KR20190121144A - Multi-layered ceramic capacitor and method of manufacturing the same - Google Patents

Multi-layered ceramic capacitor and method of manufacturing the same Download PDF

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Publication number
KR20190121144A
KR20190121144A KR1020180093708A KR20180093708A KR20190121144A KR 20190121144 A KR20190121144 A KR 20190121144A KR 1020180093708 A KR1020180093708 A KR 1020180093708A KR 20180093708 A KR20180093708 A KR 20180093708A KR 20190121144 A KR20190121144 A KR 20190121144A
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South Korea
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internal electrode
side margin
thickness
side
less
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KR1020180093708A
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Korean (ko)
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박용
이장열
조지홍
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삼성전기주식회사
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Publication of KR20190121144A publication Critical patent/KR20190121144A/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/015Special provisions for self-healing
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/224Housing; Encapsulation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • H01G4/0085Fried electrodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/012Form of non-self-supporting electrodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1209Ceramic dielectrics characterised by the ceramic dielectric material
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1209Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/248Terminals the terminals embracing or surrounding the capacitive element, e.g. caps

Abstract

An embodiment of the present invention provides a stacked ceramic capacitor comprising: a ceramic body including a dielectric body layer and including a first surface and a second surface opposite to each other, a third surface and a fourth surface connecting the first surface and the second surface, and a fifth surface and a sixth surface connected with the first surface to the fourth surface and opposite to each other; a plurality of inner electrodes arranged inside the ceramic body, exposed to the first and second surfaces, and having one end exposed to the third surface or the fourth surface; and a first side margin unit and a second side margin unit arranged in an end part of the inner electrode exposed to the first surface and the second surface. An oxidation region is arranged in the end part of the inner electrode which is less than 10% of the entire internal electrode exposed to the first surface and the second surface.

Description

Multilayer Ceramic Capacitor and Method for Manufacturing the Same {MULTI-LAYERED CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME}

The present invention relates to a multilayer ceramic capacitor and a method of manufacturing the same which can improve reliability by adjusting an oxidation region disposed at an end of an internal electrode.

In general, an electronic component using a ceramic material such as a capacitor, an inductor, a piezoelectric element, a varistor, or a thermistor includes a ceramic body made of a ceramic material, an internal electrode formed inside the body, and an external electrode installed on the surface of the ceramic body to be connected to the internal electrode. Equipped.

Recently, as electronic products are miniaturized and multifunctional, chip components are also miniaturized and highly functionalized, and thus, multilayer ceramic capacitors are required to have high capacity products with small sizes and large capacities.

Miniaturization and high capacitance of multilayer ceramic capacitors require maximizing the electrode effective area (increasing the effective volume fraction required for capacitance implementation).

In order to realize a small and high capacity multilayer ceramic capacitor as described above, in manufacturing a multilayer ceramic capacitor, the internal electrode is exposed in the width direction of the body, thereby maximizing the internal electrode width direction area through a marginless design, such a chip In the post-production firing step, a method of separately attaching a side margin part to the widthwise electrode exposed surface of the chip is applied.

However, in the method of forming the side margin portion, a large number of voids (void) is generated at the interface between the ceramic body and the side margin portion may reduce the reliability.

In addition, due to voids generated at the interface between the ceramic body and the side margin part, electric field concentration occurs, thereby causing a problem of lowering the breakdown voltage (BDV).

In addition, the voids may cause a decrease in moisture resistance reliability due to a decrease in outer sintered densities.

In general, a void formed at an interface between the ceramic body and the side margin part is formed of an oxide film to improve breakdown voltage (BDV) and moisture resistance reliability, but the effect is insufficient. have.

Therefore, research is needed to prevent the breakdown voltage (BDV) degradation and the moisture resistance reliability degradation in small and high capacity products.

Korean Laid-Open Patent Publication 2010-0136917

An object of the present invention is to provide a multilayer ceramic capacitor and a method of manufacturing the same which can improve the reliability by adjusting the oxidation region disposed at the end of the internal electrode.

An embodiment of the present invention includes a dielectric layer and includes a first surface and a second surface facing each other, a third surface and a fourth surface connecting the first and second surfaces, and the first to fourth surfaces. A ceramic body including a fifth surface and a sixth surface facing each other, disposed in the ceramic body, and exposed to the first and second surfaces, and once to the third or fourth surface. And a first side margin part and a second side margin part disposed on end portions of the exposed internal electrodes and the internal electrodes exposed to the first and second surfaces, and the first and second surfaces. Provided is a multilayer ceramic capacitor in which an oxide region is disposed at an end portion of an internal electrode of less than 10% of the entire internal electrode exposed to the substrate.

Another embodiment of the present invention provides a step of providing a first ceramic green sheet in which a plurality of first internal electrode patterns are formed at predetermined intervals and a second ceramic green sheet in which a plurality of second internal electrode patterns are formed at predetermined intervals. Stacking the first ceramic green sheet and the second ceramic green sheet so that the first internal electrode pattern and the second internal electrode pattern intersect to form a ceramic green sheet stacking body; Cutting the ceramic green sheet laminate body such that the end of the second internal electrode pattern has a side exposed in the width direction, and a first side margin on the side of the exposed end of the first internal electrode pattern and the second internal electrode pattern Forming a ceramic body including a dielectric layer and an internal electrode by baking the cut laminate body and forming a second and second side margins. Comprising the step, and provides a method for producing the internal electrode over the entire area located at the end of the oxidation of the internal electrode of the multilayer ceramic capacitor is less than 10% exposed to the side surfaces of the ceramic body.

According to one embodiment of the present invention, by adjusting the oxidized region to be disposed at the end of the internal electrode less than 10% of the total internal electrode exposed to the surface of the ceramic body on which the first and second side margins are disposed, voids ) And the ratio of the oxidized region can be reduced to increase the breakdown voltage (BDV) and improve the reliability.

1 is a schematic perspective view showing a multilayer ceramic capacitor according to an embodiment of the present invention.
FIG. 2 is a perspective view illustrating an appearance of the ceramic body of FIG. 1. FIG.
3 is a perspective view illustrating a ceramic green sheet laminated body before firing of the ceramic body of FIG. 2.
4 is a side view as viewed in the direction A of FIG. 2.
5A to 5F are cross-sectional views and perspective views schematically illustrating a method of manufacturing a multilayer ceramic capacitor according to another embodiment of the present invention.
6 is a graph comparing breakdown voltage (BDV) according to an embodiment of the present invention and a comparative example.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, embodiments of the present invention may be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for clarity, and the elements denoted by the same reference numerals in the drawings are the same elements.

1 is a schematic perspective view showing a multilayer ceramic capacitor according to an embodiment of the present invention.

FIG. 2 is a perspective view illustrating an appearance of the ceramic body of FIG. 1. FIG.

3 is a perspective view illustrating a ceramic green sheet laminated body before firing of the ceramic body of FIG. 2.

4 is a side view as viewed in the direction A of FIG. 2.

1 to 4, the multilayer ceramic capacitor 100 according to the present embodiment includes a ceramic body 110, a plurality of internal electrodes 121 and 122 formed in the ceramic body 110, and the ceramic. External electrodes 131 and 132 are formed on the outer surface of the body 110.

The ceramic body 110 has a first surface 1 and a second surface 2 facing each other, and a third surface 3 and a fourth surface 4 and an upper surface which connect the first and second surfaces. And a fifth surface 6 and a sixth surface 6, which are over and under surfaces.

The first face 1 and the second face 2 face each other in the width direction of the ceramic body 110, and the third face 3 and the fourth face 4 face each other in the longitudinal direction. The fifth surface 6 and the sixth surface 6 may be defined as surfaces facing in the thickness direction.

The shape of the ceramic body 110 is not particularly limited, but may be a rectangular parallelepiped shape as shown.

One end of the plurality of internal electrodes 121 and 122 formed in the ceramic body 110 is exposed to the third surface 3 or the fourth surface 4 of the ceramic body.

The internal electrodes 121 and 122 may be paired with the first internal electrode 121 and the second internal electrode 122 having different polarities.

One end of the first internal electrode 121 may be exposed to the third surface 3, and one end of the second internal electrode 122 may be exposed to the fourth surface 4.

The other ends of the first internal electrode 121 and the second internal electrode 122 are formed at a predetermined distance from the third surface 3 or the fourth surface 4.

First and second external electrodes 131 and 132 may be formed on the third surface 3 and the fourth surface 4 of the ceramic body to be electrically connected to the internal electrodes.

The multilayer ceramic capacitor 100 according to the exemplary embodiment of the present invention is disposed inside the ceramic body 110 and is exposed to the first and second surfaces 1 and 2, but the third surface 3 is exposed. ) Or end portions of the plurality of internal electrodes 121 and 122 having one end exposed to the fourth surface 4 and the internal electrodes 121 and 122 exposed to the first surface 1 and the second surface 2. The first side margin portion 112 and the second side margin portion 113 disposed on the.

A plurality of internal electrodes 121 and 122 are formed in the ceramic body 110, and each end of the plurality of internal electrodes 121 and 122 is a first surface that is a width direction surface of the ceramic body 110. The first side margin portion 112 and the second side margin portion 113 are disposed on the exposed end portion 1 and the second surface 2.

An average thickness of the first side margin part 112 and the second side margin part 113 may be 2 μm or more and 10 μm or less.

According to the exemplary embodiment of the present invention, the ceramic body 110 may include a laminate in which a plurality of dielectric layers 111 are stacked, and first side margin parts 112 and second side margins disposed on both sides of the laminate. The unit 113 may be configured.

The plurality of dielectric layers 111 may be in a sintered state and may be integrated such that boundaries between adjacent dielectric layers cannot be identified.

The length of the ceramic body 110 corresponds to the distance from the third surface 3 to the fourth surface 4 of the ceramic body.

The length of the dielectric layer 111 forms the distance between the third face 3 and the fourth face 4 of the ceramic body.

Although not limited thereto, according to one embodiment of the present invention, the length of the ceramic body may be 400 to 1400 μm. More specifically, the length of the ceramic body may be 400 to 800 μm, or 600 to 1400 μm.

Internal electrodes 121 and 122 may be formed on the dielectric layer 111, and the internal electrodes 121 and 122 may be formed in the ceramic body with one dielectric layer interposed therebetween by sintering.

Referring to FIG. 3, a first internal electrode 121 is formed in the dielectric layer 111. The first internal electrode 121 is not entirely formed in the longitudinal direction of the dielectric layer. That is, one end of the first internal electrode 121 may be formed at a predetermined interval from the fourth surface 4 of the ceramic body, and the other end of the first internal electrode 121 may be formed up to the third surface 3. Can be exposed to the third surface (3).

An end portion of the first internal electrode exposed to the third surface 3 of the ceramic body is connected to the first external electrode 131.

In contrast to the first internal electrode, one end of the second internal electrode 122 is formed at a predetermined distance from the third surface 3, and the other end of the second internal electrode 122 is exposed to the fourth surface 4. It is connected to the second external electrode 132.

The internal electrode may be stacked in more than 400 layers to implement a high capacity multilayer ceramic capacitor, but is not limited thereto.

The dielectric layer 111 may have the same width as that of the first internal electrode 121. That is, the first internal electrode 121 may be formed as a whole in the width direction of the dielectric layer 111.

Although not limited thereto, according to an embodiment of the present invention, the width of the dielectric layer and the width of the internal electrode may be 100 to 900 μm. More specifically, the width of the dielectric layer and the width of the internal electrode may be 100 to 500㎛, or 100 to 900㎛.

As the ceramic body becomes smaller, the thickness of the side margin may affect the electrical characteristics of the multilayer ceramic capacitor. According to the exemplary embodiment of the present invention, the side margin portion may have a thickness of 10 μm or less, thereby improving characteristics of the miniaturized multilayer ceramic capacitor.

That is, since the thickness of the side margin is less than 10㎛, by ensuring the maximum overlap area of the internal electrode forming the capacitance, it is possible to implement a high capacitance and a small multilayer ceramic capacitor.

The ceramic body 110 may include an active part as a part contributing to the capacitance formation of the capacitor, and an upper and lower cover parts respectively formed at upper and lower parts of the active part as upper and lower margin parts.

The active part may be formed by repeatedly stacking the plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

The upper and lower cover parts may have the same materials and configurations as those of the dielectric layer 111 except for not including internal electrodes.

That is, the upper and lower cover parts may include a ceramic material, and for example, may include a barium titanate (BaTiO 3 ) -based ceramic material.

The upper and lower cover portions may each have a thickness of 20 μm or less, but are not necessarily limited thereto.

In one embodiment of the present invention, the internal electrode and the dielectric layer are formed by cutting at the same time, the width of the internal electrode and the width of the dielectric layer may be formed the same. More details on this will be described later.

In the present embodiment, the width of the dielectric layer is formed to be the same as that of the internal electrode, and thus the ends of the internal electrodes 121 and 122 may be exposed to the first and second surfaces in the width direction of the ceramic body 110. .

First side margin parts 112 and second side margin parts 113 may be formed on both side surfaces of the ceramic body 110 in which the ends of the internal electrodes 121 and 122 are exposed.

The thickness of the first side margin part 112 and the second side margin part 113 may be 10 μm or less. As the thickness of the first side margin part 112 and the second side margin part 113 is smaller, the overlapping area of the internal electrodes formed in the ceramic body may be relatively larger.

The thickness of the first side margin portion 112 and the second side margin portion 113 is not particularly limited as long as it has a thickness that can prevent the short of the internal electrode exposed to the side of the ceramic body 110, for example For example, the thicknesses of the first side margin portion 112 and the second side margin portion 113 may be 2 μm or more.

If the thickness of the first and second side margins is less than 2 μm, the mechanical strength against external impact may decrease. If the thickness of the first and second side margins is more than 10 μm, the internal electrodes may be relatively overlapped. As the area is reduced, it may be difficult to secure a high capacity of the multilayer ceramic capacitor.

In order to maximize the capacity of the multilayer ceramic capacitor, a method of thinning the dielectric layer, a method of high lamination of the thinned dielectric layer, a method of improving the coverage of the internal electrode, and the like have been considered.

In addition, a method of improving the overlap area of the internal electrodes forming the capacitance has been considered.

In order to increase the overlapping area of the internal electrodes, the margin area where the internal electrodes are not formed should be minimized.

In particular, as the multilayer ceramic capacitor becomes smaller, the margin area should be minimized in order to increase the overlapping area of the internal electrode.

According to this embodiment, the internal electrodes are formed in the entire width direction of the dielectric layer, and the thickness of the side margin is set to 10 µm or less, so that the overlapping area of the internal electrodes is wide.

In general, the higher the thickness of the dielectric layer, the thinner the thickness of the dielectric layer and the internal electrode. Therefore, a phenomenon in which the internal electrode is shorted may occur frequently. In addition, when the internal electrode is formed only on a portion of the dielectric layer, a step may occur due to the internal electrode, thereby degrading the acceleration life or reliability of the insulation resistance.

However, according to the present embodiment, even when the inner electrode and the dielectric layer of the thin film are formed, since the inner electrode is formed entirely in the width direction of the dielectric layer, the overlapping area of the inner electrode can be increased to increase the capacity of the multilayer ceramic capacitor.

In addition, it is possible to provide a multilayer ceramic capacitor having excellent capacitance characteristics and excellent reliability by reducing the step difference caused by the internal electrode to improve the acceleration life of the insulation resistance.

According to one embodiment of the present invention, the oxidized region 140 is disposed at an end portion of the internal electrode that is less than 10% of the total internal electrodes 121 and 122 exposed on the first and second surfaces 1 and 2. Is placed.

In general, a large number of voids are generated at an interface between the ceramic body and the side margin part, thereby reducing reliability.

In addition, due to voids generated at the interface between the ceramic body and the side margin part, electric field concentration occurs, thereby causing a problem of lowering the breakdown voltage (BDV).

In addition, the voids may cause a decrease in moisture resistance reliability due to a decrease in outer sintered densities.

In order to solve the above problem, there is a method of forming a void generated at the interface between the ceramic body and the side margin portion as an oxide film, but there is a problem that its effect is not sufficient.

That is, in order to solve the problem of lowering the breakdown voltage (BDV) due to the void and lowering the reliability of moisture resistance, the end of the internal electrode is most preferably filled with a conductive metal.

According to one embodiment of the present invention, the oxidized region 140 is disposed at an end portion of the internal electrode that is less than 10% of the total internal electrodes 121 and 122 exposed on the first and second surfaces 1 and 2. This arrangement can increase the breakdown voltage (BDV) and improve the reliability.

That is, the ratio of the internal electrodes in which the oxidized region 140 is disposed at the ends thereof relative to the entire internal electrodes 121 and 122 exposed on the first and second surfaces 1 and 2 is adjusted to less than 10%. Thus, the end portion is filled with a conductive metal while minimizing the oxidized region disposed at the end portion of the internal electrode.

As described above, the ratio of the end portions of the internal electrodes 121 and 122 exposed to the first and second surfaces 1 and 2 of the ceramic body 110 to be filled with the conductive metal is controlled to exceed 90%. As a result, a large number of voids are generated at the interface between the ceramic body and the side margins, or the breakdown voltage is lower than that of the conventional case in which the oxidized region disposed at the end of the internal electrode occupies 10% or more of the entire internal electrode. Voltage, BDV) increase effect and moisture resistance reliability improvement effect are more excellent.

When an oxidized region is disposed at an end portion of the inner electrode 10% or more of the entire inner electrode exposed to the first and second surfaces 1 and 2, the void is formed at an interface between the ceramic body and the side margin part. Compared with the conventional method in which a large number of) are generated, there is an effect of increasing breakdown voltage (BDV) and improving moisture resistance reliability, but the oxidation region 140 at the end of the internal electrode of less than 10% as in the exemplary embodiment of the present invention. The effect is insignificant compared to the case where) is arranged.

On the other hand, in order to suppress the generation of voids generated at the interface between the ceramic body and the side margins and the oxidized regions formed at the ends of the internal electrodes, it is most ideal to fill the ends of the entire internal electrodes with conductive metal. In this way, it can be said that it is very difficult to fabricate without the oxidation region at the end of the entire internal electrode.

Accordingly, the lower limit of the ratio of the internal electrode in which the oxidized region is disposed at an end thereof compared to the entire internal electrode exposed on the first surface 1 and the second surface 2 of the ceramic body 110 is ideally 0%. However, in one embodiment of the present invention, 0% is excluded due to the process limitations.

The conductive metal is the same as the conductive metal included in the internal electrode, and may be, for example, nickel (Ni), but is not limited thereto.

According to an embodiment of the present invention, an end of the internal electrode of less than 10% of the total internal electrodes 121 and 122 exposed on the first surface 1 and the second surface 2 of the ceramic body 110. In the method of controlling the oxidation region 140 to be disposed in the first and second side margin parts 112 and 113, the adhesive-coated side ceramic sheet is transferred to the side of the ceramic body in the process of forming the baking process. By increasing the adhesive force at, it can be controlled by suppressing the occurrence of voids or oxidized regions at the interface of the ceramic body and the side margins and the ends of the exposed internal electrodes.

Details thereof will be described later.

Referring to FIG. 4, the first and second side margin parts 112 and 113 are formed of the first body 112a and 113a and the ceramic body 110 adjacent to outer surfaces of the side margin parts 112 and 113. It is divided into second regions 112b and 113b adjacent to the internal electrodes 121 and 122 exposed on the first surface 1 and the second surface 2 and includes magnesium (eg, magnesium) included in the second regions 112b and 113b. The content of Mg) may be greater than the content of magnesium (Mg) included in the first regions 112a and 113a.

The first and second side margin parts 112 and 113 disposed on the side of the ceramic body 110 are divided into two regions having different compositions, and include magnesium (eg, magnesium) included in the second regions 112b and 113b. The content of Mg) may be adjusted to be higher than that of magnesium (Mg) included in the first regions 112a and 113a, thereby increasing breakdown voltage (BDV) and improving reliability.

Specifically, by controlling the content of magnesium (Mg) included in the second regions 112b and 113b of the side margin portion adjacent to the ceramic body, the length of the end oxide layer of the inner electrode exposed to the side in the width direction of the ceramic body may be controlled. In addition, this may increase breakdown voltage (BDV) and improve moisture resistance.

According to one embodiment of the present invention, by adjusting the content of magnesium (Mg) contained in the second regions 112b and 113b of the side margin portion adjacent to the ceramic body, voids are formed at the interface between the ceramic body and the side margin portion. ) Can be suppressed.

As described above, when the void generation is suppressed at the interface where the ceramic body and the side margin contact, the electric field concentration can be alleviated due to the decrease in the number of voids in which the greatest electric field concentration occurs. Breakdown voltage (BDV) may increase and short failure may decrease.

In addition, the first and second side margin parts 112 and 113 disposed on the side of the ceramic body 110 are divided into two regions having different compositions, and the magnesium (Mg) content of each region is included. By making it different, the density of the 1st and 2nd side margin parts 112 and 113 can be improved and a moisture resistance characteristic can be improved.

Specifically, the magnesium (Mg) content of the second regions 112b and 113b of the first and second side margin portions 112 and 113 includes the magnesium (Mg) content of the first regions 112a and 113a of the outer side. By adjusting the Mg content to be greater than the Mg content, the moisture resistance characteristics may be improved by improving the density of the first regions 112a and 113a of the margin parts 112 and 113.

In particular, the amount of magnesium (Mg) contained in the first regions 112a and 113a of the first and second side margin portions 112 and 113 adjacent to the outer surfaces of the side margin portions 112 and 113 is reduced. The adhesion between the first external electrode 131 and the second external electrode 132 may be improved.

The method of controlling the amount of magnesium (Mg) included in the second regions 112b and 113b to be higher than the content of magnesium (Mg) included in the first regions 112a and 113a may be performed in the process of manufacturing a multilayer ceramic capacitor. The dielectric composition for forming the body and the dielectric composition for forming the first and second side margins may be different from each other.

That is, unlike the dielectric composition for forming the ceramic body, when the content of magnesium (Mg) is increased in the dielectric composition for forming the first and second side margins, and the content of magnesium (Mg) is controlled by diffusion in the sintering and sintering processes. The amount of magnesium (Mg) included in the second regions 112b and 113b may be adjusted to be higher than that of magnesium (Mg) included in the first regions 112a and 113a.

Accordingly, the electric field concentrated at the end of the internal electrode can be alleviated, and the reliability of the multilayer ceramic capacitor can be improved by preventing insulation breakdown, which is one of the main defects of the multilayer ceramic capacitor.

According to an embodiment of the present invention, the content of magnesium (Mg) in the second regions 112b and 113b may be 10 moles or more and 30 moles or less than titanium (Ti) included in the first and second side margin parts. .

The breakdown voltage is controlled by adjusting the content of magnesium (Mg) in the second regions 112b and 113b to be 10 mol or more and 30 mol or less with respect to titanium (Ti) included in the first and second side margins. , BDV), and can improve the reliability of moisture resistance.

When the content of magnesium (Mg) in the second regions 112b and 113b is less than 10 moles compared to titanium (Ti) included in the first and second side margin portions, voids at the interface where the ceramic body and the side margin portions contact each other. (void) The suppression of generation is not sufficient, the breakdown voltage (BV) may be lowered, and short failure may increase.

On the other hand, when the content of magnesium (Mg) in the second regions (112b, 113b) exceeds 30 moles compared to titanium (Ti) included in the first and second side margin portion, reliability and dielectric breakdown due to a decrease in sintering properties Uneven distribution of voltage (Breakdown Voltage, BDV) may occur.

According to one embodiment of the present invention, the thickness of the dielectric layer 111 is 0.4 μm or less, and the thickness of the internal electrodes 121 and 122 is 0.4 μm or less.

As in the exemplary embodiment of the present invention, the thickness of the dielectric layer 111 is 0.4 μm or less, and the thickness of the internal electrodes 121 and 122 is 0.4 μm or less. The issue of reliability due to voids occurring at the interface of the margin and oxidation regions formed at the ends of the internal electrodes is a very important issue.

That is, in the case of the conventional multilayer ceramic capacitor, the reliability of the multilayer ceramic capacitor is high even if the density of the oxidized region formed at the end of the internal electrode exposed in the width direction of the ceramic body or the ratio of the internal electrode in which the oxidized region is formed to the total internal electrode is not controlled. There was no problem.

However, in a product to which a dielectric layer and an internal electrode of a thin film are applied as in an exemplary embodiment of the present invention, voids generated at an interface between the ceramic body and the side margin parts and internal electrodes exposed in the width direction of the ceramic body are exposed. In order to prevent BDV and deterioration of reliability due to the density of the oxidized region formed at the end of the oxidized region, the oxidized region should be adjusted so as not to be formed at the end of the internal electrode exposed in the width direction of the ceramic body.

That is, according to the exemplary embodiment of the present invention, the internal electrode having the oxidation region 140 disposed at an end thereof compared with the entire internal electrodes 121 and 122 exposed on the first and second surfaces 1 and 2. By controlling the ratio to less than 10%, even if the thickness of the dielectric layer 111 and the first and second internal electrodes 121 and 122 is 0.4 μm or less, the breakdown voltage (BDV) is increased and moisture resistance is increased. Reliability can be improved.

However, the thin film does not mean that the thickness of the dielectric layer 111 and the first and second internal electrodes 121 and 122 is 0.4 μm or less, and includes a dielectric layer and an internal electrode having a thickness thinner than that of a conventional product. It can be understood as a concept.

Meanwhile, the widths of the first regions 112a and 113a may be 12 μm or less, and the widths of the second regions 112b and 113b may be 3 μm or less, but are not limited thereto.

Referring to FIG. 4, an internal electrode disposed at an outermost side of the plurality of internal electrodes 121 and 122 compared to a thickness t c1 of the first or second side margin area that is in contact with an end of the internal electrode disposed at the center. The ratio of the thickness tc2 of the first or second side margin region to be in contact with the terminal may be 1.0 or less.

The thickness of the first or second side margin portion region in contact with the end of the inner electrode disposed at the outermost side compared to the thickness tc1 of the first or second side margin portion region in contact with the end of the internal electrode disposed in the center portion ( The lower limit of the ratio of tc2) is not particularly limited, but is preferably 0.9 or more.

According to the exemplary embodiment of the present invention, since the first or second side margin part is formed by attaching the ceramic green sheet to the side of the ceramic body, unlike the related art, the thickness of each of the first or second side margin parts is constant.

That is, since the side margin part was conventionally formed by coating or printing a ceramic slurry, the variation of the thickness by the position of the side margin part was severe.

In detail, in the related art, the thickness of the first or second side margin portion in contact with the end of the internal electrode disposed in the center portion of the ceramic body is thicker than the thickness of the other region.

For example, in the related art, the thickness of the first or second side margin part area in contact with the end of the internal electrode disposed in the center portion of the first or second side margin part area in contact with the end of the internal electrode disposed in the outermost part. The ratio of thickness is less than 0.9, and the deviation is large.

As described above, in the case of a large variation in the thickness of each side margin portion, the portion of the side margin portion of the same size multilayer ceramic capacitor occupies a large amount, thus making it difficult to secure a large capacity.

On the other hand, in one embodiment of the present invention, the average thickness of the first and second side margin parts 112 and 113 is 2 μm or more and 10 μm or less, and the inside of the plurality of internal electrodes 121 and 122 is disposed in the center portion. The ratio of the thickness tc2 of the first or second side margin part region in contact with the end of the electrode to the thickness tc2 of the first or second side margin part region in contact with the end of the inner electrode disposed at the outermost part is Since it is 0.9 or more and 1.0 or less, the thickness of a side margin part is thin and there is little variation in thickness, and the size of a capacitance formation part can be ensured large.

In one embodiment of the present invention, since the ceramic green sheet is formed by attaching the ceramic green sheet to the side of the ceramic body, the thickness of each position of the first or second side margin is constant.

As a result, it is possible to implement a high capacity multilayer ceramic capacitor.

Meanwhile, referring to FIG. 4, the ceramic body 110 is compared with the thickness t c1 of the region of the first or second side margin part that is in contact with the end of the internal electrode disposed in the center of the plurality of internal electrodes 121 and 122. The ratio of the thickness tc3 of the first or second side margin region to be in contact with the edge of the) may be 1.0 or less.

Thickness (tc3) of the first or second side margin portion region in contact with the edge of the ceramic body 110 compared to the thickness (tc1) of the first or second side margin portion region in contact with the end of the internal electrode disposed in the center portion It is preferable that the lower limit of the ratio of) is 0.9 or more.

Due to the above features, the thickness variation of the region of the side margin is small, so that the size of the capacitance forming unit can be largely secured, thereby enabling the implementation of a high capacitance multilayer ceramic capacitor.

5A to 5F are cross-sectional views and perspective views schematically illustrating a method of manufacturing a multilayer ceramic capacitor according to another embodiment of the present invention.

According to another embodiment of the present invention, a first ceramic green sheet in which a plurality of first internal electrode patterns are formed at predetermined intervals and a second ceramic green sheet in which a plurality of second internal electrode patterns are formed at predetermined intervals are provided. Stacking the first ceramic green sheet and the second ceramic green sheet so that the first internal electrode pattern and the second internal electrode pattern intersect to form a ceramic green sheet stacking body; Cutting the ceramic green sheet laminate body such that ends of the pattern and the second internal electrode pattern have side surfaces exposed in the width direction, and a first side of the first internal electrode pattern and the second internal electrode pattern exposed sides Forming a side margin portion and a second side margin portion and baking the cut laminated body to include a dielectric layer and first and second internal electrodes. And preparing a mix body, wherein the first and second side margin parts are divided into a first area adjacent to an outer surface of the side margin part and a second area adjacent to the first and second internal electrodes. The content of magnesium (Mg) contained therein provides a method of manufacturing a multilayer ceramic capacitor more than the content of magnesium (Mg) included in the first region.

Hereinafter, the manufacturing method of the multilayer ceramic capacitor which concerns on other embodiment of this invention is demonstrated.

As shown in FIG. 5A, a plurality of stripe-type first internal electrode patterns 221 are formed on the ceramic green sheet 211 at predetermined intervals. The plurality of striped first internal electrode patterns 221 may be formed in parallel to each other.

The ceramic green sheet 211 may be formed of a ceramic paste including a ceramic powder, an organic solvent, and an organic binder.

The ceramic powder is a material having a high dielectric constant, but is not limited thereto, and may be a barium titanate (BaTiO 3 ) -based material, a lead composite perovskite-based material, or a strontium titanate (SrTiO 3 ) -based material, and the like. Barium (BaTiO 3 ) powder may be used. When the ceramic green sheet 211 is fired, the ceramic green sheet 211 becomes a dielectric layer 111 constituting the ceramic body 110.

The stripe first internal electrode pattern 221 may be formed by an internal electrode paste including a conductive metal. The conductive metal is not limited thereto, but may be nickel (Ni), copper (Cu), palladium (Pd), or an alloy thereof.

The method of forming the stripe-type first internal electrode pattern 221 on the ceramic green sheet 211 is not particularly limited, but may be formed by, for example, a printing method such as a screen printing method or a gravure printing method.

Although not illustrated, a plurality of stripe-type second internal electrode patterns 222 may be formed on the ceramic green sheet 211 at predetermined intervals.

Hereinafter, the ceramic green sheet on which the first internal electrode pattern 221 is formed may be referred to as a first ceramic green sheet, and the ceramic green sheet on which the second internal electrode pattern 222 is formed may be referred to as a second ceramic green sheet. have.

Next, as illustrated in FIG. 5B, the first and second ceramic green sheets may be alternately stacked so that the striped first internal electrode patterns 221 and the striped second internal electrode patterns 222 are alternately stacked. have.

Subsequently, the stripe first internal electrode pattern 221 may be a first internal electrode 121, and the stripe second internal electrode pattern 222 may be a second internal electrode 122.

According to another embodiment of the present invention, the thickness td of the first and second ceramic green sheets is 0.6 μm or less, and the thickness te of the first and second internal electrode patterns is 0.5 μm or less.

Since the present invention is characterized by an ultra-small high capacity multilayer ceramic capacitor having a thin film having a dielectric layer of 0.4 mu m or less and an internal electrode having a thickness of 0.4 mu m or less, the thickness td of the first and second ceramic green sheets is 0.6. The thickness te of the first and second internal electrode patterns may be 0.5 μm or less.

FIG. 5C is a cross-sectional view illustrating a ceramic green sheet stacking body 220 in which first and second ceramic green sheets are stacked according to an embodiment of the present invention, and FIG. 5D is a view showing the first and second ceramic green sheets stacked. It is a perspective view which shows the ceramic green sheet laminated body 220. FIG.

5C and 5D, a first ceramic green sheet on which a plurality of parallel striped first internal electrode patterns 221 are printed, and a plurality of parallel striped second internal electrode patterns 222 are printed on the first ceramic green sheet. 2 Ceramic green sheets are stacked alternately.

More specifically, the stack is formed such that a gap between the center portion of the stripe-type first internal electrode pattern 221 printed on the first ceramic green sheet and the stripe-type second internal electrode pattern 222 printed on the second ceramic green sheet overlap. Can be.

Next, as illustrated in FIG. 5D, the ceramic green sheet laminate body 220 may be cut to cross the plurality of stripe-type first internal electrode patterns 221 and the stripe-type second internal electrode patterns 222. Can be. That is, the ceramic green sheet laminated body 210 may be a laminated body 210 cut along C1-C1 and C2-C2 cutting lines that are perpendicular to each other.

More specifically, the stripe-type first internal electrode pattern 221 and the stripe-type second internal electrode pattern 222 may be cut in a length direction and divided into a plurality of internal electrodes having a predetermined width. At this time, the stacked ceramic green sheets are also cut together with the internal electrode patterns. Accordingly, the dielectric layer may be formed to have the same width as that of the internal electrode.

It can also be cut to fit individual ceramic body sizes along the C2-C2 cutting line. That is, before forming the first side margin portion and the second side margin portion, the rod-shaped laminate may be cut into individual ceramic body sizes along the C2-C2 cutting line to form a plurality of laminated bodies 210.

That is, the bar stack may be cut such that a predetermined gap formed between the central portion of the overlapping first internal electrode and the second internal electrode is cut by the same cutting line. Accordingly, one ends of the first internal electrode and the second internal electrode may be alternately exposed on the cut surface.

Thereafter, a first side margin part and a second side margin part may be formed on the first and second side surfaces of the stack body 210.

Next, as shown in FIG. 5E, a first side margin part 212 and a second side margin part (not shown) may be formed on each of the first and second side surfaces of the laminated body 210.

In detail, in the method of forming the first side margin part 212, a side ceramic greenast 212 coated with an adhesive (not shown) is disposed on the punching elastic material 300 made of rubber.

Next, the laminated body 210 is rotated 90 degrees such that the first side of the laminated body 210 faces the ceramic greenast 212 coated with the adhesive (not shown), and then the laminated body 210 is pressed and adhered to the ceramic grist 212 for the side coated with the adhesive (not shown).

When the laminated body 210 is pressed in close contact with the side ceramic green sheet 212 coated with the adhesive (not shown) to transfer the side ceramic green sheet 212 to the laminated body 210, the rubber Due to the punching elastic material 300 of the material, the side ceramic green sheet 212 may be formed to the side edge portion of the laminated body 210, and the remaining portion may be cut.

In FIG. 5F, the side ceramic green sheet 212 is formed to the side edge portion of the laminated body 210.

After that, by rotating the stacking body 210, a second side margin may be formed on the second side of the stacking body 210.

Next, the ceramic body including the dielectric layer and the first and second internal electrodes may be formed by calcining and firing the laminated body having the first and second side margins formed on both side surfaces of the multilayer body 210.

According to the exemplary embodiment of the present invention, since the adhesive is applied on the upper side of the ceramic green sheet 212, the ceramic green sheet 212 for the side surface is laminated at the low temperature and the low pressure condition unlike the conventional art. Can be transferred to the side.

As a result, damage to the laminated body 210 may be minimized, thereby preventing deterioration of electrical characteristics of the multilayer ceramic capacitor after firing and improving reliability.

In addition, by transferring the adhesive-coated side ceramic green sheet 212 to the side of the laminated body 210 and pressurized in the firing process, it is possible to increase the adhesion between the laminated body and the ceramic ceramic sheet for the side.

For this reason, voids are suppressed at the interface between the ceramic body and the side margin part after firing, and the internal electrodes 121, exposed on the first and second surfaces of the ceramic body, as in the exemplary embodiment of the present invention, are exposed. 122) The generation of the oxidized region can be suppressed to less than 10% of the ratio of the internal electrode in which the oxidized region 140 is disposed at the end thereof.

Subsequently, an external electrode may be formed on the third side of the ceramic body to which the first internal electrode is exposed and the fourth side of the ceramic body to which the second internal electrode is exposed.

According to another embodiment of the present invention, the side ceramic green sheet is thin and the thickness variation is small, so that the size of the capacitance forming portion can be largely secured.

Specifically, the average thickness of the first and second side margin parts 112 and 113 after firing is 2 μm or more and 10 μm or less, and the variation in thickness of each position is small, thereby ensuring a large size of the capacitance forming part.

As a result, it is possible to implement a high capacity multilayer ceramic capacitor.

In addition, the description of the same parts as the features in the embodiment of the present invention described above will be omitted here to avoid duplication.

Hereinafter, the present invention will be described in more detail with reference to experimental examples. However, the scope of the present invention is not limited by the experimental examples.

Experiment example

According to one embodiment of the present invention, a comparative example of forming a conventional side margin portion and an example in which a side margin portion is formed so as to suppress an oxidized region formed at an end portion of an internal electrode as in the present invention are provided.

The ceramic green sheet laminate body is formed to attach the ceramic green sheet for the side to form the side margin by attaching the ceramic green sheet for the side to the electrode exposed portion of the green chip having no margin because the internal electrode is exposed in the width direction. It was.

The ceramic green sheet for side formation is attached to both sides of the ceramic green sheet laminated body by applying a constant temperature and pressure under the condition of minimizing chip deformation.The size of 0603 (width x length x height: 0.6mm x 0.3mm x 0.3mm) A multilayer ceramic capacitor green chip was produced.

The laminated ceramic capacitor specimens thus fabricated have electrical characteristics such as poor appearance, insulation resistance and moisture resistance after firing under conditions of 400 ° C. or less, a calcination process under nitrogen atmosphere, and a firing temperature of 1200 ° C. or less and hydrogen concentration of 0.5% H 2 or less. It confirmed comprehensively.

6 is a graph comparing breakdown voltage (BDV) according to an embodiment of the present invention and a comparative example.

In FIG. 6, the embodiment is a case in which the ratio of the internal electrodes in which the oxidized regions are disposed at the ends of the internal electrodes exposed to the first and second surfaces of the ceramic body is less than 10%. The conventional multilayer ceramic capacitor structure has a ratio of 80% or more of the internal electrodes in which the oxidized regions are disposed at the ends thereof compared to the entire internal electrodes exposed on the first and second surfaces of the ceramic body, and Comparative Example 2 is a ceramic body. This is the case where the void ratio formed at the end of the entire internal electrodes exposed to the first and second surfaces of the substrate is 80% or more.

In the case of the embodiment it can be seen that the breakdown voltage (Breakdown Voltage, BDV) increased compared to the comparative examples 1 and 2 of the conventional multilayer ceramic capacitor.

In Comparative Example 1, the breakdown voltage (BDV) is higher than that of Comparative Example 2, but since it is lower than that of the present invention, it is exposed to the first and second surfaces of the ceramic body as in the exemplary embodiment of the present invention. It is preferable to adjust the ratio of the internal electrodes in which the oxidized region is disposed at the ends thereof to less than 10% of the entire internal electrodes.

The present invention is not limited by the above-described embodiment and the accompanying drawings, but is intended to be limited by the appended claims. Accordingly, various forms of substitution, modification, and alteration may be made by those skilled in the art without departing from the technical spirit of the present invention described in the claims, which are also within the scope of the present invention. something to do.

110: ceramic body 111: dielectric layer
112, 113: first and second side margins
121 and 122: first and second internal electrodes 131 and 132: first and second external electrodes
140: oxidation zone

Claims (14)

  1. A first surface and a second surface facing each other, the third and fourth surfaces connecting the first and second surfaces, and the first to fourth surfaces, and facing each other, A ceramic body comprising a fifth side and a sixth side;
    A plurality of internal electrodes disposed in the ceramic body and exposed to the first and second surfaces, the one ends of which are exposed to the third or fourth surfaces; And
    And first and second side margin parts disposed on ends of the internal electrodes exposed to the first and second surfaces.
    The multilayer ceramic capacitor having an oxide region disposed at an end portion of an internal electrode of less than 10% of the entire internal electrode exposed on the first and second surfaces.
  2. The method of claim 1,
    The first and second side margin parts may be divided into a first area adjacent to an outer surface of the side margin part and a second area adjacent to an internal electrode exposed on the first and second surfaces, and include magnesium (eg, Mg) content of the multilayer ceramic capacitor is more than the content of magnesium (Mg) included in the first region.
  3. The method of claim 2,
    The multilayer ceramic capacitor having a content of magnesium (Mg) in the second region is 10 mol or more and 30 mol or less with respect to titanium (Ti) included in the first and second side margin parts.
  4. The method of claim 1,
    The first or second side margin area that is in contact with the end of the internal electrode disposed at the outermost side compared to the thickness of the first or second side margin area which is in contact with the end of the internal electrode disposed in the center of the plurality of internal electrodes The ratio of the thickness of the multilayer ceramic capacitor is 0.9 or more and 1.0 or less.
  5. The method of claim 1,
    The ratio of the thickness of the first or second side margin portion region in contact with the edge of the ceramic body to the thickness of the first or second side margin portion region in contact with the end of the internal electrode disposed in the center of the plurality of internal electrodes The multilayer ceramic capacitor which is 0.9 or more and 1.0 or less.
  6. The method of claim 1,
    The thickness of the dielectric layer is 0.4 ㎛ or less, the thickness of the internal electrode is 0.4 ㎛ or less multilayer ceramic capacitor.
  7. The method of claim 1,
    The multilayer ceramic capacitor having an average thickness of 2 μm or more and 10 μm or less in the first side margin part and the second side margin part.
  8. Providing a first ceramic green sheet in which a plurality of first internal electrode patterns are formed at predetermined intervals and a second ceramic green sheet in which a plurality of second internal electrode patterns are formed at predetermined intervals;
    Stacking the first ceramic green sheet and the second ceramic green sheet to cross the first internal electrode pattern and the second internal electrode pattern to form a ceramic green sheet stacking body;
    Cutting the ceramic green sheet laminate body such that ends of the first internal electrode pattern and the second internal electrode pattern have side surfaces exposed in the width direction;
    Forming a first side margin part and a second side margin part on a side surface at which ends of the first internal electrode pattern and the second internal electrode pattern are exposed; And
    Firing the cut laminate body to prepare a ceramic body including a dielectric layer and an internal electrode;
    And an oxide region is disposed at an end portion of the internal electrode, which is less than 10% of the entire internal electrode exposed on the side of the ceramic body.
  9. The method of claim 8,
    The first and second side margin parts are divided into a first area adjacent to an outer surface of the side margin part and a second area adjacent to the first and second internal electrodes, and the content of magnesium (Mg) included in the second area is The manufacturing method of the multilayer ceramic capacitor more than the content of magnesium (Mg) contained in the first region.
  10. The method of claim 9,
    The method of manufacturing a multilayer ceramic capacitor having a content of magnesium (Mg) in the second region is 10 mol or more and 30 mol or less with respect to titanium (Ti) included in the first and second side margin parts.
  11. The method of claim 8,
    The thickness of the first and second ceramic green sheets is 0.6 μm or less, and the thickness of the first and second internal electrode patterns is 0.5 μm or less.
  12. The method of claim 8,
    The thickness of the first or second side margin area contacting the end of the inner electrode disposed at the outermost side compared to the thickness of the first or second side margin area contacting the end of the internal electrode disposed at the center of the internal electrodes The ratio of the manufacturing method of the multilayer ceramic capacitor is 0.9 or more and 1.0 or less.
  13. The method of claim 8,
    The thickness of the first or second side margin part in contact with the edge of the ceramic green sheet stacking body compared to the thickness of the first or second side margin part in contact with the end of the internal electrode disposed in the center of the internal electrodes. The manufacturing method of the multilayer ceramic capacitor whose ratio is 0.9 or more and 1.0 or less.
  14. The method of claim 8,
    The first side margin portion and the second side margin portion manufacturing method of the multilayer ceramic capacitor having an average thickness of 2㎛ 10㎛.
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