KR20220104821A - 큰 표면들의 반사 푸리에 타이코그래피 (reflective fourier ptychography) 이미징 - Google Patents

큰 표면들의 반사 푸리에 타이코그래피 (reflective fourier ptychography) 이미징 Download PDF

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Publication number
KR20220104821A
KR20220104821A KR1020227022550A KR20227022550A KR20220104821A KR 20220104821 A KR20220104821 A KR 20220104821A KR 1020227022550 A KR1020227022550 A KR 1020227022550A KR 20227022550 A KR20227022550 A KR 20227022550A KR 20220104821 A KR20220104821 A KR 20220104821A
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South Korea
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light sources
pattern
rfpm
selecting
individual light
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Korean (ko)
Inventor
콜린 마이클 앤더슨
로데릭 모슬리
네리사 수 드래거
제롬 에스. 후벡
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램 리써치 코포레이션
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Publication of KR20220104821A publication Critical patent/KR20220104821A/ko
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/06—Means for illuminating specimens
    • G02B21/08—Condensers
    • G02B21/14—Condensers affording illumination for phase-contrast observation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G01N21/4795—Scattering, i.e. diffuse reflection spatially resolved investigating of object in scattering medium
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/0004—Microscopes specially adapted for specific applications
    • G02B21/002—Scanning microscopes
    • G02B21/0024—Confocal scanning microscopes (CSOMs) or confocal "macroscopes"; Accessories which are not restricted to use with CSOMs, e.g. sample holders
    • G02B21/0032—Optical details of illumination, e.g. light-sources, pinholes, beam splitters, slits, fibers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/0004—Microscopes specially adapted for specific applications
    • G02B21/002—Scanning microscopes
    • G02B21/0024—Confocal scanning microscopes (CSOMs) or confocal "macroscopes"; Accessories which are not restricted to use with CSOMs, e.g. sample holders
    • G02B21/0036—Scanning details, e.g. scanning stages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/06—Means for illuminating specimens
    • G02B21/08—Condensers
    • G02B21/082—Condensers for incident illumination only
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/36—Microscopes arranged for photographic purposes or projection purposes or digital imaging or video purposes including associated control and data processing arrangements
    • G02B21/365—Control or image processing arrangements for digital or video microscopes
    • G02B21/367—Control or image processing arrangements for digital or video microscopes providing an output produced by processing a plurality of individual source images, e.g. image tiling, montage, composite images, depth sectioning, image comparison
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8883—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges involving the calculation of gauges, generating models

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Microscoopes, Condenser (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
KR1020227022550A 2019-12-02 2020-11-24 큰 표면들의 반사 푸리에 타이코그래피 (reflective fourier ptychography) 이미징 Pending KR20220104821A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962942636P 2019-12-02 2019-12-02
US62/942,636 2019-12-02
PCT/US2020/062108 WO2021113131A1 (en) 2019-12-02 2020-11-24 Reflective fourier ptychography imaging of large surfaces

Publications (1)

Publication Number Publication Date
KR20220104821A true KR20220104821A (ko) 2022-07-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227022550A Pending KR20220104821A (ko) 2019-12-02 2020-11-24 큰 표면들의 반사 푸리에 타이코그래피 (reflective fourier ptychography) 이미징

Country Status (6)

Country Link
US (1) US20220413276A1 (https=)
JP (2) JP7678810B2 (https=)
KR (1) KR20220104821A (https=)
CN (1) CN115053122A (https=)
TW (1) TW202136753A (https=)
WO (1) WO2021113131A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12405226B2 (en) 2023-01-03 2025-09-02 Samsung Electronics Co., Ltd. Substrate inspection apparatus and substrate inspection method

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11689821B2 (en) * 2020-08-07 2023-06-27 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Incoherent Fourier ptychographic super-resolution imaging system with priors
FR3125893A1 (fr) * 2021-07-29 2023-02-03 Institut Mines Telecom Système d’éclairage, notamment à usage de microscopie
US20240353665A1 (en) * 2023-03-30 2024-10-24 California Institute Of Technology Angular ptychographic imaging with closed-form reconstruction
US12581754B2 (en) * 2023-05-16 2026-03-17 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus to enhance semiconductor device manufacturing
CN120254888B (zh) * 2025-05-30 2025-09-09 长春理工大学 基于偏振关联算法的水下溢油成像探测方法及设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9497379B2 (en) 2013-08-22 2016-11-15 California Institute Of Technology Variable-illumination fourier ptychographic imaging devices, systems, and methods
US9892812B2 (en) 2012-10-30 2018-02-13 California Institute Of Technology Fourier ptychographic x-ray imaging systems, devices, and methods
US20160154301A1 (en) * 2013-06-17 2016-06-02 Paul Scherrer Institut Scanning coherent diffractive imaging method and system for actinic mask inspection for euv lithography
DE102014213198B4 (de) * 2014-07-08 2020-08-06 Carl Zeiss Ag Verfahren zur Lokalisierung von Defekten auf Substraten
WO2016090331A1 (en) 2014-12-04 2016-06-09 California Institute Of Technology Multiplexed fourier ptychography imaging systems and methods
WO2016106379A1 (en) 2014-12-22 2016-06-30 California Institute Of Technology Epi-illumination fourier ptychographic imaging for thick samples
AU2014280894A1 (en) * 2014-12-23 2016-07-07 Canon Kabushiki Kaisha Illumination systems and devices for Fourier Ptychographic imaging
WO2016187591A1 (en) * 2015-05-21 2016-11-24 California Institute Of Technology Laser-based fourier ptychographic imaging systems and methods
CN108431692B (zh) * 2015-12-23 2021-06-18 Asml荷兰有限公司 量测方法、量测设备和器件制造方法
US10739275B2 (en) * 2016-09-15 2020-08-11 Kla-Tencor Corporation Simultaneous multi-directional laser wafer inspection
CN106707486B (zh) 2017-01-24 2019-07-26 清华大学 基于fpm的宽视场显微成像方法及系统
KR20190088277A (ko) * 2018-01-18 2019-07-26 서울대학교산학협력단 단일촬영 푸리에 타이코그래피 마이크로스코피 시스템

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12405226B2 (en) 2023-01-03 2025-09-02 Samsung Electronics Co., Ltd. Substrate inspection apparatus and substrate inspection method

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JP2025111782A (ja) 2025-07-30
JP7678810B2 (ja) 2025-05-16
JP2023504151A (ja) 2023-02-01
CN115053122A (zh) 2022-09-13
TW202136753A (zh) 2021-10-01
US20220413276A1 (en) 2022-12-29
WO2021113131A1 (en) 2021-06-10

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