KR20230081531A - Electronic device including antenna - Google Patents

Abstract

According to various embodiments, an electronic device comprises: a housing including a side member including a conductive member including an inner surface and an outer surface opposite the inner surface; an antenna structure disposed in an inner space of the housing, and including a substrate and a plurality of antenna elements disposed at first distances on the substrate; a plurality of through holes penetrating from the inner surface to at least a portion of the outer surface, and formed in a number corresponding to the plurality of antenna elements; and a wireless communication circuit disposed in the inner space and configured to transmit or receive a wireless signal in a designated frequency band through the antenna structure. First openings formed in the inner surface, of the plurality of through holes can be arranged at the first intervals, and second openings formed in the outer surface, of the plurality of through holes can be arranged at second intervals greater than the first intervals. Therefore, the various embodiments can provide the electronic device comprising an antenna with an arrangement structure that can improve radiation performance. Other various embodiments are possible.

Description

Electronic device including an antenna {ELECTRONIC DEVICE INCLUDING ANTENNA}

Various embodiments of the present disclosure relate to an electronic device including an antenna.

With the development of wireless communication technology, electronic devices (eg, electronic devices for communication) are commonly used in daily life, and accordingly, the use of content is increasing. Due to the rapid increase in the use of these contents, the network capacity is gradually reaching its limit, and since the commercialization of the 4G (4th generation) communication system, high-frequency (eg mmWave) bands (eg 3 A communication system (eg, 5th generation (5G), pre-5G communication system, or new radio (NR)) that transmits or receives a signal using a frequency of a GHz to 300 GHz band is being researched.

Wireless communication technology can transmit or receive wireless signals using the mmWave band (e.g., a frequency band ranging from about 3 GHz to 100 GHz), and an efficient mounting structure to overcome high free space loss due to frequency characteristics and increase antenna gain. And a new antenna structure (eg, antenna module) corresponding to this is being developed. The antenna structure may include an antenna array in which various numbers of antenna elements (eg, conductive patches and/or conductive patterns) are disposed at regular intervals. For example, antenna elements may be arranged such that a beam pattern is formed in one direction inside an electronic device. For example, the antenna structure may be disposed such that a directional beam is formed in an external direction of the electronic device through a non-conductive structure (eg, a non-conductive portion on a side surface, a portion other than a display portion on the front side, or a rear plate) in an internal space of the electronic device. can

The electronic device may include a side member including a conductive member to reinforce rigidity and form a beautiful appearance. At least a portion of the side member may include through-holes (eg, openings) aligned with each of the antenna elements so that the antenna structure radiates a directional beam to the outside through the side member. Corresponding through-holes may be filled with a non-conductive member (eg, a polymer member or an injection product). A plurality of antenna elements may be disposed on a substrate to have regular intervals (eg, half-wavelength) in order to express a gain of the antenna array, and a plurality of through holes may also be disposed at corresponding intervals.

However, when the spacing between the antenna elements is narrowed for slimming and efficient arrangement of the electronic device, the gain of the antenna array may be reduced by the through-holes of the side members, the spacing of which is narrowed accordingly. In addition, since the antenna structure must be placed perpendicularly to the through hole in the internal space of the electronic device, the thickness of the electronic device must be designed in consideration of the vertical mounting height of the antenna structure, which may make it difficult to implement a slimmer electronic device. .

Various embodiments of the present disclosure may provide an electronic device including an antenna having a disposition structure capable of improving radiation performance.

Various embodiments may provide an electronic device including an antenna having a disposition structure that can help slim down the electronic device.

However, the problem to be solved in the present disclosure is not limited to the above-mentioned problem, and may be expanded in various ways without departing from the spirit and scope of the present disclosure.

According to various embodiments, an electronic device is provided with a housing including a side member including an inner surface and a conductive member including an outer surface opposite to the inner surface, disposed in an inner space of the housing, and spaced between a substrate and the substrate at a first distance. An antenna structure including a plurality of antenna elements disposed to have, a plurality of through-holes penetrating from the inner surface to at least a part of the outer surface, and formed in a number corresponding to the plurality of antenna elements, and disposed in the inner space and a wireless communication circuit configured to transmit or receive a radio signal in a designated frequency band through the antenna structure, wherein first openings formed on the inner surface of the plurality of through holes are disposed at the first interval, The second openings formed on the outer surface of the plurality of through holes may be arranged at a second interval greater than the first interval.

An electronic device according to exemplary embodiments of the present disclosure can reduce radiation performance degradation of an antenna array even when a spacing between antenna elements is narrowed by changing a through direction of through holes arranged to correspond to each of a plurality of antenna elements. In addition, by inducing a free layout design of the antenna structure through various structural changes of through-holes, it can help slim down the electronic device.

In addition to this, various effects identified directly or indirectly through this document may be provided.

In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar elements.
1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.
2 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication according to various embodiments of the present disclosure.
3A is a perspective view of a mobile electronic device according to various embodiments of the present disclosure.
3B is a rear perspective view of a mobile electronic device according to various embodiments of the present disclosure.
3C is an exploded perspective view of a mobile electronic device according to various embodiments of the present disclosure.
FIG. 4A illustrates an embodiment of a structure of a third antenna module described with reference to FIG. 2 according to various embodiments of the present disclosure.
FIG. 4B is a cross-section of the third antenna module shown in (a) of FIG. 4A along line Y-Y' according to various embodiments of the present disclosure.
5 is a perspective view of an antenna structure according to various embodiments of the present disclosure.
6A is a configuration diagram of an electronic device in which an antenna structure according to various embodiments of the present disclosure is disposed.
6B is a partial cross-sectional view of an electronic device taken along line 6b-6b of FIG. 6A according to various embodiments of the present disclosure.
6C is a partial perspective view of an electronic device illustrating a disposition structure of a side member and an antenna structure according to various embodiments of the present disclosure.
7 is a partial configuration diagram of an electronic device showing a disposition structure of a side member and an antenna structure according to various embodiments of the present disclosure.
8A to 8G are partial cross-sectional views of a side member including a plurality of through holes according to various embodiments of the present disclosure.
9 is a configuration diagram of a side member including a plurality of through holes according to various embodiments of the present disclosure.
10 is diagrams comparing gain characteristics of antennas through through-holes according to various embodiments of the present disclosure and through-holes according to a comparative example.
11 is a radiation pattern diagram comparing gain characteristics of antennas through through-holes according to various embodiments of the present disclosure and through-holes according to a comparative example.
12A to 12C are partial cross-sectional views of an electronic device including an antenna structure disposed using a plurality of through holes according to various embodiments of the present disclosure.
13A is a partial cross-sectional view of an electronic device including an antenna structure disposed using a plurality of through holes according to various embodiments of the present disclosure.
13B is a diagram illustrating a disposition structure of a side member including a plurality of through holes and an antenna structure according to various embodiments of the present disclosure.
13C is a diagram illustrating an electric field distribution of the antenna structure of FIG. 13A according to various embodiments of the present disclosure.
14A and 14B are partial cross-sectional views of an electronic device including an antenna structure disposed using a plurality of through holes according to various embodiments of the present disclosure.
15A to 15C are partial cross-sectional views of an electronic device including an antenna structure disposed using a plurality of through holes according to various embodiments of the present disclosure.
16 is a partial cross-sectional view of an electronic device including an antenna structure disposed using a plurality of through holes according to various embodiments of the present disclosure.

1 is a block diagram of an electronic device 101 within a network environment 100, according to various embodiments.

Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 . According to one embodiment, the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or be set to be specialized for a designated function. can The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, image signal processor or communication processor) may be implemented as part of other functionally related components (eg, camera module 180 or communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor set to detect a touch or a pressure sensor set to measure the intensity of force generated by the touch.

The audio module 170 may convert sound into an electrical signal or vice versa. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN). These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), antenna array, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an antenna array). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an antenna array) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

2 is a block diagram 200 of an electronic device 101 for supporting legacy network communication and 5G network communication, according to various embodiments.

Referring to FIG. 2, the electronic device 101 includes a first communication processor 212, a second communication processor 214, a first radio frequency integrated circuit (RFIC) 222, a second RFIC 224, and a third An RFIC 226, a fourth RFIC 228, a first radio frequency front end (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module 244, and an antenna (248). The electronic device 101 may further include a processor 120 and a memory 130 . The network 199 may include a first network 292 and a second network 294 . According to another embodiment, the electronic device 101 may further include at least one of the components shown in FIG. 1, and the network 199 may further include at least one other network. According to one embodiment, a first communication processor 212, a second communication processor 214, a first RFIC 222, a second RFIC 224, a fourth RFIC 228, a first RFFE 232, and the second RFFE 234 may form at least a portion of the wireless communication module 192 . According to another embodiment, the fourth RFIC 228 may be omitted or included as part of the third RFIC 226 .

The first communication processor 212 may establish a communication channel of a band to be used for wireless communication with the first network 292 and support legacy network communication through the established communication channel. According to various embodiments, the first network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. The second communication processor 214 establishes a communication channel corresponding to a designated band (eg, about 6 GHz to about 60 GHz) among bands to be used for wireless communication with the second network 294, and 5G network communication through the established communication channel. can support According to various embodiments, the second network 294 may be a 5G network defined by 3GPP. Additionally, according to one embodiment, the first communication processor 212 or the second communication processor 214 corresponds to another designated band (eg, about 6 GHz or less) among bands to be used for wireless communication with the second network 294. It is possible to support establishment of a communication channel and 5G network communication through the established communication channel. According to one embodiment, the first communication processor 212 and the second communication processor 214 may be implemented on a single chip or in a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be formed in a single chip or a single package with the processor 120, the co-processor 123, or the communication module 190. there is.

When transmitting, the first RFIC 222 transmits a baseband signal generated by the first communication processor 212 to about 700 MHz to about 3 GHz used in the first network 292 (eg, a legacy network). of radio frequency (RF) signals. In reception, an RF signal is obtained from a first network 292 (eg, a legacy network) via an antenna (eg, first antenna module 242), and via an RFFE (eg, first RFFE 232). It can be preprocessed. The first RFIC 222 may convert the preprocessed RF signal into a baseband signal to be processed by the first communication processor 212 .

When transmitting, the second RFIC 224 transfers the baseband signal generated by the first communication processor 212 or the second communication processor 214 to the second network 294 (eg, a 5G network). It can be converted into an RF signal (hereinafter referred to as a 5G Sub6 RF signal) of the Sub6 band (eg, about 6 GHz or less). At reception, a 5G Sub6 RF signal is obtained from a second network 294 (eg, a 5G network) through an antenna (eg, the second antenna module 244), and an RFFE (eg, the second RFFE 234) It can be pre-treated through The second RFIC 224 may convert the preprocessed 5G Sub6 RF signal into a baseband signal to be processed by a corresponding communication processor among the first communication processor 212 and the second communication processor 214 .

The third RFIC 226 transmits the baseband signal generated by the second communication processor 214 to the RF of the 5G Above 6 band (eg, about 6 GHz to about 60 GHz) to be used in the second network 294 (eg, a 5G network). signal (hereinafter referred to as 5G Above6 RF signal). Upon reception, the 5G Above6 RF signal may be obtained from the second network 294 (eg, 5G network) through an antenna (eg, antenna 248) and pre-processed through a third RFFE 236. The third RFIC 226 may convert the preprocessed 5G Above6 RF signal into a baseband signal to be processed by the second communication processor 214 . According to one embodiment, the third RFFE 236 may be formed as part of the third RFIC 226 .

The electronic device 101, according to one embodiment, may include a fourth RFIC 228 separately from or at least as part of the third RFIC 226. In this case, the fourth RFIC 228 converts the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter, an IF signal) of an intermediate frequency band (eg, about 9 GHz to about 11 GHz). After conversion, the IF signal may be transmitted to the third RFIC 226. The third RFIC 226 may convert the IF signal into a 5G Above6 RF signal. Upon reception, the 5G Above6 RF signal may be received from the second network 294 (eg, 5G network) via an antenna (eg, antenna 248) and converted to an IF signal by a third RFIC 226. . The fourth RFIC 228 may convert the IF signal into a baseband signal so that the second communication processor 214 can process it.

According to an example, the first RFIC 222 and the second RFIC 224 may be implemented as a single chip or at least part of a single package. According to one embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as a single chip or at least part of a single package. According to one embodiment, at least one antenna module of the first antenna module 242 or the second antenna module 244 may be omitted or combined with another antenna module to process RF signals of a plurality of corresponding bands.

According to one embodiment, the third RFIC 226 and the antenna 248 may be disposed on the same substrate to form the third antenna module 246 . For example, the wireless communication module 192 or processor 120 may be disposed on a first substrate (eg, main PCB). In this case, the third RFIC 226 is provided on a part (eg, bottom surface) of the second substrate (eg, sub PCB) separate from the first substrate, and the antenna 248 is placed on another part (eg, top surface). is disposed, the third antenna module 246 may be formed. By arranging the third RFIC 226 and the antenna 248 on the same substrate, it is possible to reduce the length of the transmission line therebetween. This, for example, can reduce loss (eg, attenuation) of a signal of a high frequency band (eg, about 6 GHz to about 60 GHz) used in 5G network communication by a transmission line. As a result, the electronic device 101 can improve the quality or speed of communication with the second network 294 (eg, 5G network).

According to one embodiment, the antenna 248 may be formed of an antenna array including a plurality of antenna elements that may be used for beamforming. In this case, the third RFIC 226 may include, for example, a plurality of phase shifters 238 corresponding to a plurality of antenna elements as a part of the third RFFE 236. During transmission, each of the plurality of phase converters 238 may convert the phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device 101 (eg, a base station of a 5G network) through a corresponding antenna element. . During reception, each of the plurality of phase converters 238 may convert the phase of the 5G Above6 RF signal received from the outside through the corresponding antenna element into the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device 101 and the outside.

The second network 294 (eg, 5G network) may be operated independently of the first network 292 (eg, a legacy network) (eg, Stand-Alone (SA)) or may be operated in connection with the first network 292 (eg, a legacy network). Non-Stand Alone (NSA)). For example, a 5G network may include only an access network (eg, a 5G radio access network (RAN) or a next generation RAN (NG RAN)) and no core network (eg, a next generation core (NGC)). In this case, after accessing the access network of the 5G network, the electronic device 101 may access an external network (eg, the Internet) under the control of a core network (eg, evolved packed core (EPC)) of the legacy network. Protocol information for communication with the legacy network (eg LTE protocol information) or protocol information for communication with the 5G network (eg New Radio (NR) protocol information) is stored in the memory 230, and other parts (eg processor 120, the first communications processor 212, or the second communications processor 214).

3A is a perspective view of the front of an electronic device 300 according to various embodiments of the present disclosure. 3B is a perspective view of the back of the electronic device 300 of FIG. 3A according to various embodiments of the present disclosure.

The electronic device 300 of FIGS. 3A and 3B may be at least partially similar to the electronic device 101 of FIG. 1 or may include other embodiments of the electronic device.

Referring to FIGS. 3A and 3B , an electronic device 300 according to an embodiment includes a first side (or front side) 310A, a second side (or back side) 310B, and a first side 310A. and a housing 310 including a side surface 310C surrounding a space between the second surface 310B. In another embodiment (not shown), the housing 310 may refer to a structure forming some of the first face 310A, the second face 310B, and the side face 310C of FIG. 1 . According to one embodiment, the first surface 310A may be formed by a front plate 302 (eg, a glass plate including various coating layers, or a polymer plate) that is at least partially transparent. The second surface 310B may be formed by a substantially opaque back plate 311 . The back plate 311 may be formed, for example, of coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. It can be. The side surface 310C may be formed by a side bezel structure (or "side member") 320 coupled to the front plate 302 and the rear plate 311 and including metal and/or polymer. In some embodiments, the back plate 311 and the side bezel structure 320 may be integrally formed and include the same material (eg, a metal material such as aluminum).

In the illustrated embodiment, the front plate 302 curves from the first surface 310A toward the rear plate 311 to form a first region 310D that extends seamlessly, the front plate 302 ) can be included at both ends of the long edge. In the illustrated embodiment (see FIG. 3B ), the rear plate 311 has a long second region 310E that is curved from the second surface 310B toward the front plate 302 and extends seamlessly. Can be included on both ends of the edge. In some embodiments, the front plate 302 or the rear plate 311 may include only one of the first region 310D or the second region 310E. In some embodiments, the front plate 302 may not include the first region 310D and the second region 310E, but may include only a flat plane disposed parallel to the second surface 310B. In the above embodiments, when viewed from the side of the electronic device 300, the side bezel structure 320 is the first area 310D or the second area 310E as described above is not included. 1 thickness (or width), and may have a second thickness thinner than the first thickness on a side surface including the first or second area.

According to an embodiment, the electronic device 300 includes a display 301, an input device 303, sound output devices 307 and 314, sensor modules 304 and 319, and camera modules 305, 312 and 313. , a key input device 317, an indicator (not shown), and at least one of connectors 308 and 309. In some embodiments, the electronic device 300 may omit at least one of the components (eg, the key input device 317 or the indicator) or may additionally include other components.

The display 301 may be exposed through a substantial portion of the front plate 302, for example. In some embodiments, at least a portion of the display 301 may be exposed through the front plate 302 forming the first surface 310A and the first region 310D of the side surface 310C. The display 301 may be combined with or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. In some embodiments, at least a portion of the sensor modules 304 and 319 and/or at least a portion of the key input device 317 are in the first area 310D and/or the second area 310E. can be placed.

The input device 303 may include a microphone 303 . In some embodiments, the input device 303 may include a plurality of microphones 303 disposed to detect the direction of sound. The sound output devices 307 and 314 may include speakers 307 and 314 . The speakers 307 and 314 may include an external speaker 307 and a receiver 314 for communication. In some embodiments, the microphone 303, the speakers 307 and 314, and the connectors 308 and 309 are disposed in the space of the electronic device 300, and externally through at least one hole formed in the housing 310. may be exposed to the environment. In some embodiments, the hole formed in the housing 310 may be commonly used for the microphone 303 and the speakers 307 and 314. In some embodiments, the sound output devices 307 and 314 may include a speaker (eg, a piezo speaker) that operates while excluding holes formed in the housing 310 .

The sensor modules 304 and 319 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 300 or an external environmental state. The sensor modules 304 and 319 may include, for example, a first sensor module 304 (eg, a proximity sensor) and/or a second sensor module (not shown) disposed on the first surface 310A of the housing 310. ) (eg, a fingerprint sensor), and/or a third sensor module 319 (eg, an HRM sensor) disposed on the second surface 310B of the housing 310 . The fingerprint sensor may be disposed on the first surface 310A of the housing 310 . A fingerprint sensor (eg, an ultrasonic or optical fingerprint sensor) may be disposed under the display 301 of the first surface 310A. The electronic device 300 includes a sensor module (not shown), for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, At least one of a humidity sensor and an illuminance sensor 304 may be further included.

The camera modules 305, 312, and 313 include a first camera device 305 disposed on the first surface 310A of the electronic device 300 and a second camera device 312 disposed on the second surface 310B. ), and/or flash 313. The camera modules 305 and 312 may include one or a plurality of lenses, an image sensor, and/or an image signal processor. The flash 313 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 300 .

The key input device 317 may be disposed on the side surface 310C of the housing 310 . In another embodiment, the electronic device 300 may not include some or all of the above-mentioned key input devices 317, and the key input devices 317 that are not included may include soft keys and the like on the display 301. It can be implemented in different forms. Alternatively, the key input device 317 may be implemented using a pressure sensor included in the display 301 .

The indicator may be disposed on the first surface 310A of the housing 310, for example. The indicator may provide, for example, state information of the electronic device 300 in the form of light. In another embodiment, the light emitting device may provide, for example, a light source interlocked with the operation of the camera module 305 . Indicators may include, for example, LEDs, IR LEDs, and xenon lamps.

The connector holes 308 and 309 include a first connector hole 308 capable of accommodating a connector (eg, a USB connector or an interface connector port module (IF) module) for transmitting and receiving power and/or data to and from an external electronic device. ), and/or a second connector hole (or earphone jack) 309 capable of accommodating a connector for transmitting and receiving an audio signal to and from an external electronic device.

Some of the camera modules 305 of the camera modules 305 and 312 , some of the sensor modules 304 of the sensor modules 304 and 319 , or indicators may be disposed to be exposed through the display 101 . For example, the camera module 305, the sensor module 304, or the indicator is disposed in the internal space of the electronic device 300 to be in contact with the external environment through an opening perforated to the front plate 302 of the display 301. It can be. In another embodiment, some sensor modules 304 may be arranged to perform their functions without being visually exposed through the front plate 302 in the internal space of the electronic device. For example, in this case, the area of the display 301 facing the sensor module may not require a perforated opening.

3C is an exploded perspective view of the electronic device 300 of FIG. 3A according to various embodiments of the present disclosure.

Referring to FIG. 3C , the electronic device 300 includes a side member 320 (eg, a side bezel structure), a first support member 3211 (eg, a bracket), a front plate 302, a display 301, A printed circuit board 340 , a battery 350 , a second support member 360 (eg, a rear case), an antenna 370 , and a rear plate 311 may be included. In some embodiments, the electronic device 300 may omit at least one of the components (eg, the first support member 3111 or the second support member 360) or may additionally include other components. . At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 300 of FIG. 3A or 3B, and overlapping descriptions will be omitted below.

The first support member 3211 may be disposed inside the electronic device 300 and connected to the side member 320 or integrally formed with the side member 320 . The first support member 3211 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The display 301 may be coupled to one surface of the first support member 3211 and the printed circuit board 340 may be coupled to the other surface. A processor, memory, and/or interface may be mounted on the printed circuit board 340 . The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

Memory may include, for example, volatile memory or non-volatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

The battery 350 is a device for supplying power to at least one component of the electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 350 may be disposed on a substantially coplanar surface with the printed circuit board 340 , for example. The battery 350 may be integrally disposed inside the electronic device 300 or may be disposed detachably from the electronic device 300 .

The antenna 370 may be disposed between the rear plate 311 and the battery 350 . The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, an antenna structure may be formed by a part of the side member 320 and/or the first support member 3211 or a combination thereof.

FIG. 4A shows one embodiment of the structure of the third antenna module 246 described, for example, with reference to FIG. 2 . (a) of FIG. 4A is a perspective view of the third antenna module 246 viewed from one side, and (b) of FIG. 4A is a perspective view of the third antenna module 246 viewed from the other side. 4A(c) is a cross-sectional view of the third antenna module 246 along the line XX'.

Referring to FIG. 4A , in one embodiment, the third antenna module 246 is a printed circuit board 410, an antenna array 430, a radio frequency integrate circuit (RFIC) 452, or a power manage integrate circuit (PMIC). ) (454). Optionally, the third antenna module 246 may further include a shielding member 490 . In other embodiments, at least one of the aforementioned components may be omitted or at least two of the components may be integrally formed.

The printed circuit board 410 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers. The printed circuit board 410 may provide an electrical connection between the printed circuit board 410 and/or various electronic components disposed externally using wires and conductive vias formed on the conductive layer.

Antenna array 430 (eg, 248 in FIG. 2 ) may include a plurality of antenna elements 432 , 434 , 436 , or 438 arranged to form a directional beam. The antenna elements 432, 434, 436, or 438 may be formed on the first surface of the printed circuit board 410 as shown. According to another embodiment, the antenna array 430 may be formed inside the printed circuit board 410 . According to embodiments, the antenna array 430 may include a plurality of antenna arrays (eg, a dipole antenna array and/or a patch antenna array) of the same or different shapes or types.

An RFIC 452 (eg, 226 in FIG. 2 ) may be disposed in another area of the printed circuit board 410 (eg, a second surface opposite the first surface) spaced apart from the antenna array. there is. The RFIC is configured to process signals of a selected frequency band transmitted/received through the antenna array 430. According to an embodiment, the RFIC 452 may convert a baseband signal obtained from a communication processor (not shown) into an RF signal of a designated band during transmission. When receiving, the RFIC 452 may convert the RF signal received through the antenna array 430 into a baseband signal and transmit the converted baseband signal to the communication processor.

According to another embodiment, the RFIC 452 transmits an IF signal (eg, about 9 GHz to about 11 GHz) obtained from an intermediate frequency integrate circuit (IFIC) (eg, 228 of FIG. 2 ) to a selected band during transmission. can be up-converted to an RF signal of When receiving, the RFIC 452 down-converts the RF signal obtained through the antenna array 430, converts the RF signal into an IF signal, and transmits the converted signal to the IFIC.

The PMIC 454 may be disposed in another partial area (eg, the second surface) of the printed circuit board 410 , spaced apart from the antenna array 430 . The PMIC may receive voltage from a main PCB (not shown) and provide power necessary for various components (eg, the RFIC 452) on the antenna module.

The shielding member 490 may be disposed on a portion (eg, the second surface) of the printed circuit board 410 to electromagnetically shield at least one of the RFIC 452 and the PMIC 454 . According to one embodiment, the shielding member 490 may include a shield can.

Although not shown, in various embodiments, the third antenna module 246 may be electrically connected to another printed circuit board (eg, a main circuit board) through a module interface. The module interface may include a connecting member, for example, a coaxial cable connector, a board to board connector, an interposer, or a flexible printed circuit board (FPCB). The RFIC 452 and/or the PMIC 454 of the antenna module may be electrically connected to the printed circuit board through the connection member.

FIG. 4B shows a cross section along the line Y-Y' of the third antenna module 246 shown in (a) of FIG. 4A. The printed circuit board 410 of the illustrated embodiment may include an antenna layer 411 and a network layer 413 .

Referring to FIG. 4B , the antenna layer 411 includes at least one dielectric layer 437-1, and an antenna element 436 and/or a power supply unit 425 formed on or inside an outer surface of the dielectric layer. can include The power supply unit 425 may include a power supply point 427 and/or a power supply line 429 .

The network layer 413 includes at least one dielectric layer 437-2, and at least one ground layer 433 formed on or inside the dielectric layer, at least one conductive via 435, and a transmission line. 423, and/or a signal line 429.

In addition, in the illustrated embodiment, the RFIC 452 (eg, the 3RFIC 226 of FIG. 2) of (c) shown in FIG. 4A includes, for example, first and second solder bumps 440 -1, 440-2) may be electrically connected to the network layer 413. In other embodiments, various connection structures (eg solder or BGA) may be used instead of connections. The RFIC 452 may be electrically connected to the antenna element 436 through the first connection part 440 - 1 , the transmission line 423 , and the power supply part 425 . The RFIC 452 may also be electrically connected to the ground layer 433 through the second connection portion 440 - 2 and the conductive via 435 . Although not shown, the RFIC 452 may also be electrically connected to the above-mentioned module interface through the signal line 429 .

5 is a perspective view of an antenna structure according to various embodiments of the present disclosure.

Referring to FIG. 5 , an antenna structure 500 (eg, an antenna module) includes a substrate 590 (eg, a printed circuit board) and an antenna array AR, and a plurality of antennas disposed on the substrate 590. elements 510, 520, 530, and 540. According to one embodiment, the substrate 590 has a first surface 5901 facing a designated direction (eg, ① direction) and a second surface 5902 facing a direction opposite to the first surface 5901 (eg, ② direction). ) and a side surface 5903 surrounding a space between the first surface 5901 and the second surface 5902. According to one embodiment, the plurality of antenna elements 510, 520, 530, and 540 are disposed to be exposed on the first surface 5901, or between the first surface 5901 and the second surface 5902, It is disposed close to the first surface 5901 and may form a directional beam (eg, a beam pattern) in a direction toward which the first surface 5901 faces (eg, a ① direction). According to one embodiment, the plurality of antenna elements 510 , 520 , 530 , and 540 may include a plurality of conductive patches and/or a plurality of conductive patterns disposed on the substrate 590 .

According to various embodiments, the antenna structure 500 is disposed on the second side 5902 of the substrate 590 and electrically connected to the plurality of antenna elements 510, 520, 530, 540 and the wireless communication circuit 595. ) may be included. According to one embodiment, the radio communication circuitry 595 may be configured to transmit or receive radio frequencies in the range of about 3 GHz to 300 GHz via the antenna array (AR). In some embodiments, the wireless communication circuitry 595 is spaced apart from the substrate 590 in an interior space (eg, interior space 6001 in FIG. 6A ) of an electronic device (eg, electronic device 600 in FIG. 6A ). It may be disposed at a location and electrically connected to the substrate 590 through an electrical connection member (eg, FRC, flexible RF cable).

According to various embodiments, the wireless communication circuitry 595 electrically connected to the plurality of antenna elements 510, 520, 530, and 540 is an RFIC (eg, the RFICs 222, 224, 226, and/or 228 of FIG. 2). )) may be included. For example, the plurality of antenna elements 510, 520, 530, and 540 are disposed on one surface (eg, the first surface 5901) of the substrate 590 or embedded in a position close to the one surface, and the substrate ( An RFIC (eg, the RFICs 222, 224, 226, and/or 228 of FIG. 2) may be disposed on the other surface (eg, the second surface 5902) of the 590. According to one embodiment, the wireless communication circuitry 595 is configured to form a directional beam in a designated frequency band (eg, a frequency band ranging from about 3 GHz to 100 GHz) through the plurality of antenna elements 510, 520, 530, and 540. can be set.

According to various embodiments, the plurality of antenna elements 510, 520, 530, and 540 include a first antenna element 510, a second antenna element 520, and a third antenna element 530 spaced apart at designated intervals. Alternatively, the fourth antenna element 540 may be included. According to one embodiment, a plurality of antenna elements 510, 520, 530, and 540 may be arranged in a line. In some embodiments, the plurality of antenna elements 510, 520, 530, and 540 may be arranged to have a matrix form (eg, a 2x2 matrix form). According to one embodiment, the plurality of antenna elements 510, 520, 530, and 540 may have substantially the same shape. In some embodiments, antenna structure 500 may include, but is not limited to, an antenna array (AR) including four antenna elements 510, 520, 530, and 540. For example, the antenna structure 500 may include one antenna element, and may include two, three, or five or more antenna elements as an antenna array AR. In some embodiments, the antenna structure 500 may further include a plurality of conductive patterns (eg, a dipole antenna) disposed on the substrate 590 . In some embodiments, a plurality of conductive patterns (eg, a dipole antenna) may be formed on a plurality of antenna elements 510, 520, 530, 540 in a substrate 590 composed of a plurality of insulating layers (eg, dielectric layers). It may be disposed on the same insulating layer or different insulating layers. In some embodiments, the plurality of conductive patterns (eg, a dipole antenna) are formed in an area that does not overlap with the plurality of antenna elements 510, 520, 530, and 540 when the first surface 5901 is viewed from above. can be placed. In this case, the ground layer may not be disposed in a corresponding region of the substrate 590 on which the plurality of conductive patterns are disposed. In some embodiments, a plurality of conductive patterns (eg, a dipole antenna) may be disposed inside the substrate 590, and the plurality of antenna elements 510, 520, 530, and 540 may be disposed on an outer surface of the substrate 590. (eg, the first surface 5901) may be disposed to be exposed. In this case, the direction of the beam pattern formed through the conductive patterns may be formed in a different direction (eg, a vertical direction) from the direction of the beam pattern formed by the antenna array AR.

According to various embodiments, the antenna structure 500 may include at least one power feeding unit disposed on each of the plurality of antenna elements 510, 520, 530, and 540. According to one embodiment, the antenna array (AR) may be operated as a single polarization antenna or a dual polarization antenna through at least one feeder.

According to various embodiments, the antenna module 500 is disposed on the second side 5902 of the printed circuit board 590 and includes a protective member 596 disposed to at least partially enclose the wireless communication circuitry 595. can do. According to one embodiment, the protective member 596 is a protective layer disposed to surround the wireless communication circuit 595 and may include a dielectric that is hardened and/or solidified after being applied. According to one embodiment, the protection member 596 may include epoxy resin. According to one embodiment, the protection member 596 may be disposed to cover all or part of the wireless communication circuit 595 on the second surface 5902 of the printed circuit board 590 . According to one embodiment, the antenna module 500 may include a conductive shielding layer 597 laminated on a surface of the protection member 596 . According to one embodiment, the conductive shielding layer 597 may shield noise generated from the antenna module 500 (eg, DC-DC noise or an interference frequency component) from spreading to the surroundings. According to one embodiment, the conductive shielding layer 597 may include a conductive material applied on the surface of the protection member 596 by a thin film deposition method such as sputtering. According to one embodiment, the conductive shielding layer 597 may be electrically connected to the ground of the printed circuit board 590 . Alternatively, the protection member 596 and/or the conductive shielding layer 597 may be replaced with a shield can mounted on a printed circuit board.

6A is a configuration diagram of an electronic device in which an antenna structure according to various embodiments of the present disclosure is disposed. 6B is a partial cross-sectional view of an electronic device taken along line 6b-6b of FIG. 6A according to various embodiments of the present disclosure. 6C is a partial perspective view of an electronic device illustrating a disposition structure of a side member and an antenna structure according to various embodiments of the present disclosure.

The electronic device 600 of FIGS. 6A and 6B is at least partially similar to the electronic device 101 of FIG. 1 , the electronic device 200 of FIG. 2A , and/or the electronic device 300 of FIG. 3 , or other electronic devices. Examples may include.

FIG. 6A is a plan view of the back of the electronic device when the rear cover (eg, the rear cover 380 of FIG. 6B ) is removed.

6A to 6C, the electronic device 600 (eg, the electronic device 101 of FIG. 1, the electronic device 200 of FIG. 2A, and/or the electronic device 300 of FIG. 3) includes a front cover. 320 (eg, front plate 202 in FIG. 2A or front cover 320 in FIG. 3) (eg, first cover or first plate), rear cover 380 facing in the opposite direction to front cover 320 ) (eg, the rear plate 211 of FIG. 2A or the rear cover 380 of FIG. 3) (eg, the second cover or the second plate) and the inner space between the front cover 320 and the rear cover 330 ( housing 610 (eg, housing 310 in FIG. 3A) including a side member 620 (eg, side bezel structure 320 in FIG. 3A or side member 320 in FIG. 3C) surrounding 6001; (e.g. housing structure). According to one embodiment, the electronic device 600 may include a display 330 arranged to be visible from the outside through at least a portion of the front cover 320 in the inner space 6001 of the housing 610. . According to one embodiment, the display 330 is arranged to be supported through a support member 6211 (eg, the first support member 3211 of FIG. 3C) extending from the inner space 6001 from the side member 620. can According to one embodiment, the side member 620 may be at least partially formed of a conductive member 620a (eg, a metal material) and a non-conductive member 620b (eg, a polymer material). According to one embodiment, the side member 620 may be formed by injection molding or structural coupling of the non-conductive member 620b to the conductive member 620a.

According to various embodiments, the side member 620 includes a first side surface 6201 having a first length and a second length extending in a vertical direction from the first side surface 6201 and having a second length longer than the first length. side surface 6202, a third side surface 6203 extending in a direction parallel to the first side surface 6201 from the second side surface 6202 and having a first length, and a second side surface 6202 from the third side surface 6203 ) and may include a fourth side surface 6204 having a second length.

According to various embodiments, the electronic device 600 may include the antenna structure 500 disposed in the internal space 6001 . According to one embodiment, the antenna structure 500 may include an antenna array AR including a plurality of antenna elements (eg, the plurality of antenna elements 510, 520, 530, and 540 of FIG. 5). In addition, a directional beam may be formed in a direction toward which the second side surface 6202 faces (eg, an x-axis direction) and/or a direction toward which the rear cover 380 faces (eg, a -z-axis direction). According to one embodiment, the antenna structure 500 may be fixed to at least a portion of the side member 620 through a support bracket 550 (eg, a conductive support bracket). For example, the corresponding area of the side member 620 corresponding to the antenna structure 500 disposed in the internal space 6001 of the electronic device 600 is at least partially in order to form a beam pattern to the outside of the electronic device 600. It may be formed as a non-conductive member 620b. According to one embodiment, the antenna structure 500 may be connected to the device substrate 630 disposed in the internal space 6001 of the electronic device 600 through an electrical connection member (eg, FRC, flexible RF cable).

According to various embodiments, the electronic device 600 may include a device substrate 630 (PCB, printed circuit board) (eg, a printed circuit board or a main board) disposed in the internal space 6001 . According to one embodiment, the device substrate 630 may include at least one wireless communication circuit (eg, the wireless communication module 192 of FIG. 1 ) or a power supply unit. According to one embodiment, the device substrate 630 may be electrically connected to the antenna structure 500 through an electrical connection member 560 (eg, FRC, flexible RF cable). According to one embodiment, the electronic device 600 may include a battery B disposed near the device substrate 630 or disposed at least partially overlapping the device substrate 630 .

According to various embodiments, the antenna structure 500 forms a directional beam in a direction toward which the second side surface 6202 faces (eg, an x-axis direction) through a non-conductive portion disposed at a corresponding position of the side member 620. can be set. According to one embodiment, the side member 620 is a through-hole array (TA) including a plurality of through-holes 6231, 6232, 6233, and 6234 disposed at predetermined intervals at positions corresponding to the antenna structure 500. (through hole array) may be included. According to one embodiment, the plurality of through holes 6231 , 6232 , 6233 , and 6234 are located at locations corresponding to antenna elements (eg, antenna elements 510 , 520 , 530 , and 540 of FIG. 5 ), respectively. can be placed in According to one embodiment, the plurality of through holes 6231, 6232, 6233, and 6234 may be filled with a non-conductive member 620b.

According to exemplary embodiments of the present disclosure, the plurality of through holes 6231 , 6232 , 6233 , and 6234 may be formed in the conductive member 620a of the side member 620 . According to one embodiment, the plurality of through holes 6231, 6232, 6233, and 6234 are formed from the inner surface (eg, the inner surface 621 of FIG. 7) to the outer surface (eg, the outer surface 622 of FIG. 7) of the side member 620. )) can be formed in such a way as to penetrate. According to one embodiment, when viewed from the internal space 6001 of the electronic device 600, the first interval ( Example: The first interval d1 of FIG. 7 may be substantially identical to the respective intervals of the plurality of antenna elements (eg, the plurality of antenna elements 510, 520, 530, and 540 of FIG. 5). there is. According to an embodiment, when viewed from the outside of the electronic device 600, each of the plurality of through holes 6231, 6232, 6233, and 6234 has a second interval (eg, a second interval d2 in FIG. 7) may be formed larger than the first interval d1. For example, the plurality of through-holes 6231 , 6232 , 6233 , and 6234 may be inclined so that the distance from each other increases as they go outward from the inner space 6001 . Therefore, in a state in which the interval (eg, the first interval d1) between the plurality of antenna elements (eg, the plurality of antenna elements 510, 520, 530, and 540 of FIG. 5) is determined, the plurality of through-holes By forming the second interval d2 of ( 6231 , 6232 , 6233 , 6234 ) large, it can help improve radiation performance (eg, increase in gain) of the antenna. In some embodiments, in order to miniaturize the antenna structure 500, a distance between a plurality of antenna elements (eg, a plurality of antenna elements 510, 520, 530, and 540 of FIG. 5) (eg, a first distance ( Even if d)) is narrowed, since the second interval d2 of the plurality of through holes 6231 , 6232 , 6233 , and 6234 is relatively less narrowed, deterioration in radiation performance can be reduced.

Hereinafter, the arrangement relationship between the plurality of through holes 6231 , 6232 , 6233 , and 6234 and the antenna structure 500 will be described in detail.

7 is a partial configuration diagram of an electronic device showing a disposition structure of a side member and an antenna structure according to various embodiments of the present disclosure.

Referring to FIG. 7 , the electronic device 600 may include a side member 620 including a conductive member 620a. According to one embodiment, the electronic device 600 may include an antenna structure 500 disposed to face the side member 620 in an internal space. According to one embodiment, the antenna structure 500 may include a plurality of antenna elements 510 , 520 , 530 , and 540 disposed on the substrate 590 at a designated first interval d1 . According to one embodiment, the antenna structure 500 includes a plurality of through holes 6231 formed in the side member 620 through an antenna array AR formed of a plurality of antenna elements 510, 520, 530, and 540. , 6232, 6233, 6234) may be arranged so that a directional beam is formed from the inner surface 621 to the outer surface 622 in a direction (eg, an x-axis direction). For example, the first surface 5901 of the substrate 590 may face or be close to the inner surface 621 of the side member 620 .

According to various embodiments, the side member 620 may include a plurality of through holes 6231 , 6232 , 6233 , and 6234 formed through the conductive member 620a at a predetermined second interval d2 . According to one embodiment, the plurality of through holes 6231, 6232, 6233, and 6234 may be filled with a non-conductive member 620b. According to one embodiment, each of the plurality of through holes 6231 , 6232 , 6233 , and 6234 may be disposed at a position substantially corresponding to each of the plurality of antenna elements 510 , 520 , 530 , and 540 . For example, the first antenna element 510 corresponds to the first through hole 6231, the second antenna element 520 corresponds to the second through hole 6232, and the third antenna element 530 corresponds to the third through hole 6231. Corresponds to the through hole 6233, and the fourth antenna element 540 may be disposed to correspond to the fourth through hole 6234. According to one embodiment, the plurality of through holes 6231 , 6232 , 6233 , and 6234 are formed through the first opening 6231a visible from the inner surface 621 of the side member 620 and the outer surface 622 of the side member 620 . It may include a second opening 6231b visible from. According to one embodiment. The plurality of through holes 6231 , 6232 , 6233 , and 6234 may be formed to connect the first opening 6231a and the second opening 6231b through a conduit structure. According to one embodiment, the first opening 6231a and the second opening 6231b may have substantially the same size and shape. In some embodiments, the first opening 6231a and the second opening 6231b may have different sizes and shapes. According to one embodiment, the spacing of the first openings 6231a of the plurality of through holes 6231, 6232, 6233, and 6234 is equal to the first spacing d1 of the antenna elements 510, 520, 530, and 540. may be substantially the same as According to an embodiment, the second spacing d2 of the second openings 6231b of the plurality of through holes 6231, 6232, 6233, and 6234 may be larger than the first spacing d1. According to one embodiment, the plurality of through holes 6231 , 6232 , 6233 , and 6234 may have a changed pipe structure to form a second distance d2 larger than the first distance d1 . For example, the plurality of through holes 6231 , 6232 , 6233 , and 6234 may have a structure inclined left and right around the center CL of the antenna structure 500 . According to an embodiment, second intervals d2 of the second openings 6231b of each of the plurality of through holes 6231 , 6232 , 6233 , and 6234 may be substantially equal to each other. According to one embodiment, the first distance d1 means the distance between the centers of each of the antenna elements 510, 520, 530, and 540, and the second distance d2 is the outer surface 622 of the side member 620. ) may mean the distance between the centers of the second openings 6231b formed from each other. In some embodiments, the first spacing d1 may mean a spacing between feeders of each of the antenna elements 510, 520, 530, and 540. As another example, the first distance d1 may mean the distance between the centers of the first openings 6231a of each of the plurality of through holes 6231 , 6232 , 6233 , and 6234 .

According to various embodiments, the first through-hole 6231 disposed at the outermost part of the plurality of through-holes 6231, 6232, 6233, and 6234 is located at the center of the first opening 6231a and the second opening 6231b. The first imaginary line L1 connecting the center of may be formed so that the angle θ formed with respect to the second imaginary line L2 perpendicular to the substrate 590 has an inclination that does not exceed about 45 degrees. there is. Accordingly, the slope of the second through hole 6232 adjacent to the first through hole 6231 and closer to the center line CL passing through the center of the substrate may be less than that of the first through hole 6231 . According to one embodiment, the plurality of through-holes (6231, 6232, 6233, 6234), relative to the center line (CL) of the antenna structure 500, as the distance from the left and right, the formation angle (θ) of the conduit is can grow According to an embodiment, a fourth through hole disposed in an opposite direction to the first through hole 6231 with respect to the central line CL of the substrate 590 among the plurality of through holes 6231 , 6232 , 6233 , and 6234 The hole 6234 may also have a conduit structure having substantially the same inclination as the first through hole 6231 in the opposite direction.

According to various embodiments, a first interval d1 between the plurality of antenna elements 510, 520, 530, and 540 and a second interval d2 between the plurality of through holes 6231, 6232, 6233, and 6234 are Based on the operating frequency band of the antenna structure 500, it may be set not to exceed a maximum of λ/2. For example, when the second distance d2 is λ/2, the first distance is smaller than λ/2, and the length d of the substrate 590 is reduced, thereby helping to slim down the electronic device 600. can

8A to 8G are partial cross-sectional views of a side member including a plurality of through holes according to various embodiments of the present disclosure.

Referring to FIG. 8A , the electronic device 600 includes a side member 620 formed of a conductive member 620a and including a plurality of through-holes 6241 , 6242 , 6243 , and 6244 and the electronic device 600 . An antenna structure 500 disposed to correspond to the plurality of through holes 6241 , 6242 , 6243 , and 6244 in an internal space may be included. According to one embodiment, the plurality of through holes 6241, 6242, 6243, and 6244 may be filled with a non-conductive member 620b. According to one embodiment, the antenna structure 500 includes a first surface 5901 and a second surface 5902 facing in an opposite direction to the first surface 5901, and includes a plurality of antenna elements disposed in an internal space. (510, 520, 530, 540). According to one embodiment, the substrate 590 has a first surface (such that each of the plurality of antenna elements 510, 520, 530, and 540 corresponds to each of the plurality of through holes 6241, 6242, 6243, and 6244). 5901) may be positioned facing or adjacent to the side member 620.

According to various embodiments, the first antenna element 510 among the plurality of antenna elements 510, 520, 530, and 540 has a first through hole 6241 among the plurality of through holes 6241, 6242, 6243, and 6244. ), the second antenna element 520 is disposed at a position corresponding to the second through hole 6242, and the third antenna element 530 corresponds to the third through hole 6243. position, and the fourth antenna element 540 may be disposed at a position corresponding to the fourth through hole 6244.

According to various embodiments, the first through hole 6241 among the plurality of through holes 6241 , 6242 , 6243 , and 6244 is the first opening 6241a visible from the inner surface 621 of the side member 620 and the first through hole 6241a. A conduit structure connected to the opening 6241a may be formed and a second opening 6241b visible from the outer surface 622 of the side member 620 may be included. Although not coded, the second through hole 6242, the third through hole 6243, and the fourth through hole 6244 are also separated from the inner surface 621 of the side member 620 to the outer surface 622 except for the inclination of the pipe. ) may have a through structure penetrated up to. According to one embodiment, the plurality of through holes 6241 , 6242 , 6243 , and 6244 may be formed to have an inclination in a direction (eg, an x-axis direction) from the inner surface 621 to the outer surface 622 . In this case, the plurality of through holes 6241 , 6242 , 6243 , and 6244 may be formed stepwise to have at least one stepped portion.

In the description of FIGS. 8B to 8G , the same reference numerals are assigned to substantially the same components as those of FIG. 8A , and detailed descriptions thereof may be omitted.

Referring to FIG. 8B , the side member 620 may include a plurality of through holes 6241 , 6245 , 6246 , and 6244 disposed to correspond to each of the plurality of antenna elements 510 , 520 , 530 , and 540 . there is. According to one embodiment, the first through-hole 6241 and the fourth through-hole 6244 disposed at the outermost of the plurality of through-holes 6241, 6245, 6246, and 6244 have an outwardly inclined stepped pipe structure. can have According to one embodiment, among the plurality of through-holes 6241, 6245, 6246, and 6244, the second through-hole 6245 and the third through-hole 6246 disposed in the center are not inclined, and the inner surface 621 ) and a straight pipe structure formed in a direction perpendicular to the outer surface 622.\

Referring to FIG. 8C , the side member 620 may include a plurality of through holes 6231, 6245, 6246, and 6234 disposed to correspond to the plurality of antenna elements 510, 520, 530, and 540, respectively. there is. According to one embodiment, the first through hole 6231 and the fourth through hole 6234 disposed at the outermost of the plurality of through holes 6231, 6245, 6246, and 6234 form a straight pipe structure inclined outward. can have According to one embodiment, among the plurality of through-holes 6231, 6245, 6246, and 6234, the second through-hole 6245 and the third through-hole 6246 disposed in the center are not inclined, and the inner surface 621 ) And may have a straight pipe structure formed in a direction perpendicular to the outer surface 622.

Referring to FIG. 8D, the side member 620 includes a plurality of through holes 6241', 6242', 6243', and 6244' arranged to correspond to each of the plurality of antenna elements 510, 520, 530, and 540. can include According to one embodiment, the plurality of through-holes 6241', 6242', 6243', and 6244' may have a stepped pipe structure inclined left and right with respect to the center. According to one embodiment, the plurality of through-holes 6241', 6242', 6243', and 6244' are, when viewed from the inner surface 621 of the side member 620, the plurality of through-holes 6241' and 6242 ', 6243', and 6244' may each include one integrated first opening 6247. According to one embodiment, the plurality of through holes 6241 ', 6242', 6243', and 6244' are connected to the first opening 6247 when viewed from the outer surface 622 of the side member 620, Each of the plurality of through-holes 6241', 6242', 6243', and 6244' may have a plurality of divided second openings 6241b, 6242b, 6243b, and 6244b.

Referring to FIG. 8E, the side member 620 includes a plurality of through holes 6231', 6232', 6233', and 6234' arranged to correspond to each of the plurality of antenna elements 510, 520, 530, and 540. can include According to one embodiment, the plurality of through-holes 6231', 6232', 6233', and 6234' may have a straight pipe structure inclined left and right with respect to the center. According to one embodiment, the plurality of through-holes 6231', 6232', 6233', and 6234' are, when viewed from the inner surface 621 of the side member 620, the plurality of through-holes 6231' and 6232 ', 6233', and 6234' may each include one integrated first opening 6248. According to one embodiment, the plurality of through holes 6231 ', 6232', 6233', 6234' are connected to the first opening 6248 when viewed from the outer surface 622 of the side member 620, Each of the plurality of through holes 6231', 6232', 6233', and 6234' may have a plurality of divided second openings 6231b, 6232b, 6233b, and 6234b.

Referring to FIG. 8F , the electronic device 600, in the structure of the plurality of through holes 6231, 6232, 6233, and 6234 of FIG. 7, the dielectric cover 625 disposed on the outer surface 622 of the side member 620. ) may further include. According to one embodiment, the dielectric cover 625 may be disposed in a size capable of covering all of the plurality of through holes 6231 , 6232 , 6233 , and 6234 . According to one embodiment, the permittivity of the dielectric cover 625 may be different from or the same as that of the non-conductive member 620b. According to one embodiment, the permittivity of the dielectric cover 625 may be greater than that of the non-conductive member 620b. For example, the antenna gain may be determined through the permittivity of the non-conductive member 620b filling the plurality of through-holes 6231, 6232, 6233, and 6234, but there is a limit to applying an injection molding product having a high permittivity to the through-holes. , by inducing the non-conductive member 620b to operate as a high-dielectric through the dielectric cover 625, it is possible to help improve the gain of the antenna.

Referring to FIG. 8G , in the structure of the plurality of through holes 6241 , 6245 , 6246 , and 6244 of FIG. 8B , they may be disposed on the outer surface 622 of the side member 620 in substantially the same manner. Although not shown, the dielectric cover 625 may be disposed on the outer surface 622 of the side member 620 even in the plurality of through-hole structures of FIGS. 8C to 8F.

In some embodiments, the plurality of through holes may be formed to be tapered so that the volume of the space gradually widens from the inner surface 621 toward the outer surface 622 .

9 is a configuration diagram of a side member including a plurality of through holes according to various embodiments of the present disclosure.

Referring to FIG. 9 , the side member 620 may include a plurality of through holes 6261 , 6262 , 6263 , 6264 , and 6265 formed through the conductive member 620a. According to one embodiment, the plurality of through holes 6261, 6262, 6263, 6264, and 6265 may be formed through the conductive member 620a, filled through the non-conductive member 620b, or formed into cavities. can be formed According to one embodiment, as shown in (a), the plurality of through holes 6261 may be formed in a shape having a rectangular cross section. According to one embodiment, as shown in (b), the plurality of through holes 6262 may be formed in a shape having a circular cross section. According to one embodiment, as shown in (c), the plurality of through-holes 6263 may be formed in a rectangular shape in which each corner is curved in cross section. As shown in (d), the cross section of at least one through hole 6264 among the plurality of through holes 6264 and 6265 is formed in a first shape, and the other through holes 6265 have a different shape from the first shape. It may be formed in a second shape. Although not shown, cross sections of the plurality of through holes may be formed in various shapes not shown.

10 is diagrams comparing gain characteristics of antennas through through-holes according to various embodiments of the present disclosure and through-holes according to a comparative example.

Referring to FIG. 10 , a first interval (eg, a first interval of FIG. 7 ) of a plurality of antenna elements (eg, the plurality of antenna elements 510, 520, 530, and 540 of FIG. While the gain in the straight pipe structure in which the second spacing of the second openings of the plurality of through holes is determined to be substantially the same as d1) is 9.4 dBi ((a)), the plurality according to various embodiments of the present disclosure A plurality of through-holes to be larger than the first spacing (eg, the first spacing d1 in FIG. 7) of the antenna elements (eg, the plurality of antenna elements 510, 520, 530, and 540 in FIG. (Example: the plurality of through-holes 6231, 6232, 6233, 6234 in FIG. 7) of the second opening (eg, the second opening 6231b in FIG. 7) at a second interval (eg, the second opening in FIG. The gain in the conduit structure in which the interval (d2) is determined is 9.8 dBi ((b)), so it can be seen that the radiation performance of the antenna is excellent.

11 is a radiation pattern diagram comparing gain characteristics of antennas through through-holes according to various embodiments of the present disclosure and through-holes according to a comparative example.

Referring to FIG. 11 , a first interval (eg, a first interval of FIG. 7 ) of a plurality of antenna elements (eg, a plurality of antenna elements 510, 520, 530, and 540 of FIG. d1)), the plurality of antenna elements according to various embodiments of the present disclosure (eg : A plurality of through-holes (eg, in FIG. 7) larger than the first spacing (eg, the first spacing d1 in FIG. The second spacing (eg, second spacing d2 in FIG. 7) of the second openings (eg, second opening 6231b in FIG. 7) of the plurality of through holes 6231, 6232, 6233, and 6234 is It can be seen that the gain in the determined conduit structure ((b)) is more excellent in the radial direction (eg, x-axis direction) (region 1101).

12A to 12C are partial cross-sectional views of an electronic device including an antenna structure disposed using a plurality of through holes according to various embodiments of the present disclosure.

In the description of the electronic device of FIGS. 12A to 12C , the same reference numerals are assigned to components substantially the same as those of the electronic device of FIG. 6B , and detailed descriptions thereof may be omitted.

Referring to FIG. 12A , the electronic device 600 has a substrate 590 including an antenna array AR disposed on the side member 620 through the through-hole array TA disposed on the side member 620 toward the outer side toward which the side member 620 faces. It may be arranged to form a directional beam in a direction (eg, an x-axis direction). In this case, the wireless communication circuit 595 may be disposed on the device board 630, and the board 590 is connected through an electrical connection member 560 (eg, FRC) including the connector C, to the device board ( 630) may be electrically connected.

Referring to FIG. 12B , the electronic device 600 includes a first antenna structure 500 including a first substrate 590 on which a first antenna array AR1 is disposed, and a second antenna array AR2 disposed thereon. It may include a second antenna structure 500-1 including a second substrate 590-1 and an electrical connection member 561 connecting the first antenna structure 500 and the second antenna structure 500-1. can According to one embodiment, the first antenna structure 500 may be disposed to form a directional beam in an outward direction toward which the side member 620 faces (eg, an x-axis direction). According to one embodiment, the second antenna structure 500-1 may be arranged to form a directional beam in an outward direction toward which the rear cover 380 faces (eg, -z axis direction). In one embodiment, the wireless communication circuit 595 may be disposed on the second substrate 590-1. In some embodiments, wireless communication circuitry 595 may be disposed on first substrate 590 .

Referring to FIG. 12C , the electronic device 600 includes a first antenna structure 500 including a first substrate 590 on which a first antenna array AR1 is disposed, and a second antenna array AR2 disposed thereon. It may include a second antenna structure 500-1 including a second substrate 590-1 and an electrical connection member 560 connecting the first antenna structure 500 and the second antenna structure 500-1. can According to one embodiment, the second substrate 590 - 1 may be disposed on the device substrate 630 . According to one embodiment, the first substrate 590 may be electrically connected to the device substrate 630 through the electrical connection member 560 . According to one embodiment, the first antenna structure 500 may be disposed to form a directional beam in an outward direction toward which the side member 620 faces (eg, an x-axis direction). According to one embodiment, the second antenna structure 500-1 may be arranged to form a directional beam in an outward direction toward which the rear cover 380 faces (eg, -z axis direction). In this case, the wireless communication circuit 595 may be disposed on the device substrate 630 .

13A is a partial cross-sectional view of an electronic device including an antenna structure disposed using a plurality of through holes according to various embodiments of the present disclosure. 13B is a diagram illustrating a disposition structure of a side member including a plurality of through holes and an antenna structure according to various embodiments of the present disclosure.

Referring to FIGS. 13A and 13B , the electronic device 600 (eg, the electronic device 101 of FIG. 1 , the electronic device 200 of FIG. 2A , and/or the electronic device 300 of FIG. 3 ) includes a front cover. 320 (eg, front plate 202 in FIG. 2A or front cover 320 in FIG. 3) (eg, first cover or first plate), rear cover 380 facing in the opposite direction to front cover 320 ) (eg, the rear plate 211 of FIG. 2A or the rear cover 380 of FIG. 3) (eg, the second cover or the second plate) and the inner space between the front cover 320 and the rear cover 330 ( housing 610 (eg, housing 310 in FIG. 3A) including a side member 620 (eg, side bezel structure 320 in FIG. 3A or side member 320 in FIG. 3C) surrounding 6001; (e.g. housing structure). According to one embodiment, the electronic device 600 may include a display 330 arranged to be visible from the outside through at least a portion of the front cover 320 in the inner space 6001 of the housing 610. . According to one embodiment, the display 330 is arranged to be supported through a support member 6211 (eg, the first support member 3211 of FIG. 3C) extending from the inner space 6001 from the side member 620. can According to one embodiment, the side member 620 may be at least partially formed of a conductive member 620a (eg, a metal material) and a non-conductive member 620b (eg, a polymer material). According to one embodiment, the side member 620 may be formed by injection molding or structural coupling of the non-conductive member 620b to the conductive member 620a.

According to various embodiments, the electronic device 600 is disposed on a substrate 590 including a first surface 5901 and a second surface 5902 facing the opposite direction to the first surface 5901, and the substrate 590. An antenna structure including a first antenna array AR1 disposed close to the first surface 5901 and a second antenna array AR2 disposed close to the second surface 5902 based on the ground layer G. 500-2) may be included. According to one embodiment, the first antenna array AR1 and the second antenna array AR2 may include a plurality of antenna elements 510 , 520 , 530 , 540 , and 550 shown in FIG. 5 .

According to various embodiments, the electronic device 600 may include a through hole array TA formed through the conductive member 620a of the side member 620 . According to one embodiment, the through hole array TA may be filled with a non-conductive member 620b. According to an embodiment, the through-hole array TA includes a first opening 6271a and a first opening 6271a arranged to correspond to the first antenna array AR1 on the inner surface 621 of the side member 620. ) and may include a second opening 6271b formed on the outer surface 622 of the side member 620. The through hole array TA formed through the first opening 6271a and the second opening 6271b may be formed in a bent shape. Therefore, the first antenna array AR1 of the antenna structure 500-2 disposed to form a directional beam in the direction toward which the display 330 faces (eg, the z-axis direction) is formed through the through-hole array TA, A directional beam B1 may be formed in an outward direction toward which the member 620 faces (eg, an x-axis direction). According to one embodiment, the second antenna array AR2 of the antenna structure 500-2 may form a directional beam B2 in a direction toward which the rear cover 380 faces (eg, -z axis direction).

FIG. 13C is a view showing the electric field distribution of the antenna structure 500-2 of FIG. 13A according to various embodiments of the present disclosure, and the antenna structure 500-2 has a side member 620 through a through-hole array (TA). It can be seen that smooth radiation is achieved by forming an electric field distribution in a direction toward which the rear cover 380 faces (eg, an x-axis direction) and a direction toward which the rear cover 380 faces (eg, a -z-axis direction).

14A and 14B are partial cross-sectional views of an electronic device including an antenna structure disposed using a plurality of through holes according to various embodiments of the present disclosure.

Referring to FIG. 14A , the substrate 590 of the antenna structure 500 is disposed in various ways by changing the shape of the through hole 6281 formed in the side member 620, thereby helping to design the arrangement of the electronic device 600. can give For example, the through hole 6281 may include a first opening 6281a corresponding to the inner space 6001 and a second opening 6281b connected to the first opening 6281a and corresponding to the external environment. According to one embodiment, the through hole 6281 formed through the first opening 6281a and the second opening 6281b is formed in the direction the side member 620 faces (eg, x, even if the substrate 590 is obliquely disposed). axial direction) may have a structure in which a directional beam is formed. Through this structure, the substrate 590 of the antenna structure 500 is arranged to have an inclined structure inclined at a designated angle θ1 from the front cover 320, thereby helping to design the component arrangement of the electronic device 600. can

Referring to FIG. 14B , the electronic device 600 may include a through hole 6291 including a first opening 6291a corresponding to an internal space 6001 and a second opening 6291b corresponding to an external environment. there is. According to one embodiment, the second opening 6291b is formed in a diagonal direction between the direction the side member 620 faces (eg, the x-axis direction) and the direction the rear cover 380 faces (eg, the z-axis direction) ( ③ direction). As another example, the second opening 6291b may be filled with a non-conductive member 620b to have a shape corresponding to the shape of the side member 620 . According to one embodiment, the substrate 590 of the antenna structure 500 corresponding to the first opening 6291a may be disposed in a direction perpendicular to the front cover 320 . According to one embodiment, at least a portion of the second opening 6291b corresponds to the direction the side member 620 faces (eg, the x-axis direction), and the other part corresponds to the direction the rear cover 380 faces (eg, - z-axis direction). In this case, the antenna structure 500 is directed in the diagonal direction (③ direction) between the direction the side member 620 faces (eg, the x-axis direction) and the direction the rear cover 380 faces (eg, the z-axis direction). It can be set to form a directional beam.

15A to 15C are partial cross-sectional views of an electronic device including an antenna structure disposed using a plurality of through holes according to various embodiments of the present disclosure.

Referring to FIG. 15A , the electronic device 600 includes a first antenna structure 500 including a first substrate 590 on which the first antenna array AR1 is disposed and a second antenna array AR2 disposed thereon. A second antenna structure 500-1 including two substrates 590-1 may be included. According to one embodiment, the electronic device 600 is disposed in the inner space 6001, and has a first substrate surface 6301 and a second substrate surface 6302 facing in a direction opposite to the first substrate surface 6301. It may include a device substrate 630 including. According to one embodiment, the first substrate of the first antenna structure 500 may be disposed on the first substrate surface 6301 of the device substrate 630 . According to one embodiment, the second substrate 590 - 1 of the second antenna structure 500 - 1 may be disposed on the second substrate surface 6302 of the device substrate 630 . According to one embodiment, wireless communication circuitry 595 may be disposed on device substrate 630 .

According to various embodiments, the electronic device 600 may include a through hole 651 formed to connect the internal space 6001 and an external environment through the side member 620 . According to one embodiment, the through hole 651 is connected to the first opening 651a disposed to correspond to the first antenna structure 500 in the internal space 6001 and the first opening 651a, and is connected to the external environment. A second opening 651b arranged to correspond may be included. For example, the first antenna structure 500 disposed to form a directional beam in a direction toward which the display 330 faces (eg, a z-axis direction) passes through a through hole 651 in a direction toward which the side member 620 faces (eg, a z-axis direction). The directional beam B1 may be formed in the x-axis direction), and the second antenna structure 500-1 forms the directional beam B2 in the direction toward which the rear cover 380 is directed (eg - z-axis direction). can do.

Referring to FIGS. 15B and 15C , the electronic device 600 may further include a director 652 disposed between the first opening 651a and the second opening 651b. According to one embodiment, the director 652 may change the radiation direction of the directional beam B1 formed from the first antenna structure 500 . For example, as shown in FIG. 15B, the directional beam B1 radiated from the first antenna structure 500 passes through the director 652 in the direction the side member 620 faces (eg, the x-axis direction) and It may be formed in a diagonal direction (④ direction) between the rear cover 380 direction (eg, -z axis direction). As shown in FIG. 15C, the directional beam B1 radiated from the first antenna structure 500 passes through the director 652 in the direction the side member 620 faces (eg, the x-axis direction) and the front cover. 320 may be formed in a diagonal direction (⑤ direction) between directions (eg, z-axis direction).

16 is a partial cross-sectional view of an electronic device including an antenna structure disposed using a plurality of through holes according to various embodiments of the present disclosure.

In describing the electronic device 600 of FIG. 16 , the same reference numerals are assigned to components substantially the same as those of the electronic device 600 of FIG. 15A , and detailed description thereof may be omitted.

Referring to FIG. 16 , the electronic device 600 may include a through hole 653 including a first opening 653a corresponding to an internal space 6001 and a second opening 653b corresponding to an external environment. there is. According to one embodiment, the first substrate 590 of the first antenna structure 500 may be disposed to correspond to the first opening 653a. According to one embodiment, at least a portion of the second opening 653b corresponds to the direction the side member 620 faces (eg, the x-axis direction), and the other part corresponds to the direction the front cover 320 faces (eg, z-axis direction). axial direction). In this case, the antenna structure 500 forms a directional beam B1 in the direction the side member 620 faces (eg, the x-axis direction), and in the direction the front cover 320 faces (eg, the z-axis direction). , It may be set to form the directional beam B3 into the space 331 (eg, the BM area) between the display 330 and the side member 620 . For example, the space 331 between the display 330 and the side member 620 may include a non-conductive region through which radio waves emitted from the antenna structure 500 may pass. In some embodiments, the space 331 between the display 330 and the side member 620 is a non-conductive region in which at least a portion of a shielding member (eg, a conductive sheet layer) disposed on the rear surface of the display 330 is removed. may also include In some embodiments, a space between the display 330 and the side member 620 may include at least a portion of a non-conductive region of the display 330 made of a non-conductive material.

According to various embodiments, an electronic device (eg, the electronic device 600 of FIG. 7 ) may include an inner surface (eg, the inner surface 621 of FIG. 7 ) and an outer surface opposite to the inner surface (eg, the outer surface 622 of FIG. 7 ). ) A housing including a side member (eg, the side member 620 of FIG. 7 ) including a conductive member (eg, the conductive member 620a of FIG. 7 ) (eg, the housing 610 of FIG. 6A ) And, disposed in the inner space of the housing (eg, the inner space 6001 of FIG. 6A), a substrate (eg, the substrate 590 of FIG. 7) and a first interval (eg, the first gap in FIG. 7) An antenna structure (eg, the antenna structure 500 of FIG. 7 ) including a plurality of antenna elements (eg, the plurality of antenna elements 510, 520, 530, and 540 of FIG. 7) arranged to have a gap d1. )), and a plurality of through-holes (for example, the plurality of through-holes 6231, 6232, and 6233 of FIG. , 6234)) and a wireless communication circuit (eg, the wireless communication circuit 595 of FIG. 5) disposed in the inner space and set to transmit or receive a wireless signal in a designated frequency band through the antenna structure, wherein the The first openings formed on the inner surface of the plurality of through holes (eg, the first opening 6231a in FIG. 7 ) are arranged at the first interval, and the second openings formed on the outer surface of the plurality of through holes (eg, the second openings 6231b in FIG. 7 ) may be arranged at a second interval greater than the first interval (eg, the second interval d2 in FIG. 7 ).

According to various embodiments, the side member may at least partially include a non-conductive member, and the plurality of through holes may be filled with the non-conductive member.

According to various embodiments, the antenna structure may be arranged such that a directional beam is formed in a direction from the inner surface to the outer surface through the plurality of through holes.

According to various embodiments, the plurality of through-holes may be formed to have a pipe structure inclined from side to side with respect to the center of the antenna structure.

According to various embodiments, the second interval may be formed to have an interval of up to λ/2 based on the operating frequency band of the antenna structure.

According to various embodiments, inner surfaces of the plurality of through holes may be formed in a straight shape or at least one stepped shape.

According to various embodiments, the plurality of through holes may have a rectangular, circular or polygonal cross section.

According to various embodiments, the first opening and the second opening may be formed to have the same shape and/or size.

According to various embodiments, the plurality of through holes may be formed to be tapered such that a space volume increases as they progress from the inner surface to the outer surface.

According to various embodiments, in the outermost through hole among the plurality of through holes, a first imaginary line connecting the first opening and the second opening extends perpendicularly to the substrate; It may include an inclined pipe structure having an inclination that does not exceed 45 degrees based on the virtual line.

According to various embodiments, a dielectric cover disposed to cover the plurality of through holes may be included on the outer surface.

According to various embodiments, the dielectric cover may be formed of a material having a higher permittivity than that of the plurality of through holes.

According to various embodiments, second intervals of each of the plurality of through holes may be substantially the same.

According to various embodiments, the housing may include a front cover and a rear cover facing in an opposite direction to the front cover, and the side member may be disposed between the front cover and the rear cover.

According to various embodiments, at least a portion of the second opening may be formed in a direction toward which the rear cover faces.

According to various embodiments, a display disposed to be visible from the outside through at least a portion of the front cover may be included in the internal space.

According to various embodiments, at least a portion of the second opening may be formed to face a space between the display and the side member.

According to various embodiments, the space may include the BM area of the display.

According to various embodiments, the wireless communication circuit may be disposed on the substrate.

According to various embodiments, the designated frequency band may include a frequency band ranging from 3 GHz to 100 GHz.

And the embodiments of the present disclosure disclosed in the present specification and drawings are only presented as specific examples to easily explain the technical content according to the embodiments of the present disclosure and help understanding of the embodiments of the present disclosure, and do not cover the scope of the embodiments of the present disclosure. It is not meant to be limiting. Therefore, the scope of various embodiments of the present disclosure should be construed as including all changes or modified forms derived based on the technical spirit of various embodiments of the present disclosure in addition to the embodiments disclosed herein are included in the scope of various embodiments of the present disclosure. .

500: antenna structure 590: substrate
595: wireless communication circuit 600: electronic device
620: side member 620a: conductive member
620b: non-conductive member 630: device substrate
AR: antenna array TA: through-hole array

Claims (20)

In electronic devices,
a housing including a side member including an inner surface and a conductive member including an outer surface opposite to the inner surface;
an antenna structure disposed in the inner space of the housing and including a substrate and a plurality of antenna elements disposed on the substrate to have a first gap therebetween;
a plurality of through-holes penetrating from the inner surface to at least a part of the outer surface and formed in a number corresponding to the number of the plurality of antenna elements; and
A wireless communication circuit disposed in the inner space and configured to transmit or receive a radio signal in a designated frequency band through the antenna structure;
First openings formed on the inner surface of the plurality of through holes are arranged at the first interval,
The second openings formed on the outer surface of the plurality of through holes are arranged at a second interval greater than the first interval.
According to claim 1,
the side member at least partially comprises a non-conductive member;
The plurality of through holes are filled with the non-conductive member.
According to claim 1,
The antenna structure is arranged so that a directional beam is formed in a direction from the inner surface to the outer surface through the plurality of through holes.
According to claim 1,
The plurality of through holes are formed to have a pipe structure inclined left and right with respect to the center of the antenna structure.
According to claim 1,
The second interval is an electronic device formed to have a maximum interval of λ / 2 based on the operating frequency band of the antenna structure.
According to claim 1,
The electronic device of claim 1 , wherein inner surfaces of the plurality of through holes are formed in a straight shape or at least one stepped shape.
According to claim 1,
The electronic device of claim 1 , wherein the plurality of through holes have a rectangular, circular, or polygonal cross section.
According to claim 1,
The electronic device of claim 1 , wherein the first opening and the second opening are formed to have the same shape and/or size.
According to claim 1,
The electronic device of claim 1 , wherein the plurality of through-holes are formed to be tapered such that a space volume increases as they progress from the inner surface to the outer surface.
According to claim 1,
In the outermost through hole among the plurality of through holes, a first imaginary line connecting the first opening and the second opening is based on a second imaginary line extending perpendicularly to the substrate. An electronic device comprising an inclined conduit structure having an inclination not exceeding 45 degrees.
According to claim 1,
On the outer surface, a dielectric cover disposed to cover the plurality of through holes.
According to claim 11,
An electronic device formed of a material having a permittivity of the dielectric cover greater than a permittivity of the plurality of through holes.
According to claim 1,
The second interval of each of the plurality of through holes is substantially the same electronic device.
According to claim 1,
The housing includes a front cover and a rear cover facing in an opposite direction to the front cover,
The side member is disposed between the front cover and the rear cover.
According to claim 14,
At least a portion of the second opening is formed in a direction toward which the rear cover faces.
According to claim 14,
An electronic device comprising a display disposed in the inner space so as to be visible from the outside through at least a portion of the front cover.
According to claim 16,
At least a portion of the second opening is formed to face a space between the display and the side member.
According to claim 17,
The electronic device of claim 1 , wherein the space includes a BM area of the display.
According to claim 1,
The wireless communication circuit is disposed on the board.
According to claim 1,
The designated frequency band is an electronic device including a frequency band in the range of 3 GHz to 100 GHz.

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