KR20200022799A - Apparatus for controlling temperature using thermoelectric element - Google Patents

Abstract

The present invention relates to a temperature control device using a thermoelectric element to control the temperature of a target area by a radiation method. According to an embodiment of the present invention, a temperature control device comprises: a heat transfer unit including a first surface and a second surface being thermally connected to a target area, and including a heat storage unit between the first surface and the second surface; and a thermoelectric element configured to perform a heat generation operation that provides warm heat through the surface in contact with the first surface or a heat absorption operation that provides cold heat through the surface in contact with the first surface based on the applied current, and exchange heat with the heat storage unit through the surface in contact with the first surface. Even when the heat generation operation and the heat absorption operation are not performed in the thermoelectric element, the heat storage unit may be configured to maintain the temperature of the second surface within a predetermined temperature range.

Description

Temperature control device using thermoelectric device {APPARATUS FOR CONTROLLING TEMPERATURE USING THERMOELECTRIC ELEMENT}

The following embodiments relate to a temperature control apparatus using a thermoelectric element, and more particularly, to a temperature control apparatus using a thermoelectric element to control a temperature of a target region by a radiation method.

The thermoelectric element may be used as a temperature controller by a Peltier effect in which one side is cooled by the applied current and the other side generates heat.

The phase change material (PCM) absorbs heat through a phase change process between a solid state and a liquid state, and then releases heat when the temperature decreases. The phase change material may be used as a heat storage medium by storing and releasing heat only at a phase change temperature. Phase change materials have a higher heat storage capacity than alternative heat storage materials, and are very useful because they are relatively lightweight and occupy a small installation area.

Conventional thermoelectric devices require fluid, fluid lines must be arranged at appropriate intervals to increase efficiency, and fluid connections must be stable. For this reason, in the conventional temperature control device, the design has to be complicated and sophisticated, and there is a problem that leakage occurs and the temperature control efficiency is lowered when the design is incorrect or the installation of the fluid pipe is wrong.

Recently, studies have been conducted to control temperature by using a thermoelectric device to solve this problem, but using a radiation method.

One problem relates to a temperature control device that provides cooling to a target region without using a refrigerant required for existing cooling.

One object is to radiate heat exchange directly with a human body by controlling the temperature of a target region by a radiation method, and to a temperature control device that is efficient in terms of thermal comfort and energy.

One problem is that by using a thermoelectric element alone can provide cooling or heating, no additional heat source device is required. In addition, by using a phase change material, the heat provided from the thermoelectric element is absorbed to the heat storage unit as much as possible, and even after the operation of the thermoelectric element is stopped, the heat absorbed from the heat storage unit is released to provide heat to the target area for a predetermined time. It relates to a temperature control device that can be.

Another task is to operate the thermoelectric element using electric power at night time when the electricity usage is low, store the heat provided by the thermoelectric element in the heat storage unit, stop the thermoelectric element, and then operate the temperature control device during the day. The present invention relates to an apparatus for controlling a temperature of a target area that reduces energy load and reduces energy consumption.

The problem to be solved is not limited to the above-described problem, and the problems that are not mentioned will be clearly understood by those skilled in the art from the present specification and the accompanying drawings.

According to one embodiment, the temperature control device for controlling the temperature of the target region by a radiation method, comprising a first surface and a second surface, the second surface is thermally connected to the target region, the first surface A heat transfer part including a heat storage part between the second surface and the second surface; And an exothermic operation of providing heat through the surface in contact with the first surface or an endothermic operation of providing cooling heat through the surface in contact with the first surface based on the applied current, and contacting the first surface. And a thermoelectric element configured to exchange heat with the heat storage part through a predetermined surface. Even when the heat generating operation and the endothermic operation are not performed in the thermoelectric element, the heat storage part has a temperature of the second surface. A temperature control device may be provided, wherein the temperature control device is configured to maintain the predetermined temperature range.

Means for solving the problems are not limited to the above-described solutions, and solutions that are not mentioned will be clearly understood by those skilled in the art from the present specification and the accompanying drawings. .

According to one embodiment, it is possible to provide a temperature control device for providing cooling to a target region without using a conventional refrigerant required for cooling.

According to one embodiment, the radiant heat exchange is performed directly with the human body by controlling the temperature of the target region by the radiation method, thereby providing an efficient temperature control device in terms of thermal comfort and energy.

According to one embodiment, by using a thermoelectric element alone can provide cooling or heating, no additional heat source device is required. In addition, by using a phase change material, the heat provided from the thermoelectric element is absorbed to the heat storage unit as much as possible, and even after the operation of the thermoelectric element is stopped, the heat absorbed from the heat storage unit is released to provide heat to the target area for a predetermined time. A temperature control device capable of doing so can be provided.

According to an embodiment of the present invention, the thermoelectric element is operated using electric power at a low-night time when electricity is not used to store heat provided by the thermoelectric element in the heat storage unit, the thermoelectric element is stopped, and the temperature control device is operated during the day. As a result, it is possible to provide an apparatus for controlling the temperature of the target area to reduce the energy load and reduce the energy consumption.

The effects of the present invention are not limited to the above-described effects, and effects that are not mentioned will be clearly understood by those skilled in the art from the present specification and the accompanying drawings.

1 is a view for explaining a temperature control apparatus using a thermoelectric element to control a temperature of a target region by a radiation method according to an embodiment.
2 is a view for explaining a temperature control apparatus using a thermoelectric element to control a temperature of a target region by a radiation method according to another exemplary embodiment.
3 is a diagram for describing an operation of a target region of a temperature control apparatus using a thermoelectric element to control the temperature of the target region by a radiation method according to an exemplary embodiment.
4 is a diagram for describing an operation of a target region of a temperature control apparatus using a thermoelectric device to control the temperature of the target region by a radiation method according to another exemplary embodiment.
5 is a block diagram illustrating a temperature control device 50 according to an embodiment.
6 is a flowchart illustrating an operation of a temperature control device when heating is provided to a target area according to an exemplary embodiment.
7 is a flowchart illustrating an operation of a temperature control device when cooling is provided to a target area according to an exemplary embodiment.

Hereinafter, with reference to the drawings will be described in detail a specific embodiment of the present invention. However, the spirit of the present invention is not limited to the embodiments presented, and those skilled in the art who understand the spirit of the present invention may further degenerate other inventions or the present invention by adding, changing, or deleting other elements within the scope of the same idea. Other embodiments that fall within the scope of the inventive concept may be easily proposed, but they will also be included within the scope of the inventive concept.

In addition, the components with the same functions within the scope of the same idea shown in the drawings of each embodiment will be described using the same reference numerals.

According to one embodiment, the temperature control device for controlling the temperature of the target region by a radiation method, comprising a first surface and a second surface, the second surface is thermally connected to the target region, the first surface A heat transfer part including a heat storage part between the second surface and the second surface; And an exothermic operation of providing heat through the surface in contact with the first surface or an endothermic operation of providing cooling heat through the surface in contact with the first surface based on the applied current, and contacting the first surface. And a thermoelectric element configured to exchange heat with the heat storage part through a predetermined surface. Even when the heat generating operation and the endothermic operation are not performed in the thermoelectric element, the heat storage part has a temperature of the second surface. A temperature control device may be provided, wherein the temperature control device is configured to maintain the predetermined temperature range.

According to one embodiment, the temperature control device further comprises a control unit for controlling the direction of the current and the amount of current applied to the thermoelectric element, the thermoelectric element, under the control of the control unit, the heating operation and the A temperature control device may be provided that is controlled in any one of an off mode that does not perform an endothermic operation, a heat mode that performs the exothermic operation, or a cold heat mode that performs the endothermic operation.

According to one embodiment, when the thermoelectric element is performed in the warm mode, the temperature of the second surface of the heat storage unit based on the heat provided through the first surface is the first detail of the predetermined temperature range A temperature control device may be provided that is configured to maintain the temperature range.

According to one embodiment, when the thermoelectric element is performed in the off mode, the heat storage unit of the second surface on the basis of the heat received from the thermoelectric element even before the heat is not received from the thermoelectric element A temperature control device may be provided that is configured such that the temperature is maintained within a first detailed temperature range of the predetermined temperature range.

According to one embodiment, when the thermoelectric element is performed in the cold heat mode, the temperature of the second surface is based on the cold heat provided through the first surface is a second detail of the predetermined temperature range A temperature control device may be provided that is configured to maintain the temperature range.

According to one embodiment, when the thermoelectric element is performed in the off mode, the heat storage portion of the second surface on the basis of the cold heat provided from the thermoelectric element even before the cold heat is not received from the thermoelectric element A temperature control device may be provided that is configured such that the temperature is maintained in a second detailed temperature range of the predetermined temperature range.

According to one embodiment, the heat storage unit may be provided with a temperature control device including a phase change material.

According to one embodiment, the heat transfer unit may be provided with a temperature control device further comprising; a heat transfer unit for uniformly transferring the heat provided from the thermoelectric element inside the heat storage unit.

According to one embodiment, the heat transfer unit may be provided with a temperature control device comprising a; a plurality of heat transfer plates spaced at regular intervals inside the heat transfer unit.

According to one embodiment, the thermoelectric device may be provided on the other side of the surface in contact with the first surface, the temperature control device further comprising a heat dissipation unit in contact with the thermoelectric element.

According to an embodiment, the heat dissipation unit may be provided in a space in which an air inlet and an air outlet are disposed, and an air flow unit having an air flow space connecting the air inlet and the air outlet. have.

According to one embodiment, the air flow unit may be provided with a temperature control device including a; fan for blowing the air flowing into the air inlet to the air inlet outlet.

Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings.

1 is a view for explaining a temperature control apparatus using a thermoelectric element to control a temperature of a target region by a radiation method according to an embodiment.

Referring to FIG. 1, a temperature control device 10 using a thermoelectric element to control a temperature of a target region by a radiation method includes a thermoelectric element 100, a heat transfer part 110, a first surface 111, and a second surface. 112, the heat storage unit 120 may be included.

Thermoelectric Module (TEM) is a device that absorbs heat from a low-temperature heat source and heats it to a high-temperature heat source. The thermoelectric module (TEM) realizes a SeeBeck effect, a phenomenon in which electromotive force is generated by a temperature difference, or is absorbed by an electric current. Alternatively, a Peltier effect, which is a phenomenon in which heat is generated, may be implemented.

Specifically, the inside of the thermoelectric element is a device consisting of an N-type semiconductor containing a lot of electrons (negative charge) and a P-type semiconductor containing a lot of holes (positive charge). According to the direction of the current applied to the thermoelectric element, one side of the thermoelectric element performs an exothermic operation in which the electric charge inside the thermoelectric element is increased and is heated, and the other side performs the endothermic operation in which the electric charge is relatively reduced. .

Using this, if the temperature control device 10 applies a current so that the endothermic operation is performed on the surface in which the thermoelectric element 100 is in contact with the first surface 111, the first surface in contact with the thermoelectric element 100 ( 111 may provide cold heat. When a current is applied such that the heat generating operation is performed on the surface in which the thermoelectric element 100 is in contact with the first surface 111, the first surface 111 in contact with the thermoelectric element 100 may provide heat. Here, since heat is a physical quantity expressed in the form of a positive scalar, the expression 'providing cold heat' or 'transmitting cold heat' may not be strictly expressed from a physical point of view, but heat is applied for convenience of description in this specification. Heat is provided or transferred to a phenomenon that is transmitted or transmitted, and vice versa, that is, a phenomenon of absorbing heat, is expressed as being provided or transmitted.

The heat storage unit 120 according to an embodiment may include a phase change material (PCM). When the phase change material (PCM) reaches the phase change temperature through the phase change process of the material from solid to liquid, it can accumulate a large amount of heat energy or release the stored heat energy. The heat at this time is called latent heat, and the phase change material may mean a material having a greater amount of latent heat than a general material. Because of this, even if the phase change material absorbs a larger amount of heat than the general material, the surface temperature may be continuously maintained at the phase change temperature until the phase change is completed. That is, compared to a general material, the phase change material may be understood as a material having a property that the surface temperature is maintained in a certain temperature range despite the absorption and release of heat.

Types of phase change materials include paraffinic mixtures and non-paraffinic mixtures as organic materials, and salts and metals as inorganic materials.

The predetermined temperature range is a temperature range including the first detailed temperature range and the second detailed temperature range, and means a temperature range suitable for heating and cooling.

The first sub-temperature range means a temperature range of a heat storage unit suitable for applying heating to the target region, and the second sub-temperature range means a temperature range of a heat storage unit suitable for applying cooling to the target region.

Specifically, when the heat provided to the heat storage unit 120 is cold heat, the heat stored in the heat storage unit 120 is released due to the cold heat, the heat inside the heat storage unit 120 may be reduced. Even though the stored heat of the heat storage unit 120 is released, due to the characteristics of the heat storage unit 120 having a large amount of latent heat, the heat storage unit 120 may be maintained at a phase change temperature, and the second surface 112 may be maintained. The temperature of may also be maintained in the predetermined temperature range.

Subsequently, in the off mode in which the endothermic operation of the thermoelectric element 100 is not performed, since no heat is provided to the heat storage unit 120, the heat storage unit 120 may absorb heat from the outside. have. However, since the heat storage unit 120 has a characteristic that the temperature of the surface of the heat storage unit 120 is maintained even if a large amount of heat is absorbed, as the temperature of the surface of the heat storage unit 120 is maintained The temperature of the second surface 112 may be maintained in a predetermined temperature range.

The temperature control device 10 according to an embodiment applies a current so that the endothermic operation is performed on the surface in which the thermoelectric element 100 is in contact with the first surface 111, and the first surface in contact with the thermoelectric element 100. 111 may provide cold heat to the heat storage unit 120. At this time, the phase change temperature of the heat storage unit 120 may correspond to a predetermined temperature range (ex. 16 ℃), when the cold heat is provided to the heat storage unit 120 from the first surface 111 The stored heat of the heat storage unit 120 may be released. Due to the characteristic of the heat storage unit 120 having a large amount of latent heat, the heat storage unit 120 may be maintained at a phase change temperature, such that the second surface 112 may be maintained in the predetermined temperature range. Of course, when the heat stored in the heat storage unit 120 is released when the amount of heat stored in the heat storage unit 120 is less than the predetermined heat amount, the temperature of the heat storage unit 120 may be lower than the phase change temperature. In this case, the temperature of the second surface 112 may be lowered below a predetermined temperature range (eg, 16 ° C.).

In addition, in the off mode in which the endothermic operation is not performed in the thermoelectric element 100, since the cold heat is not provided to the heat storage unit 120, the heat storage unit 120 may absorb heat from the outside. have. However, the heat storage unit 120 is maintained at a phase change temperature due to the characteristic that the temperature of the surface of the heat storage unit 120 having a large amount of latent heat is kept constant even if a large amount of heat is absorbed. The temperature of the second surface 112 may also be maintained in the predetermined temperature range (eg, 16 ° C.).

Phase change materials usable for cooling in summer are, for example, n-pentadecane (phase change temperature: 10 ° C), n-hexadecane (phase change temperature: 18 ° C), n-heptadecane (phase change temperature: 22 ° C) , KF4H₂O (phase change temperature: 18.5 ℃), Paraffin 16-Carbons (phase change temperature: 16.7 ℃), and the like can be used. The phase change material is only an example and is not limited to the phase change material, and may be variously changed according to a situation.

In summer, since the temperature of the target region is higher than the temperature of the second surface 112 of the temperature control device, the phase change material may be in a liquid state. At this time, by operating the thermoelectric element 100, when the thermoelectric element 100 is applied with a current so that the endothermic operation is performed on the surface in contact with the first surface 111, the first surface in contact with the thermoelectric element 100 As the 111 is cooled, it may provide cooling heat to the heat storage unit 120, and the phase change material may be provided with cooling heat until the temperature becomes lower than the phase change temperature.

When the heat provided to the heat storage unit 120 is heat, the heat stored in the heat storage unit 120 may increase due to the heat. That is, the heat storage unit 120 absorbs heat provided from the thermoelectric element and stores the heat in the heat storage unit 120. Due to the characteristics of the heat storage unit 120 having a large amount of latent heat, the heat storage unit 120 may be maintained at a phase change temperature, and the temperature of the second surface may also be maintained at a predetermined temperature range.

Subsequently, in the off mode in which the heat generating operation of the thermoelectric element 100 is not performed, since the heat is not provided to the heat storage unit, the heat storage unit may release heat to the outside. However, since the heat storage part has a characteristic that the temperature of the surface of the heat storage part is maintained even when a large amount of heat is released, the temperature of the second surface is a predetermined temperature range as the temperature of the surface of the heat storage part is maintained. Can be maintained.

The temperature control device 10 according to an embodiment applies a current to perform a heat generation operation on the surface in which the thermoelectric element 100 is in contact with the first surface 111, and thus, the first surface in contact with the thermoelectric element 100. The reference numeral 111 may provide heat to the heat storage unit 120. In this case, the phase change temperature of the heat storage unit 120 may correspond to a predetermined temperature range (eg, 25 ° C.). When heat is provided to the heat storage unit 120 from one surface, the heat storage unit 120 may absorb heat. Due to the characteristic of the heat storage unit 120 having a large amount of latent heat, the heat storage unit 120 may be maintained at a phase change temperature, such that the second surface 112 may be maintained in the predetermined temperature range. Of course, when the heat storage unit 120 absorbs heat, when the amount of heat stored in the heat storage unit 120 becomes more than a predetermined heat amount, the temperature of the heat storage unit 120 may be higher than the phase change temperature. In this case, the temperature of the second surface 112 may be higher than a predetermined temperature range (eg, 25 ° C.).

In addition, in the off mode in which the heating operation is not performed in the thermoelectric element 100, since heat is not provided to the heat storage unit 120, the heat storage unit 120 may emit heat to the outside. have. However, the heat storage unit 120 maintains the temperature of the phase change temperature due to the characteristic that the temperature of the surface of the heat storage unit 120 having a large amount of latent heat is maintained even if a large amount of heat is released. The second surface 112 may be maintained at the predetermined temperature range (eg, 25 ° C.).

Phase change materials that can be used for winter heating are, for example, Paraffin 21-Carbons (phase change temperature: 40.2 ° C), Paraffin 22-Carbons (phase change temperature: 44 ° C), 2-Heptadecanone (phase change temperature: 48) ℃), O-Nitroaniline (phase change temperature: 50 ℃) and the like can be used. The phase change material is only an example and is not limited to the phase change material, and may be variously changed according to a situation.

In winter, since the temperature of the target region is lower than the temperature of the second surface of the temperature control device, the phase change material may be in a solid state. At this time, by operating the thermoelectric element, when a current is applied such that the thermoelectric element performs a heating operation on the surface in contact with the first surface, the first surface in contact with the thermoelectric element is heated to provide heat to the heat storage unit. And, the phase change material may be provided with heat until the temperature is higher than the phase change temperature.

2 is a view for explaining a temperature control apparatus using a thermoelectric element to control the temperature of a target region by a radiation method according to another embodiment.

Referring to FIG. 2, (a) is a front view of a temperature control device, and the temperature control device 20 includes a thermoelectric element 200, a heat transfer part 210, a first surface 211, and a second surface 212. The heat storage part 220 may include a heat transfer part 230, a heat dissipation part 240, and a heat insulation part 250.

Compared with the temperature control device shown in FIG. 1, the temperature control device shown in FIG. 2 further includes a heat transfer unit 230 and a heat dissipation unit 240. The thermoelectric element 200, the heat transfer unit 210, and the first heat transfer unit 240 are included. The descriptions of the plane 211 and the second plane 212 may be applied as it is described in FIG. 1.

The heat transfer part 230 serves to evenly distribute the heat provided from the thermoelectric element 200 in the heat transfer part 210. Without the heat transfer part 230, heat provided from the thermoelectric element 200 is concentrated only around the first surface 211 in contact with the thermoelectric element 200, and heat is transferred to the second surface 212. You may not. If the heat provided from the thermoelectric element 200 is provided in only a portion and less in other portions, the temperature control device 20 may not operate efficiently.

In winter, heat is transferred from the thermoelectric element 200 to the heat storage unit 220 through the first surface 211, so that only the periphery in contact with the first surface 211 absorbs much heat even in the heat storage unit 220. Since the other portions do not absorb heat, no heat may be transferred to the second surface 212. In the summer, the cold heat is transferred from the thermoelectric element 200 to the heat storage unit 220 through the first surface 211, so that only the periphery in contact with the first surface 211 is released even in the heat storage unit 220. Since no other portion releases heat, no cooling heat may be transferred to the second surface 212.

The heat transfer part 230 may include a plurality of heat transfer plates spaced at regular intervals inside the heat transfer part 210. This is because heat provided from the thermoelectric element 200 may be evenly transferred to the heat transfer part 210 at regular intervals.

That is, the heat transfer part 230 may prevent the heat provided from the thermoelectric element 200 from being concentrated in one place and operate the temperature control device 20 efficiently to control the temperature in the target area.

The heat dissipation part 240 may be positioned on the other side of the surface where the thermoelectric element 200 and the first surface 211 are in contact with each other, and may contact the thermoelectric element 200.

When the thermoelectric device 200 applies a current to perform the endothermic operation on the surface in contact with the first surface 211 in the temperature control device 20, the first surface 211 in contact with the thermoelectric element 200 is cold-heated. May be provided, and the first surface 211 is cooled. By the Peltier effect described above, when the first surface 211 is cooled, the other side of the surface in which the thermoelectric element 200 and the first surface 211 are in contact with each other is heated, and the heating operation is performed on the first surface 211. If cooling continues, heat generated on the other side of the surface where the thermoelectric element 200 is in contact with the first surface 211 becomes waste heat that may affect the cooling of the first surface 211. If the waste heat is not removed, the waste heat may transfer heat to a portion of the first surface 211 that is cooled, thereby lowering the cooling efficiency of the first surface 211. That is, there is a problem that the cooling efficiency of the first surface 211 is reduced due to the waste heat, the heat radiating unit 240 can effectively discharge the waste heat generated from the other side.

The heat dissipation unit 240 may remove waste heat generated at the other side of the thermoelectric element 200, thereby increasing efficiency of the thermoelectric element 200 and preventing a thermal reversal phenomenon of the thermoelectric element 200.

The heat insulation part 250 serves to prevent heat from being absorbed or released to the outside. That is, in winter, heat is released from the heat storage unit 220 of the temperature control device 20 to the outside, and in summer, the heat storage unit 220 of the temperature control device reduces heat absorption from the outside. Can be.

In addition, the heat insulating part 250 may have a structure surrounding the heat transfer part 210. However, since the thermoelectric element 200 and the first surface 211 are to be thermally connected, they are not disposed between the thermoelectric element 200 and the first surface 211. In addition, since the heat storage unit 220 and the second surface 212 should be thermally connected, the heat storage unit 220 and the second surface 212 are not disposed between the heat storage unit 220 and the second surface 212. That is, the heat insulating part 250 surrounds the heat transfer part 210, except for the part where the thermoelectric element 200 and the first surface 211 are in contact with each other and the heat storage part 220 and the second surface 212 are in contact with each other. do.

Accordingly, the thermal insulation unit 250 is to thermally block the heat storage unit 220 located inside the heat transfer unit 210 from the outside, thereby minimizing the heat loss to reduce the temperature to the target area with less power Can be controlled.

(b) is a three-dimensional view showing the temperature control device, which is a different representation of the temperature control device expressed in (a).

The heat dissipation part 240 generally has a rectangular plate structure in a multi-layered structure, and each plate has a structure in which the thermoelectric element 200 is connected. However, the present invention is not limited to the quadrangle structure and may have a polygonal structure such as a triangle and a circle.

The multi-layered structure of the heat dissipation part 240 can effectively remove waste heat discharged to the heat dissipation part 240 by increasing the surface area.

The heat transfer part 230 may include a plurality of heat transfer plates or heat transfer fins spaced apart at regular intervals in the heat transfer part 210. In the case of the heating plate may form a lattice-shaped plate, in the case of the heating fins may form a lattice-shaped line.

3 and 4 are views for explaining the operation of the target region of the temperature control device using the thermoelectric element to control the temperature of the target region by the radiation method.

Referring to FIG. 3, the temperature control device 30 includes a thermoelectric element 300, a heat transfer part 310, a first surface 311, a second surface 312, a heat storage part 320, and a heat transfer part 330. ), A heat dissipation unit 340, a heat insulating part 350, an air flow unit 360, an air inlet 370, and an air outlet 380.

Compared with the temperature control device represented in FIG. 2, the air flow part 360, the air inlet 370, and the air outlet 380 are further included, and the thermoelectric element 300, the heat transfer part 310, and the first surface are provided. 311, the second surface 312, the heat storage part 320, the heat transfer part 330, the heat dissipation part 340, and the heat insulation part 350 may be applied as it is described in FIG. 2. .

The heat dissipation unit 340 may be located in a space where the air inlet 370 and the air outlet 380 are disposed. In addition, the air inlet 370 and the air outlet 380 may be connected, and may include an air flow unit 360 having an air flow space.

If the heat dissipation unit 340 is disposed in a closed space or the heat source around the heat dissipation unit 340 is not eliminated, the role and effect of the heat dissipation unit 340 for removing waste heat is reduced.

Accordingly, the temperature control device may include an air flow unit 360, an air inlet 370, and an air outlet 380. When cold air enters the air inlet 370, the heat discharged from the heat dissipating unit 340 is removed by the cold air entering the air inlet, and the air heated through the heat dissipating unit is discharged to the air outlet 380. do. Thus, the efficiency of the heat dissipation unit 340 is improved, and thus, the efficiency of the thermoelectric element 300 is also improved.

That is, the air flow part 360 serves to effectively remove heat discharged to the heat radiating part 340.

Referring to FIG. 4, the temperature control device 40 according to an embodiment includes a thermoelectric element 400, a heat transfer part 410, a first surface 411, a second surface 412, and a heat storage unit 420. The heat transfer part 430, the heat dissipation part 440, the heat insulation part 450, the air flow part 460, the air inlet 470, the air outlet 480, and a blowing fan 490 may be included.

Compared with the temperature control device represented in FIG. 3, a blower fan 490 is further included, and the thermoelectric element 400, the heat transfer part 410, the first surface 411, the second surface 412, and heat storage The description of the unit 420, the heat transfer unit 430, the heat dissipation unit 440, the heat insulation unit 450, the air flow unit 460, the air inlet 470, and the air outlet 480 is illustrated in FIGS. 2 and 3. The information described in this section may apply.

The temperature control device 40 according to an embodiment blows the air inlet 470 and the air outlet 480 in order to more effectively flow the outside air and to effectively remove the waste heat discharged from the heat radiating unit 440. 490 may be provided, and the air flowing into the air inlet 470 may flow out to the air outlet 480 through the air flow unit 460.

Blowing fan 490 is discharged through the heat dissipation unit 440, the waste heat generated on the other side of the thermoelectric element 410, in order to effectively remove the waste heat discharged to the heat dissipation unit 440, cool by the air inlet 470 The air is introduced, and the hot air is effectively discharged to the air outlet 480 while removing the waste heat of the heat dissipation unit 440.

The blower fan 490 installed at the air inlet 470 rotates the fan only in the direction in which air is introduced, so that the air can be introduced more effectively, and the blower fan 490 installed at the air outlet 480 has air flowed out. The fan can only rotate in the direction, allowing more efficient air outflow.

When the heat absorbing operation is performed on the surface in which the thermoelectric element 400 and the first surface 411 contact, the first surface 411 in contact with the thermoelectric element 400 may provide cooling heat. At this time, the other side where the thermoelectric element 400 and the first surface 411 are not in contact with each other performs the heating operation that is heated by the Peltier effect described above. The waste heat generated on the other side of the thermoelectric element 400 in which the heat generation operation is performed may be removed. If the air flows smoothly in the air flow unit 460, the waste heat may be more effectively removed.

Since heat is not generated when the heat generating operation is performed on the surface in which the thermoelectric element 400 and the first surface 411 are in contact, the blower fan 490 is in contact with the thermoelectric element 400 and the first surface 411. Only when the endothermic operation is performed in this respect, turning is efficient for power usage.

5 is a block diagram illustrating a temperature control device 50 according to an embodiment.

Referring to FIG. 5, the temperature control device 50 according to an embodiment includes a control unit 500. The thermoelectric element 510 may include a heat transfer part 520 and a heat storage part 530.

The controller 500 may control the direction of the current applied to the thermoelectric element and the amount of current. Under the control of the controller 500, the thermoelectric element may be operated in three modes, namely, a heat mode, a cold heat mode, and an off mode.

The warm mode is a mode in which a heating operation is performed to provide heat through a surface in which the thermoelectric element and the first surface are in contact with each other based on the applied current, and the cold heat mode is in contact with the thermoelectric element and the first surface in accordance with the applied current. The end mode is a mode in which an endothermic operation is provided to provide cooling heat through the surface, and the off mode is a mode in which the heat generating operation and the endothermic operation are not performed through the surface in which the thermoelectric element and the first surface are in contact with each other. .

When the thermoelectric element is operated in the thermal mode under the control of the controller 500, the heat transfer part may be provided with heat through a surface in which the thermoelectric element is in contact with the first surface.

When the heat provided to the heat storage unit 530 via the heat transfer unit 520 is heat, heat stored in the heat storage unit 530 may increase due to heat. Subsequently, in the off mode in which the heat generating operation of the thermoelectric element 510 is not performed, since heat is not provided to the heat storage unit 530, heat of the heat storage unit 530 may be discharged to the outside. have. However, the heat storage unit 530 may have a characteristic in which the temperature of the surface of the heat storage unit 530 is kept constant even when a large amount of heat is stored therein. As a result, the thermoelectric element 510 is turned off. In the case where the heat storage unit 530 releases heat to the outside, the temperature of the surface of the heat storage unit 530 may be maintained.

In addition, when the thermoelectric element is operated in the cold heat mode under the control of the controller 500, cold heat may be provided to the heat transfer part 520 through a surface in which the thermoelectric element is in contact with the first surface.

When the heat provided to the heat storage unit 530 via the heat transfer unit 520 is cold heat, the heat stored in the heat storage unit 530 may be reduced due to cold heat. Subsequently, in the off mode in which the endothermic operation of the thermoelectric element is not performed, since no heat is provided to the heat storage unit 530, the heat storage unit 530 may absorb heat from the outside. However, the heat storage unit 530 may have a characteristic that the temperature of the surface of the heat storage unit 530 is kept constant even if a large amount of heat is stored. Although the storage unit 530 absorbs heat from the outside, the temperature of the surface of the heat storage unit 530 may be maintained.

That is, even when operated in the off mode, the surface temperature of the heat storage unit 530 may be maintained by the characteristics of the heat storage unit 530.

6 is a flowchart illustrating an operation of a temperature control device when heating is provided to a target area according to an exemplary embodiment.

Referring to FIG. 6, the temperature control device 20 may start the operation of the thermoelectric element, thereby controlling the heating mode in which the heating operation is performed at the surface where the thermoelectric element is in contact with the first surface (S110). In detail, in operation S110, the temperature control device 60 may control the thermoelectric element in a warm mode at night time. In this case, the thermoelectric element may operate the thermoelectric element by using a late night power (for example, 10 pm to 8 am) to which electricity consumption is low and a rate lower than a general electric charge is applied. By controlling in the warm mode, the first surface in contact with the thermoelectric element may provide heat to the heat storage unit.

Thereafter, the method may include determining the temperature by comparing the temperature of the heat storage unit with a predetermined temperature range (S120). If the temperature of the heat storage unit is greater than or equal to the predetermined temperature range, the temperature control device 20 may stop the operation of the thermoelectric element (S130), and if the temperature of the heat storage unit is smaller than the predetermined temperature range, By operating the thermoelectric element can be controlled in the thermal mode (S110).

In addition, the temperature control apparatus 20 may control the off-mode in which the heating operation is not performed at the surface in which the thermoelectric element is in contact with the first surface (S130). That is, the operation of the thermoelectric element may be stopped. Although the heat from the thermoelectric element is not provided to the heat storage unit in the off mode, due to the characteristics of the heat storage unit having a large latent heat amount during the phase change process, the heat provided from the thermoelectric element in the warm mode may be stored in the heat storage unit. In the off mode, the heat storage unit maintains the phase change temperature through the phase change even though the heat storage unit releases heat to the outside, thereby maintaining the temperature of the second surface in the predetermined temperature range.

As the temperature of the second surface is maintained in a predetermined temperature range, the temperature of the target region may be controlled by a radiation method even when the thermoelectric element is stopped.

Specifically, during the weekly time when the electricity consumption is high (for example, 9 am to 6 pm), the operation of the thermoelectric element using electricity is stopped, and the temperature of the second surface is maintained in a predetermined temperature range. The temperature of the target area can be controlled by the radiation method. In other words, since no power is used during the day, it can reduce energy load and reduce energy consumption.

7 is a flowchart illustrating an operation of a temperature control apparatus when cooling is provided to a target area according to an exemplary embodiment.

Referring to FIG. 7, the temperature control device 20 may start the operation of the thermoelectric element, thereby controlling the cold heat mode in which the endothermic operation is performed at the surface where the thermoelectric element is in contact with the first surface (S210). In detail, in operation S210, the temperature control device 70 may control the thermoelectric element in a cold heat mode at night time. In this case, the thermoelectric element may operate the thermoelectric element by using a late night power (for example, 10 pm to 8 am), which uses less electricity and is lower than a general electric bill. By controlling in the cold heat mode, the first surface in contact with the thermoelectric element may provide cold heat to the heat storage unit.

Thereafter, comparing the temperature of the heat storage unit with a predetermined temperature range may include determining (S220). If the temperature of the heat storage unit is less than or equal to the predetermined temperature range, the temperature control device 20 may stop the operation of the thermoelectric element (S230), and if the temperature of the heat storage unit is greater than the predetermined temperature range, By operating the thermoelectric element can be controlled in the cold heat mode (S210).

In addition, the temperature control device 20 may control in the off mode in which the endothermic operation is not performed at the surface in contact with the thermoelectric element and the first surface (S230). That is, the operation of the thermoelectric element may be stopped.

Since no heat is provided to the heat storage unit in the off mode, the heat storage unit may absorb heat from the outside. However, even if the heat storage unit absorbs heat from the outside, due to the characteristics of the heat storage unit having a large latent heat during the phase change process, the heat storage unit is maintained at the phase change temperature through the phase change, so that the temperature of the second surface is a predetermined temperature. It can be kept in range.

Accordingly, even if the thermoelectric element is stopped, the temperature of the target region can be controlled by the radiation method.

Specifically, during the weekly hours of high electricity consumption (eg, 9 am to 6 pm), the operation of the thermoelectric element using electricity is stopped and the temperature of the second surface is maintained in a predetermined temperature range. The temperature of the target area can be controlled by the radiation method. In other words, since no power is used during the day, it can reduce energy load and reduce energy consumption.

Although the embodiments have been described by the limited embodiments and the drawings as described above, various modifications and variations are possible to those skilled in the art from the above description. For example, the described techniques may be performed in a different order than the described method, and / or components of the described systems, structures, devices, circuits, etc. may be combined or combined in a different form than the described method, or other components. Or, even if replaced or substituted by equivalents, an appropriate result can be achieved.

Therefore, other implementations, other embodiments, and equivalents to the claims are within the scope of the claims that follow.

200 Thermoelectric 360 Air Flow
210 Heat Transfer Section 370 Air Inlet
211 First Page 380 Air Outlet
212 page 2 490 Blower fan
220 heat storage
230 electric heating parts
240 heat sink
250 insulation

Claims (12)

In the temperature control device for controlling the temperature of the target area by the radiation method,
A heat transfer part including a first surface and a second surface, wherein the second surface is thermally connected to the target region and includes a heat storage unit between the first surface and the second surface; And
An exothermic operation of providing heat through the surface in contact with the first surface or an endothermic operation of providing cooling heat through the surface in contact with the first surface based on an applied current, and contacting with the first surface And a thermoelectric element configured to exchange heat with the heat storage part through a surface.
Even when the heat generating operation and the endothermic operation are not performed in the thermoelectric element, the heat storage unit is configured to maintain the temperature of the second surface in a predetermined temperature range.
Temperature control device.
The method of claim 1,
And a controller for controlling the direction of the current and the amount of current applied to the thermoelectric element.
Under the control of the controller, the thermoelectric element is controlled to any one of the heating mode, an off mode in which the endothermic operation is not performed, a heating mode in which the heating operation is performed, or a cold heat mode in which the endothermic operation is performed. ,
Temperature control device. The method of claim 2,
When the thermoelectric element is performed in the warm mode,
The heat storage unit is configured to maintain the temperature of the second surface in the first detailed temperature range of the predetermined temperature range based on the heat provided through the first surface,
Temperature control device. The method of claim 3,
When the thermoelectric element is performed in the off mode,
The heat storage unit is configured to maintain the temperature of the second surface in the first detailed temperature range of the predetermined temperature range based on the heat provided from the thermoelectric element until the heat storage is not received from the thermoelectric element. ,
Temperature control device. The method of claim 2,
When the thermoelectric element is performed in the cold heat mode,
The heat storage unit is configured to maintain the temperature of the second surface in a second detailed temperature range of the predetermined temperature range based on the cold heat provided through the first surface.
Temperature control device. The method of claim 5,
When the thermoelectric element is performed in the off mode,
The heat storage unit is configured such that the temperature of the second surface is maintained in the second detailed temperature range of the predetermined temperature range based on the cold heat provided from the thermoelectric element until the cold storage is not received from the thermoelectric element. ,
Temperature control device. The method of claim 1,
The heat storage unit includes a phase change material,
Temperature control device.
The method of claim 1,
The heat transfer unit,
And a heat transfer part configured to uniformly transfer heat provided from the thermoelectric element into the heat storage part.
Temperature controller
The method of claim 8,
And a plurality of heat transfer plates spaced at regular intervals in the heat transfer unit.
Temperature controller. The method of claim 1,
A heat dissipation part disposed on the other side of the surface where the thermoelectric element is in contact with the first surface and in contact with the thermoelectric element;
Temperature controller
The method of claim 10,
The heat dissipation unit is located in a space where an air inlet and an air outlet are disposed, and an air flow unit having an air flow space connecting the air inlet and the air outlet;
Temperature controller. The method of claim 11,
And a fan for blowing the air flowing into the air inlet to the air inlet.
Temperature controller.

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