KR20220096996A - Encapsulation member - Google Patents

Abstract

The present invention relates to an encapsulant for an organic electronic device and an organic electronic device including the same. More specifically, the present invention relates to an encapsulant for an organic electronic device which removes and blocks malfunction-causing substances such as moisture and impurities so as to prevent the access to the organic electronic device thereof, and which does not cause a delamination phenomenon that may occur when moisture being removed, and to an organic electronic device including the same. The encapsulant for an organic electronic device according to the present invention has excellent moisture resistance and heat resistance, and has the advantage in that the bonding between the organic electronic device and the encapsulant is excellent even at room temperature when performing a thin film encapsulation process.

Description

Encapsulation material for organic electronic devices {Encapsulation member}

The present invention relates to an encapsulant for an organic electronic device, and more particularly, to remove and block materials that cause defects such as moisture and impurities from accessing the organic electronic device, and to prevent delamination that may occur when moisture is removed. The present invention relates to an encapsulant for an organic electronic device that has excellent effects in moisture resistance and heat resistance at the same time, and has excellent adhesion between an organic electronic device and the encapsulant in a thin film encapsulation process.

An organic light emitting diode (OLED) is a light emitting diode in which a light emitting layer is made of a thin organic compound, and uses an electroluminescence phenomenon in which a current is passed through a fluorescent organic compound to generate light. In general, these organic light emitting diodes implement main colors in three colors (Red, Green, Blue) independent pixel method, bioconversion method (CCM), color filter method, etc. Accordingly, it is divided into a low molecular organic light emitting diode and a polymer organic light emitting diode. In addition, according to the driving method, it may be divided into a passive driving method and an active driving method.

These organic light emitting diodes have characteristics such as high efficiency by self-emission, low voltage driving, and simple driving, and thus have the advantage of being able to express high-definition video. In addition, applications to flexible displays and organic electronic devices using the flexible characteristics of organic materials are also expected.

The organic light emitting diode is manufactured in the form of laminating an organic compound, which is a light emitting layer, in the form of a thin film on a substrate. However, organic compounds used in organic light emitting diodes are very sensitive to impurities, oxygen and moisture, and thus have a problem in that their properties are easily deteriorated by external exposure or penetration of moisture and oxygen. This deterioration of the organic material affects the light emitting characteristics of the organic light emitting diode and shortens the lifespan. In order to prevent this phenomenon, a thin film encapsulation process is required to prevent oxygen, moisture, etc. from flowing into the inside of the organic electronic device.

Conventionally, a metal can or glass is processed into a cap shape to have a groove, and a desiccant for moisture absorption is loaded in the groove in a powder form. However, this method removes moisture to a desired level with a sealed organic electronic device, It blocks organic electronic devices from accessing materials that cause defects, such as moisture and impurities, does not cause delamination that can occur when moisture is removed, and it is difficult to have excellent effects in moisture resistance and heat resistance at the same time.

On the other hand, in the thin film encapsulation process, in general, the process is performed at a temperature of 40 to 60° C. in order to bond (= packaging) an organic light emitting diode and an encapsulant for encapsulating the organic light emitting diode. However, if the thin film encapsulation process is performed at a temperature of 40 to 60° C., there is a problem in that bending occurs due to the difference in coefficient of thermal expansion (CTE) between the substrates.

Korean Patent Publication No. 10-2006-0030718 (2006.04.11)

The present invention has been devised to solve the above problems, and the problem to be solved by the present invention is to remove and block materials that cause defects such as moisture and impurities from accessing the organic electronic device, and may occur when the moisture is removed. To provide an organic electronic device encapsulant and an organic electronic device including the same, which does not cause delamination and has excellent moisture resistance and heat resistance, and has excellent adhesion between the organic electronic device and the encapsulant in the thin film encapsulation process. .

In order to solve the above problems, the present invention is a substrate layer having a moisture resistance and heat dissipation function;

an encapsulant layer formed on one surface of the base layer and formed of two or more multi-layers; and

Including; a compensation layer formed on the other surface of the base layer and a protective film layer formed on the compensation layer;

An encapsulant for an organic electronic device that satisfies the following condition (1) is provided.

(1) 0.3 ≤ B/A ≤ 28.5

In the above condition (1), A represents the thickness (μm) of the base layer, B represents the thickness (μm) of the protective film layer.

In a preferred embodiment of the present invention, the substrate layer may have a water vapor transmission rate of 1.0 g/m ² /day or less, and a thermal conductivity of 50 W/m·K or more.

In a preferred embodiment of the present invention, the base layer may be a metal thin film.

In a preferred embodiment of the present invention, the substrate layer may have a tensile strength of 100 to 400 MPa.

In a preferred embodiment of the present invention, A may be 7 to 50 μm, and B may be 15 to 200 μm.

In a preferred embodiment of the present invention, the encapsulation layer consists of a first encapsulant layer and a second encapsulant layer interposed between the base layer and the first encapsulant layer,

The first encapsulating resin layer and the second encapsulating resin layer may have a thickness ratio of 1:2.8 to 1:5.2.

In a preferred embodiment of the present invention, the first encapsulation layer may have a thickness of 1 to 30 μm, and the second encapsulation layer may have a thickness of 15 to 70 μm.

In a preferred embodiment of the present invention, the compensation layer may be a pressure-sensitive adhesive layer (PSA) or a third encapsulant layer.

In a preferred embodiment of the present invention, the compensation layer may have a thickness of 10 ~ 300㎛.

In a preferred embodiment of the present invention, the first encapsulant layer and the second encapsulant layer may each independently include an encapsulant resin, a tackifier, and a moisture absorbent.

In a preferred embodiment of the present invention, the first encapsulation layer and the second encapsulation layer may each independently further include at least one selected from a curing agent and a UV initiator.

In a preferred embodiment of the present invention, a release film layer may be further included on the opposite surface of the surface in contact with the substrate layer of the encapsulation resin layer formed on one surface of the substrate layer.

In a preferred embodiment of the present invention, the peeling force of the release film layer may be lower than that of the protective film layer.

In a preferred embodiment of the present invention, the surface of the protective film layer in contact with the compensation layer is release-treated, and the surface resistance of the rear surface of the release-treated surface is 9.99×10 ³ to 9.99×10 ¹² Ω/□. it could be

In the encapsulant according to a preferred embodiment of the present invention, the sum of the thicknesses of the encapsulant layer, the base layer and the compensation layer, and the protective film layer may be 48 μm to 650 μm.

The encapsulant for an organic electronic device of the present invention blocks oxygen, impurities, and moisture, and at the same time effectively removes moisture permeable to significantly prevent moisture from reaching the organic electronic device, thereby significantly improving the lifespan and durability of the organic electronic device. can do it In addition, the delamination phenomenon that may occur when moisture is removed does not occur, and at the same time, there is an effect of excellent moisture resistance and heat resistance. In addition, bonding between the organic electronic device and the encapsulant is excellent in the thin film encapsulation process for packaging the encapsulant in the organic electronic device.

1 is a cross-sectional view of an encapsulant for an organic electronic device according to a preferred embodiment of the present invention.
2 is a cross-sectional view of an organic electronic device according to a preferred embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those of ordinary skill in the art to which the present invention pertains can easily implement them. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly explain the present invention in the drawings, parts irrelevant to the description are omitted, and the same reference numerals are added to the same or similar elements throughout the specification.

Referring to FIG. 1 , the encapsulant for an organic electronic device of the present invention includes the encapsulant layer 10 .

The encapsulant layer 10 of the present invention includes a substrate layer 13 having a moisture resistance and heat dissipation function;

encapsulation layers 11 and 12 formed on one surface of the base layer 13 and formed of two or more multi-layers; and

and a compensation layer 14 formed on the other surface of the base layer 13 and a protective film layer 20 formed on the compensation layer.

In this case, the encapsulation layers 11 and 12 may include a first encapsulation layer 11 and a second encapsulation layer 12,

Each of the first encapsulant layer 11 and the second encapsulant layer (12) may be independently formed to include an encapsulant, a tackifier, and a desiccant (40', 40"). In this case, the Second, the encapsulation resin of the encapsulation layer 12 may be the same as or different from the encapsulation resin of the first encapsulation layer 11 .

First, the encapsulating resin may include a pressure-sensitive adhesive composition, preferably a polyolefin-based resin, and the polyolefin-based resin is polyethylene (PE), polypropylene (PP), polyisobutylene polyolefin resins of C ₂ to C ₆ alkylene such as (polyisobutylene); and a random copolymer resin copolymerized with ethylene, propylene and/or a diene-based compound; It may include one or two or more selected from among.

As a preferred example, the encapsulant may include a compound represented by the following formula (1).

[Formula 1]

In Formula 1, R ¹ is a hydrogen atom, a C ₃ to C ₁₀ linear alkenyl group or a C ₄ to C ₁₀ pulverized alkenyl group, preferably R ¹ is a hydrogen atom, C ₄ It may be a straight-chain alkenyl group of ~C ₈ or a pulverized alkenyl group of C ₄ ~ C ₈ .

In addition, as R ¹ in Formula 1 is a hydrogen atom, a C ₃ to C ₁₀ linear alkenyl group, or a C ₄ to C ₁₀ pulverized alkenyl group, the reliability of the encapsulation resin may be more excellent.

In addition, in Formula 1, n is a rational number satisfying a weight average molecular weight of 30,000 to 1,550,000 g/mol, and preferably, may be a rational number satisfying a weight average molecular weight of 40,000 to 1,500,000 g/mol. If the weight average molecular weight is less than 30,000 g/mol, there may be a problem that the panel sags due to the decrease in modulus, there may be a problem that heat resistance is lowered, and reliability is lowered as the filling property of the desiccant is lowered. There may be a problem, there may be a problem that mechanical properties are lowered, there may be a problem that the lifting phenomenon with the substrate due to the volume expansion of the desiccant due to the decrease in elasticity may occur. In addition, when the weight average molecular weight exceeds 1,550,000 g/mol, there may be a problem in that adhesion to the substrate is lowered due to deterioration in wettability, and there may be a problem in that cohesion to the panel is lowered as the modulus increases.

In addition, the compound represented by Formula 1 may have a crystallization temperature of 100°C to 140°C, preferably 110 to 130°C, and more preferably 115°C to 125°C when measured by the following measuring method.

[How to measure]

The crystallization temperature (T _c ) was measured through peak analysis of the cooling curve of the heat flow measured with a differential scanning calorimetry (DSC) while cooling from 200°C to -150°C at a rate of 10°C/min. .

Next, the tackifier may include without limitation, as long as it is an adhesive resin commonly used in encapsulants for organic electronic devices, preferably hydrogenated petroleum resin, hydrogenated rosin resin, hydrogenated rosin ester resin, hydrogenated terpene resin, and hydrogenated terpene. It may include at least one selected from a phenol resin, a polymerized rosin resin, and a polymerized rosin ester resin.

Next, the desiccant (40', 40") can be used without limitation as long as it is a desiccant typically used for packaging of organic electronic devices, and preferably a desiccant containing zeolite, titania, zirconia or montmorillonite as a component, a metal salt, and It may include one or more kinds of metal oxides, and more preferably include a metal oxide.

Metal oxides are silica (SiO ₂ ), alumina (Al ₂ O ₃ ), lithium oxide (Li ₂ O), sodium oxide (Na ₂ O), barium oxide (BaO), calcium oxide (CaO) or magnesium oxide (MgO) It may include one or more of metal oxides, such as organic metal oxides, and phosphorus pentoxide (P ₂ O ₅ ).

Metal salts are lithium sulfate (Li ₂ SO ₄ ), sodium sulfate (Na ₂ SO ₄ ), calcium sulfate (CaSO ₄ ), magnesium sulfate (MgSO ₄ ), cobalt sulfate (CoSO ₄ ), gallium sulfate (Ga ₂ (SO ₄ ) ₃ ) ), sulfates such as titanium sulfate (Ti(SO ₄ ) ₂ ) or nickel sulfate (NiSO ₄ ), calcium chloride (CaCl ₂ ), magnesium chloride (MgCl ₂ ), strontium chloride (SrCl ₂ ), yttrium chloride (YCl ₃ ), Copper chloride (CuCl ₂ ), cesium fluoride (CsF), tantalum fluoride (TaF ₅ ), niobium fluoride (NbF ₅ ), lithium bromide (LiBr), calcium bromide (CaBr ₂ ), cesium bromide (CeBr ₃ ), selenium bromide ( Metal halides such as SeBr ₄ ), vanadium bromide (VBr ₃ ), magnesium bromide (MgBr ₂ ), barium iodide (BaI ₂ ) or magnesium iodide (MgI ₂ ), and barium perchlorate (Ba(ClO ₄ ) ₂ ) or magnesium perchlorate (Mg(ClO ₄ ) ₂ ) It may include at least one of metal chlorates.

It is recommended to use a desiccant with a purity of 95% or more. If the purity is less than 95%, the moisture absorption function is lowered, and the material contained in the desiccant acts as an impurity, which can cause defects in the adhesive film, may affect, but is not limited to.

Meanwhile, the first encapsulating resin layer 11 and the second encapsulating resin layer 12 of the present invention may further include at least one selected from a curing agent and a UV initiator.

The curing agent may include without limitation as long as it is a material that can be used as a curing agent in general, and preferably includes a material that can secure sufficient crosslinking density of the encapsulation resin layer by acting as a crosslinking agent, more preferably by weight. It may include at least one selected from a urethane acrylate curing agent having an average molecular weight of 100 to 1,500 g/mol and an acrylate curing agent having an average molecular weight of 100 to 1,500 g/mol. If the weight average molecular weight of the curing agent is less than 100 g/mol, panel cohesion and adhesion to the substrate decrease due to the increase in hardness, and an outgas problem of the unreacted curing agent may occur, and the weight average molecular weight is 1,500 g/mol. If it is exceeded, a problem may occur in which mechanical properties are deteriorated due to an increase in softness.

The UV initiator may include without limitation as long as it is used as a conventionally used UV initiator, for example, mono acyl phosphine, bis acyl phosphine, α-hydroxyketone. (α-Hydroxyketone), α-aminoketone (α-Aminoketone), phenyl glyoxylate (Phenylglyoxylate), and may include at least one selected from benzyldimethyl-ketal (Benzyldimethyl-ketal).

The encapsulant for an organic electronic device of the present invention may further include a protective film layer 20 formed on one surface of the encapsulant layer 10 , and specifically, the protective film layer 20 is a compensation layer 14 of the encapsulant layer 10 . may be formed on the

In addition, the encapsulant for an organic electronic device of the present invention may further include a release film layer 30 formed on the other surface of the encapsulant layer 10 . Specifically, the release film layer 30 may be formed under the first encapsulation resin layer 11 of the encapsulant layer 10 .

On the other hand, referring to Figure 1, the encapsulant layer 10 of the present invention is a base layer 13 having a moisture resistance and heat dissipation function, the encapsulant layer 11 and 12 formed on one surface of the base layer and formed of two or more multi-layers. and a compensation layer 14 formed on the other surface of the base layer.

At this time, the encapsulation layers 11 and 12 may include a first encapsulation layer 11 and a second encapsulation layer 12 , and the second encapsulation layer 12 is the base layer 13 . ) is tangent to In addition, the second encapsulant layer 12 may be formed on one surface of the first encapsulant layer 11 , and the release film layer 30 may be formed on the other surface.

The encapsulant for an organic electronic device of the present invention satisfies the following condition (1).

(1) 0.3 ≤ B/A ≤ 28.5

In the above condition (1), A represents the thickness (μm) of the base layer 13 , and B represents the thickness (μm) of the protective film layer 20 .

If the B/A value of condition (1) is less than 0.3, it may be difficult to control curl during manufacturing of the encapsulation material, and it may cause warping or distortion of the display panel in the customer process. If the distortion is severe, it may cause damage to the panel glass, which may be a manufacturing problem. When the B/A value exceeds 28.5, the thickness and rigidity of the protective film layer may increase, which may cause deterioration of the adhesion quality between the encapsulation material and OLED TFT Glass. Examples of adhesion quality may include bubble generation and reduced adhesion.

The base layer 13 of the present invention may be a polymer such as graphene, carbon fiber, PET, PE, or PP, or a thin metal film such as aluminum (Al) or copper (Cu). Preferably, the base layer 13 may be a metal thin film.

In a preferred embodiment of the present invention, the base layer has a Water Vapor Transmission Rate of 1.0 g/m ² /day or less, preferably less than 10 ^-2 g/m ² /day. If the moisture permeability is 1.0 If g/m ² /day is exceeded, performance degradation of the encapsulation layer due to penetration of moisture and oxygen through the base layer and display panel device defects may occur. At this time, the moisture permeability may be measured through a water permeability test method.

In addition, the substrate layer may have a thermal conductivity of 50 W/m·K or more.

If the thermal conductivity of the base layer is less than 50 W/m·K, deterioration of the device due to a decrease in heat dissipation performance is deepened, and there may be a problem of shortening the device lifespan.

In addition, the base layer 13 may have a tensile strength of 100 to 400 MPa. If the tensile strength is less than 100 MPa, the stiffness of the encapsulation material is low, so there may be a problem of bending or bending during the logistics process. If the tensile strength exceeds 400 MPa, the stiffness is too high, There is a risk of glass breakage.

In addition, the peeling force of the release film layer 30 may be lower than that of the protective film layer 20 . The first step of the customer process is to remove the release film layer first and adhere the first encapsulation resin layer to the OLED TFT GLASS. The layer is peeled off, and the release film layer is not peeled off, which may cause process errors. At this time, the protective film layer should be attached to the plate on which the encapsulating material is seated.

인 것을 특징으로 할 수 있다. 보호필름층의 배면 표면저항이 9.99Х10¹² Ω/

를 초과 하는 경우 물류 공정에서 보호필름층과 맞닿는 면과의 정전기 인력으로 인해 제품 이송기와의 탈락을 야기, OLED PANEL의 추락 및 파손 문제가 발생 할 수 있다. In addition, the protective film layer 20 has a surface in contact with the compensation layer is release-treated, and the surface resistance of the rear surface of the release-treated surface is 9.99×10 ³ ~ 9.99Х10 ¹² Ω/

It can be characterized as being. The back surface resistance of the protective film layer is 9.99Х10 ¹² Ω/

In the case of exceeding the value, it may cause drop-off from the product transporter due to the electrostatic attraction between the surface in contact with the protective film layer in the logistics process, and the problem of falling and damage of the OLED panel may occur.

In addition, the thickness of the base layer 13 may be 7 ~ 50㎛, preferably 15 ~ 40㎛, more preferably 23 ~ 36㎛. If the thickness of the base layer 13 is less than 7㎛, there may be problems in the difficulty of controlling wrinkles in the encapsulation material manufacturing process and the problem of fabric bursting during the process run, and if it exceeds 50㎛, the heat of the substrate layer The amount of volume change increases, which may cause the display panel to warp.

In addition, the protective film layer 20 may have a thickness of 15 ~ 200㎛, preferably 38 ~ 125㎛, more preferably 50 ~ 100㎛. If the thickness of the protective film layer 20 is less than 15㎛, the rigidity of the encapsulation material is weak, which may cause process errors due to bending and sagging in the customer logistics process, and wrinkles may occur during bonding with TFT GLASS. If it exceeds 200㎛, the thickness and rigidity of the encapsulating material may increase, which may cause a decrease in adhesive quality.

Looking at the condition (1), the thickness ratio B/A of the base layer 13 and the protective film layer 20 may be 0.3 to 28.5, preferably 0.95 to 8.33, more preferably 1.39 to 4.35, and if If the B/A is less than 0.3, it may be difficult to control the curl when manufacturing the encapsulant, and it may cause warping or distortion of the display panel in the subsequent panel bonding process. If the distortion is severe, it may cause damage to the panel glass, which may be a manufacturing problem. If B/A exceeds 28.5, the thickness and rigidity of the protective film layer increase, which may cause deterioration of the adhesion quality between the encapsulation material and TFT GLASS. Examples of adhesive quality problems may include bubble generation and poor adhesion.

The encapsulation layers 11 and 12 include a first encapsulation layer 11 and a second encapsulation layer 12, and the first encapsulation layer 11 and the second encapsulation layer 12 are It may have a thickness ratio of 1:2.8 to 1:5.2. The first encapsulant layer 11 and the second encapsulant layer 12 have a thickness ratio of preferably 1:3.2 to 1:4.8, more preferably a thickness ratio of 1:3.6 to 1:4.4, still more preferably 1 It may have a thickness ratio of :3.8 to 1:4.2, and if the thickness ratio is less than 1:2.8, it may cause a display device defect due to a decrease in encapsulant performance due to a decrease in moisture absorption efficiency, and if it exceeds 1:5.2, the second encapsulation index As the layer becomes thicker, problems such as generation of bubbles and an increase in residual solvent in the encapsulation material manufacturing process may occur, which may cause display device defects.

In addition, the first encapsulant layer 11 may have a thickness of 1 to 30 μm, preferably 2 to 15 μm, more preferably 3 to 12 μm, and if the thickness is less than 1 μm, There may be a problem of adhesion quality with OLED TFT GLASS, and if it exceeds 30㎛, the penetration path of moisture and oxygen is expanded, so there may be a problem of reducing the performance of the encapsulation material.

In addition, the second encapsulant layer 12 may have a thickness of 15 to 70 μm, preferably 30 to 60 μm, more preferably 40 to 55 μm, and if the thickness is less than 15 μm, Decreased moisture absorption efficiency may cause OLED device defects due to reduced encapsulant performance, and if it exceeds 70㎛, problems such as bubble generation and residual solvent increase in the encapsulation material manufacturing process may occur, which may cause OLED device defects .

Furthermore, referring to FIGS. 1 and 2 , the first encapsulant layer 11 is a layer in direct contact with the organic electronic device ( FIG. 2 ), and may include an encapsulant and a tackifier.

The sealing resin included in the first sealing resin layer 11 may include the same material as the aforementioned sealing resin, and the tackifier included in the first sealing resin layer 11 is the aforementioned tackifier and The same material may be included, and the second encapsulating resin layer 12 may or may not include the desiccant 40 ′. When a desiccant is included, the same material as the desiccant described above may be included. For example, silica can be used as the desiccant, and when the desiccant is included, the moisture removal performance is excellent, the separation of the organic electronic device and the encapsulant can be prevented, and the durability of the organic electronic device can be significantly increased. have. In addition, when a moisture absorbent is included in the first encapsulating resin layer 11, the shape or particle diameter of the moisture absorbent 40" is not limited, but preferably the shape may be amorphous or spherical, and the average particle diameter is 0.01 to 10 μm, Preferably it may be 0.1 to 5 μm, more preferably 0.2 to 1 μm, and if the average particle diameter is less than 0.01 μm, there may be problems of reliability and lowering of adhesion due to lowering of dispersing force, and when it exceeds 10 μm, during the bonding process There may be a problem of dark spots due to the damage caused by the protruding particles.

On the other hand, the first sealing resin layer 11 is based on 100 parts by weight of the sealing resin, 94 to 176 parts by weight of the tackifier, preferably 108 to 163 parts by weight, more preferably 121 to 149 parts by weight, even more preferably It may contain 128 to 143 parts by weight, and if it contains less than 94 parts by weight, there may be a problem with poor moisture resistance, and if it contains more than 176 parts by weight, durability and There may be a problem that moisture resistance is lowered.

In addition, when the first encapsulation layer 11 contains the desiccant 40", the amount of the desiccant 40" is 11.2 parts by weight or less, preferably 10.4 parts by weight or less, with respect to 100 parts by weight of the encapsulating resin. Preferably, it may be included in an amount of 9.5 parts by weight or less, still more preferably 9.1 parts by weight or less. When it contains in excess of 11.2 parts by weight, there may be a problem in that the reliability of the organic electronic device is lowered due to poor adhesion such as adhesion and adhesion to the organic electronic device due to lack of wettability.

The first encapsulant layer 11 may be formed to further include one or more selected from a curing agent and a UV initiator, in addition to an encapsulating resin, a tackifier and a moisture absorbent 40 ", preferably a curing agent and a UV initiator. It may be formed to further include.

The curing agent included in the first encapsulant layer 11 may include the same material as the curing agent mentioned above, and preferably at least one selected from a compound represented by the following Chemical Formula 2 and a compound represented by the following Chemical Formula 3 It may include, and more preferably, a compound represented by the following formula (2) and a compound represented by the following formula (3) may be included, thereby ensuring sufficient curing density, and through this, the advantage of excellent moisture resistance and heat resistance have.

[Formula 2]

[Formula 3]

In Formula 2, A ₁ , A ₂ and A ₃ are each independently a C ₁ to C ₆ alkylene group, preferably a methylene group, an ethylene group, or a propylene group. )to be.

In addition, the curing agent included in the first encapsulation layer 11 is 1:5.25 to 1:9.75 weight ratio of the compound represented by Formula 2 and the compound represented by Formula 3, preferably 1:6 to 1:9 A weight ratio, more preferably 1:6.75 to 1:8.25 weight ratio, still more preferably 1:7.12 to 1:7.88 weight ratio may include, and if the weight ratio is less than 1:5.25, reliability is lowered due to lowering of adhesive force There may be, and if it exceeds 1:9.75, there may be problems with steaming and omission of the encapsulant and poor heat resistance.

In addition, the first sealing resin layer 11 is based on 100 parts by weight of the sealing resin, 28 to 52 parts by weight of the curing agent, preferably 32 to 48 parts by weight, more preferably 36 to 44 parts by weight, even more preferably 38 to 42 parts by weight may be included, and if included in less than 28 parts by weight, the desired gelation rate and modulus may not be achieved, and there may be a problem of lowering elasticity, and if it contains more than 52 parts by weight, high Due to the modulus and hardness, there may be a problem of panel adhesion failure and a decrease in adhesive strength due to deterioration in wettability.

The UV initiator included in the first encapsulant layer 11 may include the same material as the aforementioned UV initiator.

In addition, the first encapsulation resin layer 11 is 1.64 to 3.06 parts by weight of the UV initiator, preferably 1.88 to 2.83 parts by weight, more preferably 2.11 to 2.59 parts by weight, even more preferably based on 100 parts by weight of the sealing resin. may contain 2.23 to 2.48 parts by weight, and if included in less than 1.64 parts by weight, there may be a problem of poor heat resistance due to UV curing failure, and if it is included in excess of 3.06 parts by weight, heat resistance due to lowering of curing density There may be some bad issues.

The second encapsulant layer 12 is a layer in direct contact with the base layer 13 , and may include an encapsulant, a tackifier, and a moisture absorbent 40 ′.

The encapsulant included in the second encapsulant layer 12 may include the same material as the aforementioned encapsulant, and the encapsulant contained in the second encapsulant layer 12 may include the tackifier as described above. It may include the same material as the imparting agent, and the desiccant 40' included in the second encapsulation layer 12 may include the same material as the above-mentioned desiccant, preferably calcium oxide (CaO). may be included, and this may have the advantage that stable moisture absorption is possible through a chemical reaction rather than physical moisture absorption. In addition, the moisture absorbent 40' included in the second sealing resin layer 12 is not limited in shape or particle size, but preferably may have an amorphous or spherical shape, and an average particle diameter of 0.1 to 20 μm, preferably 0.5 to 10 µm, more preferably 1.5 to 4 µm, and if the average particle diameter is less than 0.1 µm, there may be problems of reliability and lowering of adhesion due to lowering of dispersing force, and if it exceeds 20 µm, the protruding particles during the bonding process There may be a problem of scotomas due to damage caused by

On the other hand, the second sealing resin layer 12, based on 100 parts by weight of the sealing resin, 57 to 107 parts by weight of the tackifier, preferably 65 to 99 parts by weight, more preferably 73 to 90 parts by weight, even more preferably It may contain 77 to 86 parts by weight, and if it contains less than 57 parts by weight, there may be a problem with poor moisture resistance, and if it contains more than 107 parts by weight, durability and There may be a problem that moisture resistance is lowered.

In addition, the second sealing resin layer 12 is based on 100 parts by weight of the sealing resin, 110 to 205 parts by weight of the moisture absorbent 40', preferably 126 to 190 parts by weight, more preferably 141 to 174 parts by weight, Even more preferably, it may contain 149 to 166 parts by weight, and if it contains less than 110 parts by weight, the desired effect of removing moisture from the second encapsulant layer 12 cannot be achieved, so that the durability of the organic electronic device is reduced. There may be a problem of deterioration, and when it contains more than 205 parts by weight, the adhesive performance is significantly reduced, and due to excessive volume expansion when moisture is absorbed, the encapsulant layer 10 including the first encapsulant layer and the second encapsulant layer (10) There may be a problem in that the organic electronic device is excited and moisture rapidly penetrates therebetween, shortening the lifespan of the organic electronic device.

Furthermore, the second encapsulant layer 12 may be formed to further include one or more selected from a curing agent and a UV initiator in addition to an encapsulant resin, a tackifier and a moisture absorbent 40 ′, preferably a curing agent and a UV initiator. It may be formed by further comprising an initiator.

The curing agent included in the second encapsulation layer 12 may include the same material as the aforementioned curing agent, and preferably include a compound represented by Chemical Formula 2 above.

In addition, the second sealing resin layer 12 of the present invention is 6.36 to 11.82 parts by weight of the curing agent, preferably 7.27 to 11.0 parts by weight, more preferably 8.18 to 10.0 parts by weight, even more preferably based on 100 parts by weight of the sealing resin. It may contain 8.63 to 9.55 parts by weight, and if included in less than 6.36 parts by weight, it is not possible to achieve the desired gelation rate and modulus, and there may be a problem of lowering elasticity, and it may contain more than 11.82 parts by weight. In this case, there may be problems of panel adhesion failure due to high modulus and hardness, and a decrease in adhesive strength due to deterioration of wettability.

The UV initiator included in the second encapsulation layer 12 may include the same material as the aforementioned UV initiator.

In addition, the second encapsulation layer 12 of the present invention is 1.27 to 2.37 parts by weight of the UV initiator, preferably 1.45 to 2.19 parts by weight, more preferably 1.63 to 2.0 parts by weight, even more, based on 100 parts by weight of the sealing resin. Preferably, it may contain 1.72 to 1.91 parts by weight, and if it is included in less than 1.27 parts by weight, there may be a problem of poor heat resistance due to UV curing failure, and if it is included in excess of 2.37 parts by weight, the curing density may be lowered. There may be a problem of poor heat resistance.

The second encapsulation layer 12 may further include a metal powder.

The type of the metal powder may include nickel, iron, copper, titanium, aluminum, and the like, and may broadly include the entire metal material. The purpose of adding the metal powder is to prevent defects in the OLED device by adsorbing moisture or oxygen.

In addition, the second sealing resin layer 12 of the present invention is based on 100 parts by weight of the sealing resin,

It may contain 1.4 to 20.4 parts by weight of metal powder, preferably 2.5 to 15.5 parts by weight, more preferably 3.5 to 10.5 parts by weight, and if it is included in less than 1.4 parts by weight, there may be a decrease in OLED device defect prevention performance. And, when it is included in excess of 20.4 parts by weight, there may be a problem in that the degree of curing is lowered due to a decrease in transmittance. When the degree of curing is lowered, there may be a problem in that the mechanical and thermal properties of the encapsulant layer are lowered, so that the moisture permeation prevention performance is lowered.

In addition, the compensation layer 14 provides an effect of improving the adhesion quality with TFT GLASS by further adding a thickness to the encapsulant of the present invention, and has a thickness of 10 μm to 300 μm, preferably a thickness of 20 to 150 μm, More preferably, it may have a thickness of 30 to 100 μm. If the thickness is less than 10㎛, there may be a problem of adhesion quality with TFT GLASS due to insufficient thickness compensation, and if it exceeds 300㎛, there may be problems such as steaming of the sealing material.

The compensation layer 14 may be preferably a pressure-sensitive adhesive layer (PSA) or an additional encapsulant layer, that is, a third encapsulant layer.

When the compensation layer 14 is a third encapsulant layer, the third encapsulant layer may include an encapsulant, a tackifier, and a moisture absorbent.

The encapsulation resin of the third encapsulation layer may be the same as the encapsulation resin of the first encapsulation layer, the same encapsulation resin as the encapsulation resin of the second encapsulation layer, or a third encapsulation resin.

Furthermore, referring to FIG. 1 , the encapsulant according to a preferred embodiment of the present invention includes a base layer 13 having moisture resistance and heat dissipation function, and encapsulation layers 11 and 12 formed on one surface of the base layer 13 . and a compensation layer 14 formed on the other surface of the base layer.

In addition, the encapsulant layers 11 and 12 , the base layer 13 , and the compensation layer 14 may be the encapsulant layers 10 and 10 ′ in a dried or cured state.

Further, in the encapsulant for an organic electronic device according to a preferred embodiment of the present invention, a release film layer 30 may be further included on the encapsulant layer, in particular, the first encapsulant layer 11 .

The release film layer 30 may use a release sheet material generally used in the art as a release sheet (liner sheet) material, for example, PET (polyethylene terephthalate), paper (Paper), PI (Poly) Imide) and PE (Poly Ester) may include one or two or more selected from.

In addition, the thickness of the release film layer 30 may be 15㎛ ~ 75㎛, preferably 25㎛ ~ 60㎛, more preferably 35㎛ ~ 55㎛.

In addition, the protective film layer 20 serves to improve customer logistics fairness by supplementing the rigidity of the encapsulant according to the present invention, and also serves as a release film for the compensation layer 14 . The protective film layer 20 may be preferably one selected from PET, PE, PI, PTFE, PP, PU, PVC, and a polymer film.

However, the material of the protective film layer 20 is not necessarily limited thereto, and can be freely selected from among general polymer film materials.

The protective film layer 20 may have a thickness of 15㎛ ~ 200㎛. Preferably, the protective film layer may have a thickness of 38 μm to 125 μm, and more preferably, a thickness of 50 μm to 100 μm.

If the thickness of the protective film layer 20 is less than 15㎛, the rigidity of the encapsulating material is weak, which may cause process errors due to bending and sagging in the customer logistics process, and wrinkles may occur when bonding with the TFT glass. If the thickness exceeds 200㎛, the thickness and rigidity of the encapsulating material may increase, which may cause a decrease in adhesive quality.

In a preferred embodiment of the present invention, the peeling force of the release film layer 30 with respect to the first encapsulation layer 11 is smaller than the peeling force of the protective film layer 20 with respect to the compensation layer 14 . it could be

In the process of packaging an organic electronic device using an encapsulant, first, the release film layer 30 is removed to adhere the encapsulant to the TFT GLASS, and then after removing the protective film layer 20, the inner plate ), when removing the release film layer 30, the protective film layer 20 should not be removed because it proceeds in the order of bonding. Therefore, it is preferable that the peeling force of the release film layer 30 is smaller than the peeling force of the protective film layer 20 .

Furthermore, referring to FIG. 2 , the organic electronic device of the present invention includes a substrate 1 , an organic electronic device 2 formed on at least one surface of the substrate 1 , and the present invention packaging the organic electronic device 2 . may include an encapsulant layer 10 for an organic electronic device.

The substrate 1 is preferably any one of a glass substrate, a quartz substrate, a sapphire substrate, a plastic substrate, and a flexible polymer film that can be bent.

In the organic electronic device 2 formed on at least one surface of the substrate 1, a lower electrode is thinly formed on the substrate 1, and an n-type semiconductor layer, an active layer, a p-type semiconductor layer, and an upper electrode are sequentially stacked thereon. It may be formed by etching, or may be formed by disposing it on the substrate 1 after being prepared through a separate substrate. A specific method of forming the organic electronic device 2 on the substrate 1 may be based on a known and customary method in the art, and the present invention is not particularly limited, and the organic electronic device 2 is It may be a light emitting diode.

Next, the encapsulant 10 for an organic electronic device of the present invention packages the organic electronic device 2, and the specific method of the packaging may be a known conventional method, and the present invention is not particularly limited. . As a non-limiting example, in the organic electronic device 2 formed on the substrate 1 , the first encapsulant layer 11 of the organic electronic device encapsulant 10 is directly connected to the organic electronic device 2 . It can be carried out by applying heat and/or pressure using a vacuum press or a vacuum laminator in a contact state. In addition, heat may be applied to cure the encapsulant 10 for an organic electronic device, and in the case of an encapsulant including a photocurable encapsulant resin, the encapsulant may be moved to a chamber to which light is irradiated to further undergo a curing process.

Hereinafter, the present invention will be described with reference to the following examples. At this time, the following examples are only presented to illustrate the invention, and the scope of the present invention is not limited by the following examples.

Example 1: Preparation of an encapsulant for an organic electronic device

(1) Preparation of the first encapsulant layer

Based on 100 parts by weight of the encapsulating resin, 82 parts by weight of a tackifier, 7 parts by weight of a curing agent, and 2 parts by weight of a UV initiator were mixed to prepare a mixture.

At this time, the compound represented by the following Chemical Formula 1-1 was used as the encapsulating resin, SU-525 (Kolon Industries, Ltd.) was used as the tackifier, and the compound represented by the following Chemical Formula 2-1 and the following Chemical Formula 3 as the curing agent. The compound represented by -1 was used in a weight ratio of 1:0.3, and irgacure TPO (Ciba) was used as a UV initiator.

The prepared mixture was adjusted to a viscosity of 600 cps at a temperature of 20 ° C, passed through a capsule filter to remove foreign substances, and then applied to 38 μm thick antistatic release PET (REL382, Toray) using a slot die coater, and then After removing the solvent by drying at a temperature of 160° C., a second first encapsulating resin layer having a final thickness of 10 μm was prepared.

[Formula 1-1]

In Formula 1-1, R ¹ is isoprene, and n is a rational number satisfying the weight average molecular weight of the compound represented by Formula 1-1 of 400,000 g/mol.

[Formula 2-1]

[Formula 3-1]

(2) Preparation of the second encapsulant layer

Based on 100 parts by weight of the encapsulant, 90 parts by weight of a tackifier, 10 parts by weight of a curing agent, 2 parts by weight of a UV initiator, 8 parts by weight of a pixel defect prevention agent, and 210 parts by weight of a desiccant were mixed to prepare a mixture.

At this time, the compound represented by the following formula 1-1 was used as the sealing resin, SU-525 (Kolon Industries, Ltd.) was used as the tackifier, and the compound represented by the following formula 2-1 was used as the curing agent, Irgacure TPO (Ciba) was used as a UV initiator, nickel having an average particle diameter of 0.5 μm was used as an agent for preventing pixel defects, and calcium oxide having an average particle diameter of 3 μm was used as a moisture absorbent.

The prepared mixture was adjusted to a viscosity of 600 cps at a temperature of 20 ° C, passed through a capsule filter to remove foreign substances, and then applied to a 36 μm thick antistatic release PET (TG65R, SKC) using a slot die coater, and then After the solvent was removed by drying at a temperature of 160° C., a second encapsulant layer having a final thickness of 40 μm was prepared.

[Formula 1-1]

In Formula 1-1, R ¹ is isoprene, and n is a rational number satisfying the weight average molecular weight of the compound represented by Formula 1-1 of 400,000 g/mol.

[Formula 2-1]

(3) Compensation layer manufacturing

A compensation layer was prepared with the same composition as the first encapsulant layer. However, unlike the first encapsulant layer, it is applied using a slot die coater on heavy-duty antistatic release PET (HT&M R4010P) having a thickness of 75 μm, and then dried at a temperature of 160° C. to remove the solvent, and the final thickness is 50 μm. A compensation layer was prepared.

(4) Preparation of base layer

As the base layer, an aluminum foil with a thickness of 30 μm (product of AL3104 from Korea Aluminum Company) is used,

It was laminated by passing the compensation layer and 70 ℃ ramirol.

The aluminum foil had moisture permeability and thermal conductivity of 10 ⁻⁴ g/m 2 /day and 160 W/m·K, respectively, which are shown in Table 1 below.

(5) Manufacture of encapsulation material

The second encapsulation layer 12 of the prepared first encapsulant layer 11 was laminated to face each other, and the encapsulation layer 11 and 12 was prepared by passing it through a 70° C. lamirol.

Thereafter, the protective film of the second encapsulation resin layer was removed, laminated to face the base layer on which the compensation layer was laminated, and passed through a 70° C. lamirol to complete the encapsulation material.

Examples 2-7 and Comparative Examples 1-2: Preparation of encapsulants for organic electronic devices

An encapsulant was prepared in the same manner as in Example 1, except that the thickness and physical properties of the encapsulant layer, the base layer, and the compensation layer were adjusted as shown in Table 1 below.

Example 1 Example 2 Example 3 Example 4 first encapsulant layer
Thickness (㎛) 10 10 10 10 2nd encapsulation resin layer
Thickness (㎛) 40 40 40 40 encapsulant layer
Sum of thickness (㎛) 50 50 50 50 base layer
Material/Thickness (A, ㎛) AL 3104
30 PET
23 SUS430
50 AL 1050
30 base layer
moisture permeability
(g/m ² /day) 10 ^-4 16-20 10 ^-4 10 ^-4 base layer
thermal conductivity
(W/m K) 160 0.29 25-30 231 base layer
The tensile strength
(MPa) 310 55 650 75 reward layer
(Material/Thickness) PSA/50 PSA/50 PSA/50 PSA/50 protective film layer
Thickness (B, μm) 75 75 75 75 B/A 2.5 3.26 1.5 1.5 protective film layer surface resistance
(Ω/□) 5.6×10 ⁶ 5.6×10 ⁶ 5.6×10 ⁶ 5.6×10 ⁶

Example 5 Example 6 Example 7 Comparative Example 1 Comparative Example 2 First encapsulation resin layer thickness (㎛) 10 10 10 10 10 Second encapsulation resin layer thickness (㎛) 40 40 40 40 40 encapsulant layer
Sum of thickness (㎛) 50 50 50 50 50 base layer
Material/Thickness (A, ㎛) Fe
50 AL 1235/
5 AL 3104/
75 AL3104/
75 AL 1235/
7 base layer
moisture permeability
(g/m ² /day) 10 ^-4 10 ^-4 10 ^-4 10 ^-4 10 ^-4 Base layer thermal conductivity
(W/m K) 80 160 160 160 160 base layer
The tensile strength
(MPa) 800 130 310 310 130 reward layer
(Material/Thickness, ㎛) PSA/50 PSA
/50 PSA
/50 PSA
/50 PSA
/50 protective film layer
Thickness (B, μm) 75 75 75 15 250 B/A 1.5 25.0 1.0 0.2 35.7 protective film layer
surface resistance
(Ω/□) 5.6×10 ⁶ 5.6×10 ⁶ 5.6×10 ⁶ 5.6×10 ⁶ 5.6×10 ⁶

Experimental Example 1

The following physical properties were measured for the encapsulants prepared in Examples and Comparative Examples, and are shown in Table 1 below.

1. Evaluation of water penetration of encapsulants

After cutting the specimen (= encapsulant) to a size of 95 mm × 95 mm, remove the protective film on 100 mm × 100 mm alkali-free glass. After fitting it well, it was attached using a roll laminator heated to 65°C. After removing the release film remaining on the attached specimen, cover another 100mmХ100mm alkali-free glass and lamination with a vacuum laminator at 65°C for 1 minute to prepare a bonded sample without bubbles. In the sample after the cementation was completed, the length of moisture penetration was observed under a microscope in a reliability chamber set at 85° C. and 85% relative humidity in units of 1000 hours.

2. Evaluation of volume expansion of encapsulants

After removing the release film of the specimen (= encapsulant) on a 50 μm thick SUS plate cut to 30 mm × 20 mm, it was attached using a roll laminator heated to about 65° C. The attached specimen was cut with a knife to fit the size of SUS, and then attached to 40 mm × 30 mm 0.5T alkali-free glass using a roll laminator heated to 65°C. After confirming that the specimen is well attached without voids between the glass and SUS, observe for 1,000 hours at intervals of 100 hours in a reliability chamber set at 85°C and 85% relative humidity, and the specimen is based on SUS in the area where moisture is absorbed. The change in height was observed through an optical microscope.

As a result of observation, when the height change in the moisture absorption area is less than 12㎛ ◎, when the height change in the moisture absorption area is less than 12-14㎛ ○, when the height change in the moisture absorption area is less than 14-16㎛ △, the height in the moisture absorption area When the change is 16 μm or more, it is indicated by ×.

3. Heat resistance evaluation of encapsulants

The specimen (= encapsulant) was cut to a size of 50 mmХ80 mm, and after removing the protective film of the specimen, it was attached to a 60 mmХ150 mm 0.08T Ni alloy using a roll laminator at 80° C., Gap 1 mm, and Speed 1. . After removing the release film of the attached specimen, it was attached to 30mmХ70mm 0.5T alkali-free glass using a roll laminator at 80°C, Gap 1mm, and Speed 1. After the specimen attached to the glass was vertically fixed in a chamber at 130° C., a 1 kg weight was hung to determine the flow of the encapsulating resin. At this time, if there is no abnormality in the evaluation result, it is indicated by ○, and if it flows even a little, it is indicated by ×.

4. Glass adhesion evaluation

For the encapsulant prepared according to Examples and Comparative Examples, the adhesive force measuring tape (7475, TESA) was laminated on the upper surface of the encapsulant through a 2 kg hand roller, and the sample (= encapsulant) was width 25 After cutting to ㎜ and 120㎜ in length, laminating the lower surface of the encapsulant on alkali-free glass at 80°C, leaving the sample at room temperature for 30 minutes, and using a universal material testing machine (UTM) at a speed of 300 mm/min. Adhesion was measured.

5. Metal adhesion evaluation

For the encapsulants prepared according to Examples and Comparative Examples, the upper surface of the encapsulant was laminated to a Ni alloy having a thickness of 80 μm at 80 ° C., and an adhesive force measuring tape (7475, TESA) was laminated to the lower surface of the adhesive film, After cutting the adhesive film) to a width of 25 mm and a length of 120 mm, the prepared sample was left at room temperature for 30 minutes, and the metal adhesion was measured at a speed of 300 mm/min through a universal testing machine (UTM).

6. Evaluation of the moisture permeability of the base layer

The thickness of the base layer in a state where the base layer was placed at 100°F and 100% relative humidity

The moisture permeability with respect to the direction was measured. The moisture permeability was measured according to the regulations in ASTM F1249.

7. Evaluation of the thermal conductivity of the substrate layer

The thermal conductivity of the substrate layer to Thru-Plan was measured at 25° C. using LFA (Laser Flash Analysis) equipment.

8. Evaluation of Tensile Strength of Base Layer

The tensile strength of the substrate layer was measured using a universal testing machine (UTM). Tensile strength was measured according to the rules of ASTM E8/E8M.

9. Evaluation of surface resistance of protective film

In order to analyze the surface resistance of the rear surface of the release treatment layer of the protective film, the specimen is cut to 100 * 100 mm. At this time, if there is a wrinkle, an error in the resistance value may occur, so pay attention to the wrinkle. Place the sample in the center of the measuring plate. In this case, an insulator is used for the plate material. Use the analysis equipment (Grade: TREK 152-1) and measure using a 2 point probe. After setting a specific voltage, the two probes were placed in contact with the surface to be measured, and the current was flowed by pressing the probe forcefully, and the value displayed on the analysis equipment was analyzed.

Experimental Example 2

An organic light emitting device (hole transport layer NPD/thickness 800A, light emitting layer Alq3/thickness 300A, electron injection layer LiF/thickness 10A, cathode Al + Liq/thickness 1,000A) on a substrate with an ITO pattern is deposited and laminated on the fabricated device. After laminating the encapsulant according to Examples and Comparative Examples at room temperature, an OLED unit specimen emitting green light was prepared. Thereafter, the following physical properties were evaluated for the specimen and shown in Table 1.

1. Durability evaluation of organic light emitting device according to moisture penetration of encapsulant

In an environment of 85 ℃ and 85% relative humidity of the specimen, pixel shrinkage and the generation and/or growth of dark spots in the light emitting part for each time period were observed with a digital microscope of ×100 in units of 100 hours. The time taken for pixel reduction to occur by 50% or more and/or to generate dark spots was measured.

In this case, when 50% or more of pixel reduction occurs and the time required to create dark spots is 1,000 hours or more ◎, When 50% or more of pixel reduction occurs and the time required to create dark spots is less than 1000 hours to 800 hours or more ○, 50% or more of pixel reduction When the time required for occurrence and dark spot generation was less than 800 hours to 600 hours or more, △, and when the pixel reduction occurred by 50% or more and the time required for dark spot generation was less than 600 hours, ×.

2. Durability evaluation of encapsulants

Specimens were observed for 1,000 hours at 100 hour intervals in a reliability chamber set at 85°C and 85% relative humidity to examine the interface separation between the organic electronic device and the encapsulant, cracks or bubbles in the adhesive film, and separation between the adhesive layers using an optical microscope. Physical damage was evaluated by observation. In the case of no abnormality as a result of the evaluation, it is indicated by ○, when any abnormality occurs, such as interfacial separation, cracks or bubbles in the encapsulant, and separation between the first and second encapsulant layers.

3. Is there any abnormality in the logistics process?

Cut the specimen of encapsulation material to 250mm×30mm, fix 50mm to a jig with adjustable height, let 200mm sag by its own weight, and adjust the height until the fixed end reaches the floor. If the height of the 200mm length specimen in contact with the floor is less than 130mm, it is indicated by ○, and when the sagging height is 130mm or more, it is indicated by ×.

4. Is there any abnormality in panel high temperature/high humidity bending?

Cut a specimen of encapsulation material to 250Х30mm, align it with 260Х35mm, 0.5T alkali-free glass, and pass it through a 70℃ lamirol to adhere it.

After putting it in the 85℃/85%RH chamber for 48 hours, take it out, let the room temperature sealing material look at the top, and leave it for 40 hours so that 0.5T alkali-free glass comes into contact with the table.

Measure the height of the gap between the table and alkali-free glass using the height gauge for the specimen manufactured in the above method. When the height is less than 2mm, it is indicated by ○, and when the height is 2mm or more, it is indicated by ×. Measurements are made once for each left and right, and if either one exceeds 2mm, it is indicated as ×.

division Example 1 Example 2 Example 3 Example 4 Example 5 adhesion
film moisture penetration length
(μm) 1.7 3.5 2.1 1.8 1.8 Volume expansion evaluation ◎ × ○ ○ ○ Heat resistance evaluation ○ × ○ ○ ○ Glass adhesion
(gf/25mm) 2,423 2,106 2,592 2419 2384 Metal adhesion (gf/25mm) 1,834 1,443 1,966 1913 1882 OLED
Psalter organic light emitting device
Durability evaluation ◎ △ ○ ○ ○ of encapsulant
Durability evaluation ○ × ○ ○ × Logistics process abnormality ○ ○ ○ × × Is there any abnormality in panel high temperature/high humidity bending? ○ × × × × division Example 6 Example 7 Comparative Example 1 Comparative Example 2 adhesion
film moisture penetration length
(μm) 3.8 0.1 0.1 3.3 Volume expansion evaluation ○ × × ○ Heat resistance evaluation ○ × × ○ Glass adhesion
(gf/25mm) 2,524 2,300 2,481 1,725 metal adhesion
(gf/25mm) 1901 1,852 1,769 968 OLED
Psalter organic light emitting device
Durability evaluation ○ ○ ○ × of encapsulant
Durability evaluation ○ ○ × × Logistics process abnormality × ○ ○ ○ Is there any abnormality in panel high temperature/high humidity bending? ○ × × ○

Simple modifications or changes of the present invention can be easily carried out by those skilled in the art, and all such modifications or changes can be considered to be included in the scope of the present invention.

1: Substrate
2: organic electronic device
10: encapsulant layer
11: First encapsulation resin layer
12: first encapsulation resin layer
13: base layer
14: reward layer
20: protective film layer
30: release film layer
40': tackifier and moisture absorbent
40": tackifier and desiccant
50': metal powder

Claims (15)

a base layer having moisture resistance and heat dissipation;
an encapsulant layer formed on one surface of the base layer and formed of two or more multi-layers; and
Including; a compensation layer formed on the other surface of the base layer and a protective film layer formed on the compensation layer;
An encapsulant for an organic electronic device that satisfies the following condition (1):
(1) 0.3≤B/A≤28.5
In the above condition (1), A represents the thickness (μm) of the base layer, B represents the thickness (μm) of the protective film layer.
According to claim 1,
The base layer has a water vapor transmission rate of 1.0 g/m ² /day or less,
An encapsulant for an organic electronic device, characterized in that the thermal conductivity is 50 W/m·K or more.
According to claim 1,
The base layer is an encapsulant for an organic electronic device, characterized in that the metal thin film.
4. The method of claim 3,
The base layer is an encapsulant for an organic electronic device, characterized in that the tensile strength of 100 to 400 MPa.
According to claim 1,
A is 7-50㎛, B is an organic electronic device encapsulant, characterized in that 15 ~ 200㎛.
According to claim 1,
The encapsulant layer is composed of a first encapsulant layer and a second encapsulant layer interposed between the base layer and the first encapsulant layer,
The first encapsulating resin layer and the second encapsulating resin layer have a thickness ratio of 1:2.8 to 1:5.2.
7. The method of claim 6,
The first encapsulant layer has a thickness of 1 ~ 30㎛,
The second encapsulant layer is an encapsulant for an organic electronic device, characterized in that it has a thickness of 15 ~ 70㎛.
According to claim 1,
The compensation layer is an encapsulant for an organic electronic device, characterized in that it is a pressure-sensitive adhesive layer (PSA) or a third encapsulant layer.
According to claim 1,
The compensation layer is an encapsulant for an organic electronic device, characterized in that it has a thickness of 10 ~ 300㎛.
7. The method of claim 6,
The first encapsulant layer and the second encapsulant layer each independently contain an encapsulant, a tackifier and a moisture absorbent.
11. The method of claim 10,
The first encapsulant layer and the second encapsulant layer are each independently an encapsulant for an organic electronic device, characterized in that it further comprises at least one selected from a curing agent and a UV initiator.
According to claim 1,
The encapsulant for an organic electronic device, characterized in that it further comprises a release film layer on the opposite surface of the surface in contact with the base layer of the encapsulant layer formed on one surface of the base layer.
13. The method of claim 12,
The peeling force of the release film layer is an organic electronic device encapsulant, characterized in that lower than the peeling force of the protective film layer.
According to claim 1,
An encapsulant for an organic electronic device, characterized in that the surface of the protective film layer in contact with the compensation layer is release-treated, and the surface resistance of the rear surface of the release-treated surface is 9.99×10 ³ to 9.99×10 ¹² Ω/□ .
According to claim 1,
The encapsulant for an organic electronic device, characterized in that the sum of the thickness of the encapsulant layer, the base layer and the compensation layer, and the protective film layer is 48 to 650 μm.

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