KR20220084081A - 파쇄가 용이한 다이아몬드 그릿 및 그 제조방법 - Google Patents
파쇄가 용이한 다이아몬드 그릿 및 그 제조방법 Download PDFInfo
- Publication number
- KR20220084081A KR20220084081A KR1020227015173A KR20227015173A KR20220084081A KR 20220084081 A KR20220084081 A KR 20220084081A KR 1020227015173 A KR1020227015173 A KR 1020227015173A KR 20227015173 A KR20227015173 A KR 20227015173A KR 20220084081 A KR20220084081 A KR 20220084081A
- Authority
- KR
- South Korea
- Prior art keywords
- diamond
- particles
- grit
- diamond particles
- starting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/25—Diamond
- C01B32/28—After-treatment, e.g. purification, irradiation, separation or recovery
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
- B01J3/06—Processes using ultra-high pressure, e.g. for the formation of diamonds; Apparatus therefor, e.g. moulds or dies
- B01J3/062—Processes using ultra-high pressure, e.g. for the formation of diamonds; Apparatus therefor, e.g. moulds or dies characterised by the composition of the materials to be processed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
- B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2203/00—Processes utilising sub- or super atmospheric pressure
- B01J2203/06—High pressure synthesis
- B01J2203/065—Composition of the material produced
- B01J2203/0655—Diamond
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/90—Other properties not specified above
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Geology (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Carbon And Carbon Compounds (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2019-183852 | 2019-10-04 | ||
| JP2019183852 | 2019-10-04 | ||
| PCT/JP2020/037635 WO2021066172A1 (ja) | 2019-10-04 | 2020-10-02 | 易破砕性ダイヤモンド砥粒及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20220084081A true KR20220084081A (ko) | 2022-06-21 |
Family
ID=75337042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227015173A Pending KR20220084081A (ko) | 2019-10-04 | 2020-10-02 | 파쇄가 용이한 다이아몬드 그릿 및 그 제조방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20220348470A1 (https=) |
| EP (1) | EP4039766A4 (https=) |
| JP (1) | JP7650073B2 (https=) |
| KR (1) | KR20220084081A (https=) |
| CN (1) | CN114787315B (https=) |
| WO (1) | WO2021066172A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025250873A1 (en) * | 2024-05-30 | 2025-12-04 | Engis Corporation | Thermal graphitization of encapsulated micron size and submicron size diamond particles |
| CN119954152B (zh) * | 2025-02-11 | 2025-10-17 | 长垣市新材料与装备产业研究院 | 一种金刚石面蚀刻方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5518871B2 (https=) | 1975-05-28 | 1980-05-22 | ||
| JP3411239B2 (ja) | 1998-08-28 | 2003-05-26 | 石塚 博 | ダイヤモンド研磨材粒子及びその製法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5518654B1 (https=) * | 1970-11-18 | 1980-05-20 | ||
| JPS5969266A (ja) * | 1982-09-14 | 1984-04-19 | Nippon Gureen Kenkyusho:Kk | ビトリフアイドボンドダイヤモンド砥石の製造方法 |
| JP3119098B2 (ja) * | 1994-10-17 | 2000-12-18 | 株式会社ティ・ケー・エックス | ダイヤモンド砥粒、砥石及びそれらの製造方法 |
| JP2002060733A (ja) * | 2000-08-17 | 2002-02-26 | Ishizuka Kenkyusho:Kk | ダイヤモンド研磨材粒子及びその製法 |
| ES2814225T3 (es) * | 2008-09-16 | 2021-03-26 | Diamond Innovations Inc | Partículas abrasivas que tienen una morfología única |
| US20100213175A1 (en) * | 2009-02-22 | 2010-08-26 | General Electric Company | Diamond etching method and articles produced thereby |
| GB201017924D0 (en) * | 2010-10-22 | 2010-12-01 | Element Six Production Pty Ltd | Polycrystalline diamond material |
| GB201122064D0 (en) * | 2011-12-21 | 2012-02-01 | Element Six Abrasives Sa | A superhard structure or body comprising a body of polycrystalline diamond containing material |
| CN102757044B (zh) * | 2012-07-23 | 2013-06-05 | 河南省联合磨料磨具有限公司 | 高切削力金刚石微粉及其制备方法 |
| KR101811761B1 (ko) * | 2014-10-11 | 2017-12-22 | 허난 페이머스 다이아몬드 인더스트리얼 씨오. 엘티디 | 거친 표면의 금강석의 합성방법 |
| KR20160113373A (ko) * | 2015-03-18 | 2016-09-29 | 일진다이아몬드(주) | 표면처리된 다이아몬드 및 그 다이아몬드의 표면 처리방법 |
| CN108795383A (zh) * | 2018-06-05 | 2018-11-13 | 燕山大学 | 一种提高金刚石自锐性的制备方法 |
-
2020
- 2020-10-02 CN CN202080084255.4A patent/CN114787315B/zh active Active
- 2020-10-02 KR KR1020227015173A patent/KR20220084081A/ko active Pending
- 2020-10-02 WO PCT/JP2020/037635 patent/WO2021066172A1/ja not_active Ceased
- 2020-10-02 JP JP2021551620A patent/JP7650073B2/ja active Active
- 2020-10-02 EP EP20870533.5A patent/EP4039766A4/en active Pending
- 2020-10-02 US US17/766,033 patent/US20220348470A1/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5518871B2 (https=) | 1975-05-28 | 1980-05-22 | ||
| JP3411239B2 (ja) | 1998-08-28 | 2003-05-26 | 石塚 博 | ダイヤモンド研磨材粒子及びその製法 |
Non-Patent Citations (1)
| Title |
|---|
| 비특허문헌 1 : 「다이아몬드 공구」 닛케이 기술도서사 출판(1987) |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021066172A1 (ja) | 2021-04-08 |
| JP7650073B2 (ja) | 2025-03-24 |
| EP4039766A1 (en) | 2022-08-10 |
| US20220348470A1 (en) | 2022-11-03 |
| CN114787315B (zh) | 2024-06-11 |
| CN114787315A (zh) | 2022-07-22 |
| JPWO2021066172A1 (https=) | 2021-04-08 |
| EP4039766A4 (en) | 2023-10-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
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| D21 | Rejection of application intended |
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