collecting position of the transparent substrate is adjusted. While changing, a high aspect ratio structure can be smoothly formed on the photocurable resin applied to the entire surface of the transparent substrate.

1 is a conceptual diagram showing an apparatus for manufacturing a high aspect ratio fine pattern according to an embodiment of the present invention.
FIG. 2 is a diagram schematically showing a process for manufacturing a high aspect ratio structure at region 'A' shown in FIG. 1.
Figures 3 and 4 are diagrams showing a method for manufacturing a high aspect ratio fine pattern according to an embodiment of the present invention, respectively.
Figures 5, 6, and 7 are enlarged views of the fine patterns of the high aspect ratio structure manufactured according to the high aspect ratio fine pattern manufacturing method shown in Figure 3, respectively, at various magnifications.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the attached drawings. However, the present invention is not limited or limited by the examples. The same reference numerals in each drawing indicate the same members.

Figure 1 is a conceptual diagram showing a high aspect ratio fine pattern manufacturing apparatus 100 according to an embodiment of the present invention, and Figure 2 is a process in which the high aspect ratio structure 160 is manufactured at the 'A' region shown in Figure 1. This is a diagram schematically showing.

Referring to Figures 1 and 2, the high aspect ratio fine pattern manufacturing apparatus 100 according to an embodiment of the present invention includes a transparent substrate 110, a photocurable resin 120, a light source 130, and a digital optical unit ( 140) and a control unit 150.

The high aspect ratio fine pattern manufacturing apparatus 100 according to this embodiment is an apparatus for manufacturing a fine pattern consisting of a plurality of high aspect ratio structures 160 using a free design type 3D printing method. To this end, the fine pattern manufacturing apparatus 100 of this embodiment can be formed in a structure that combines digital optical technology for freely controlling the light irradiation pattern with the SPPW process for manufacturing the fine pattern of the high aspect ratio structure 160. there is.

That is, the fine pattern manufacturing apparatus 100 of this embodiment can finely converge the light L1 of the light source 130 at the micro or nano level using the digital optical unit 140, and condense the light into a fine structure. By irradiating light (L3) to the photocurable resin 120, the photocurable resin 120 can be cured to a nano pattern or less. Therefore, in this embodiment, the digital optical unit 140 can process the light L1 of the light source 130 and smoothly set it to various freely designed irradiation patterns, and the irradiation pattern of the light L1 is By finely curing the photocurable resin 120, a fine pattern of the high aspect ratio structure 160 can be easily formed at the nano-sized level.

Meanwhile, Figure 1 schematically shows a conceptual diagram of the high aspect ratio fine pattern manufacturing apparatus 100 according to this embodiment, and the configuration of the present invention will be described in detail using this as follows.

Referring to FIG. 1, the transparent substrate 110 of this embodiment is a thin substrate made of a transparent material on which the fine pattern of the high aspect ratio structure 160 is formed, and is made of a material with excellent light transmittance and low refractive index and reflectance of light. can be formed. For example, in this embodiment, the transparent substrate 110 may be provided as a thin glass substrate made of a glass material.

Referring to FIG. 1, the photocurable resin 120 of this embodiment is a resin that is cured by the light (L1, L2, L3) of the light source 130, and reacts with the light of the light source 130 to form a high aspect ratio structure ( 160). For example, in this embodiment, it is an ultraviolet curing resin that is cured by ultraviolet rays, but may be formed of a transparent material that allows light to pass through.

Here, the photocurable resin 120 may be applied in a liquid state to one surface of the transparent substrate 110 with a sufficient thickness. The photocurable resin 120 in a liquid state as described above is cured by the light L1, L2, and L3 of the light source 130 to form a high aspect ratio structure 150 in a solid state in a fine pattern. At this time, the high aspect ratio structure 160 may be provided on one side of the transparent substrate 110 like the photocurable resin 120.

In addition, the photocurable resin 120 may be formed of a material that has a relatively higher refractive index of light (L3) in a solid state than the refractive index of light (L3) in a liquid state. As shown in FIG. 2, as the light L1 of the light source 130 is irradiated to the liquid photocurable resin 120, the irradiated area of the photocurable resin 120 is cured and a solid high aspect ratio structure ( 160) can be formed. At this time, the path of light L3 irradiated to the photocurable resin 120 tends to be concentrated on the high aspect ratio structure 160 as the curing of the high aspect ratio structure 160 progresses, and the high aspect ratio structure (160) is processed through the SPPW process. 160) can be formed. The above SPPW process technology will be described in detail again below.

FIG. 2 shows a continuous process of forming a fine pattern of the high aspect ratio structure 160 through the SPPW process of the fine pattern manufacturing apparatus 100 according to this embodiment. For reference, in this embodiment, for convenience of explanation, the manufacturing process of the high aspect ratio structure 160 will be described in detail at 'A' in FIG. 1.

As shown in FIG. 2, the process technology for manufacturing the high aspect ratio structure 160 according to the SPPW process is to produce a cured solid portion when curing occurs in the photocurable resin 120 applied to one surface of the transparent substrate 110. (e.g., a slight difference in refractive index between the high aspect ratio structure 160) and the non-hardened liquid portion may occur, and the resulting light L3 does not spread due to a lensing effect and self-focuses ( A self-focusing effect, that is, a nonlinear effect, may occur. (See Figure 2 (a) and (b))

Through the nonlinear effect of light L3, the photocurable resin 120 can be cured like a waveguide along the direction of light L3, and as a result, the high aspect ratio structure 160 grows long. This can happen. (See (c) in Figure 2)

At this time, the change in refractive index between the photocurable resin 120 in a liquid state and the high aspect ratio structure 160 in a solid state and the maximum transparency possible at the wavelength of light (L3) are controlled to control the high aspect ratio and the size of the nano-level or less. A fine pattern of the aspect ratio structure 160 can be formed.

In conclusion, the SPPW process technology of this embodiment creates a nonlinear optical phenomenon in which the photopolymerization reaction is aligned in the direction of light L3 using the optical waveguide effect caused by a slight change in refractive index that occurs through the photopolymerization reaction. By utilizing this, a fine pattern of the high aspect ratio structure 160 can be manufactured on the photocurable resin 120 applied to one surface of the transparent substrate 110.

Referring to FIG. 1, the light source 130 of this embodiment may provide light (L1, L2, L3) to the other surface of the transparent substrate 110 to cure the photocurable resin 120. For example, as the light source 130 of this embodiment, a digital display capable of consistently irradiating straight light (L1, L2, L3) to the entire other surface of the transparent substrate 110 may be used. For this purpose, the light source 130 includes a collimation lens (not shown) that converts the light (L1, L2, L3) irradiated to the digital optical unit 140 into parallel light and increases the straightness of the light (L1, L2, L3). Can be installed.

Referring to FIGS. 1 and 2, the digital optical unit 140 of this embodiment processes the light L1 from the light source 130 into various types of irradiation patterns and then produces light L3 of the processed irradiation patterns. The other side of the transparent substrate 110 can be provided with a nano-level or smaller fine pattern. The digital optical unit 140 as described above may be disposed between the light source 130 and the transparent substrate 110. That is, the digital optical unit 140 of the present embodiment irradiates the light L1 of the light source 130 toward the other surface of the transparent substrate 110 in a preset irradiation pattern, thereby producing a fine irradiation pattern corresponding to the irradiation pattern of the light L3. The high aspect ratio structure 160 can be cured in the photocurable resin 120 according to the SPPW process as a pattern.

As shown in FIG. 1, the digital optical unit 140 is a digital optical processor (DLP) operating in one of a plurality of processing modes corresponding to the irradiation patterns of light (L1, L2, and L3). light process) (142). The digital optical processor 142 as described above may be operated to process the irradiation pattern of light L3 irradiated on the other surface of the transparent substrate 110 into a desired pattern. For reference, the digital optical processor 142 may irradiate light L3 to the other surface of the transparent substrate 110 using an irradiation pattern that combines a square, pentagon, circle, oval, polygon, straight line, curved shape, etc.

For example, the digital optical processor 142 of this embodiment may include a digital mirror device (DMD) 144, a first lens unit 146, and a second lens unit 148.

The digital reflection indicator 144 may be operated according to a processing mode selected by the control unit 150, and may irradiate the light (L1, L2, L3) of the light source 130 with an irradiation pattern corresponding to the processing mode. It may be provided as a reflector assembly. Here, the digital reflection indicator 144 may reflect the light L2 of the light source 130 transmitted from the first lens unit 146 to the other surface of the transparent substrate 110.

For reference, the digital optical processor 142 irradiates light L1 in a freely designed pattern through the digital reflection indicator 144 to the transparent substrate 110 to cure the photocurable resin 120 on a surface-by-surface basis. Can be stacked. Therefore, conventionally, a photomask that selectively irradiates light (L1) is a structure applied to the SPPW process, but in this embodiment, a photomask is not required by the digital optical processor 142, so the fine pattern of the high aspect ratio structure 160 is formed. It has the advantage of being able to freely create the shape you want to print using only 3D modeling.

The first lens unit 146 may receive light L1 from the light source 130 and transmit it to the digital reflective indicator 144. The first lens unit 146 as described above may be disposed between the digital reflection indicator 144 and the light source 130.

The second lens unit 148 may transmit the light L2 reflected by the digital reflective indicator 144 to the other surface of the transparent substrate 110. The second lens unit 148 as described above may be disposed between the digital reflective indicator 144 and the transparent substrate 110. The second lens unit 148 can focus the light L2 transmitted from the digital reflection indicator 144 onto the transparent substrate 110 to further refine the fine pattern of the high aspect ratio structure 160.

Meanwhile, the first lens unit 146 and the second lens unit 148 may each be formed in a structure that combines a plurality of lenses. However, the lens arrangement structures of the first lens unit 146 and the second lens unit 148 may be designed in various combinations depending on the design conditions and circumstances of the digital optical processor 142.

For reference, the digital optical processor 142 can greatly improve the brightness of the light L3 irradiated to the photocurable resin 120 by condensing the light L1 of the light source 130 with high precision, as well as the luminous flux. Because it is possible to control all physical properties of light, such as hyperpolarization and wavelength, new added value can be created by reducing the size or integrating functions depending on the purpose. For example, the higher the required brightness of the light L1 emitted from the light source 130, the larger the size of the light source 130 or the use of a high-performance light source 130, but the digital optical processor 142 When applied, it is possible to align them side by side, so that the size of the fine pattern manufacturing device 100 can be kept the same, and at the same time, the light L3 can be focused on a plurality of desired positions.

Referring to FIG. 1, the control unit 150 of this embodiment may control the operation of the digital optical processor 142 by selecting one of the processing modes of the digital optical processor 142. Control unit 150 may be controllably coupled to digital reflective indicator 144 of digital optical processor 142. Therefore, the operation of the digital reflective indicator 144 can be appropriately controlled simply by freely designing the operation program of the control unit 150, and the light L1 of the light source 130 according to the operation of the digital reflective indicator 144. can be processed into various lighting patterns.

The control unit 150 as described above can select one of the processing modes of the digital optical processor 142 and then appropriately adjust the operation of the digital reflective indicator 144 according to the processing mode. Accordingly, the digital optical processor 142 may operate according to the processing mode selected by the control unit 150 to determine the irradiation pattern of the light L3 irradiated to the transparent substrate 110 into various patterns.

As shown in FIG. 1, in this embodiment, the optical pattern control module 200 may be configured by integrating the digital optical processor 142, the light source 130, and the control unit 150. However, it is not limited to this, and the optical pattern control module 200 of this embodiment may be formed with only the digital optical processor 142 and the light source 130 depending on the design conditions and circumstances of the fine pattern manufacturing apparatus 100.

The control unit 150 of this embodiment may control the operation of the digital optical processor 142 to continuously change the processing modes of the digital optical processor 142 at regular intervals. Specifically, the control unit 150 can change the processing modes of the digital optical processor 142 at regular time intervals as needed, thereby changing the irradiation pattern of light L2 irradiated to a portion of the transparent substrate 110. By changing at regular time intervals, the fine pattern of the high aspect ratio structure 160 can be manufactured into various lighting patterns.

In addition, the digital optical processor 142 of this embodiment can be moved along the other side of the transparent substrate 110 to form the high aspect ratio structure 160 on the entire one side of the transparent substrate 110. For reference, the transparent substrate 110 can be formed in a larger area than the irradiation pattern of the light (L1, L2, L3) emitted from the digital optical processor 142, and the optical pattern control module 200 is a transparent substrate. It may be placed on the other surface of 110 to be movable along the transparent substrate 110 .

For example, the digital optical processor 142 of this embodiment forms the high aspect ratio structure 160 on the photocurable resin 120 at the first position of the transparent substrate 110, and forms the high aspect ratio structure 160 on the photocurable resin 120 at the first position of the transparent substrate 110. When the formation of the high aspect ratio structure 160 is completed, the transparent substrate 110 may be moved to a second position and the high aspect ratio structure 160 may be formed again on the photocurable resin 120. As shown in FIG. 1, in this embodiment, the digital optical processor 142, the light source 130, and the control unit 150 are integrated into one optical pattern control module 200, so the optical pattern control module ( 200 may be horizontally moved along the other side of the transparent substrate 110 by a transfer stage unit or robot unit.

In particular, in the fine pattern manufacturing apparatus 100 of this embodiment, the focusing ability of the digital optical unit 140, the wavelength of the light (L1, L2, L3) emitted from the light source 130, the digital optical unit 140 and the sight The resolution of the high aspect ratio structure 160 can be adjusted in various ways by changing the material properties of the chemical resin 120, etc. In addition, in the fine pattern manufacturing apparatus 100 of this embodiment, the digital optical processor 142 of the digital optical unit 140 creates an irradiation pattern of light L3 irradiated to the light collection position P of the transparent substrate 110. It is also possible to change the irradiation area and amount of light (L3).

The operation and effects of the high aspect ratio fine pattern manufacturing apparatus 100 according to an embodiment of the present invention configured as described above are as follows.

Figures 3 and 4 are diagrams showing a method for manufacturing a fine pattern with a high aspect ratio according to an embodiment of the present invention, respectively, and Figures 5, 6, and 7 are diagrams showing the method for manufacturing a fine pattern with a high aspect ratio shown in Figure 3. This is a drawing in which the micropattern of the high aspect ratio structure 160 manufactured according to this method is enlarged at various magnifications.

Referring to FIG. 3, the method for manufacturing a fine pattern with a high aspect ratio according to this embodiment includes a step (S1) of irradiating light (L1) from the light source 130 to the digital optical unit 140, and the digital optical unit 140 Step (S2) of irradiating the light L3 of the light source 130 to the transparent substrate 110 according to a preset irradiation pattern, and the light irradiated to the transparent substrate 110 is applied to one surface of the transparent substrate 110. A step of transferring to the photo-curable resin 120 (S3), and a high aspect ratio is applied to the photo-curable resin 120 according to the SPPW process with a fine pattern corresponding to the irradiation pattern of light L3 irradiated to the photo-curable resin 120. It includes a step (S4) of curing the structure 160.

In the step (S1) of irradiating the light (L1) of the light source 130 to the digital optical unit 140, the light source 130 directs the straight light (L1) to the first lens unit 146 of the digital optical unit 140. ) to investigate.

In step S2, where the digital optical unit 140 irradiates the light L3 to the transparent substrate 110 according to the irradiation pattern, the digital optical unit 140 irradiates the light L1 from the light source 130 to a preset level. After processing according to the pattern, the light L3 processed with the corresponding irradiation pattern is irradiated toward the other surface of the transparent substrate 110. At this time, the light L3 irradiated toward the other surface of the transparent substrate 110 is set to a desired irradiation pattern by the digital optical unit 140, and is formed into a fine pattern of nano size or less by the digital optical unit 140. do.

In the step (S3) of transmitting the light (L3) to the photocurable resin 120, the light (L3) is irradiated in a desired irradiation pattern at the light collection position (P) of the transparent substrate 110, and the light (L3) is It passes through the transparent substrate 110 and is irradiated to the photocurable resin 120 applied to one surface of the transparent substrate 110.

In the step (S4) of curing the high aspect ratio structure 160 in the photocurable resin 120, the photocurable resin 120 is formed in a fine pattern corresponding to the irradiation pattern of the light L3 irradiated on the photocurable resin 120. The high aspect ratio structure 160 is cured.

As described above, when the photocurable resin 120 begins to harden by the light L3 irradiated to the light collection positions P, the photocurable resin 120 is fixed to the area corresponding to the irradiation pattern of the light L3. A fine pattern of the aspect ratio structure 160 is formed. That is, a fine pattern of the high aspect ratio structure 160 is formed through the SPPW process at the area corresponding to the light collecting positions (P) of the photocurable resin 120, and the high aspect ratio structure 160 is formed of the light L3. As transmission continues, it gradually grows longer.

In particular, in the SPPW process technology of this embodiment, it is possible to focus the size of light L3 provided to the photocurable resin 120 for forming the high aspect ratio structure 160 into a very small size using the digital optical unit 140. do. That is, since the light (L3) is structured to pass through the digital optical unit 140 before being irradiated to the photocurable resin 120, the light (L1, L2, L3) is focused by the digital optical unit 140 The cured portion of the chemical resin 120 is formed very finely, and the intensity of light L3 irradiated to the photocurable resin 120 also increases. Using this, in this embodiment, by applying the digital optical unit 140 to the SPPW process technology, the fine pattern of the high aspect ratio structure 160 can be easily manufactured in nano units smaller than the existing minimum micro unit, and nano A unit fine pattern can be produced with high resolution on one side of the transparent substrate 110.

Figure 4 shows another example of a method for manufacturing a high aspect ratio fine pattern according to this embodiment. That is, in FIG. 4, reference numbers identical to and similar to those shown in FIG. 3 indicate the same steps, and detailed description thereof will be omitted. Hereinafter, the description will focus on differences from the high aspect ratio fine pattern manufacturing method shown in FIG. 3.

Referring to FIG. 4, the difference between the high aspect ratio fine pattern manufacturing method according to another modification of the present invention from the fine pattern manufacturing method shown in FIG. 3 is that the digital optical unit 140 uses light (L1, L2, L3). )'s lighting pattern can be freely changed (see S5~S6), and the digital optical unit 140, light source 130, and control unit 150 are moved (see S7~S8).

Here, in steps (S2, S5 to S6) where the digital optical unit 140 irradiates light L3 to the transparent substrate 110 according to the irradiation pattern, the processing mode of the digital optical processor 142 is controlled to control the light ( The investigation pattern of L3) can be changed. Accordingly, in the step S4 of curing the high aspect ratio structure 160 in the photocurable resin 120, the photocurable resin 120 is formed according to a fine pattern corresponding to a change in the irradiation pattern of light (L1, L2, L3). ), different types of high aspect ratio structures 160 can be formed.

By changing the processing mode of the digital optical processor 142 as described above, the high aspect ratio structure 160 of various patterns can be manufactured in various forms on the photocurable resin 120 applied to the transparent substrate 110.

Meanwhile, the transparent substrate 110 may be formed to have a larger area than the irradiation pattern of the light (L1, L2, L3) emitted from the digital optical processor 142 (S7 to S8). That is, the digital optical processor 142 ) The transparent substrate 110 is divided into a plurality of divided regions based on the irradiation area, and the digital optical processor 142 sequentially provides the illumination pattern of light L3 to the divided regions of the transparent substrate 110. It is desirable to do so.

The digital optical processor 142 as described above may be formed to move along the other surface of the transparent substrate 110. Accordingly, the digital optical processor 142 can sequentially form the high aspect ratio structure 160 on one side of the transparent substrate 110 while moving along the transparent substrate 110 .

As shown in FIG. 4, in the method of manufacturing a high aspect ratio fine pattern according to another modification of the present invention, when the step (S4) of curing the high aspect ratio structure 160 in the photocurable resin 120 is completed, the light source With the operation of 130 and the digital optical unit 140 stopped, the transparent substrate 110 is moved to another part, and then the light (L1, L2, L3) of the light source 130 is transmitted to the digital optical unit 140. It can be performed again from the investigation stage (S7, S8).

As described above, in this embodiment, a high aspect ratio structure can be smoothly formed into various fine patterns by changing the irradiation pattern of the digital optical processor 142 up to a set number of times, and at the same time, the position of the digital optical processor 142 can be adjusted. The high aspect ratio structure 160 can be easily formed through the SPPW process on the entire photocurable resin 120 applied to the large-area transparent substrate 110 while moving.

5 to 7 show a high aspect ratio structure 160 and a high aspect ratio fine pattern produced by the high aspect ratio fine pattern manufacturing method according to the above-described embodiment.

Figure 5 shows a high aspect ratio fine pattern enlarged at low magnification. It can be seen that high aspect ratio structures 160 are arranged at regular intervals on the transparent substrate 110 of FIG. 5 .

Figure 6 shows a high aspect ratio fine pattern enlarged at twice the magnification of Figure 5. It can be seen that high aspect ratio structures 160 are arranged at regular intervals on the transparent substrate 110 of FIG. 5 , and that some of the high aspect ratio structures 160 are separated from the transparent substrate 110 . It can be seen that the high aspect ratio structure 160 as described above is manufactured in the shape of an elongated cone, but it is not limited to this and can also be manufactured in the shape of a cylinder or polygonal pyramid.

Figure 7 shows a high aspect ratio fine pattern enlarged at a higher magnification than Figure 6. In Figure 7, the shape of the cone-shaped high aspect ratio structure 160 can be seen more clearly, and it may be possible to use the high aspect ratio structures 160 by separating them from the transparent substrate 110 and attaching them to another substrate. .

As described above, the embodiments of the present invention have been described with specific details such as specific components and limited examples and drawings, but this is only provided to facilitate a more general understanding of the present invention, and the present invention is limited to the above embodiments. This does not mean that various modifications and variations can be made from this description by those skilled in the art. Accordingly, the spirit of the present invention should not be limited to the described embodiments, and all claims that are equivalent or equivalent to the claims as well as the following claims fall within the scope of the present invention.

100: High aspect ratio fine pattern manufacturing device
110: transparent substrate
120: Photocurable resin
130: light source
140: digital optical unit
142: Digital optical processor
144: Digital reflective indicator
146: first lens unit
148: second lens unit
150: control unit
160: High aspect ratio structure
200: Optical pattern control module
L1, L2, L3: Light from the light source
P: Concentrating position

Claims (13)

transparent substrate;
Photocurable resin applied to one surface of the transparent substrate;
A light source that generates light to cure the photocurable resin; and
It is disposed between the light source and the transparent substrate, and irradiates light from the light source toward the other side of the transparent substrate in a preset irradiation pattern to form a fine pattern corresponding to the irradiation pattern in the SPPW (self-propagating polymer waveguide) process. a digital optical unit that cures the high aspect ratio structure in the photocurable resin;
A high aspect ratio fine pattern manufacturing device comprising a.
According to paragraph 1,
The digital optical unit,
A digital optical processor (DLP) that operates in one of a plurality of processing modes corresponding to the light irradiation patterns to process the light irradiation pattern irradiated on the other surface of the transparent substrate into a desired pattern. A high aspect ratio fine pattern manufacturing device, characterized in that it is provided.
According to paragraph 2,
It further includes a control unit that controls the operation of the digital optical processor by selecting one of the processing modes of the digital optical processor,
The control unit selects one of the processing modes of the digital optical processor, and the digital optical processor operates according to the processing mode selected by the control unit to determine an irradiation pattern of the light irradiated to the transparent substrate. A high aspect ratio fine pattern manufacturing device, characterized in that.
According to paragraph 3,
The digital optical processor,
A digital reflection indicator (DMD: digital mirror device) that operates according to a processing mode selected by the control unit and is provided as a collection of fine reflectors to irradiate light from the light source in an irradiation pattern corresponding to the processing mode;
a first lens unit disposed between the digital reflective indicator and the light source, and receiving light from the light source and transmitting it to the digital reflective indicator; and
a second lens unit disposed between the digital reflective indicator and the transparent substrate and transmitting light reflected from the digital reflective indicator to the other surface of the transparent substrate;
A high aspect ratio fine pattern manufacturing device comprising a.
According to paragraph 4,
The digital reflective indicator is,
High aspect ratio, characterized in that it operates according to the processing mode selected by the control unit and reflects the light of the light source transmitted from the first lens unit to the other surface of the transparent substrate according to the irradiation pattern corresponding to the processing mode. Fine pattern manufacturing device.
According to clause 5,
The control unit continuously changes the processing mode of the digital reflective indicator at regular intervals,
The digital reflective indicator is a high aspect ratio fine pattern manufacturing device, characterized in that the irradiation pattern of the light irradiated to the other side of the transparent substrate is continuously changed at regular intervals.
According to clause 5,
The transparent substrate is formed with an area larger than the irradiation pattern of the light emitted from the digital optical unit,
The digital optical unit is moved along the other side of the transparent substrate to form the high aspect ratio structure on the entire side of the transparent substrate.
According to paragraph 4,
The first lens unit and the second lens unit,
A high-aspect-ratio fine pattern manufacturing device, each formed with a structure that combines a plurality of lenses.
According to paragraph 4,
The second lens unit,
A high aspect ratio fine pattern manufacturing device, characterized in that the fine pattern of the high aspect ratio structure is further refined by focusing the light transmitted from the digital reflection indicator onto the transparent substrate.
According to paragraph 1,
A high aspect ratio fine pattern manufacturing device, characterized in that the light source is equipped with a collimation lens so that the light irradiated to the digital optical unit travels straight.
Irradiating light from a light source to a digital optical unit;
irradiating light from the light source to a transparent substrate according to a preset irradiation pattern by the digital optical unit;
transmitting light irradiated to the transparent substrate to a photocurable resin applied to one surface of the transparent substrate; and
Curing a high aspect ratio structure on the photo-curable resin according to the SPPW process with a fine pattern corresponding to the irradiation pattern of light irradiated on the photo-curable resin;
A method of manufacturing a high aspect ratio fine pattern comprising.
According to clause 11,
The digital optical unit is a digital optical processor (DLP) that operates in one of a plurality of processing modes corresponding to the light irradiation patterns to process the light irradiation pattern irradiated on the other surface of the transparent substrate into a desired pattern. ) is provided as,
In the step of the digital optical unit irradiating light to the transparent substrate according to the irradiation pattern, the processing mode of the digital optical processor is controlled to change the light irradiation pattern at regular intervals,
In the step of curing the high aspect ratio structure in the photocurable resin, different types of the high aspect ratio structure are formed in the photocurable resin according to a fine pattern corresponding to a change in the light irradiation pattern. Fine pattern manufacturing method.
According to claim 11 or 12,
When the step of curing the high aspect ratio structure in the photocurable resin is completed, the light source and the digital optical unit are moved to another part of the transparent substrate while the operation is stopped, and the light from the light source is irradiated to the digital optical unit. A method of manufacturing a fine pattern with a high aspect ratio, characterized in that it is performed again from the first step.

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