KR20200134085A - Injection apparatus for removing precipitate and substrate treating apparatus comprising the same - Google Patents

Abstract

According to one embodiment of the present invention, a substrate processing device may comprise: a plurality of transfer shafts rotating around an axis and disposed in parallel with each other; a plurality of transfer contact members provided on each of the plurality of transfer shafts and contacting a lower surface of the substrate to transfer a substrate; an injection shaft disposed in parallel at a height corresponding to the plurality of transfer shafts and supplied with a chemical solution therein; and a plurality of injection nozzles provided on the injection shaft and injecting the chemical solution toward an opening and closing unit. Therefore, the transfer of the substrate can be assisted.

Description

A spray device for removing precipitates and a substrate processing device including the same {INJECTION APPARATUS FOR REMOVING PRECIPITATE AND SUBSTRATE TREATING APPARATUS COMPRISING THE SAME}

The following embodiments relate to an injection device for removing precipitates and a substrate processing device including the same.

In general, semiconductors are manufactured by repeatedly performing a series of processes such as lithography, deposition, and etching. Since various chemical solutions are supplied to each process, a precipitate of the chemical solution may be formed inside the chamber. When such a chemical liquid precipitate or the like is formed, it may affect the semiconductor quality, so it may be important to remove or prevent the precipitate. In general, an injection device for injecting a chemical solution to remove precipitates is used. However, the conventional injection device was located near the bottom of the chamber. Even if the chemical liquid is injected toward the opening and closing part in the conventional injection device, there is a problem that the chemical liquid cannot sufficiently reach the target point due to the interference of the transfer part. Accordingly, there is a problem that the efficiency of removing precipitates is lowered or a large amount of the chemical solution is consumed. Accordingly, there is a need for a substrate processing apparatus and a spraying apparatus having a structure capable of accurately and effectively spraying a chemical solution onto a precipitate generation region without interference from other structures.

The above-described background technology is possessed or acquired by the inventor in the process of deriving the present invention, and is not necessarily a known technology disclosed to the general public prior to filing the present invention.

An object of an embodiment is to provide a spray device capable of spraying a chemical solution without interference from other structures, and a substrate processing device including the same.

An object of an embodiment is to provide a spraying device capable of accurately and effectively spraying a chemical liquid onto a precipitate generation area, and a substrate processing device including the same.

An object of an embodiment is to provide an injection device capable of assisting in transporting a substrate and a substrate processing device including the same.

A substrate processing apparatus according to an exemplary embodiment includes: a plurality of transfer shafts that are rotated about an axis and disposed in parallel with each other; A plurality of transfer contact members provided on each of the plurality of transfer shafts and contacting a lower surface of the substrate to transfer the substrate; A spray shaft disposed in parallel at a height corresponding to the plurality of transfer shafts and supplying a chemical liquid therein; And a plurality of spray nozzles provided on the spray shaft and spraying the chemical solution toward the opening and closing part.

It may further include a plurality of idle contact members provided on the injection shaft, in contact with the lower surface of the substrate to rotate according to the transfer of the substrate.

The plurality of transfer contact members and the plurality of idle contact members may be positioned at a height corresponding to each other so that the substrate is transferred in a horizontal direction.

The injection shaft may be disposed between a transfer shaft closest to the opening/closing part among the plurality of transfer shafts and the opening/closing part.

The plurality of transfer shafts and injection shafts may be arranged at equal intervals from each other.

The injection shaft may be supported, and a height adjustable injection support may be further included.

The plurality of spray nozzles may be installed in a direction toward the opening/closing part with respect to the spray shaft, and at least some of them may be installed at different angles from other parts.

The injection shaft may be rotatable so that the injection angle of the injection nozzle is adjusted.

The opening and closing part may provide a connection space connected to another chamber.

An injection device for removing precipitates formed on an opening and closing portion of a chamber according to an exemplary embodiment includes: an injection shaft provided in the chamber, disposed adjacent to the opening and closing portion, and supplying a chemical liquid therein; A plurality of idle contact members rotatably connected to the injection shaft and contacting a lower surface of the substrate; And a plurality of spray nozzles provided on the spray shaft and spraying the chemical solution toward the opening and closing part.

The injection shaft may be disposed between a transfer unit and an opening/closing unit for transferring the substrate.

The injection shaft may be located at a height corresponding to a transfer unit for transferring the substrate.

The idle contact member may be rotated according to the transfer of the substrate to assist the transfer of the substrate.

The plurality of spray nozzles may include: a first group spray nozzle forming a first angle with the spray shaft; And a second group spray nozzle forming a second angle with the spray shaft.

The first group injection nozzles and the second group injection nozzles may be alternately arranged with each other.

Using the spraying apparatus and the substrate processing apparatus including the same according to an embodiment, it is possible to remove the precipitate by spraying a chemical solution without interference from other structures.

Using the spraying device and the substrate processing device including the same according to an embodiment, it is possible to accurately and effectively spray the chemical liquid onto the precipitate generation area.

The spraying apparatus and the substrate processing apparatus including the same according to an exemplary embodiment may assist transfer of a substrate.

Effects of the spraying apparatus and the substrate processing apparatus including the same according to an exemplary embodiment are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

The following drawings attached to the present specification illustrate a preferred embodiment of the present invention, and serve to further understand the technical idea of the present invention together with the detailed description of the present invention, so the present invention is limited to the matters described in such drawings. It is limited and should not be interpreted.
1 is a schematic diagram of a conventional injection device.
2 is a schematic diagram of a substrate processing apparatus and an injection apparatus according to an exemplary embodiment.
3 is a perspective view of an injection device according to an embodiment.

Hereinafter, embodiments will be described in detail through exemplary drawings. In adding reference numerals to elements of each drawing, it should be noted that the same elements are assigned the same numerals as possible even if they are indicated on different drawings. In addition, in describing the embodiment, if it is determined that a detailed description of a related known configuration or function interferes with the understanding of the embodiment, a detailed description thereof will be omitted.

In addition, in describing the constituent elements of the embodiment, terms such as first, second, A, B, (a) and (b) may be used. These terms are only used to distinguish the component from other components, and the nature, order, or order of the component is not limited by the term. When a component is described as being "connected", "coupled" or "connected" to another component, that component may be directly connected or connected to that other component, but another component between each component It should be understood that may be “connected”, “coupled” or “connected”.

Components included in one embodiment and components including common functions will be described using the same name in other embodiments. Unless otherwise stated, descriptions in one embodiment may be applied to other embodiments, and detailed descriptions in the overlapping range will be omitted.

1 is a schematic diagram of a conventional injection device.

Referring to FIG. 1, a conventional injection device for removing precipitates formed on an opening and closing portion of a chamber is located near the bottom of the chamber. Even if the chemical liquid is injected toward the opening and closing part in the conventional injection device, there is a problem that the chemical liquid cannot sufficiently reach the target point due to the interference of the transfer part. Accordingly, there is a problem that the efficiency of removing precipitates is lowered or a large amount of the chemical solution is consumed.

2 is a schematic diagram of a substrate processing apparatus and an injection apparatus according to an exemplary embodiment. 3 is a perspective view of an injection device according to an embodiment.

Referring to FIGS. 2 and 3, when the substrate processing apparatus and the spraying apparatus according to an exemplary embodiment are used, a chemical solution can be accurately and effectively sprayed to a precipitate generation area, thereby increasing the efficiency of removing precipitates.

The substrate processing apparatus 1 according to an exemplary embodiment may include a chamber 10, a transfer unit 11, and an injection device 12.

The chamber 10 may be a chamber in which the substrate W is processed. For example, the chamber 10 may be a chamber in which an etching process is performed. The chamber 10 may be a chamber in which a deposition, cleaning, or polishing process is performed. The chamber 10 may include an opening/closing part 101. The substrate W may enter and exit the chamber 10 through the opening and closing part 101. The opening/closing part 101 may be opened or closed to allow the substrate W to be input/exited. The opening/closing part 101 may provide a connection space connected to another chamber. That is, the opening/closing part 101 may mean a portion where the chambers are connected to each other.

The substrate W may include glass for a flat panel display device (FPD) such as a liquid crystal display (LCD) and a plasma display panel (PDP). However, the type of the substrate W is not limited thereto. For example, the substrate W may be a silicon wafer for manufacturing a semiconductor device (semiconductor).

The transfer unit 11 may transfer the substrate W. The transfer unit 11 may be provided inside the chamber 10. The transfer unit 11 may transfer the substrate W from one side to the other side within the chamber 10. The transfer unit 11 may carry the substrate W into or out of the chamber 10. The transfer unit 11 may transfer the substrate W to another chamber.

The transfer unit 11 may include a transfer shaft 111 and a transfer contact member 112.

The transfer shaft 111 may be provided inside the chamber 10. The transfer shaft 111 may rotate around an axis. A plurality of transfer shafts 111 may be provided. The plurality of transfer shafts 111 may be disposed in parallel with each other. The plurality of transfer shafts 111 may be located at a height corresponding to each other. The plurality of transfer shafts 111 may be disposed at equal intervals from each other.

The transfer contact member 112 may be provided on the transfer shaft 111. The transfer contact member 112 may be in contact with the lower surface of the substrate W to transfer the substrate W. For example, the transfer contact member 112 may include a roller or the like. The transfer contact member 112 may rotate integrally with the transfer shaft 111. That is, the transfer contact member 112 rotates together with the transfer shaft 111 to transfer the substrate W in contact with the transfer contact member 112 in the tangential direction of the rotation direction. A plurality of transfer contact members 112 may be provided. The plurality of transfer contact members 112 may be provided on each of the plurality of transfer shafts 111. The plurality of transfer contact members 112 may be disposed to be spaced apart with respect to the longitudinal direction of the transfer shaft 111. For example, the plurality of transfer contact members 112 may be disposed at equal intervals with respect to the longitudinal direction of the transfer shaft 111.

The injection device 12 may be an injection device for removing precipitates formed on the opening and closing portion 101. By spraying the chemical liquid toward the opening and closing portion 101, the spraying device 12 can remove precipitates formed in the opening and closing portion 101 or prevent formation of precipitates in the opening and closing portion 101. At the same time, the injection device 12 can assist the transfer of the substrate W. The chemical liquid may contain chemicals, pure water, air or gas.

The injection device 12 may include an injection shaft 121, an idle contact member 122, an injection nozzle 123, and an injection support 124.

The injection shaft 121 may be provided in the chamber 10. The injection shaft 121 may be supplied with a chemical liquid therein. The injection shaft 121 may be disposed in parallel with the plurality of transfer shafts 111. The injection shaft 121 may be located at a height corresponding to the transfer unit 11. For example, the injection shaft 121 may be located at a height corresponding to the plurality of transfer shafts 111. The injection shaft 121 may be disposed between the transfer unit 11 and the opening/closing unit 101. The injection shaft 121 may be disposed between the opening and closing portion 101 and the transport shaft 111 closest to the opening and closing portion 101 and the opening and closing portion 101. In other words, the injection shaft 121 may be a shaft installed closest to the opening and closing unit 101. The injection shaft 121 and the plurality of transfer shafts 111 may be disposed at equal intervals from each other.

The idle contact member 122 may be provided on the injection shaft 121. The idle contact member 122 may be rotatably connected to the injection shaft 121. That is, the idle contact member 122 may rotate about the injection shaft 121 with respect to the injection shaft 121. For example, the idle contact member 122 may include a bearing or the like. The idle contact member 122 is in contact with the lower surface of the substrate W and may rotate according to the transfer of the substrate W. That is, when the substrate W is transferred by the transfer unit 11, the idle contact member 122 comes into contact with the lower surface of the transferred substrate W and rotates according to the transfer of the substrate W, so that the substrate W Can assist in the transfer of According to this structure, since the idle contact member 122 can assist the transfer of the substrate W, even if the injection device 12 is positioned at a height corresponding to the transfer unit 11, it affects the transfer of the substrate W. May not give. The idle contact member 122 may be provided in plural. The plurality of idle contact members 122 may be disposed to be spaced apart with respect to the longitudinal direction of the injection shaft 121. The pattern in which the plurality of idle contact members 122 are arranged along the length direction of the injection shaft 121 may correspond to the pattern in which the plurality of transfer contact members 112 are arranged along the length direction of the transfer shaft 111. have. For example, the plurality of idle contact members 122 may be disposed at equal intervals with respect to the longitudinal direction of the injection shaft 121. The transfer contact member 112 and the idle contact member 122 may be positioned at a height corresponding to each other so that the substrate W is transferred in the horizontal direction. That is, the plurality of transfer contact members 112, the idle contact member 122, and the contact points in which the substrate W contacts each other may be located on one plane. According to this structure, even if the substrate W passes through the idle contact member 122 while being transferred by the transfer contact member 112, the transfer path of the substrate W can be maintained in the horizontal direction.

The spray nozzle 123 may be provided on the spray shaft 121. The spray nozzle 123 may spray the chemical liquid supplied to the spray shaft 121. The spray nozzle 123 may spray a chemical solution toward the opening and closing portion 101 of the chamber 10. The spray nozzle 123 may be installed on the spray shaft 121 in a direction toward the opening and closing part 101. By spraying the chemical solution toward the opening and closing portion 101 by the spray nozzle 123, the precipitate formed on the opening and closing portion 101 can be removed, and the formation of the precipitate on the opening and closing portion 101 can be prevented. A plurality of spray nozzles 123 may be provided. The plurality of spray nozzles 123 may be arranged along the length direction of the spray shaft 121. The plurality of spray nozzles 123 may be disposed between the plurality of idle contact members 122. The plurality of spray nozzles 123 are installed in a direction toward the opening/closing unit 101, but may be installed at different angles. That is, at least some of the plurality of spray nozzles 123 may be set differently from the other spray nozzles 123 at an angle formed with the spray shaft 121. For example, the injection nozzles 123 constituting the first group form a first angle with respect to the injection shaft 121, and the injection nozzle 123 constituting the second group is at a second angle with respect to the injection shaft 121 Can be formed. The injection nozzles 123 constituting the first group and the injection nozzles 123 constituting the second group may be alternately arranged with each other. According to such a structure, the range to which the chemical liquid sprayed from the spray nozzle 123 reaches can be widened, and the effect of removing and preventing precipitates can be increased. Meanwhile, this is exemplary, and the plurality of spray nozzles 123 may include the spray nozzles 123 constituting two or more groups.

According to the above-described structure, since the injection shaft 121 may be located at a height corresponding to the transfer shaft 111, the chemical liquid injected from the injection nozzle 123 may not be interfered with by other structures. Accordingly, a sufficient amount of the chemical liquid can be sprayed from the opening/closing part 101 to a region where precipitates are frequently generated, and the strength at which the chemical liquid is sprayed can also be improved. Accordingly, the effect of removing and preventing precipitates can be increased, and the amount of chemical liquid consumed can be reduced. Furthermore, since the idle contact member 122 assists the transfer of the substrate W while rotating according to the transfer of the substrate W, the substrate W can be stably transferred even with this structure. In addition, since the spraying device 12 simultaneously performs two functions of injecting the chemical solution and assisting the transfer of the substrate, the space inside the chamber 10 can be efficiently utilized.

The injection support 124 may support the injection shaft 121. The spray support 124 may be height adjustable. The spray support part 124 may adjust a range in which the chemical solution is sprayed from the spray nozzle 123 by adjusting the height of the spray shaft 121.

Meanwhile, the injection shaft 121 may be configured to be rotatable. The injection shaft 121 may be rotatable so that the injection angle of the injection nozzle 123 is adjusted. As the injection shaft 121 rotates, the range in which the chemical solution is injected from the injection nozzle 123 may be adjusted. However, even in this case, the injection shaft 121 and the idle contact member 122 may rotate independently of each other. That is, the idle contact member 122 may not be dependent on the rotation of the injection shaft 121.

As described above, although the embodiments have been described by the limited drawings, various modifications and variations are possible from the above description to those of ordinary skill in the art. For example, the described techniques are performed in a different order from the described method, and/or components such as the described structure, device, etc. are combined or combined in a form different from the described method, or in other components or equivalents. Even if substituted or substituted by, appropriate results can be achieved.

1: substrate processing device
10: chamber
101: opening and closing part
11: Transfer section
111: transfer shaft
112: transfer contact member
12: injection device
121: injection shaft
122: idle contact member
123: spray nozzle
124: spray support

Claims (15)

A chamber including an opening/closing part through which a substrate is input and output, and in which the substrate is processed;
A plurality of transfer shafts that rotate around an axis and are disposed in parallel with each other;
A plurality of transfer contact members provided on each of the plurality of transfer shafts and contacting a lower surface of the substrate to transfer the substrate;
A spray shaft disposed in parallel at a height corresponding to the plurality of transfer shafts and supplying a chemical liquid therein; And
A substrate processing apparatus comprising a plurality of spray nozzles provided on the spray shaft and spraying a chemical solution toward the opening and closing portion. The method of claim 1,
The substrate processing apparatus further comprises a plurality of idle contact members provided on the injection shaft and contacting a lower surface of the substrate to rotate according to the transfer of the substrate. The method of claim 2,
The substrate processing apparatus, wherein the plurality of transfer contact members and the plurality of idle contact members are positioned at corresponding heights so that the substrate is transferred in a horizontal direction. The method of claim 1,
The injection shaft is disposed between the opening and closing portion and a transport shaft closest to the opening and closing portion among the plurality of transmission shafts. The method of claim 4,
The plurality of transfer shafts and injection shafts are arranged at equal intervals from each other. The method of claim 5,
A substrate processing apparatus supporting the injection shaft and further comprising a height-adjustable injection support. The method of claim 1,
The plurality of spray nozzles are installed in a direction toward the opening and closing part with respect to the spray shaft, and at least some of them are installed at different angles from other parts. The method of claim 1,
The spray shaft is rotatable so that the spray angle of the spray nozzle is adjusted. The method of claim 1,
The opening and closing part provides a connection space connected to another chamber. In the injection device for removing precipitates formed in the opening and closing portion of the chamber,
A spray shaft provided inside the chamber, disposed adjacent to the opening and closing part, and supplying a chemical liquid therein;
A plurality of idle contact members rotatably connected to the injection shaft and contacting a lower surface of the substrate; And
An injection device including a plurality of injection nozzles provided on the injection shaft and spraying the chemical solution toward the opening and closing part. The method of claim 10,
The injection shaft is disposed between a transfer unit and an opening/closing unit for transferring the substrate. The method of claim 10,
The injection shaft, the injection device is located at a height corresponding to the transfer unit for transferring the substrate. The method of claim 10,
The idle contact member is rotated according to the transfer of the substrate to assist the transfer of the substrate, spraying device. The method of claim 10,
The plurality of spray nozzles,
A first group injection nozzle forming a first angle with the injection shaft; And
The injection device comprising a second group injection nozzles forming a second angle with the injection shaft. The method of claim 14,
The injection device, wherein the first group injection nozzles and the second group injection nozzles are alternately arranged with each other.

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