KR20220140865A - 사전 형성된 종단을 갖는 인덕터 및 이를 제조하기 위한 방법 및 어셈블리 - Google Patents

사전 형성된 종단을 갖는 인덕터 및 이를 제조하기 위한 방법 및 어셈블리 Download PDF

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Publication number
KR20220140865A
KR20220140865A KR1020227034072A KR20227034072A KR20220140865A KR 20220140865 A KR20220140865 A KR 20220140865A KR 1020227034072 A KR1020227034072 A KR 1020227034072A KR 20227034072 A KR20227034072 A KR 20227034072A KR 20220140865 A KR20220140865 A KR 20220140865A
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KR
South Korea
Prior art keywords
inductor
conductive coil
terminal leads
inductor body
leads
Prior art date
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Pending
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KR1020227034072A
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English (en)
Korean (ko)
Inventor
벤자민 엠. 한슨
타일러 위첼
Original Assignee
비쉐이 데일 일렉트로닉스, 엘엘씨
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Application filed by 비쉐이 데일 일렉트로닉스, 엘엘씨 filed Critical 비쉐이 데일 일렉트로닉스, 엘엘씨
Publication of KR20220140865A publication Critical patent/KR20220140865A/ko
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/255—Magnetic cores made from particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H01F27/2852—Construction of conductive connections, of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206—Manufacturing of magnetic cores by mechanical means
    • H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Of Transformers For General Uses (AREA)
KR1020227034072A 2020-03-03 2021-03-02 사전 형성된 종단을 갖는 인덕터 및 이를 제조하기 위한 방법 및 어셈블리 Pending KR20220140865A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202062984584P 2020-03-03 2020-03-03
US62/984,584 2020-03-03
US17/187,161 US12567533B2 (en) 2020-03-03 2021-02-26 Inductor with preformed termination and method and assembly for making the same
US17/187,161 2021-02-26
PCT/US2021/020488 WO2021178415A1 (en) 2020-03-03 2021-03-02 Inductor with preformed termination and method and assembly for making the same

Publications (1)

Publication Number Publication Date
KR20220140865A true KR20220140865A (ko) 2022-10-18

Family

ID=77556324

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227034072A Pending KR20220140865A (ko) 2020-03-03 2021-03-02 사전 형성된 종단을 갖는 인덕터 및 이를 제조하기 위한 방법 및 어셈블리

Country Status (8)

Country Link
US (1) US12567533B2 (https=)
EP (1) EP4107766A4 (https=)
JP (2) JP7792341B2 (https=)
KR (1) KR20220140865A (https=)
CN (1) CN115244633A (https=)
IL (1) IL296046A (https=)
MX (1) MX2022010994A (https=)
WO (1) WO2021178415A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022085511A1 (ja) * 2020-10-21 2022-04-28 パナソニックＩｐマネジメント株式会社 インダクタ及びインダクタの製造方法
US11948724B2 (en) 2021-06-18 2024-04-02 Vishay Dale Electronics, Llc Method for making a multi-thickness electro-magnetic device
FR3130082A1 (fr) * 2021-12-07 2023-06-09 Valeo Systemes De Controle Moteur Composant électrique pour machine électrique
WO2023163168A1 (ja) * 2022-02-28 2023-08-31 パナソニックＩｐマネジメント株式会社 インダクタ
DE102022204625A1 (de) * 2022-05-11 2023-11-16 Würth Elektronik eiSos Gmbh & Co. KG Induktives Bauelement
CN115691992A (zh) * 2022-11-03 2023-02-03 苏州鸣动智能设备有限公司 一种电感生产线及其生产方法
DE102022134934A1 (de) * 2022-12-28 2024-07-04 Tdk Electronics Ag Induktives Bauelement, Mold-Werkzeug und Verfahren zum Einbetten

Family Cites Families (287)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1085437A (en) 1912-02-06 1914-01-27 Friedrich August Volkmar Klopfer Manufacture of milled soap.
US2497516A (en) 1944-04-22 1950-02-14 Metropolitan Eng Co Electrical winding
US2889525A (en) 1954-12-13 1959-06-02 Central Transformer Corp Three-phase core for transformers
US3169234A (en) 1959-08-17 1965-02-09 Coileraft Inc Coil form, and coils and transformers mounted thereto
FR1392548A (fr) 1964-01-10 1965-03-19 Comp Generale Electricite Enroulement à haute tension d'appareil électrique statique
US3668586A (en) 1971-03-08 1972-06-06 Electronic Associates Transformer-inductor frame and kit
GB1440343A (en) 1973-04-13 1976-06-23 Data Recording Instr Co Magnetic core and coil assemblies
US3958328A (en) 1975-06-02 1976-05-25 Essex International, Inc. Method of making a transformer coil assembly
US4180450A (en) 1978-08-21 1979-12-25 Vac-Tec Systems, Inc. Planar magnetron sputtering device
US4413161A (en) 1980-02-09 1983-11-01 Nippon Gakki Seizo Kabushiki Kaisha Electro-acoustic transducer
US4901048A (en) 1985-06-10 1990-02-13 Williamson Windings Inc. Magnetic core multiple tap or windings devices
JPH0236013A (ja) 1988-06-20 1990-02-06 Soc Gen Tech Nouv (Sgn) バック刃とその配置器具を備える照射燃料要素用の切断ボックス
US6026311A (en) 1993-05-28 2000-02-15 Superconductor Technologies, Inc. High temperature superconducting structures and methods for high Q, reduced intermodulation resonators and filters
DE3912840A1 (de) 1989-04-19 1990-10-25 Foerster Inst Dr Friedrich Suchspulenanordnung fuer ein induktives suchgeraet
US5468681A (en) 1989-08-28 1995-11-21 Lsi Logic Corporation Process for interconnecting conductive substrates using an interposer having conductive plastic filled vias
USD340692S (en) 1989-11-27 1993-10-26 Nec Corporation Electrolytic capacitor
JPH03171793A (ja) 1989-11-30 1991-07-25 Yokogawa Electric Corp 面実装部品の半田付け方法
JPH03171703A (ja) 1989-11-30 1991-07-25 Tokin Corp トランスフォーマー
US5010314A (en) 1990-03-30 1991-04-23 Multisource Technology Corp. Low-profile planar transformer for use in off-line switching power supplies
JPH0459396A (ja) 1990-06-29 1992-02-26 Yoshikazu Kimura 情報通信体の製法とその素材
US5126715A (en) 1990-07-02 1992-06-30 General Electric Company Low-profile multi-pole conductive film transformer
JPH04129206A (ja) 1990-09-19 1992-04-30 Toshiba Corp 薄形変圧器
US5530308A (en) 1992-02-18 1996-06-25 General Electric Company Electromagnetic pump stator coil
JPH05258959A (ja) 1992-03-10 1993-10-08 Mitsubishi Electric Corp 信号弁別器
US5801432A (en) 1992-06-04 1998-09-01 Lsi Logic Corporation Electronic system using multi-layer tab tape semiconductor device having distinct signal, power and ground planes
JP2886005B2 (ja) 1992-10-12 1999-04-26 松下電器産業株式会社 Ｌｃフィルタ
JP2697548B2 (ja) 1993-03-26 1998-01-14 松下電器産業株式会社 インダクタンス部品の製造方法
DE69323383T2 (de) * 1992-10-12 1999-06-10 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka Verfahren zur Herstellung eines elektronischen Bauelementes
JPH0655211U (ja) 1993-01-09 1994-07-26 東光株式会社 ノイズフィルタ
JPH0655215U (ja) 1993-01-11 1994-07-26 株式会社トーキン インダクタ
US5773886A (en) 1993-07-15 1998-06-30 Lsi Logic Corporation System having stackable heat sink structures
NO950083L (no) 1994-01-10 1995-07-11 Hughes Aircraft Co Helisk induksjonsspole samt fremgangsmåte for dens fremstilling
US5844451A (en) 1994-02-25 1998-12-01 Murphy; Michael T. Circuit element having at least two physically separated coil-layers
JPH07245217A (ja) 1994-03-03 1995-09-19 Tdk Corp インダクタンス素子及び該素子用コイル
JPH07273292A (ja) 1994-03-31 1995-10-20 Matsushita Electron Corp 半導体集積回路
US5481238A (en) 1994-04-19 1996-01-02 Argus Technologies Ltd. Compound inductors for use in switching regulators
US5451914A (en) 1994-07-05 1995-09-19 Motorola, Inc. Multi-layer radio frequency transformer
JP3497276B2 (ja) 1994-07-20 2004-02-16 松下電器産業株式会社 インダクタンス素子とその製造方法
FR2733630B1 (fr) 1995-04-27 1997-05-30 Imphy Sa Pattes de connexion pour composant electronique
US7034645B2 (en) 1999-03-16 2006-04-25 Vishay Dale Electronics, Inc. Inductor coil and method for making same
US7263761B1 (en) 1995-07-18 2007-09-04 Vishay Dale Electronics, Inc. Method for making a high current low profile inductor
US6198375B1 (en) 1999-03-16 2001-03-06 Vishay Dale Electronics, Inc. Inductor coil structure
US7921546B2 (en) 1995-07-18 2011-04-12 Vishay Dale Electronics, Inc. Method for making a high current low profile inductor
CA2180992C (en) 1995-07-18 1999-05-18 Timothy M. Shafer High current, low profile inductor and method for making same
JPH09213530A (ja) 1996-01-30 1997-08-15 Alps Electric Co Ltd 平面トランス
US6078502A (en) 1996-04-01 2000-06-20 Lsi Logic Corporation System having heat dissipating leadframes
JPH09306757A (ja) 1996-05-14 1997-11-28 Sumitomo Special Metals Co Ltd 低背型コイル及び磁性製品
JP2978117B2 (ja) 1996-07-01 1999-11-15 ティーディーケイ株式会社 つぼ型コアを用いた面実装部品
USD390825S (en) 1996-07-25 1998-02-17 James Chen Casing for transformer
US7362015B2 (en) 1996-07-29 2008-04-22 Iap Research, Inc. Apparatus and method for making an electrical component
US5781093A (en) 1996-08-05 1998-07-14 International Power Devices, Inc. Planar transformer
SE9704413D0 (sv) 1997-02-03 1997-11-28 Asea Brown Boveri Krafttransformator/reaktor
USD421595S (en) 1997-05-06 2000-03-14 Steve M. Davis Vehicle distributor coil cover
US6144269A (en) 1997-06-10 2000-11-07 Fuji Electric Co., Ltd. Noise-cut LC filter for power converter with overlapping aligned coil patterns
US5917396A (en) 1997-08-04 1999-06-29 Halser, Iii; Joseph G. Wideband audio output transformer with high frequency balanced winding
CN1241409C (zh) 1997-08-29 2006-02-08 松下电器产业株式会社 静态图象播放装置
US6114932A (en) 1997-12-12 2000-09-05 Telefonaktiebolaget Lm Ericsson Inductive component and inductive component assembly
US6137237A (en) 1998-01-13 2000-10-24 Fusion Lighting, Inc. High frequency inductive lamp and power oscillator
TW416067B (en) 1998-02-27 2000-12-21 Tdk Corp Pot-core components for planar mounting
US6087922A (en) 1998-03-04 2000-07-11 Astec International Limited Folded foil transformer construction
US6222437B1 (en) 1998-05-11 2001-04-24 Nidec America Corporation Surface mounted magnetic components having sheet material windings and a power supply including such components
JP3469464B2 (ja) 1998-05-22 2003-11-25 東光株式会社 インバータトランス
US6081416A (en) 1998-05-28 2000-06-27 Trinh; Hung Lead frames for mounting ceramic electronic parts, particularly ceramic capacitors, where the coefficient of thermal expansion of the lead frame is less than that of the ceramic
US6255725B1 (en) 1998-05-28 2001-07-03 Shinko Electric Industries Co., Ltd. IC card and plane coil for IC card
JP3306377B2 (ja) 1998-06-26 2002-07-24 東光株式会社 インバータトランス
US6409859B1 (en) 1998-06-30 2002-06-25 Amerasia International Technology, Inc. Method of making a laminated adhesive lid, as for an Electronic device
TW462131B (en) 1998-07-08 2001-11-01 Winbond Electronics Corp Assembling type inductive devices
JP2000091133A (ja) 1998-09-10 2000-03-31 Oki Electric Ind Co Ltd トランスの端子構造及びその端子の形成方法
US6372348B1 (en) 1998-11-23 2002-04-16 Hoeganaes Corporation Annealable insulated metal-based powder particles
US6392525B1 (en) 1998-12-28 2002-05-21 Matsushita Electric Industrial Co., Ltd. Magnetic element and method of manufacturing the same
JP2000323336A (ja) 1999-03-11 2000-11-24 Taiyo Yuden Co Ltd インダクタ及びその製造方法
JP3680627B2 (ja) 1999-04-27 2005-08-10 富士電機機器制御株式会社 ノイズフィルタ
CN1161880C (zh) 1999-09-21 2004-08-11 株式会社村田制作所 电感电容滤波器
US6351033B1 (en) 1999-10-06 2002-02-26 Agere Systems Guardian Corp. Multifunction lead frame and integrated circuit package incorporating the same
EP1091369A3 (en) 1999-10-07 2002-04-17 Lucent Technologies Inc. Low profile transformer and method for making a low profile transformer
US6204745B1 (en) 1999-11-15 2001-03-20 International Power Devices, Inc. Continuous multi-turn coils
AUPQ637600A0 (en) 2000-03-21 2000-04-15 Metal Manufactures Limited A superconducting transformer
JP4684461B2 (ja) 2000-04-28 2011-05-18 パナソニック株式会社 磁性素子の製造方法
JP2001332430A (ja) 2000-05-22 2001-11-30 Murata Mfg Co Ltd トランス
JP2001345212A (ja) 2000-05-31 2001-12-14 Tdk Corp 積層電子部品
JP2002036013A (ja) 2000-07-27 2002-02-05 Kitagawa Iron Works Co Ltd チャック用電動操作装置
FR2812755B1 (fr) 2000-08-04 2002-10-31 St Microelectronics Sa Inductance integree
AR033569A1 (es) 2000-09-14 2003-12-26 Rohm & Haas Una composicion que comprende un copolimero tipo peine, un proceso para formar una capa de material de revestimiento solida, un compuesto polimerico de capas multiples, y un proceso de coextrusion para formar el compuesto.
US6456184B1 (en) 2000-12-29 2002-09-24 Abb Inc. Reduced-cost core for an electrical-power transformer
JP2002324714A (ja) 2001-02-21 2002-11-08 Tdk Corp コイル封入圧粉磁芯およびその製造方法
ATE255271T1 (de) 2001-06-21 2003-12-15 Magnetek Spa Kreisförmige flachspulen sowie induktives bauelement, welches mit einer oder mehreren dieser spulen hergestellt wird
US6856007B2 (en) 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
US7176506B2 (en) 2001-08-28 2007-02-13 Tessera, Inc. High frequency chip packages with connecting elements
TW550997B (en) 2001-10-18 2003-09-01 Matsushita Electric Industrial Co Ltd Module with built-in components and the manufacturing method thereof
JP2003171793A (ja) 2001-12-06 2003-06-20 Fuji Kogyo Co Ltd アルミニウム合金上への陽極酸化皮膜の形成方法
US6734074B2 (en) 2002-01-24 2004-05-11 Industrial Technology Research Institute Micro fabrication with vortex shaped spirally topographically tapered spirally patterned conductor layer and method for fabrication thereof
JP2003229311A (ja) 2002-01-31 2003-08-15 Tdk Corp コイル封入圧粉磁芯およびその製造方法、コイルおよびその製造方法
US6621140B1 (en) 2002-02-25 2003-09-16 Rf Micro Devices, Inc. Leadframe inductors
JP4049246B2 (ja) 2002-04-16 2008-02-20 Ｔｄｋ株式会社 コイル封入型磁性部品及びその製造方法
JP2003324017A (ja) 2002-04-30 2003-11-14 Koito Mfg Co Ltd トランス
JP2003347125A (ja) 2002-05-27 2003-12-05 Sansha Electric Mfg Co Ltd コイル
JP4178004B2 (ja) 2002-06-17 2008-11-12 アルプス電気株式会社 磁気素子及びインダクタ及びトランス
US6940154B2 (en) 2002-06-24 2005-09-06 Asat Limited Integrated circuit package and method of manufacturing the integrated circuit package
US20040232982A1 (en) 2002-07-19 2004-11-25 Ikuroh Ichitsubo RF front-end module for wireless communication devices
CA2394403C (en) 2002-07-22 2012-01-10 Celestica International Inc. Component substrate for a printed circuit board and method of assemblying the substrate and the circuit board
TW553465U (en) 2002-07-25 2003-09-11 Micro Star Int Co Ltd Integrated inductor
JP2004087607A (ja) 2002-08-23 2004-03-18 Alps Electric Co Ltd 磁気素子
US6985062B2 (en) 2002-09-13 2006-01-10 Matsushita Electric Industrial Co., Ltd. Coil component and method of producing the same
JP2004140006A (ja) 2002-10-15 2004-05-13 Minebea Co Ltd コモンモードチョークコイル及びラインフィルタ
US6873239B2 (en) 2002-11-01 2005-03-29 Metglas Inc. Bulk laminated amorphous metal inductive device
JP2004174797A (ja) 2002-11-26 2004-06-24 Fuji Xerox Co Ltd 印刷制御プログラム、印刷制御システム及び印刷制御方法
US7292128B2 (en) 2002-12-19 2007-11-06 Cooper Technologies Company Gapped core structure for magnetic components
US6933895B2 (en) 2003-02-14 2005-08-23 E-Tenna Corporation Narrow reactive edge treatments and method for fabrication
JP2004266120A (ja) 2003-03-03 2004-09-24 Matsushita Electric Ind Co Ltd チョークコイルおよびそれを用いた電子機器
TW200419603A (en) 2003-03-25 2004-10-01 Cyntec Co Ltd Choke and manufacturing method thereof
US7126443B2 (en) 2003-03-28 2006-10-24 M/A-Com, Eurotec, B.V. Increasing performance of planar inductors used in broadband applications
US6879238B2 (en) 2003-05-28 2005-04-12 Cyntec Company Configuration and method for manufacturing compact high current inductor coil
US7041937B2 (en) 2003-06-04 2006-05-09 Illinois Tool Works Inc. Wire feeder operable with lower minimum input voltage requirement
US20050007232A1 (en) 2003-06-12 2005-01-13 Nec Tokin Corporation Magnetic core and coil component using the same
US7307502B2 (en) 2003-07-16 2007-12-11 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US7489219B2 (en) 2003-07-16 2009-02-10 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US7023313B2 (en) 2003-07-16 2006-04-04 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
JP2005109290A (ja) 2003-10-01 2005-04-21 Hitachi Ferrite Electronics Ltd 低背型インダクタ
US7557433B2 (en) 2004-10-25 2009-07-07 Mccain Joseph H Microelectronic device with integrated energy source
US6998952B2 (en) 2003-12-05 2006-02-14 Freescale Semiconductor, Inc. Inductive device including bond wires
CN1677581A (zh) 2004-04-01 2005-10-05 乾坤科技股份有限公司 新颖线圈及其制造方法
JP2005310865A (ja) 2004-04-19 2005-11-04 Matsushita Electric Ind Co Ltd コイル部品
US7289329B2 (en) 2004-06-04 2007-10-30 Siemens Vdo Automotive Corporation Integration of planar transformer and/or planar inductor with power switches in power converter
US7295448B2 (en) 2004-06-04 2007-11-13 Siemens Vdo Automotive Corporation Interleaved power converter
US20050273938A1 (en) 2004-06-09 2005-12-15 The Coleman Company, Inc. Airbed utilizing extruded coils
CN2726077Y (zh) 2004-07-02 2005-09-14 郑长茂 电感器
WO2006008679A2 (en) 2004-07-13 2006-01-26 Koninklijke Philips Electronics N.V. Electronic device comprising an integrated circuit
US7567163B2 (en) 2004-08-31 2009-07-28 Pulse Engineering, Inc. Precision inductive devices and methods
US7667565B2 (en) 2004-09-08 2010-02-23 Cyntec Co., Ltd. Current measurement using inductor coil with compact configuration and low TCR alloys
US7339451B2 (en) 2004-09-08 2008-03-04 Cyntec Co., Ltd. Inductor
US7915993B2 (en) 2004-09-08 2011-03-29 Cyntec Co., Ltd. Inductor
KR100684715B1 (ko) 2004-10-19 2007-02-20 삼성에스디아이 주식회사 입체 영상 표시 장치 및 이를 갖는 전자 기기
JP4436794B2 (ja) 2004-11-16 2010-03-24 スミダコーポレーション株式会社 プレート部材、このプレート部材を用いた磁性素子および磁性素子の製造方法
JP4321818B2 (ja) 2004-11-30 2009-08-26 Ｔｄｋ株式会社 トランス
CA2588094A1 (en) 2004-12-27 2006-07-06 Sumida Corporation Magnetic device
KR100688858B1 (ko) 2004-12-30 2007-03-02 삼성전기주식회사 스파이럴 3차원 인덕터를 내장한 인쇄회로기판 및 그 제조방법
US7192809B2 (en) 2005-02-18 2007-03-20 Texas Instruments Incorporated Low cost method to produce high volume lead frames
US7221251B2 (en) 2005-03-22 2007-05-22 Acutechnology Semiconductor Air core inductive element on printed circuit board for use in switching power conversion circuitries
KR20060103864A (ko) 2005-03-28 2006-10-04 타이코 일렉트로닉스 코포레이션 Ｐｐｔｃ 층들 사이에 능동 소자를 갖는 표면 장착식 다층전기 회로 보호 장치
JP5276433B2 (ja) 2005-04-29 2013-08-28 フィニサー コーポレイション １つ以上の受動部品を備えた成形リードフレームコネクタ
US7460002B2 (en) 2005-06-09 2008-12-02 Alexander Estrov Terminal system for planar magnetics assembly
JP4699102B2 (ja) 2005-06-22 2011-06-08 ルネサスエレクトロニクス株式会社 半導体装置
US7317373B2 (en) 2005-08-18 2008-01-08 Delta Electronics, Inc. Inductor
US7362201B2 (en) 2005-09-07 2008-04-22 Yonezawa Electric Wire Co., Ltd. Inductance device and manufacturing method thereof
EP1933340B1 (en) 2005-09-08 2012-08-01 Sumida Corporation Coil device, composite coil device and transformer device
WO2007049692A1 (ja) 2005-10-27 2007-05-03 Kabushiki Kaisha Toshiba 平面磁気素子およびそれを用いた電源ｉｃパッケージ
US20070257759A1 (en) 2005-11-04 2007-11-08 Delta Electronics, Inc. Noise filter and manufacturing method thereof
JP2007134595A (ja) 2005-11-11 2007-05-31 Sumida Corporation コイル部品
WO2007063884A1 (ja) 2005-11-30 2007-06-07 Holy Loyalty International Co., Ltd. 面状インダクタ装置
US20070166554A1 (en) 2006-01-18 2007-07-19 Ruchert Brian D Thermal interconnect and interface systems, methods of production and uses thereof
US20080002460A1 (en) 2006-03-01 2008-01-03 Tessera, Inc. Structure and method of making lidded chips
JP2007250924A (ja) 2006-03-17 2007-09-27 Sony Corp インダクタ素子とその製造方法、並びにインダクタ素子を用いた半導体モジュール
JP2007273292A (ja) 2006-03-31 2007-10-18 Omron Corp 電磁継電器
US7864015B2 (en) 2006-04-26 2011-01-04 Vishay Dale Electronics, Inc. Flux channeled, high current inductor
US7705508B2 (en) 2006-05-10 2010-04-27 Pratt & Whitney Canada Crop. Cooled conductor coil for an electric machine and method
US20080036566A1 (en) 2006-08-09 2008-02-14 Andrzej Klesyk Electronic Component And Methods Relating To Same
CN101136281B (zh) 2006-08-28 2011-10-26 Abb技术有限公司 具有屏蔽环的高压变压器、屏蔽环及屏蔽环的制造方法
US8378777B2 (en) 2008-07-29 2013-02-19 Cooper Technologies Company Magnetic electrical device
US7791445B2 (en) 2006-09-12 2010-09-07 Cooper Technologies Company Low profile layered coil and cores for magnetic components
US8400245B2 (en) 2008-07-11 2013-03-19 Cooper Technologies Company High current magnetic component and methods of manufacture
US8941457B2 (en) 2006-09-12 2015-01-27 Cooper Technologies Company Miniature power inductor and methods of manufacture
US8466764B2 (en) 2006-09-12 2013-06-18 Cooper Technologies Company Low profile layered coil and cores for magnetic components
US9589716B2 (en) 2006-09-12 2017-03-07 Cooper Technologies Company Laminated magnetic component and manufacture with soft magnetic powder polymer composite sheets
US8310332B2 (en) 2008-10-08 2012-11-13 Cooper Technologies Company High current amorphous powder core inductor
US7298238B1 (en) 2006-12-15 2007-11-20 The United States Of America As Represented By The Secretary Of The Navy Programmable microtransformer
KR100834744B1 (ko) 2006-12-20 2008-06-05 삼성전자주식회사 다층의 대칭형 헬리컬 인덕터
MY145348A (en) 2007-03-15 2012-01-31 Semiconductor Components Ind Circuit component and method of manufacture
DE112008000720T5 (de) 2007-03-20 2010-04-29 Nec Tokin Corp., Sendai Weichmagnetische Legierung, die weichmagnetische Legierung verwendendes magnetisches Teil und Verfahren zum Herstellen derselbigen
US7872350B2 (en) 2007-04-10 2011-01-18 Qimonda Ag Multi-chip module
US7468547B2 (en) 2007-05-11 2008-12-23 Intersil Americas Inc. RF-coupled digital isolator
US7629860B2 (en) 2007-06-08 2009-12-08 Stats Chippac, Ltd. Miniaturized wide-band baluns for RF applications
US20090057822A1 (en) 2007-09-05 2009-03-05 Yenting Wen Semiconductor component and method of manufacture
USD586745S1 (en) 2007-09-26 2009-02-17 Tdk Corporation Coil unit
US8097934B1 (en) 2007-09-27 2012-01-17 National Semiconductor Corporation Delamination resistant device package having low moisture sensitivity
TWI362047B (en) 2007-09-28 2012-04-11 Cyntec Co Ltd Inductor and manufacture method thereof
TWI397930B (zh) 2007-11-06 2013-06-01 威盛電子股份有限公司 螺旋電感元件
JP5084459B2 (ja) 2007-11-15 2012-11-28 太陽誘電株式会社 インダクタ及びその製造方法
WO2009066433A1 (ja) 2007-11-21 2009-05-28 Panasonic Corporation コイル部品
US7825502B2 (en) 2008-01-09 2010-11-02 Fairchild Semiconductor Corporation Semiconductor die packages having overlapping dice, system using the same, and methods of making the same
US8183967B2 (en) 2008-07-11 2012-05-22 Cooper Technologies Company Surface mount magnetic components and methods of manufacturing the same
US8659379B2 (en) 2008-07-11 2014-02-25 Cooper Technologies Company Magnetic components and methods of manufacturing the same
US8279037B2 (en) 2008-07-11 2012-10-02 Cooper Technologies Company Magnetic components and methods of manufacturing the same
US9859043B2 (en) 2008-07-11 2018-01-02 Cooper Technologies Company Magnetic components and methods of manufacturing the same
US9558881B2 (en) 2008-07-11 2017-01-31 Cooper Technologies Company High current power inductor
JP4650536B2 (ja) 2008-07-28 2011-03-16 ソニー株式会社 電界結合器、通信装置、通信システム及び電界結合器の製造方法。
CN101673609A (zh) 2008-09-09 2010-03-17 鸿富锦精密工业（深圳）有限公司 电感器及其上的电感线圈
DE102008051491A1 (de) 2008-10-13 2010-04-29 Tyco Electronics Amp Gmbh Leadframe für elektronische Bauelemente
FR2937270B1 (fr) * 2008-10-20 2010-11-26 Roctool Dispositif de transformation de materiaux utilisant un chauffage par induction permettant un prechauffage du dispositif
JP2010118574A (ja) 2008-11-14 2010-05-27 Denso Corp リアクトル、及びその製造方法
CN102341899B (zh) 2009-03-06 2013-05-29 优特香港有限公司 具有多种ic封装构造的无引线阵列塑料封装
JP4714779B2 (ja) 2009-04-10 2011-06-29 東光株式会社 表面実装インダクタの製造方法とその表面実装インダクタ
US20100277267A1 (en) 2009-05-04 2010-11-04 Robert James Bogert Magnetic components and methods of manufacturing the same
US9276339B2 (en) 2009-06-02 2016-03-01 Hsio Technologies, Llc Electrical interconnect IC device socket
US20100314728A1 (en) 2009-06-16 2010-12-16 Tung Lok Li Ic package having an inductor etched into a leadframe thereof
JP5650928B2 (ja) 2009-06-30 2015-01-07 住友電気工業株式会社 軟磁性材料、成形体、圧粉磁心、電磁部品、軟磁性材料の製造方法および圧粉磁心の製造方法
JP2009224815A (ja) 2009-07-07 2009-10-01 Sumida Corporation 防磁型薄型トランス
KR101089976B1 (ko) 2009-09-02 2011-12-05 삼성전기주식회사 평면형 트랜스포머
JP2011054811A (ja) 2009-09-03 2011-03-17 Panasonic Corp コイル部品およびその製造方法
US8350659B2 (en) 2009-10-16 2013-01-08 Crane Electronics, Inc. Transformer with concentric windings and method of manufacture of same
CN102044327A (zh) 2009-10-19 2011-05-04 富士电子工业株式会社 高频感应加热用薄型变压器
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
EP3252786A1 (en) 2009-12-25 2017-12-06 Tamura Corporation Reactor
US8530981B2 (en) 2009-12-31 2013-09-10 Texas Instruments Incorporated Leadframe-based premolded package having acoustic air channel for micro-electro-mechanical system
JP4920089B2 (ja) 2010-01-14 2012-04-18 Ｔｄｋラムダ株式会社 エッジワイズコイル及びインダクタ
CN102822913B (zh) 2010-03-26 2017-06-09 日立粉末冶金株式会社 压粉磁芯及其制造方法
USD649115S1 (en) 2010-04-15 2011-11-22 Tdk Corporation Coil component
US20110287663A1 (en) 2010-05-21 2011-11-24 Gailus Mark W Electrical connector incorporating circuit elements
US8698587B2 (en) 2010-07-02 2014-04-15 Samsung Electro-Mechanics Co., Ltd. Transformer
US20120049334A1 (en) 2010-08-27 2012-03-01 Stats Chippac, Ltd. Semiconductor Device and Method of Forming Leadframe as Vertical Interconnect Structure Between Stacked Semiconductor Die
CN201877237U (zh) 2010-11-11 2011-06-22 美桀电子科技(深圳)有限公司 Smd型电感器
JP2012104724A (ja) 2010-11-12 2012-05-31 Panasonic Corp インダクタ部品
JP5927641B2 (ja) 2010-12-13 2016-06-01 アルプス・グリーンデバイス株式会社 インダクタンス素子
US20120176214A1 (en) 2011-01-07 2012-07-12 Wurth Electronics Midcom Inc. Flatwire planar transformer
US8943675B2 (en) 2011-02-26 2015-02-03 Superworld Electronics Co., Ltd. Method for making a shielded inductor involving an injection-molding technique
JP5877296B2 (ja) 2011-03-16 2016-03-08 パナソニックＩｐマネジメント株式会社 コイル部品およびその製造方法
WO2012132841A1 (ja) 2011-03-29 2012-10-04 ソニー株式会社 給電装置、給電システムおよび電子機器
CN102231320B (zh) 2011-04-15 2013-07-17 安徽千恩智能科技股份有限公司 电子式圆形电能表用大电流互感器及其生产方法
EP2482312A4 (en) 2011-04-29 2012-09-26 Huawei Tech Co Ltd POWER SUPPLY MODULE AND PACKAGING AND INTEGRATION METHOD THEREFOR
US8288209B1 (en) 2011-06-03 2012-10-16 Stats Chippac, Ltd. Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die
USD693302S1 (en) 2011-06-15 2013-11-12 Sumida Corporation Coil component
US9001524B1 (en) 2011-08-01 2015-04-07 Maxim Integrated Products, Inc. Switch-mode power conversion IC package with wrap-around magnetic structure
US8916421B2 (en) 2011-08-31 2014-12-23 Freescale Semiconductor, Inc. Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits
US8760872B2 (en) 2011-09-28 2014-06-24 Texas Instruments Incorporated DC-DC converter vertically integrated with load inductor structured as heat sink
US9141157B2 (en) 2011-10-13 2015-09-22 Texas Instruments Incorporated Molded power supply system having a thermally insulated component
TWI481071B (zh) 2012-01-12 2015-04-11 長廣科技有限公司 Light-emitting device LED 3D surface lead frame
US9627738B2 (en) 2012-01-16 2017-04-18 Telefonaktiebolaget Lm Ericsson (Publ) Wideband multilayer transmission line transformer
US9494660B2 (en) 2012-03-20 2016-11-15 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US8946880B2 (en) 2012-03-23 2015-02-03 Texas Instruments Incorporated Packaged semiconductor device having multilevel leadframes configured as modules
DE102012007232B4 (de) 2012-04-07 2014-03-13 Susanne Weller Verfahren zur Herstellung von rotierenden elektrischen Maschinen
KR101941447B1 (ko) 2012-04-18 2019-01-23 엘지디스플레이 주식회사 평판 표시 장치
US20130307117A1 (en) 2012-05-18 2013-11-21 Texas Instruments Incorporated Structure and Method for Inductors Integrated into Semiconductor Device Packages
US8707547B2 (en) 2012-07-12 2014-04-29 Inpaq Technology Co., Ltd. Method for fabricating a lead-frameless power inductor
JP5724984B2 (ja) 2012-10-19 2015-05-27 トヨタ自動車株式会社 回転電機の固定子
TWI475579B (zh) 2012-12-14 2015-03-01 Ghing Hsin Dien 線圈
JP5782017B2 (ja) 2012-12-21 2015-09-24 トヨタ自動車株式会社 リアクトル及びその製造方法
US10840005B2 (en) 2013-01-25 2020-11-17 Vishay Dale Electronics, Llc Low profile high current composite transformer
US20140210062A1 (en) 2013-01-28 2014-07-31 Texas Instruments Incorporated Leadframe-Based Semiconductor Package Having Terminals on Top and Bottom Surfaces
US8998454B2 (en) 2013-03-15 2015-04-07 Sumitomo Electric Printed Circuits, Inc. Flexible electronic assembly and method of manufacturing the same
US20140340186A1 (en) 2013-04-10 2014-11-20 Pulse Electronics, Inc. Interleaved planar inductive device and methods of manufacture and use
US9411025B2 (en) 2013-04-26 2016-08-09 Allegro Microsystems, Llc Integrated circuit package having a split lead frame and a magnet
US9368423B2 (en) 2013-06-28 2016-06-14 STATS ChipPAC Pte. Ltd. Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die package
US9190389B2 (en) 2013-07-26 2015-11-17 Infineon Technologies Ag Chip package with passives
CN103400819B (zh) 2013-08-14 2017-07-07 矽力杰半导体技术(杭州)有限公司 一种引线框架及其制备方法和应用其的封装结构
CN104795218B (zh) 2014-01-17 2017-03-01 台达电子工业股份有限公司 导电折片组、盖体及其所组合的导电组件以及磁性元件
US10515928B2 (en) 2014-01-29 2019-12-24 Texas Instruments Incorporated Stacked semiconductor system having interposer of half-etched and molded sheet metal
KR102004791B1 (ko) 2014-05-21 2019-07-29 삼성전기주식회사 칩 전자부품 및 그 실장기판
CN106165035B (zh) 2014-07-07 2019-05-03 松下知识产权经营株式会社 线圈部件及线圈部件的制造方法
CN105390246B (zh) 2014-08-21 2019-03-12 乾坤科技股份有限公司 电感及制造电感的方法
CN104300767A (zh) 2014-09-05 2015-01-21 胜美达电机（香港）有限公司 电源模块及其制造方法
US9852928B2 (en) 2014-10-06 2017-12-26 Infineon Technologies Ag Semiconductor packages and modules with integrated ferrite material
US20160181001A1 (en) 2014-10-10 2016-06-23 Cooper Technologies Company Optimized electromagnetic inductor component design and methods including improved conductivity composite conductor material
TWI573149B (zh) 2014-10-27 2017-03-01 吳李文相 平面線圈及其製法，以及使用該平面線圈之平面變壓器
US9704639B2 (en) 2014-11-07 2017-07-11 Solantro Semiconductor Corp. Non-planar inductive electrical elements in semiconductor package lead frame
KR101792317B1 (ko) 2014-12-12 2017-11-01 삼성전기주식회사 칩 전자부품 및 그 제조방법
US9960671B2 (en) 2014-12-31 2018-05-01 Avago Technologies General Ip (Singapore) Pte. Ltd. Isolator with reduced susceptibility to parasitic coupling
KR102107036B1 (ko) 2015-01-27 2020-05-07 삼성전기주식회사 권선형 인덕터 및 그 제조 방법
US9880574B2 (en) 2015-03-02 2018-01-30 Texas Instruments Incorporated Power combiner and balancer
TWD179058S (zh) 2015-07-31 2016-10-21 Alps Green Devices Co Ltd 電感器
CN108292556B (zh) 2015-12-22 2020-10-27 伊顿智能动力有限公司 模块化集成多相非耦合绕组功率电感器及制造方法
US10446309B2 (en) 2016-04-20 2019-10-15 Vishay Dale Electronics, Llc Shielded inductor and method of manufacturing
DE112017002220T5 (de) 2016-04-27 2019-04-11 Panasonic Intellectual Property Management Co., Ltd. lnduktorkomponente und Verfahren zum Herstellen von dieser
JP2017220573A (ja) 2016-06-08 2017-12-14 Tdk株式会社 コイル部およびコイル装置
JP6681544B2 (ja) 2016-08-04 2020-04-15 パナソニックＩｐマネジメント株式会社 電子部品およびそれを用いた電子機器
KR102571361B1 (ko) 2016-08-31 2023-08-25 비쉐이 데일 일렉트로닉스, 엘엘씨 낮은 직류 저항을 갖는 고전류 코일을 구비한 인덕터
TWI624845B (zh) 2016-11-08 2018-05-21 Alps Electric Co Ltd 電感元件及其製造方法
JP6520896B2 (ja) 2016-11-16 2019-05-29 Tdk株式会社 磁気センサ用インダクタンス素子及びこれを備える磁気センサ
JP2018098312A (ja) 2016-12-12 2018-06-21 パナソニックＩｐマネジメント株式会社 インダクター
KR20180071644A (ko) 2016-12-20 2018-06-28 삼성전기주식회사 인덕터
US20180301276A1 (en) 2017-04-18 2018-10-18 MAG.LAYERS Scientific-Technics Co., Ltd. Multiple winding inductor assembly
JP7075185B2 (ja) 2017-04-27 2022-05-25 太陽誘電株式会社 コイル部品及び電子機器
JP6658669B2 (ja) 2017-05-23 2020-03-04 株式会社村田製作所 巻線型コイル部品
CN207134214U (zh) 2017-06-26 2018-03-23 常州市武进红光无线电有限公司 变压器模组化线圈结构
JP1603858S (https=) 2017-09-14 2018-05-14
CN107564698A (zh) 2017-09-15 2018-01-09 珠海群创新材料技术有限公司 一种热压一体成型电感器及其制作方法
JP6930433B2 (ja) 2018-01-10 2021-09-01 Tdk株式会社 インダクタ素子
CN112005196B (zh) 2018-02-06 2024-10-11 沃尔玛阿波罗有限责任公司 定制的增强现实商品过滤系统
JP6819632B2 (ja) 2018-03-01 2021-01-27 株式会社村田製作所 表面実装インダクタ
JP1617830S (https=) 2018-03-16 2018-11-12
KR102052819B1 (ko) 2018-04-10 2019-12-09 삼성전기주식회사 코일 부품의 제조방법
CN208596597U (zh) 2018-07-18 2019-03-12 周希骏 一种电感器的铜片绕组及电感器
CN208706396U (zh) 2018-07-18 2019-04-05 遂宁普思电子有限公司 低直流电阻、高饱和电流的电感器
CN111092536B (zh) 2018-10-19 2021-07-06 台达电子工业股份有限公司 平面型变换器
CN109754986B (zh) 2019-01-28 2024-01-05 东莞顺络电子有限公司 一种射出成型电感及其制造方法
CN209388809U (zh) 2019-01-28 2019-09-13 深圳顺络电子股份有限公司 一种射出成型电感
JP2021052181A (ja) * 2019-09-20 2021-04-01 太陽誘電株式会社 インダクタ
US12087495B2 (en) 2019-10-28 2024-09-10 Eaton Intelligent Power Limited Ultra-narrow high current power inductor for circuit board applications
CN114649944A (zh) 2020-12-17 2022-06-21 深圳比特微电子科技有限公司 谐振槽电路、宽电压输入输出电源和电子设备

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St.27 status event code: A-1-2-D10-D22-exm-PE0701