KR20230045037A - 배선 형성용 부재, 배선 형성용 부재를 이용한 배선층의 형성 방법, 및, 배선 형성 부재 - Google Patents

배선 형성용 부재, 배선 형성용 부재를 이용한 배선층의 형성 방법, 및, 배선 형성 부재 Download PDF

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Publication number
KR20230045037A
KR20230045037A KR1020237006745A KR20237006745A KR20230045037A KR 20230045037 A KR20230045037 A KR 20230045037A KR 1020237006745 A KR1020237006745 A KR 1020237006745A KR 20237006745 A KR20237006745 A KR 20237006745A KR 20230045037 A KR20230045037 A KR 20230045037A
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KR
South Korea
Prior art keywords
wiring
layer
metal foil
forming
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020237006745A
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English (en)
Korean (ko)
Inventor
히로유키 이자와
히카리 무라이
노조무 다카노
구니히코 아카이
유카 이토
마사시 오코시
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to KR1020257041413A priority Critical patent/KR20260003851A/ko
Publication of KR20230045037A publication Critical patent/KR20230045037A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H01L23/12—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4658—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern characterized by laminating a prefabricated metal foil pattern, e.g. by transfer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020237006745A 2020-08-07 2021-08-06 배선 형성용 부재, 배선 형성용 부재를 이용한 배선층의 형성 방법, 및, 배선 형성 부재 Ceased KR20230045037A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020257041413A KR20260003851A (ko) 2020-08-07 2021-08-06 배선 형성용 부재, 배선 형성용 부재를 이용한 배선층의 형성 방법, 및, 배선 형성 부재

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-135143 2020-08-07
JP2020135143 2020-08-07
PCT/JP2021/029403 WO2022030634A1 (ja) 2020-08-07 2021-08-06 配線形成用部材、配線形成用部材を用いた配線層の形成方法、及び、配線形成部材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020257041413A Division KR20260003851A (ko) 2020-08-07 2021-08-06 배선 형성용 부재, 배선 형성용 부재를 이용한 배선층의 형성 방법, 및, 배선 형성 부재

Publications (1)

Publication Number Publication Date
KR20230045037A true KR20230045037A (ko) 2023-04-04

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ID=80118187

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020237006745A Ceased KR20230045037A (ko) 2020-08-07 2021-08-06 배선 형성용 부재, 배선 형성용 부재를 이용한 배선층의 형성 방법, 및, 배선 형성 부재
KR1020257041413A Pending KR20260003851A (ko) 2020-08-07 2021-08-06 배선 형성용 부재, 배선 형성용 부재를 이용한 배선층의 형성 방법, 및, 배선 형성 부재

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020257041413A Pending KR20260003851A (ko) 2020-08-07 2021-08-06 배선 형성용 부재, 배선 형성용 부재를 이용한 배선층의 형성 방법, 및, 배선 형성 부재

Country Status (6)

Country Link
US (1) US20230328897A1 (https=)
JP (1) JP7771959B2 (https=)
KR (2) KR20230045037A (https=)
CN (1) CN116420225A (https=)
TW (1) TWI898012B (https=)
WO (1) WO2022030634A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118661476A (zh) * 2022-02-09 2024-09-17 株式会社力森诺科 配线形成用部件、使用了配线形成用部件的配线层的形成方法及配线形成部件

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012191204A (ja) 2011-03-11 2012-10-04 Ibiden Co Ltd プリント配線板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09300632A (ja) * 1996-05-09 1997-11-25 Ricoh Co Ltd インクジェット記録装置
JPH1167410A (ja) * 1997-08-18 1999-03-09 Hitachi Chem Co Ltd 異方導電性接着フィルムの製造方法
JP2011049612A (ja) 2006-01-16 2011-03-10 Hitachi Chem Co Ltd 太陽電池モジュールの製造方法
JP2008235007A (ja) * 2007-03-20 2008-10-02 Sumitomo Electric Ind Ltd 異方導電シート、異方導電シートで接続された配線板体、配線板接続体および配線板モジュール
EP2146355A1 (en) * 2007-05-09 2010-01-20 Hitachi Chemical Company, Ltd. Conductor connection member, connection structure, and solar cell module
CN101669258B (zh) * 2007-05-09 2016-04-13 日立化成株式会社 导电体的连接方法、导电体连接用部件、连接结构及太阳能电池模块
JP5622137B2 (ja) 2007-10-29 2014-11-12 デクセリアルズ株式会社 電気的接続体及びその製造方法
CN209693203U (zh) * 2016-12-27 2019-11-26 株式会社村田制作所 多层基板及电子设备
JPWO2018147424A1 (ja) * 2017-02-13 2019-12-12 タツタ電線株式会社 プリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012191204A (ja) 2011-03-11 2012-10-04 Ibiden Co Ltd プリント配線板の製造方法

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Publication number Publication date
JP7771959B2 (ja) 2025-11-18
TWI898012B (zh) 2025-09-21
WO2022030634A1 (ja) 2022-02-10
JPWO2022030634A1 (https=) 2022-02-10
US20230328897A1 (en) 2023-10-12
KR20260003851A (ko) 2026-01-07
CN116420225A (zh) 2023-07-11
TW202209949A (zh) 2022-03-01

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