KR20210073993A - Stretchable substrate - Google Patents

Abstract

A stretchable substrate according to one embodiment of the present invention comprises: a base; a first pad and a second pad disposed on the base; and a wiring connecting the first pad and the second pad, wherein one end of the wiring is connected to the first pad and the other end of the wiring is connected to the second pad, and is wound, in between one end of the wiring and the other end of the wiring, in a spiral shape. Therefore, the present invention is capable of having a low chance of disconnection.

Description

Stretchable substrate {STRETCHABLE SUBSTRATE}

The present invention relates to a stretchable substrate, and more particularly, to a wiring of the stretchable substrate.

A stretchable substrate is a next-generation electronic device that operates without losing device characteristics even when a base is stretched or bent, and can maintain device characteristics even when external force is removed. Stretchable substrates are attracting attention as a core component material for implementing wearable electronic devices, electronic skin, Internet of Things, electronic devices for vehicles, and intelligent robots. In addition, the stretchable substrate may be applied to a stretchable display, a stretchable solar cell, a stretchable battery/energy harvest, and the like.

In order to implement a stretchable substrate, a base that stretches elastically and a wiring that stretches therewith are required. The elastically stretchable base can be implemented relatively easily using a stretchable material such as PDMS (polydimethylsiloxane) or PU (polyurethane). It is difficult to implement wiring.

1 is an example of a stretchable substrate. Referring to FIG. 1 , after processing the surface of the base 10 in a serpentine shape or in a wrinkled shape, the wiring 20 may be printed on the processed surface. Accordingly, as the surface area of the base 10 increases, the area of the wiring 20 also increases, so that the degree of integration may be reduced. In addition, as the base 10 increases, the length of the wiring 20 also increases. Accordingly, resistance may increase, and when stress is concentrated in a specific area, there is a risk of disconnection.

On the other hand, there are attempts to develop an electrode material having elasticity, but the development of a new material may require a large amount of cost and time.

An object of the present invention is to provide a stretchable substrate.

A stretchable substrate according to an embodiment of the present invention includes a base, first and second pads disposed on the base, and a wire connecting the first pad and the second pad, and One end is connected to the first pad, the other end of the wire is connected to the second pad, and a spiral wound is formed between one end of the wire and the other end of the wire.

The diameter of the spiral shape may increase from one end of the wiring toward the other end of the wiring.

The diameter of the spiral shape may be 30 μm to 1 mm, and the interval between the spiral spirals may be 1 μm to 5 mm.

A space between one end of the wire and the other end of the wire may be stretchable in a direction parallel to the plane of the base.

Between one end of the wire and the other end of the wire, the wire may be wound so as to approach it after repeatedly moving away from each other in a direction perpendicular to the plane of the base.

At least a portion of the base, the first pad, the second pad, and the wiring may be embedded in a resin including silicon.

In the wiring, an insulating film may be disposed on at least one surface of both surfaces between one end of the wiring and the other end of the wiring.

A stretchable substrate according to another embodiment of the present invention includes a first insulating film, a wiring disposed on the first insulating film, and a second insulating film disposed on the wiring, the first insulating film; The wiring and the second insulating film are integrally wound in a spiral shape, and one end of the wiring and the other end of the wiring are exposed from the first insulating film and the second insulating film.

A total thickness of the first insulating film, the wiring, and the second insulating film may be 20 μm to 200 μm.

The diameter of the spiral shape may increase from one end of the wiring toward the other end of the wiring.

The diameter of the spiral shape may be 30 μm to 1 mm, and the interval between the spiral spirals may be 1 μm to 5 mm.

At least a portion of the first insulating film, the wiring, and the second insulating film wound in the spiral shape may be embedded in a resin including silicon.

According to an embodiment of the present invention, a stretchable substrate may be obtained. In particular, according to the embodiment of the present invention, it is possible to obtain a stretchable wiring that is easy to manufacture, has high durability, and has a low possibility of disconnection. In addition, according to the embodiment of the present invention, it is possible to obtain a stretchable wiring having a strain limiting function, a high degree of integration, and a small resistance change.

1 is an example of a stretchable substrate.
FIG. 2(a) is a cross-sectional view of a stretchable substrate according to an embodiment of the present invention, and FIG. 2(b) is a shape when the stretchable substrate of FIG. 2(a) is stretched.
3(a) is a cross-sectional view of a stretchable substrate according to another embodiment of the present invention, FIG. 3(b) is a shape when the stretchable substrate of FIG. 3(a) is stretched and contracted, and FIG. 3(c) is The shape of the stretchable substrate of FIG. 3(a) when compressed.
4(a) and 4(b) show a method of forming an electrode according to the embodiment of FIG. 3 .
5 is a cross-sectional view of a stretchable substrate according to another embodiment of the present invention.
6 is a perspective view of a stretchable substrate according to another embodiment of the present invention.
7 is a cross-sectional view in a state in which the stretchable substrate of FIG. 6 is unfolded in a plane.
8 to 9 are perspective and cross-sectional views of another stretchable substrate of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical spirit of the present invention is not limited to some embodiments described, but may be implemented in various different forms, and within the scope of the technical spirit of the present invention, one or more of the components may be selected among the embodiments. It can be combined and substituted for use.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be generally understood by those of ordinary skill in the art to which the present invention pertains, unless specifically defined and described explicitly. It may be interpreted as a meaning, and generally used terms such as terms defined in advance may be interpreted in consideration of the contextual meaning of the related art.

In addition, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention.

In the present specification, the singular form may also include the plural form unless otherwise specified in the phrase, and when it is described as "at least one (or one or more) of A and (and) B, C", it is combined with A, B, C It may include one or more of all possible combinations.

In addition, in describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used.

These terms are only used to distinguish the component from other components, and are not limited to the essence, order, or order of the component by the term.

And, when it is described that a component is 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also with the component It may also include a case of 'connected', 'coupled' or 'connected' due to another element between the other elements.

In addition, when it is described as being formed or disposed on "above (above) or under (below)" of each component, the top (above) or bottom (below) is one as well as when two components are in direct contact with each other. Also includes a case in which another component as described above is formed or disposed between two components. In addition, when expressed as "upper (upper) or lower (lower)", the meaning of not only an upper direction but also a lower direction based on one component may be included.

The stretchable substrate according to an embodiment of the present invention operates without losing the characteristics of the device even when the base is stretched or bent, and is a device capable of maintaining the characteristics of the device even when external force is removed, and is a stretchable electronic device, a stretchable substrate It may be used interchangeably with a (stretchable) electronic device, a flexible (flexible) electronic device, and the like. The stretchable substrate according to an embodiment of the present invention is variously used in a wearable electronic device, electronic skin, Internet of Things, vehicle electronic device, intelligent robot, stretchable display, stretchable solar cell, stretchable battery/energy harvest, etc. can be applied.

FIG. 2(a) is a cross-sectional view of a stretchable substrate according to an embodiment of the present invention, and FIG. 2(b) is a shape when the stretchable substrate of FIG. 2(a) is stretched. 3(a) is a cross-sectional view of a stretchable substrate according to another embodiment of the present invention, FIG. 3(b) is a shape when the stretchable substrate of FIG. 3(a) is stretched and contracted, and FIG. 3(c) is The shape of the stretchable substrate of FIG. 3(a) when compressed. 4(a) and 4(b) show a method of forming an electrode according to the embodiment of FIG. 3 .

Referring to FIGS. 2A and 3A , the stretchable substrate 100 includes a base 110 , a first pad 120 and a second pad 130 disposed on the base 110 , And a wiring 140 connecting the first pad 120 and the second pad 130 is included.

Here, the base 110 may be bent by an external force or stretched in at least one direction by an external force. That is, the base 110 may be a stretchable base, and in the present specification, the base 110 may be mixed with a flexible base, a flexible base, a soft base, a stretchable base, a stretchable base, an elastic base, and the like. The base 110 may be restored to its original state when the external force is removed. To this end, the base 110 may include a polymer resin having a predetermined elasticity. For example, the base 110 may include at least one of polyethylene terephthalate (PET), polyimide (PI), polyurethane (PU), polypyrrole (PPy), and polydimethylsiloxane (PDMS). According to this, the base 110 can be elastically expanded and contracted according to an external force.

Meanwhile, the first pad 120 and the second pad 130 are disposed on the base 110 , and the first pad 120 and the second pad 130 are made of the same material as the wiring 140 , or It may be made of a material different from the wiring 140 but having conductivity. A semiconductor device is disposed on the first pad 120 and the second pad 130 , and may be wired or soldered to the semiconductor device. Alternatively, the first pad 120 and the second pad 130 may be electrically connected to a component on the base 110 or may be connected to an external power source. At this time, the first pad 120 and the second pad 130 should be bent or stretched together with the bending or stretching of the base 110 . To this end, at least a portion of the surface of the base 110 may have a wavy structure as shown in FIG. 1 , or the base 110 may have a porous structure. When at least a portion of the surface of the base 110 has a wavy structure, if the first pad 120 and the second pad 130 also have a corresponding wavy structure, the first pad 120 and Even if the second pad 130 is bent or stretched together with the base 110 , the characteristics of the pad may be maintained. In this case, the thickness of the first pad 120 and the second pad 130 may have a skin depth. Alternatively, when the base 110 has a porous structure, the material constituting the pad may be patterned even in the pores of the base 110 , so that even when the base 110 is bent or stretched, there is no concern about disconnection of the first pad 120 . ) and the characteristics of the second pad 130 may be maintained.

According to an embodiment of the present invention, one end of the wiring 140 is connected to the first pad 120 , and the other end of the wiring 140 is connected to the second pad 130 . And, between one end of the wiring 140 and the other end of the wiring 140 is wound in a spiral shape. Here, the wiring 140 may include at least one of silver (Ag), copper (Cu), platinum (Pt), and gold (Au). Alternatively, the wiring 140 may be a silver nanowire (Ag nanowire, AgNW), a silver nanostructure, an AgNW/PU composite electrode, graphene, PEDOT:PSS, a nano-thick Ag single thin film electrode, carbon nanotube, copper nanowire, copper nano It may be formed of a structure or the like. The wiring 140 may be used interchangeably with an electrode or an electrode wiring.

Here, the spiral shape has a predetermined direction, for example, a direction A parallel to the plane direction of the base 110 , that is, a direction from the first pad 120 to the second pad 130 , or the second pad 130 . ) may mean a three-dimensional shape extending while rotating repeatedly with a predetermined curvature in a direction toward the first pad 120 . The spiral shape may be used interchangeably with a spiral shape, a helical shape, and the like. That is, according to an embodiment of the present invention, between one end and the other end of the wiring 140 may be wound to approach and repeatedly move away from each other in the direction B perpendicular to the plane of the base 110 . Also, as shown in FIGS. 2(b) and 3(b) , a space between one end and the other end of the wiring 140 may be expanded and contracted in a direction A parallel to the plane of the base 110 . At this time, the diameter (D) of the spiral shape is 30 μm to 1 mm, preferably 50 μm to 500 μm, more preferably 100 μm to 300 μm, and the spacing H between the spiral spirals is 1 μm to 5 mm, preferably Preferably, it may be 100 μm to 3 mm, more preferably 300 μm to 2 mm.

According to this, the wiring 140 can also be bent or stretched without restriction according to the bending or expansion and contraction of the base 110 , and since the degree of integration of the wiring 140 can be increased, the overall size of the stretchable substrate 100 can be miniaturized. can do. In particular, even when the wiring 140 is made of an inorganic material that does not have elasticity, since it may be bent or stretched together with the base 110 due to a spiral shape, the material of the wiring 140 may not be restricted. In addition, even if the wiring 140 is also bent or stretched according to the bending or stretching of the base 110, the actual length of the wiring 140 does not increase, so the resistance change can be minimized, and a reliable stretchable substrate can be produced. can be obtained

Meanwhile, referring to FIG. 3A , the diameter D of the spiral shape may increase from one end of the wiring 140 to the other end of the wiring 140 . For example, in the first turn 141 , the second turn 142 , and the third turn 143 sequentially connected in a direction from one end of the wire 140 to the other end of the wire 140 , the second turn ( The diameter d2 of the first turn 142 may be greater than the diameter d1 of the first turn 141 , and the diameter d3 of the third turn 143 may be greater than the diameter d2 of the second turn 142 . Preferably, the diameter d2 of the second turn 142 is large enough to accommodate the first turn 141 , and the diameter d3 of the third turn 143 is large enough to accommodate the diameter of the second turn 142 . can be as large as According to this, since a turn having a large diameter can be wound while overlapping a neighboring turn having a small diameter, even when the distance between the first pad 120 and the second pad 130 is narrow, the wiring according to the embodiment of the present invention is applied. It is possible, and when the base 110 is compressed or contracted by an external force as shown in FIG. 3( c ), the wiring 140 may also be overlapped according to the compression or contraction of the base 110 .

That is, according to the embodiment of the present invention, wiring with a high degree of integration can be implemented even on a narrow substrate area, and a stretchable substrate that is not restricted by the bending or stretching direction of the base 110 can be obtained.

At this time, in order to prevent a short circuit due to overlapping of turns forming the wiring 140 , an insulating film (not shown) is disposed on at least one of both surfaces of the wiring 140 , or the surface of the wiring 140 . may be insulated. According to this, the first turn 141 forming the spiral shape of the wiring 140 is accommodated within the diameter of the second turn 142 , or the second turn 142 is accommodated within the diameter of the third turn 143 to turn the turn. Even if they overlap, the performance of the wiring 140 can be maintained.

The wiring according to the embodiment of FIGS. 3 (a) to 3 (c) is to be manufactured by a method of cutting the two-dimensional plane of the material constituting the wiring 140 in a spiral shape, as shown in FIG. 4 (a). can Alternatively, the wiring according to the embodiment of Figs. 3 (a) to 3 (c) may be manufactured by a method of thermoforming after winding a film of the material constituting the wiring 140, as shown in Fig. 4 (b). may be

5 is a cross-sectional view of a stretchable substrate according to another embodiment of the present invention.

Referring to FIGS. 5A and 5B , at least a portion of the base 110 , the first pad 120 , the second pad 130 , and the wiring 140 is a resin 500 including silicon. can be embedded within. Here, the resin 500 including silicon may include PDMS. Accordingly, it is possible to prevent the wiring 140 from being cut or damaged even when the stretchable substrate 100 is repeatedly bent or stretched, and to protect the wiring 140 from the outside. In addition, since the resin 500 including silicon has elasticity, it may be bent or stretched along with bending or stretching of the stretchable substrate 100 .

Although not shown, the resin 500 including silicone is the same material as the base 110 , and may be integrally formed.

6 is a perspective view of a stretchable substrate according to another embodiment of the present invention, FIG. 7 is a cross-sectional view in a state in which the stretchable substrate of FIG. 6 is unfolded in a plane, and FIGS. 8 to 9 are another view of the present invention It is a perspective view and a cross-sectional view of another stretchable substrate. Duplicate descriptions of the same contents as those described with reference to FIGS. 2 to 5 will be omitted.

6 to 7 , the stretchable substrate 600 includes a first insulating film 610 , a wiring 620 disposed on the first insulating film 610 , and a second insulating film disposed on the wiring 620 . It includes two insulating films 630 , and the first insulating film 610 , the wiring 620 , and the second insulating film 630 may be integrally wound in a spiral shape. Here, the first insulating film 610 and the second insulating film 630 may be made of a material that is bent by an external force or stretched in at least one direction by an external force. For example, the first insulating film 610 and the second insulating film 620 may include at least one of polyethylene terephthalate (PET), polyimide (PI), polyurethane (PU), polypyrrole (PPy), and polydimethylsiloxane (PDMS). can do. Accordingly, it is possible to prevent disconnection or short circuit of the wiring 620 even during low bending or expansion/contraction.

In addition, one end of the wiring 620 and the other end of the wiring 620 may be exposed from the first insulating film 610 and the second insulating film 630 . Accordingly, one end of the wiring 620 and the other end of the wiring 620 may be electrically connected to an electrode terminal or a pad (not shown). The stretchable substrate 600 according to the embodiment of FIG. 6 may be a single electronic device, or may be a wiring 140 of the stretchable substrate according to the embodiment of FIGS. 2 to 5 .

In order to manufacture the stretchable substrate 600 according to the embodiment of FIG. 6 , a two-dimensional plane in which the first insulating film 610 , the wiring 620 , and the second insulating film 630 are sequentially arranged is formed. It can be cut in a spiral shape like the method shown in Fig. 4(a). Alternatively, in order to manufacture the stretchable substrate 600 according to the embodiment of FIG. 6 , the first insulating film 610 , the wiring 620 , and the second insulating film 630 are sequentially arranged in a two-dimensional shape. After the film is wound, it can also be thermoformed.

At this time, the total thickness (T) of the first insulating film 610, the wiring 620, and the second insulating film 630 may be 20 to 200㎛, the diameter (D) of the spiral shape is 30㎛ to 1mm, Preferably it is 50 μm to 500 μm, more preferably 100 μm to 300 μm, and the spacing (H) between the helical spirals is 1 μm to 5 mm, preferably 100 μm to 3 mm, more preferably 300 μm to 2 mm. can be Accordingly, the stretchable substrate 600 may be easily manufactured, and the degree of integration of the wiring 620 may be increased. In addition, the stretchable substrate according to the embodiment of the present invention can be applied to various applications without restrictions on bending strength and direction and stretching strength.

Meanwhile, referring to FIG. 8 , the diameter D of the spiral shape may increase from one end to the other end of the stretchable substrate 600 . For example, the second turn 602 in the first turn 601 , the second turn 602 , and the third turn 603 sequentially connected from one end to the other end of the stretchable substrate 600 . may have a diameter greater than that of the first turn 601 , and a diameter of the third turn 603 may be greater than a diameter of the second turn 602 . Preferably, the diameter of the second turn 602 may be large enough to accommodate the first turn 601 , and the diameter of the third turn 603 may be large enough to accommodate the diameter of the second turn 602 . Accordingly, it is possible to obtain a stretchable substrate having a high degree of integration and not being restricted by bending or stretching directions.

Referring to FIG. 9 , the stretchable substrate 600 according to an embodiment of the present invention may be embedded in a resin 900 including silicon. Here, the resin 900 including silicon may include PDMS. Since the resin 900 including silicon has elasticity, it may be bent or stretched together with the bending or stretching of the stretchable substrate 600 . That is, as shown in FIG. 9( b ), when a force is applied to both sides of the resin 900 in which the stretchable substrate 600 is embedded, the stretchable substrate 600 is formed together with the resin 900 . can be stretched.

Accordingly, the problem of being cut or damaged despite repeated bending or stretching of the stretchable substrate 600 may be prevented, and the stretchable substrate 600 may be protected from the outside.

Although the above has been described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention within the scope without departing from the spirit and scope of the present invention as set forth in the claims below. You will understand that it can be done.

Claims (12)

Base,
a first pad and a second pad disposed on the base, and
a wire connecting the first pad and the second pad;
One end of the wire is connected to the first pad, and the other end of the wire is connected to the second pad,
A stretchable substrate wound in a spiral shape between one end of the wiring and the other end of the wiring. According to claim 1,
A stretchable substrate in which the diameter of the spiral shape increases from one end of the wiring to the other end of the wiring. According to claim 1,
A diameter of the spiral shape is 30 μm to 1 mm, and an interval between the spiral spirals is 1 μm to 5 mm. According to claim 1,
A stretchable substrate that is stretchable and stretchable in a direction parallel to the plane of the base between one end of the wiring and the other end of the wiring. According to claim 1,
A stretchable substrate in which one end of the wiring and the other end of the wiring are repeatedly moved away from each other in a direction perpendicular to the plane of the base and then wound so as to become closer. According to claim 1,
At least a portion of the base, the first pad, the second pad, and the wiring is embedded in a resin containing silicon. According to claim 1,
In the wiring, an insulating film is disposed on at least one surface of both surfaces between one end of the wiring and the other end of the wiring. a first insulating film;
wiring disposed on the first insulating film, and
a second insulating film disposed on the wiring;
The first insulating film, the wiring, and the second insulating film are integrally wound in a spiral shape,
One end of the wiring and the other end of the wiring are exposed from the first insulating film and the second insulating film. 9. The method of claim 8,
A total thickness of the first insulating film, the wiring, and the second insulating film is 20 to 200 μm. 9. The method of claim 8,
A stretchable substrate in which the diameter of the spiral shape increases from one end of the wiring to the other end of the wiring. 9. The method of claim 8,
A diameter of the spiral shape is 30 μm to 1 mm, and an interval between the spiral spirals is 1 μm to 5 mm. 9. The method of claim 8,
At least a portion of the first insulating film, the wiring, and the second insulating film wound in the spiral shape is embedded in a resin containing silicon.

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