KR20220140840A - 적층 필름, 그의 제조 방법 및 이용 - Google Patents
적층 필름, 그의 제조 방법 및 이용 Download PDFInfo
- Publication number
- KR20220140840A KR20220140840A KR1020227032412A KR20227032412A KR20220140840A KR 20220140840 A KR20220140840 A KR 20220140840A KR 1020227032412 A KR1020227032412 A KR 1020227032412A KR 20227032412 A KR20227032412 A KR 20227032412A KR 20220140840 A KR20220140840 A KR 20220140840A
- Authority
- KR
- South Korea
- Prior art keywords
- film
- laminated
- piezoelectric
- piezoelectric film
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
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- MIZLGWKEZAPEFJ-UHFFFAOYSA-N 1,1,2-trifluoroethene Chemical compound FC=C(F)F MIZLGWKEZAPEFJ-UHFFFAOYSA-N 0.000 description 1
- QHTSJPCQUQAHSQ-UHFFFAOYSA-M 1-dodecylpyridin-1-ium thiocyanate Chemical compound [S-]C#N.C(CCCCCCCCCCC)[N+]1=CC=CC=C1 QHTSJPCQUQAHSQ-UHFFFAOYSA-M 0.000 description 1
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- HMUXFMGHIBFLOV-UHFFFAOYSA-N C(CCCCCCCCCCC)OS(=O)(=O)C1=CC=CC=C1.C(CCCCCCC)[N+]1=CC=CC=C1 Chemical compound C(CCCCCCCCCCC)OS(=O)(=O)C1=CC=CC=C1.C(CCCCCCC)[N+]1=CC=CC=C1 HMUXFMGHIBFLOV-UHFFFAOYSA-N 0.000 description 1
- TXPLBWYHZPZOES-UHFFFAOYSA-N C1(=CC=CC=C1)S(=O)(=O)OCCCCCCCCCCCC.C(CCCCCCCCCCC)[N+]1=CC=CC=C1 Chemical compound C1(=CC=CC=C1)S(=O)(=O)OCCCCCCCCCCCC.C(CCCCCCCCCCC)[N+]1=CC=CC=C1 TXPLBWYHZPZOES-UHFFFAOYSA-N 0.000 description 1
- CHDVXKLFZBWKEN-UHFFFAOYSA-N C=C.F.F.F.Cl Chemical compound C=C.F.F.F.Cl CHDVXKLFZBWKEN-UHFFFAOYSA-N 0.000 description 1
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- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 229920007962 Styrene Methyl Methacrylate Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 150000001414 amino alcohols Chemical class 0.000 description 1
- DQPBABKTKYNPMH-UHFFFAOYSA-N amino hydrogen sulfate Chemical class NOS(O)(=O)=O DQPBABKTKYNPMH-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
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- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- XGDBOJRURXXJBF-UHFFFAOYSA-M fluoroindium Chemical compound [In]F XGDBOJRURXXJBF-UHFFFAOYSA-M 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000002314 glycerols Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical compound FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- ADFPJHOAARPYLP-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;styrene Chemical compound COC(=O)C(C)=C.C=CC1=CC=CC=C1 ADFPJHOAARPYLP-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005553 polystyrene-acrylate Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B32B7/025—Electric or magnetic properties
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
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- H—ELECTRICITY
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/402—Coloured
- B32B2307/4026—Coloured within the layer by addition of a colorant, e.g. pigments, dyes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/514—Oriented
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/737—Dimensions, e.g. volume or area
- B32B2307/7375—Linear, e.g. length, distance or width
- B32B2307/7376—Thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/08—Dimensions, e.g. volume
- B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
- B32B2309/105—Thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/208—Touch screens
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F1/00—Preventing the formation of electrostatic charges
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
- H10N30/045—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Laminated Bodies (AREA)
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| JPJP-P-2020-066712 | 2020-04-02 | ||
| JP2020066712 | 2020-04-02 | ||
| PCT/JP2021/013199 WO2021200790A1 (ja) | 2020-04-02 | 2021-03-29 | 積層フィルム、その製造方法および利用 |
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| US20230295392A1 (en) * | 2022-03-15 | 2023-09-21 | Taghleef Industries Inc. | Triboelectric mitigator coating |
| EP4507480A4 (en) * | 2022-05-18 | 2025-07-09 | Kureha Corp | LAMINATED PIEZOELECTRIC FILM |
| EP4503902A4 (en) * | 2022-05-18 | 2025-08-06 | Kureha Corp | CONDUCTIVE PIEZOELECTRIC FILM, DEVICE AND METHOD FOR PRODUCING CONDUCTIVE PIEZOELECTRIC FILM |
| JPWO2024203685A1 (https=) * | 2023-03-24 | 2024-10-03 | ||
| TWI903935B (zh) * | 2023-12-21 | 2025-11-01 | 日商吳羽股份有限公司 | 積層壓電體及其製造方法 |
| WO2025182752A1 (ja) * | 2024-02-28 | 2025-09-04 | 株式会社クレハ | フッ素系樹脂圧電フィルムおよびその製造方法 |
| WO2026029139A1 (ja) * | 2024-07-31 | 2026-02-05 | 株式会社クレハ | フッ素系樹脂圧電フィルムおよびその製造方法 |
Citations (2)
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| JP2000158611A (ja) | 1998-11-26 | 2000-06-13 | Teijin Ltd | 離形フィルムならびにそれを用いた樹脂シート成形用キャリヤーフィルムおよび樹脂シート保護用フィルム |
| JP2018140634A (ja) | 2017-02-28 | 2018-09-13 | パナソニックＩｐマネジメント株式会社 | 保護フィルム及びフィルム積層体 |
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| JPH0587186A (ja) * | 1991-09-27 | 1993-04-06 | Calp Corp | 制振性材料 |
| JPH10315373A (ja) * | 1997-05-22 | 1998-12-02 | Teijin Ltd | 離型フィルム |
| US7602108B2 (en) * | 2005-05-26 | 2009-10-13 | Eastman Chemical Company | Micro-coextruded film modified with piezoelectric layers |
| JP2010247495A (ja) * | 2009-04-20 | 2010-11-04 | Seiko Epson Corp | 圧電素子及び液体噴射ヘッド |
| JP2013237788A (ja) * | 2012-05-16 | 2013-11-28 | Nitto Denko Corp | 表面保護フィルム |
| JP6010381B2 (ja) * | 2012-07-31 | 2016-10-19 | 帝人フィルムソリューション株式会社 | 離型フィルム |
| JP6439250B2 (ja) * | 2013-10-29 | 2018-12-19 | ダイキン工業株式会社 | 積層体 |
| WO2015129829A1 (ja) * | 2014-02-26 | 2015-09-03 | ダイキン工業株式会社 | バイモルフ型圧電フィルム |
| CN106575699A (zh) * | 2014-08-22 | 2017-04-19 | 三井化学株式会社 | 高分子压电膜 |
| JP2015186910A (ja) * | 2014-10-20 | 2015-10-29 | 三井化学株式会社 | 積層体 |
| CN107000268B (zh) * | 2014-12-09 | 2019-11-22 | Ａｇｃ株式会社 | 脱模膜以及半导体封装体的制造方法 |
| KR20170085086A (ko) * | 2015-03-02 | 2017-07-21 | 미쯔이가가꾸가부시끼가이샤 | 필름 권층체 및 그 제조 방법 |
| JP6993555B2 (ja) * | 2015-05-22 | 2022-01-13 | ダイキン工業株式会社 | 有機圧電フィルム |
| JP2017146492A (ja) * | 2016-02-18 | 2017-08-24 | リンテック株式会社 | 保護フィルム付き透明導電膜積層用フィルム、および透明導電性フィルムの製造方法 |
| EP3418049B1 (en) * | 2016-03-09 | 2021-02-17 | Mitsui Chemicals, Inc. | Laminated article |
| JP6918468B2 (ja) * | 2016-11-10 | 2021-08-11 | 日東電工株式会社 | セパレーター付補強用フィルム |
| JP2019067908A (ja) * | 2017-09-29 | 2019-04-25 | 株式会社クレハ | 圧電フィルムおよびフィルムの製造方法 |
| CN109679125A (zh) * | 2017-10-18 | 2019-04-26 | 江苏膜斯宝环保科技有限公司 | 一种耐高温pvdf薄膜的制备方法 |
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2021
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- 2021-03-31 TW TW110111790A patent/TW202138191A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000158611A (ja) | 1998-11-26 | 2000-06-13 | Teijin Ltd | 離形フィルムならびにそれを用いた樹脂シート成形用キャリヤーフィルムおよび樹脂シート保護用フィルム |
| JP2018140634A (ja) | 2017-02-28 | 2018-09-13 | パナソニックＩｐマネジメント株式会社 | 保護フィルム及びフィルム積層体 |
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| TW202138191A (zh) | 2021-10-16 |
| EP4129669A1 (en) | 2023-02-08 |
| EP4129669A4 (en) | 2024-04-03 |
| US20230119647A1 (en) | 2023-04-20 |
| CN115362059A (zh) | 2022-11-18 |
| JPWO2021200790A1 (https=) | 2021-10-07 |
| WO2021200790A1 (ja) | 2021-10-07 |
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