KR20230115662A - Cleaning apparatus - Google Patents

Abstract

Start the cleaning device.
This cleaning device is a cleaning device for surface maintenance of components for the chamber used in the chamber device of the semiconductor manufacturing process,
A table portion formed so that components for the chamber can be placed thereon, and a dry cleaning portion formed so that foreign matters on the surface of the components for the chamber placed on the side of the table portion can be peeled off by a heating vaporization method using plasma laser light for cleaning, and the above and an exhaust unit configured to exhaust and remove foreign substances vaporized and detached from the surface side of the component for the chamber by the dry cleaning unit.

Description

Cleaning device {CLEANING APPARATUS}

The present invention relates to a cleaning device.

In general, a chamber device is used in a process for deposition or etching in a semiconductor manufacturing process.

The chamber device has a chamber space that can be hermetically shut off from the outside, and the chamber space is formed in a state in which various components for the chamber, such as a shield or liner for deposition or etching, are mounted and set.

In particular, the chamber device requires a structure capable of realizing physical and chemical resistance characteristics corresponding to the working atmosphere when a deposition or etching process is performed in a chamber space.

Accordingly, various chamber components installed in the chamber device must be formed to have surface resistance characteristics corresponding to the working atmosphere in the chamber, and it is important to ensure that the surface resistance characteristics are stably maintained through periodic surface maintenance work. .

This surface maintenance work separates the components for the chamber from the chamber device, removes surface foreign substances based on a wet cleaning process (eg, ultrasonic cleaning) linked to the blasting work in a separate work place, and It proceeds in a way to restore the surface.

However, the wet cleaning process associated with the blasting operation may cause damage to the surface (coating layer) of the components for the chamber due to blasting impact.

In addition, when components for chambers that have been subjected to surface maintenance through a wet cleaning process are used while being re-installed on the chamber device side, residual moisture is discharged through the surface of the parts (e.g., Out Gassing), which reduces the operability of the chamber. may be a factor in deterioration.

Therefore, it is difficult to expect satisfactory surface maintenance quality and work reliability with conventional wet cleaning methods associated with blasting operations.

(Patent Document 0001) Patent Publication No. 10-2006-0095018.

The present invention has been made to solve the conventional problems as described above,

An object of the present invention is to provide a cleaning device capable of easily exfoliating and removing surface foreign substances by a heating vaporization method using plasma laser light during surface maintenance of components for a chamber.

In order to realize the object of the present invention as described above,

As a cleaning device for surface maintenance of components for chambers used in chamber devices in semiconductor manufacturing processes,

a table portion formed so that components for the chamber can be placed;

a dry cleaning unit formed to peel foreign substances on the surface of the components for the chamber placed on the side of the table unit by heating and evaporating the cleaning plasma laser light; and

an exhaust unit configured to exhaust and remove foreign substances vaporized and detached from the surface side of the component for the chamber by the dry cleaning unit;

It provides a cleaning device comprising a.

In the present invention, the components for the chamber used on the chamber device side of the semiconductor manufacturing process are cleaned in a state consistent with the surface maintenance, but in particular, the surface foreign matter is easily peeled off by a heating vaporization method using plasma laser light. In addition to treatment, by carrying out the cleaning operation in a dry method using plasma laser light, the effect of improving problems caused by wet cleaning (e.g., surface out-gassing) can be expected. .

1 is a diagram schematically showing the overall structure of a cleaning device according to an embodiment of the present invention.
2 to 8 are views for explaining the detailed structure and operation of a cleaning device according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

Embodiments of the present invention are described to the extent that those with average knowledge in the art can practice the present invention.

Therefore, since the embodiments of the present invention can be modified in many different forms, the scope of the claims of the present invention is not limited to the embodiments described below.

1 is a diagram schematically showing the overall structure of a cleaning device according to an embodiment of the present invention, and FIGS. 2 to 8 are diagrams for explaining detailed structures and actions, and a cleaning device according to an embodiment of the present invention. includes a table part 10, a dry cleaning part 20 and an exhaust part 30.

Referring to FIGS. 1 to 5 , the table portion 10 includes a tray 12 and a support 14 .

The tray 12 has a size in which the chamber component P can be placed, and is formed to be detachably disposed on the support 14 side.

The component M for the chamber may be a shield member or a liner member of a chamber device used for a deposition or etching operation in a semiconductor manufacturing process, and during the operation, surface contamination (foreign matter) caused by splashes in the chamber is easily generated, thereby are known to require periodic surface maintenance.

The tray 12 may be formed in the shape of a disk, and the material selected from metal or synthetic resin is used, but it is preferable to use it in a surface-treated state (eg, a resistant coating layer) to have resistance characteristics corresponding to plasma laser light.

The support 14 is formed to have a structure capable of detachably fixing the lower side of the tray 12 in a supporting state.

The support 14 is composed of a plurality of supporters A as shown in FIGS. 2 and 3, and the supporters A are slid in a direction in which the distance between them is narrowed or widened, and the circumferential side of the tray 12 And it can be formed to detachably fix the lower side in a support support state.

For example, the support member A may be set in a state in which two ball screws B, each having a right-hand screw part and a left-hand screw part, are installed in a set on the side of two ball screws B arranged in a direction crossing each other.

Then, as shown in FIG. 3, the support members A are slid in a state in which the distance between them is narrowed or widened by the normal or reverse rotation of the ball screw B, and the circumferential side and the lower side of the tray 12 correspond to each other. It can be fixed or unfixed in the state.

This support 14 can not only fix or unfix the side of the tray 12 on which the chamber component M is placed in a stable support state, but also maintain the support position by sliding the support members A. Of course, it is possible to secure functionality and compatibility that match the supporting trays 12 of various sizes.

As shown in FIG. 1 , the table unit 10 may further include a rotation driving source 16 .

The rotation drive source 16 may use a turntable type drive source, and may be set to enable rotation drive in forward and reverse directions in a state in which the side of the support 14 is supported horizontally.

The rotation driving source 16 may provide a structure capable of more easily adjusting and setting the position and direction of the tray 12 in association with the manipulation of the support 14 .

The dry cleaning unit 20 has a structure capable of exfoliating the foreign substances P adhering to the surface of the component M for the chamber using a dry cleaning method.

In particular, the dry cleaning unit 20 is formed to exfoliate the foreign matter P from the surface of the component M for the chamber by heating and evaporating.

The dry cleaning unit 20 includes a cleaning head 22 as shown in FIG. 1 , and the cleaning head 22 may be set above the table portion 10 in a state installed on the side of the robot arm 24 .

The cleaning head 22 has a light emitting surface C, and may be installed on the side of the robot arm 24 with the light emitting surface C facing the tray 12 side of the table portion 10.

The cleaning head 22 is formed to irradiate the cleaning plasma laser light L through the light emitting surface C.

Although not shown in the drawing, the light emitting surface C may be formed to have a structure capable of irradiating the cleaning plasma laser light L through, for example, a plurality of beam holes.

In addition, the robot arm 24 may be disposed at a point adjacent to the table unit 10 as shown in FIG. 1, and may hold the cleaning head 22 side so that the position and posture can be adjusted by joint motion of the arm. It can be set as is.

As shown in FIG. 4, the dry cleaning unit 20 irradiates the cleaning plasma laser light L from the cleaning head 22 toward the chamber component M side, thereby cleaning the cleaning plasma laser light L ), thereby inducing heating and vaporization of the foreign matter (P), thereby allowing the foreign matter (P) to be separated from the surface of the component (M) for the chamber.

In this way, the dry cleaning method using the plasma laser light (L) for cleaning can improve the problem of damage to the surface to be treated due to the blasting impact, especially compared to the wet cleaning method associated with the blasting operation, thereby increasing work stability and reliability. can be higher

In addition, the method of inducing heating and evaporation of the foreign matter (P) by using the cleaning plasma laser light (L) can suppress surface damage of the chamber component (M) made of graphite as well as metal material. You can proceed with the work as long as you can.

On the other hand, the exhaust unit 30 is formed to remove the foreign matter P vaporized and peeled from the surface side of the component M for the chamber by the dry cleaning unit 20 in an exhaust atmosphere (SUCTION).

Referring to FIGS. 1 and 2 , the exhaust unit 30 includes an exhaust port 32 , and through the exhaust port 32 , exhaust removal treatment of vaporized foreign substances P may be formed.

As shown in FIG. 1 , the exhaust port 32 may be installed above the table portion 10 while being connected to the exhaust pipe D.

That is, the exhaust port 32 is disposed and formed in a state capable of generating an exhaust atmosphere on the surface (upper surface) of the component M for the chamber placed on the side of the tray 12 of the table portion 10, for example It can be installed in a fixed state on the ceiling of the workshop or on the side of the robot arm 24 .

In addition, the exhaust pipe (D) is connected to the exhaust port 32 side, and may be formed to have a tubular structure capable of changing the exhaust position or posture of the exhaust port 32.

In the exhaust pipe (D), for example, a joint (D1) is formed in the pipe extension section as shown in FIG. can be formed

At least one exhaust port 32 may be installed in a state corresponding to the table portion 10 side according to required working conditions.

Although not shown in the drawing, the exhaust port 32 may be set so that an exhaust atmosphere is formed through the exhaust pipe D by driving an exhaust driving device connected to the exhaust pipe D side.

The exhaust port 32 may further include an exhaust guide port 34 as shown in FIGS. 1 and 2 .

The exhaust guide port 34 is formed to more smoothly induce the exhaust of the vaporized foreign matter P in association with the operation of the exhaust port 32 .

That is, the exhaust induction port 34 has an induction space E on the inside, and the induction space E is formed in the form of a space open toward the outside in a state of communication with the exhaust port 32 side, FIG. As shown in 2, it may be formed to have a shape (eg, DOME or CONE type) in which the size of the space circumference gradually increases while extending outward.

As shown in FIG. 5, the exhaust inlet 34 exhausts the vaporized foreign substances P on the surface of the component M for the chamber through the exhaust port 32, at the end (free end) side of the exhaust port 32. It is possible to induce the exhaust atmosphere to act more smoothly on the surface side of the chamber component (M) by forming an induction space (E) that is covered from the outside.

Referring to FIGS. 6 to 8 , the cleaning device according to an embodiment of the present invention may further include a fixing part 40 .

The fixing part 40 is formed to fixably support the component M for the chamber placed on the table part 10 side so that the flow is suppressed.

In particular, the fixing part 40 is formed to fix and support the component M for the chamber in a contact method by its own weight.

As shown in FIG. 6 , the fixing unit 40 may include a fixing weight 42 and a fixing guide 44 for guiding the fixing operation of the fixing weight 42 .

The fixing weight 42 is formed so as to be able to press the side of the component M for the chamber with a contact force due to its own weight.

The fixing weight 42 may be formed in the form of a bar-type weight, and is formed to have a weight capable of suppressing the movement of the component M for the chamber.

A guide hole (F) is formed on the side of the fixing weight (42) in a state corresponding to the side of the guide sphere (44) for fixation, and the guide hole (F) is detachably inserted into the guide sphere (44) for fixation. It is formed to have a hole shape that can be.

As shown in FIG. 6, the guide holes F are formed in a state penetrating the upper and lower surfaces of the fixing weight 42, spaced apart from each other within the circumference of the upper and lower surfaces of the fixing weight 42, and a plurality of guide holes F. Dogs may be formed in a spaced-apart arrangement.

A functional coating layer (G) may be formed on the side of the fixing weight 42 to cover the outer surface of the weight.

The functional coating layer (G) suppresses surface damage (eg, scratches) and particles (abrasion) of the chamber component (M) caused by the contact force of the fixing weight 42, and is applied to the plasma laser light (L) for cleaning. can be formed to be resistant to

The fixing guide sphere 44 is formed to guide the fixing operation of the fixing weight 42 in a fitting manner.

As shown in FIG. 6, the fixing guide spheres 44 may be formed in a protruding shape on the upper surface of the tray 12 of the table unit 10 by forming a set of two.

That is, when the guide hole F side of the fixing weight 42 is detachably inserted into the fixing guide sphere 44, the fixing or unfixing operation of the weight is guided in the upward and downward directions in connection therewith. can

Also, on the side of the tray 12, as shown in FIG. 6, a rail groove H may be formed in a state corresponding to the guide sphere 44 for fixing.

The rail groove (H), for example, may be formed extending in a state of forming a circular rail section corresponding to the circumference of the upper surface of the tray 12, and along the rail section, the two fixing guide spheres 44 side Each of them may be set on the side of the groove in a movable state.

Then, since the fixing guide sphere 44 is provided on the tray 12 side in a position-adjustable state along the rail section of the rail groove H, the required working conditions (eg, size or shape of components for the chamber) ), as shown in FIG. 7, it is possible to guide the fixing position or posture of the fixing weight 42 to be set more diversely.

As shown in FIG. 8, the fixing part 40 easily holds the chamber component M placed on the tray 12 side of the table part 10 in a contact support method using the weight of the fixing weight 42. can be given, and thereby further improved work stability can be ensured.

Therefore, the present invention is a dry cleaning device capable of exfoliating the surface foreign matter (P) by heating and vaporizing using a cleaning plasma laser light (L) during cleaning treatment for surface maintenance of the chamber component (M). structure can be provided.

In particular, the dry cleaning method using the plasma laser light (L) for cleaning removes moisture from the surface side of the chamber component (M) after the cleaning operation, compared to, for example, a general wet cleaning method using ultrasonic cleaning or chemicals. This residual phenomenon can be prevented as much as possible.

Therefore, it is possible to improve the problem (surface out-gassing) that usually occurs when the surface maintenance-treated chamber component (M) is mounted on the chamber device side and reused, thereby improving the surface maintenance quality and reliability. can be implemented.

10: table part 20: dry cleaning part
30: exhaust part 40: fixing part
M: Component for chamber P: Foreign matter

Claims (6)

As a cleaning device for surface maintenance of chamber components used in chamber devices in semiconductor manufacturing processes,
a table portion formed so that components for the chamber can be placed;
a dry cleaning unit formed to peel foreign substances on the surface of the components for the chamber placed on the side of the table unit by heating and evaporating the cleaning plasma laser light; and
an exhaust unit configured to exhaust and remove foreign substances vaporized and detached from the surface side of the component for the chamber by the dry cleaning unit;
Cleaning device comprising a. The method of claim 1,
The table part,
A cleaning device comprising a tray on which components for a chamber are placed, and a support formed to detachably support the side of the tray. The method of claim 2,
the support,
It consists of a plurality of supports,
The supports are
A cleaning device formed to detachably fix the circumferential side and the lower side of the tray in a supporting state while sliding in a direction in which the interval is narrowed or widened. In claim 1.
The dry cleaning unit,
A cleaning head for emitting and irradiating a plasma laser light for cleaning,
The cleaning head,
A cleaning device set to irradiate a plasma laser light for cleaning from above the table portion toward the surface side of the component for the chamber. The method of claim 1,
the exhaust,
Equipped with an exhaust port,
The exhaust port,
A cleaning device formed to exhaust vaporized foreign substances on the surface side of the component for the chamber in an exhaust atmosphere in a state disposed above the table portion. The method of claim 1,
The cleaning device further includes a fixing unit,
The fixing part,
A fixing weight and a fixing guide tool for guiding the fixing operation of the fixing weight are provided;
A cleaning device formed to be supported and fixed on the table part in a state of pressing the component side for the chamber with the weight of the fixing weight.

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