KR20230050416A - 도전성 페이스트 및 도전막 - Google Patents

도전성 페이스트 및 도전막 Download PDF

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Publication number
KR20230050416A
KR20230050416A KR1020237008533A KR20237008533A KR20230050416A KR 20230050416 A KR20230050416 A KR 20230050416A KR 1020237008533 A KR1020237008533 A KR 1020237008533A KR 20237008533 A KR20237008533 A KR 20237008533A KR 20230050416 A KR20230050416 A KR 20230050416A
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KR
South Korea
Prior art keywords
tannic acid
conductive paste
mass
conductive
less
Prior art date
Application number
KR1020237008533A
Other languages
English (en)
Korean (ko)
Inventor
뎃페이 니시카와
노부히토 하마다
신야 다나카
시즈오 사카이
신야 고가
Original Assignee
고오 가가쿠고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 고오 가가쿠고교 가부시키가이샤 filed Critical 고오 가가쿠고교 가부시키가이샤
Publication of KR20230050416A publication Critical patent/KR20230050416A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/205—Compounds containing groups, e.g. carbamates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L97/00—Compositions of lignin-containing materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Conductive Materials (AREA)
KR1020237008533A 2020-09-10 2021-09-07 도전성 페이스트 및 도전막 KR20230050416A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020152421 2020-09-10
JPJP-P-2020-152421 2020-09-10
PCT/JP2021/032755 WO2022054774A1 (ja) 2020-09-10 2021-09-07 導電性ペースト及び導電膜

Publications (1)

Publication Number Publication Date
KR20230050416A true KR20230050416A (ko) 2023-04-14

Family

ID=80632400

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237008533A KR20230050416A (ko) 2020-09-10 2021-09-07 도전성 페이스트 및 도전막

Country Status (5)

Country Link
JP (1) JPWO2022054774A1 (zh)
KR (1) KR20230050416A (zh)
CN (1) CN116323749A (zh)
TW (1) TW202217859A (zh)
WO (1) WO2022054774A1 (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008130301A (ja) 2006-11-20 2008-06-05 Sumitomo Bakelite Co Ltd 導電性銅ペースト
JP2014011006A (ja) 2012-06-29 2014-01-20 Arakawa Chem Ind Co Ltd 導電性ペースト

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05135619A (ja) * 1991-11-13 1993-06-01 Kao Corp 導電性銅ペーストの製造方法および該方法により得られる導電性銅ペースト
JPH06215631A (ja) * 1993-01-19 1994-08-05 Ajinomoto Co Inc 繊維状導電性物質及びこれを含有する導電性樹脂組成物
JPH1074661A (ja) * 1996-08-30 1998-03-17 Matsushita Electric Ind Co Ltd 電子部品の製造方法とそれに用いる導電性ペースト
KR100619638B1 (ko) * 2002-05-14 2006-09-08 신닛뽄세이테쯔 카부시키카이샤 성형 가공부의 내식성이 우수한 용접 가능한 피복 금속재
WO2006093398A1 (en) * 2005-03-04 2006-09-08 Inktec Co., Ltd. Conductive inks and manufacturing method thereof
KR100727434B1 (ko) * 2005-03-04 2007-06-13 주식회사 잉크테크 투명 은 잉크 조성물 및 이를 이용한 박막 형성방법
CN104123974B (zh) * 2014-01-21 2015-11-04 深圳唯一科技股份有限公司 一种手机触摸屏用导电浆料及其制备方法
JP6404614B2 (ja) * 2014-06-25 2018-10-10 古河機械金属株式会社 コアシェル型金属微粒子の製造方法、コアシェル型金属微粒子、導電性インクおよび基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008130301A (ja) 2006-11-20 2008-06-05 Sumitomo Bakelite Co Ltd 導電性銅ペースト
JP2014011006A (ja) 2012-06-29 2014-01-20 Arakawa Chem Ind Co Ltd 導電性ペースト

Also Published As

Publication number Publication date
JPWO2022054774A1 (zh) 2022-03-17
CN116323749A (zh) 2023-06-23
TW202217859A (zh) 2022-05-01
WO2022054774A1 (ja) 2022-03-17

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