KR20220082748A - Film forming apparatus, film forming method and manufacturing method of electronic device - Google Patents

Abstract

[Problem] Maintainability is improved while preventing deposition of deposition materials on the inner surface of the ceiling of the transfer chamber.
[Solutions] An in-line type film forming apparatus that vapor-deposits while conveying a substrate, comprising a plurality of deposition-preventing members covering the inner surface of a ceiling portion of a conveyance chamber. The said transfer chamber is equipped with the 1st edge part which has the carrying-in opening of the said board|substrate. The plurality of deposition-preventing members includes a first deposition-preventing member disposed along the inner surface of the ceiling portion, and a second deposition-preventing member disposed at the first end side of the first deposition-preventing member, and the second deposition preventing member The member has a lateral wall portion extending from the first deposition preventing member side toward the first end portion, and a vertical wall portion extending downward from the lateral wall portion.

Description

A film-forming apparatus, a film-forming method, and the manufacturing method of an electronic device TECHNICAL FIELD

The present invention relates to a film forming apparatus, a film forming method, and a manufacturing method of an electronic device.

In manufacture of an organic electroluminescent display etc., vapor deposition substances, such as an organic material and a metal material, are vapor-deposited on a board|substrate using a mask. A film-forming apparatus which arranges a vapor deposition apparatus below the conveyance apparatus which conveys a board|substrate, and discharges|releases a vapor deposition material to a board|substrate from under a board|substrate is proposed (patent document 1).

Patent Document 1: Japanese Patent Laid-Open No. 11-131232

The substrate is conveyed within the conveying chamber of the conveying apparatus. Since the deposition material discharged from the deposition apparatus enters the transfer chamber, the deposition material may adhere to the inner surface of the ceiling portion. In order to prevent the deposition material from adhering to the inner surface of the ceiling part, it is effective to cover the inner surface with an anti-deposition member. However, the position of the corner portion of the ceiling portion is difficult for the operator to reach. When the deposition material progresses to clean or replace the deposition-preventing member, there is a problem that maintenance is inconvenient.

An object of the present invention is to provide a technique for improving maintainability while preventing deposition of a deposition material on an inner surface of a ceiling portion of a transfer chamber.

According to the present invention,

a transport device for transporting the substrate in a horizontal transport direction;

a deposition device disposed below the transport device to deposit a deposition material on the substrate;

An in-line type film forming apparatus for performing vapor deposition while conveying the substrate,

The conveying device is

a transfer chamber forming a transfer space of the substrate;

and a plurality of deposition preventing members covering the inner surface of the ceiling portion of the transfer chamber,

The transfer chamber includes a first end having an inlet for the substrate;

The plurality of deposition-preventing members,

a first deposition preventing member disposed along the inner surface of the ceiling portion;

With respect to the first deposition-preventing member, including a second deposition-preventing member disposed on the first end side,

The second deposition preventing member,

a transverse wall portion extending from the first deposition preventing member side toward the first end;

There is provided a film forming apparatus characterized by having a vertical wall portion extending downward from the horizontal wall portion.

According to the present invention, it is possible to improve maintainability while preventing the deposition material from adhering to the inner surface of the ceiling portion of the transfer chamber.

BRIEF DESCRIPTION OF THE DRAWINGS It is a front view of the film-forming apparatus which concerns on one Embodiment of this invention.
FIG. 2 is a side view of the film forming apparatus of FIG. 1 .
FIG. 3 is an explanatory diagram showing an internal structure of the film forming apparatus of FIG. 1 .
4(A) to 4(C) are explanatory views of the movement operation of the vapor deposition apparatus by the movement apparatus.
5(A) and 5(B) are explanatory views of an example of detachment of the anti-stick member.
6 is a perspective view of a deposition preventing member.
7 is a perspective view of a deposition preventing member of another example.
8(A) and 8(B) are perspective views of a deposition preventing member of another example.
Fig. 9(A) is an overall view of an organic EL display device, and Fig. 9(B) is a view showing a cross-sectional structure of one pixel.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment is described in detail with reference to an accompanying drawing. In addition, the following embodiment does not limit the invention which concerns on a claim. Although a plurality of features are described in the embodiment, not all of these plurality of features are necessarily essential to the invention, and a plurality of features may be arbitrarily combined. In addition, in an accompanying drawing, the same reference number is attached|subjected to the same or similar structure, and overlapping description is abbreviate|omitted.

<Outline of film forming apparatus>

1 is a front view of a film forming apparatus 1 according to an embodiment of the present invention, and FIG. 2 is a side view of the film forming apparatus 1 . 3 : is explanatory drawing which shows the internal structure of the film-forming apparatus 1. As shown in FIG. On the other hand, in each figure, arrows X and Y indicate a horizontal direction orthogonal to each other, and arrow Z indicates a vertical direction (vertical direction). The film forming apparatus 1 is equipped with the conveying apparatus 2 and the some vapor deposition apparatus 3 . The some vapor deposition apparatuses 3 are arrange|positioned side by side in the X direction, and the conveyance apparatus 2 is supported by the frame 4 so that it may be located above these vapor deposition apparatuses 3 . The frame 4 is provided with the some post 4a and the some beam 4b supported by the some post 4a, The conveying apparatus 2 is being fixed to the beam 4b.

The conveying apparatus 2 is equipped with the conveyance chamber 20 which forms inside the conveyance space (transfer chamber) 20a maintained by vacuum at the time of use. An inlet 21a is provided in one end 21 of the transfer chamber 20 in the X direction, and an outlet 22a is provided in the other end 22 on the opposite side, and the object to be processed is a carry in port 21a. It is carried into the conveyance space 20a from the , and is carried out from the discharge port 22a after processing. Gate valves are provided in the inlet 21a and the outlet 22a. An annular reinforcing rib 21b surrounding the periphery of the carry-in port 21a is integrally formed at the end 21 of the transfer chamber 20 to improve the rigidity of the periphery of the carry-in port 21a. The reinforcing rib 21b projects from the inner surface of the end 21 into the conveying space 20a. Similarly, an annular reinforcing rib 22b surrounding the periphery of the transport port 22a is integrally formed at the end 22 of the transfer chamber 20 to improve the rigidity of the periphery of the transport port 22a. The reinforcing rib 22b projects from the inner surface of the end 22 into the conveying space 20a.

A plurality of conveying rollers R arranged in the X direction are provided in the conveying space 20a. The rows of this conveyance roller R are spaced apart in the Y direction, and two rows are arrange|positioned. Each conveyance roller R rotates around the rotation axis of a Y direction. The both ends of the Y direction are mounted on the row|line|column of the conveyance roller R of 2 rows, and a conveyance object is conveyed in a horizontal attitude|position to a X direction by rotation of the conveyance roller R. That is, the conveyance direction of the conveyance object in this embodiment is an X direction. In addition, although the roller mechanism was used as a conveyance mechanism of the object to be processed in this embodiment, other types of conveyance mechanisms, such as magnetic levitation conveyance, may be sufficient.

Each vapor deposition apparatus 3 is provided with a source chamber 3a forming an internal space maintained in a vacuum during use. The source chamber 3a has a box shape with an opening formed therein, and the conveyance space 20a and the internal space of the source chamber 3a communicate with each other through the opening. The deposition apparatus 3 is provided with a deposition source 6 which discharges the deposition material 13 upward. The vapor deposition source 6 of this embodiment is a so-called line source, and extends in a direction (Y direction orthogonal to the conveying direction in this embodiment) intersecting the conveyance direction (X direction) of the object to be processed in the conveying apparatus 2 . installed. The vapor deposition source 6 includes a crucible for accommodating the raw material of the vapor deposition material, a heater for heating the crucible, and the like, and heats the raw material to discharge the vapor deposition material as a vapor to the conveying space 20a. In addition, the evaporation source 6 may be a spot source.

Deposition prevention members 7A and 7B are provided around the evaporation source 6 . The deposition preventing members 7A and 7B constitute a shielding wall that restricts the emission range of the deposition material from the deposition source 6 so that the deposition material does not adhere to the wall portion of the source chamber 3a or other devices in the vicinity.

The deposition preventing member 7A is a cylindrical member configured to surround the emitting space of the vapor deposition material extending from the deposition source 6 to the transport space 20a (in other words, the space above the deposition source 6 ). In the case of this embodiment, since the evaporation source 6 is in the form of a line source extended in the Y direction, the deposition-preventing plate unit 7 has a rectangular cylindrical shape following the shape of the evaporation source 6 . . The deposition preventing member 7B is a cylindrical member configured to surround the deposition source 6 and the emitting space of the deposition material from the deposition source 6 to the transport space 20a. In the case of this embodiment, similarly to the deposition preventing member 7A, the deposition preventing member 7B also has a rectangular cylindrical shape.

The deposition preventing member 7B is located at the lower side, the deposition preventing member 7A is located at the upper side, and the upper portion of the deposition preventing member 7A is entering the conveying space 20a. The lower end of the anti-adhesive member 7A enters the inside of the anti-adhesive member 7B, and the lower end of the anti-adhesive member 7A and the upper end of the anti-adhesive member 7B overlap each other in the vertical direction. In the case of this embodiment, the deposition preventing members 7A and 7B are supported by the source chamber 3a. On the other hand, in the present embodiment, although the adhesion-preventing members 7A and 7B have a configuration of two members, they may be one integral member.

The film forming apparatus 1 is an inline film forming method capable of depositing a vapor deposition material on the object to be treated by the vapor deposition apparatus 3 (evaporation process) while conveying the object to be treated by the transfer apparatus 2 (transport process). It is a type film forming device. The film-forming apparatus 1 manufactures electronic devices, such as a display apparatus (flat panel display etc.), a thin-film solar cell, an organic photoelectric conversion element (organic thin-film imaging element), an optical member, etc., for example, Manufacturing of an electronic device It is applicable to a manufacturing apparatus implementing the method. In FIG. 3 , the substrate 11 is exemplified as the object to be processed. The substrate 11 is transferred together with the mask 12 in the X-direction, and the deposition material is deposited on the substrate 10 through the mask 12 positioned below the substrate 11 , thereby forming a predetermined pattern of the deposition material. A thin film may be formed on the substrate 11 . The board|substrate 11 is a board|plate material which consists of materials, such as glass, resin, and a metal, for example, and is a substance, such as an organic material and an inorganic material (metal, metal oxide, etc.) as a vapor deposition material.

In this embodiment, the some vapor deposition apparatus 3 is arrange|positioned in the conveyance direction of the board|substrate 11. As shown in FIG. When different types of deposition materials are emitted by the deposition apparatus 3 , different deposition materials may be continuously deposited on the substrate 11 . In addition, the number of the vapor deposition apparatuses 3 is not limited to three, One or two may be sufficient, and four or more may be sufficient as it.

Each vapor deposition apparatus 3 is provided with a moving apparatus 7 which moves the vapor deposition apparatus 3, respectively. By moving the vapor deposition apparatus 3, its maintenance becomes easy. Moreover, the maintenance of the conveying apparatus 2 also becomes easy. The moving device 7 includes a traveling unit 5a and a pair of lifting units 5b. The traveling unit 5a includes, for example, a drive source such as a motor, and wheels that are driven by a driving force of the drive source, and is Y along a guide portion 5c such as a rail member installed on the floor of a factory. can be reciprocated in any direction. A pair of raising/lowering units 5b is mounted on the traveling unit 5a. The vapor deposition apparatus 3 is located between a pair of raising/lowering units 5b, and is raised and lowered by a pair of raising/lowering units 5b. Each lifting unit 5b includes a drive source such as a motor and a mechanism for raising and lowering the vapor deposition apparatus 3 by the driving force of the drive source, and the pair of lifting units 5b is driven synchronously.

4 : is explanatory drawing of the movement operation|movement of the vapor deposition apparatus 3 by the movement apparatus 7 . Fig. 4(A) shows a state in which the vapor deposition apparatus 3 is positioned at the position at the time of the film forming process. In this position, the vapor deposition apparatus 3 and the conveying apparatus 2 are in the positional relationship of FIG. When moving the vapor deposition apparatus 3, from the position of FIG. 4(A), as shown in FIG. 4(B), the vapor deposition apparatus 3 is lowered downward by a pair of lifting units 5b. . Thereby, the deposition-preventing plate unit 7A whose upper part has entered the conveyance space 20a is retracted from the conveyance space 20a. Then, the traveling unit 5a is driven to move the vapor deposition apparatus 3 in the Y direction. Thereby, as shown in FIG.4(C), the vapor deposition apparatus 3 moves to the position shifted from the lower side of the conveyance apparatus 2 in the Y direction. The conveying apparatus 2 and the vapor deposition apparatus 3 are in the state in which the inside was exposed, respectively, and these maintenance can be performed efficiently.

<Transfer chamber and deposition prevention structure>

The transfer chamber 20 and its deposition preventing structure will be described with reference to Figs. 5A and 5B in addition to Figs. 5(A) and 5(B) show the deposition-preventing members 8A to 8C installed in the transfer chamber 20 (collectively, the deposition-preventing member 8 is called when there is no distinction), and the deposition-preventing member 9A. and 9B) (in the case of generic terms, when not distinguished, the anti-stick member 9 is referred to), and the anti-deposition members 10A and 10B (collectively, when not distinguished, the anti-stick member 10 is referred to). It is an example explanatory diagram.

The transfer chamber 20 has a rectangular parallelepiped shape as a whole. The end 21 and the end 22 of the transfer chamber 20 each form an end wall on the Z-Y plane, and a ceiling portion 23 is formed so as to connect the upper ends thereof. The transfer chamber 20 includes a chamber main body 20A and a cover member 20B. The chamber main body 20A has the opening part 23a in the part corresponded to a part of the ceiling part 23, The lid member 20B is a plate-shaped member which blocks the opening part 23a. In the case of this embodiment, the opening part 23a is located in the central part of the X direction and the Y direction, the ceiling part 23 is mostly formed with the cover member 20B, and the chamber main body 20A is the ceiling part 23. form the perimeter of

Since the deposition material 13 from the deposition source 6 is discharged into the conveyance space 20a, the deposition material 13 may be adhered to the inner surface of the ceiling portion 23 . In the case of this embodiment, the deposition preventing members 8 to 10 are provided at a position higher than the conveyance surface L1 (conveyance height) of the substrate 11 to cover the inner surface of the ceiling portion 23 , and to the inner surface of the ceiling portion 23 . The direct deposition material 13 is prevented from being attached.

The deposition preventing member 8 is disposed along the inner surface of the ceiling portion 23 . In the case of the present embodiment, although a plurality of anti-stick members 8A to 8C are provided, a single anti-stick member may be used. Each deposition preventing member 8 is supported by a ceiling portion 23 via a hanging member 24 . In the case of this embodiment, the suspension member 24 is supported by the cover member 20B. At the time of maintenance of the deposition preventing member 8, as shown in FIG.

The deposition preventing member 8 is a plate-shaped member, and is planarly disposed on the X-Y plane. A plurality of the deposition preventing members 8A to 8C are arranged in the Y direction. That is, the deposition preventing member 8A is arranged in plurality in the Y direction. The same applies to the deposition preventing members 8B and 8C. The deposition preventing member 8B has an overlapping portion 8a overlapping the edges of the adjacent deposition preventing members 8A and 8C in the Z direction. By providing such an overlapping portion 8a, it is possible to prevent the vapor deposition material 13 from leaking from the gap between the deposition-preventing members, and furthermore, it is possible to relieve the positioning accuracy of each deposition-preventing member 8 .

The deposition-preventing members 9 and 10 are deposition-preventing members disposed outside in the X direction with respect to the deposition-preventing member 8 , and are vapor-deposited on the inner surface of the ceiling portion 23 in the vicinity of the corner portions 20b and 20c of the transport space 20a. It is a member that prevents the material 13 from adhering. The deposition preventing member 9A is disposed on the side of the end 21 in the X direction with respect to the deposition preventing member 8 , and the deposition preventing member 9B is on the side of the end 22 in the X direction with respect to the deposition preventing member 8 . is placed in The adhesion prevention member 9 is supported by the suspension member 25 supported by the part formed by the chamber main body 20A of the ceiling part 23. As shown in FIG.

The deposition preventing member 10A is a plate-shaped member disposed between the deposition preventing member 9A and the end 21 , and the deposition preventing member 10B is disposed between the deposition preventing member 9B and the end 22 . It is a plate-shaped member. The adhesion prevention member 10 is supported in a horizontal posture by the suspension member 26 supported by the part formed by the chamber main body 20A of the ceiling part 23. As shown in FIG.

At the time of maintenance of the deposition preventing members 9 and 10, as shown in Fig. 5(A), the lid member 20B is raised by a crane or the like to access the deposition preventing members 9 and 10 from the opening 23a. However, even in the embodiment in which the lid member 20B blocks the opening 23a as shown in Fig. 5(B), it is possible to access the deposition preventing members 9 and 10 from the communicating portion 20d. . FIG.5(B) is an aspect which moved the vapor deposition apparatus 3 to the position shifted in the Y direction from the lower side of the conveyance apparatus 2, as illustrated in FIG.4(C). The communicating portion 20d is an opening for communicating the conveyance space 20a and the internal space of the source chamber 3a, and it is possible for an operator to take out the deposition preventing members 9 and 10 from the communicating portion 20d.

The deposition preventing members 9A and 10A will be further described with reference to FIG. 6 . 6 is a perspective view of the deposition preventing members 9A and 10A. Although the deposition-preventing members 9A and 10A are described here, the deposition-preventing members 9B and 10B have the same configuration.

A plurality of the deposition-preventing members 9A and 10A are arranged side by side in the Y-direction similarly to the deposition-preventing member 8 . The deposition preventing member 9A includes a horizontal plate-shaped lateral wall portion 90 extending from the side of the deposition preventing member 8 to the end 21 side, and a plate-shaped vertical wall portion 91 integral with the lateral wall portion 90, 92). The vertical wall portion 91 extends downward from the horizontal wall portion 90 , and the vertical wall portion 92 extends upward from the horizontal wall portion 90 . The vertical wall part 91 extends downwardly from the edge part on the side of the edge part 21 of the horizontal wall part 90 in the X direction, The horizontal wall part 90 and the vertical wall part 91 form L-shape. The vertical wall portion 92 extends upward from the middle portion of the horizontal wall portion 90 in the X direction, and the horizontal wall portion 90 and the vertical wall portion 92 form a T-shape (inverted T-shape).

The anti-stick member 9A has a locked portion 9a that is locked by the suspending member 25 . In the case of the present embodiment, the suspending member 25 is a hook portion whose lower end is bent in a J-shape, and the held portion 9a is an inverted U-shaped member on which the hook portion is caught. The locked portion 9a is fixed to the lateral wall portion 90 .

The deposition preventing member 10A extends from the lower end of the vertical wall portion 91 toward the end 21 , and is supported in a horizontal posture by the suspending member 26 . In the case of this embodiment, the deposition preventing member 10A is supported at a position slightly higher than the lowermost end of the vertical wall portion 91, so that the deposition material 13 is not leaked from the gap between the vertical wall portion 91 and the deposition preventing member 10A. It is a difficult arrangement.

The anti-stick member 10A has a locked portion 10a that is held by the suspending member 26 . In the case of the present embodiment, the suspending member 26 is a hook portion bent in a J-shape at its lower end, and the held portion 10a is an inverted U-shaped member on which the hook portion is caught.

On the other hand, between the deposition preventing members 9A adjacent in the Y direction and between the deposition preventing members 10A, an overlapping portion overlapping in the Z direction similar to the overlapping portion 8a of the deposition preventing member 8B may be provided. It is possible to prevent the deposition material 13 from leaking from the gap between the deposition-preventing members, and also to reduce the alignment accuracy of the deposition-preventing members 9 and 10 .

The effect of the deposition preventing member 9A having such a configuration will be described with reference to Figs. 3, 5(A), 5(B), and the like. The deposition preventing member 9A includes the horizontal wall portion 90 and the vertical wall portion 91 to improve the effect of preventing adhesion of the vapor deposition material 13 to the corner portion 20b. That is, the vertical wall portion 91 allows the deposition material 13 to be directed upwardly toward the end 21 side than the vertical wall portion 91 is wider than the case where the deposition preventing member is disposed parallel to the inner surface of the ceiling portion 23 . It can be blocked over a range. In particular, in the case of this embodiment, since the vertical wall part 91 is located on the end part 21 side rather than the position L2 on the edge part 21 side of 7A of adhesion prevention members 7A, the adhesion-preventing substance which passed through 7A. (13) can be prevented more reliably from reaching the corner part 20b.

The corner portion 20b is a remote or narrow position where it is difficult for an operator to access from the communicating portion 20d or the opening 23a, and here an anti-stick member along the inner surface of the ceiling portion 23 such as the anti-stick member 8 . If installed, its maintenance work becomes difficult. On the other hand, since the vertical wall portion 91 is extended downward, the communicating portion 20d is brought closer to the vertical wall portion 91, and the access thereof is facilitated. Furthermore, since the vertical wall portion 91 and the horizontal wall portion 90 are integrally formed, the horizontal wall portion 90 at a slightly higher position or the vertical wall portion 92 extending upward from the horizontal wall portion 90 is also anti-deposition. It can be collectively attached and detached as 9 A of members, and maintainability improves. As described above, according to the present embodiment, it is possible to improve maintainability while preventing the deposition material 13 from adhering to the inner surface of the ceiling portion 23 of the transfer chamber 20 .

In the case of this embodiment, a space in the X direction is formed between the vertical wall portion 91 and the end portion 21 . The reinforcing rib 2lb described above is located here, and this space can be efficiently utilized. In addition, it is also possible to arrange|position the mechanism of the gate valve which opens and closes the carry-in port 21a in this space.

Since the deposition-preventing member 10A also extends from the lower end of the vertical wall portion 91 to the end portion 21, the deposition-preventing material 13 passing through the deposition-preventing member 7A is transferred to the corner portion 20b (especially the end portion 21). can be more reliably prevented from reaching the inner surface of Since the deposition preventing member 10A is located at a relatively low position, access from the communication portion 20d is relatively easy.

The supporting structure of the anti-sticking members 9A and 10A is a simple supporting structure that is held by the suspending members 25 and 26 which are hook portions. Since the lock is released when the operator lifts and moves them slightly, the exchange operation is easy.

The deposition-preventing members 9B and 10B also exert the same effect as the deposition-preventing members 9A and 10A with respect to the corner portion 20c. On the other hand, in Fig. 3, the line L3 indicates the position on the edge 22 side of the deposition prevention member 7A, and the vertical wall portion 91 of the deposition prevention member 9B is on the edge 22 side rather than the position L3. is located in

<Another configuration example of the adhesion-preventing member>

The configuration of the deposition preventing member 9A is not limited to the configuration of FIG. 6 . Another structural example of the deposition preventing member 9A will be described. In addition, the following structural example is applicable also to the deposition preventing member 9B.

The example of FIG. 7 has shown the example which provided the lower side wall part 93 extending to the edge part 21 in the lower end part of the vertical wall part 91 of 9A of adhesion prevention members. In this example, the deposition preventing member 10A is integrated with the deposition preventing member 9A, and the lower side wall portion 93 corresponds to the deposition preventing member 10A.

Fig. 8(A) shows an example of the deposition preventing member 9A without the vertical wall portion 92 . Such a configuration is also employable. In addition, a configuration without the deposition preventing member 10A is also employable.

Fig. 8(B) shows an example of the deposition preventing member 9A in which a vertical wall portion 91 ′ replacing the vertical wall portion 91 extends downward from an intermediate portion of the horizontal wall portion 90 in the X direction. The transverse wall portion 90 and the vertical wall portion 91 ′ are T-shaped.

<Electronic device>

Next, an example of an electronic device is demonstrated. Hereinafter, the configuration of the organic EL display device will be exemplified as an example of the electronic device.

First, the organic EL display device to be manufactured is demonstrated. Fig. 9(A) is an overall view of the organic EL display device 500, and Fig. 9(B) is a view showing a cross-sectional structure of one pixel.

As shown in Fig. 9A, in the display area 51 of the organic EL display device 500, a plurality of pixels 52 including a plurality of light emitting elements are arranged in a matrix shape. Although the details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes.

In addition, the pixel here refers to the minimum unit which enables display of a desired color in the display area 51. As shown in FIG. In the case of a color organic EL display device, the pixel 52 is constituted by a combination of a plurality of sub-pixels of the first light emitting element 52R, the second light emitting element 52G, and the third light emitting element 52B that emit light different from each other. has been The pixel 52 is often constituted by a combination of three types of sub-pixels: a red (R) light-emitting element, a green (G) light-emitting element, and a blue (B) light-emitting element, but is not limited thereto. The pixel 52 may include at least one type of sub-pixel, preferably includes two or more types of sub-pixels, and more preferably includes three or more types of sub-pixels. As the sub-pixel constituting the pixel 52 , for example, a combination of four types of sub-pixels: a red (R) light-emitting element, a green (G) light-emitting element, a blue (B) light-emitting element, and a yellow (Y) light-emitting element. may be

Fig. 9(B) is a schematic partial cross-sectional view taken along line A-B of Fig. 9(A). The pixel 52 is, on the substrate 53 , a first electrode (anode) 54 , a hole transport layer 55 , a red layer 56R, a green layer 56G, or a blue layer 56B. It has a plurality of sub-pixels composed of one, an electron transport layer 57 , and an organic EL element including a second electrode (cathode) 58 . Among them, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 correspond to the organic layer. The red layer 56R, the green layer 56G, and the blue layer 56B are formed in a pattern corresponding to a light emitting element (sometimes referred to as an organic EL element) emitting red, green, and blue, respectively.

In addition, the 1st electrode 54 is formed separately for each light emitting element. The hole transport layer 55 , the electron transport layer 57 , and the second electrode 58 may be formed in common over the plurality of light emitting elements 52R, 52G, and 52B, or may be formed for each light emitting element. That is, as shown in FIG. 9B , after the hole transport layer 55 is formed as a common layer over a plurality of sub-pixel regions, the red layer 56R, the green layer 56G, and the blue layer 56B are formed. Each sub-pixel region may be formed separately, and further, the electron transport layer 57 and the second electrode 58 may be formed thereon as a common layer over a plurality of sub-pixel regions.

On the other hand, in order to prevent a short circuit between the adjacent first electrodes 54 , an insulating layer 59 is provided between the first electrodes 54 . Furthermore, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 60 for protecting the organic EL element with moisture or oxygen is provided.

Although the hole transport layer 55 and the electron transport layer 57 are shown as one layer in FIG. 9B , depending on the structure of the organic EL display device, it may be formed of a plurality of layers having a hole blocking layer or an electron blocking layer. do. In addition, between the first electrode 54 and the hole transport layer 55, a hole injection layer having an energy band structure capable of smoothly injecting holes from the first electrode 54 to the hole transport layer 55 is provided. may be formed. Similarly, an electron injection layer may be formed also between the second electrode 58 and the electron transport layer 57 .

Each of the red layer 56R, the green layer 56G, and the blue layer 56B may be formed as a single light emitting layer or may be formed by laminating a plurality of layers. For example, the red layer 56R may be composed of two layers, the upper layer may be formed of a red light emitting layer, and the lower layer may be formed of a hole transporting layer or an electron blocking layer. Alternatively, the lower layer may be formed of a red light emitting layer, and the upper layer may be formed of an electron transporting layer or a hole blocking layer. By providing the layer below or above the light emitting layer in this way, there is an effect of improving the color purity of the light emitting element by adjusting the light emitting position in the light emitting layer and adjusting the optical path length.

In addition, although the example of the red layer 56R is shown here, the same structure may be employ|adopted also for the green layer 56G and the blue layer 56B. In addition, the number of layers may be two or more. Further, layers of different materials such as the light emitting layer and the electron blocking layer may be laminated, or layers of the same material may be laminated, for example, two or more light emitting layers are laminated.

In manufacture of such an electronic device, the above-mentioned film forming apparatus 1 is applicable, and the said manufacturing method includes the conveyance process of conveying the board|substrate 53 by the conveyance apparatus 2, The board|substrate 53 being conveyed. It may include a deposition process of depositing at least one layer of each layer by the deposition apparatus 3 .

<Other embodiment>

The invention is not limited to the above embodiments, and various changes and modifications are possible without departing from the spirit and scope of the invention. Accordingly, the claims are appended to disclose the scope of the invention.

1: film forming device
2: conveying device
3: deposition apparatus
6: Evaporator
8A to 8C: anti-adhesive member
9A-9B: anti-stick member

Claims (11)

a transport device for transporting the substrate in a horizontal transport direction;
a deposition device disposed below the transport device to deposit a deposition material on the substrate;
An in-line type film forming apparatus for performing vapor deposition while conveying the substrate,
The conveying device is
a transfer chamber forming a transfer space of the substrate;
and a plurality of deposition preventing members covering the inner surface of the ceiling portion of the transfer chamber,
The transfer chamber includes a first end having an inlet for the substrate;
The plurality of deposition-preventing members,
a first deposition preventing member disposed along the inner surface of the ceiling portion;
With respect to the first deposition-preventing member, including a second deposition-preventing member disposed on the first end side,
The second deposition preventing member,
a transverse wall portion extending from the first deposition preventing member side toward the first end;
and a vertical wall portion extending downward from the horizontal wall portion. The film forming apparatus according to claim 1, comprising:
The film forming apparatus according to claim 1, wherein the horizontal wall portion and the vertical wall portion form an L-shape. The film forming apparatus according to claim 1, comprising:
The plurality of deposition-preventing members,
and a third deposition preventing member extending from a lower end of the vertical wall portion of the second deposition preventing member toward the first end. The film forming apparatus according to claim 1, comprising:
The second deposition preventing member,
and a lower lateral wall portion extending from a lower end portion of the vertical wall portion toward the first end portion. The film forming apparatus according to claim 1, comprising:
The first end has a reinforcing rib for reinforcing the periphery of the inlet,
The reinforcing rib is positioned between the first end portion and the vertical wall portion. The film forming apparatus according to claim 1, comprising:
The transfer chamber includes a hook portion for holding the second deposition preventing member. The film forming apparatus according to claim 1, comprising:
The transfer chamber,
a chamber body having an opening in a portion corresponding to a part of the ceiling;
and a cover member for blocking the opening;
A plurality of deposition-preventing members serving as the first deposition-preventing member are supported by the cover member. The film forming apparatus according to claim 1, comprising:
The transfer chamber,
It has an exit port for the substrate and has a second end opposite to the first end in the conveying direction;
The plurality of deposition-preventing members,
With respect to the first deposition-preventing member, comprising a fourth deposition-preventing member disposed on the second end side,
The fourth deposition preventing member,
a transverse wall portion extending from the first deposition preventing member side to the second end side;
and a vertical wall portion extending downward from the horizontal wall portion. The film forming apparatus according to claim 8, comprising:
The plurality of deposition-preventing members,
and a fifth deposition preventing member extending from a lower end of the vertical wall portion of the fourth deposition preventing member toward the second end. A film forming method using the film forming apparatus according to claim 1, comprising:
a conveying step of conveying the substrate by the conveying device;
and a vapor deposition step of performing vapor deposition on the transferred substrate by the vapor deposition apparatus. A method for manufacturing an electronic device using the film forming apparatus according to claim 1, comprising:
a conveying step of conveying the substrate by the conveying device;
A method for manufacturing an electronic device, comprising: a vapor deposition step of performing vapor deposition on the substrate being conveyed by the vapor deposition apparatus.

Images