KR20190120061A - Control method of gate valve - Google Patents

Control method of gate valve Download PDF

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Publication number
KR20190120061A
KR20190120061A KR1020190029730A KR20190029730A KR20190120061A KR 20190120061 A KR20190120061 A KR 20190120061A KR 1020190029730 A KR1020190029730 A KR 1020190029730A KR 20190029730 A KR20190029730 A KR 20190029730A KR 20190120061 A KR20190120061 A KR 20190120061A
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South Korea
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valve body
valve
chamber
opening
gate valve
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KR1020190029730A
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Korean (ko)
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KR102217925B1 (en
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도모히로 사와하타
가츠유키 사이토
히데아키 나가이
미츠히로 이케다
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가부시키가이샤 브이텍스
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K11/00—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves
    • F16K11/10—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with two or more closure members not moving as a unit
    • F16K11/14—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with two or more closure members not moving as a unit operated by one actuating member, e.g. a handle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K11/00—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves
    • F16K11/10—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with two or more closure members not moving as a unit
    • F16K11/20—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with two or more closure members not moving as a unit operated by separate actuating members
    • F16K11/22—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with two or more closure members not moving as a unit operated by separate actuating members with an actuating member for each valve, e.g. interconnected to form multiple-way valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K13/00—Other constructional types of cut-off apparatus; Arrangements for cutting-off
    • F16K13/08—Arrangements for cutting-off not used
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
    • F16K3/02—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
    • F16K3/0254—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor being operated by particular means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
    • F16K3/02—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
    • F16K3/16—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together
    • F16K3/18—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together by movement of the closure members
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K47/00—Means in valves for absorbing fluid energy
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D19/00—Control of mechanical oscillations, e.g. of amplitude, of frequency, of phase
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Details Of Valves (AREA)
  • Sliding Valves (AREA)

Abstract

Provided is a control method of a gate valve, which implements opening operation in a short time while suppressing vibration of a valve body. The control method of a gate valve, which is provided on an opening of a chamber, comprises: a valve body opening and closing so as to block the opening; a valve sheet provided on an edge of the opening so that the valve body is pushed; and a sealing material sealing a space between the valve body and the valve sheet, thereby temporarily stopping the valve body as much as predetermined time with respect to a position directly before or directly after the sealing material opening the valve body to be crushed is detached when opening the valve body from a closing position that the valve body is pushed by the valve sheet by crushing the sealing material.

Description

게이트 밸브의 제어 방법{CONTROL METHOD OF GATE VALVE}CONTROL METHOD OF GATE VALVE

본 발명은, 진공 챔버의 개구부에 마련된 게이트 밸브를 열 때의 진동을 억제하는 방법에 관한 것이다.TECHNICAL FIELD This invention relates to the method of suppressing the vibration at the time of opening the gate valve provided in the opening part of a vacuum chamber.

반도체 소자, 태양 전지, 액정 등의 제조에 있어서의 각종 프로세스에서는, 웨이퍼(실리콘 등의 반도체 기판)나 유리 기판 등에 진공 증착, 스퍼터링, CVD(화학 기상 성장) 등에 의해 박막을 형성하는 수단이나, 박막으로부터 불필요 부분을 제거하는 에칭 수단 등이 있다.In various processes in the manufacture of semiconductor devices, solar cells, liquid crystals, and the like, means for forming a thin film by vacuum deposition, sputtering, CVD (chemical vapor deposition) or the like on a wafer (a semiconductor substrate such as silicon) or a glass substrate, or a thin film Etching means for removing an unnecessary portion from the same.

예를 들면, 스퍼터링 장치에서는, 기판이 배치된 진공 챔버 내에 아르곤(Ar) 등의 불활성 가스를 도입하고, 소정의 진공도로 고주파 전압을 인가하여 플라즈마를 발생시키고, 재료인 타깃에 충돌시킴으로써, 방출된 재료를 당해 기판에 부착시켜 박막을 형성한다.For example, in a sputtering apparatus, an inert gas such as argon (Ar) is introduced into a vacuum chamber in which a substrate is placed, and a high frequency voltage is applied at a predetermined vacuum to generate a plasma, and the target is made of a material. The material is attached to the substrate to form a thin film.

또한, 드라이 에칭 장치에서는, 박막이 형성된 기판에 대하여, 박막의 필요 부분을 레지스트로 마스크한 다음에, 진공 챔버 내에서 플라즈마를 발생시켜 불필요 부분을 제거하고, 불필요해진 레지스트를 제거한다.In the dry etching apparatus, a necessary portion of the thin film is masked with a resist on the substrate on which the thin film is formed, and then plasma is generated in the vacuum chamber to remove the unnecessary portion, and the unnecessary resist is removed.

반도체 제조 장치에서는, 복수의 챔버를 구비하고, 프로세스마다 처리를 행하는 챔버에 기판을 반송한다. 챔버 사이는 게이트 밸브로 구분되고, 기판을 반송할 때에 게이트 밸브를 개폐한다. 또한, 특허문헌 1에 기재되어 있는 바와 같이, 2개의 진공 공간에 배치되는 진공 밸브의 제어 방법의 발명도 개시되어 있다.In a semiconductor manufacturing apparatus, a plurality of chambers are provided, and a substrate is conveyed to a chamber which performs processing for each process. The chambers are divided by gate valves, and the gate valves are opened and closed when conveying the substrate. Moreover, as described in patent document 1, invention of the control method of the vacuum valve arrange | positioned at two vacuum spaces is also disclosed.

기판을 반송할 때에 게이트 밸브의 개폐에 수반되어 진동 등이 있으면, 챔버내에서 파티클이 발생하는 경우가 있고, 그에 의해 기판이 오염될 우려가 있다. 또한, 특허문헌 2에 기재되어 있는 바와 같이, 처리 챔버로의 진동을 억제하여 처리 챔버 내에서 파티클을 발생시키지 않는 게이트 밸브의 발명도 개시되어 있다.If vibration or the like is accompanied by opening and closing of the gate valve when conveying the substrate, particles may be generated in the chamber, which may contaminate the substrate. Moreover, as described in patent document 2, invention of the gate valve which suppresses the vibration to a process chamber and does not generate | occur | produce particle in a process chamber is also disclosed.

일본공개특허 특개2006-52846호 공보Japanese Laid-Open Patent Publication No. 2006-52846 일본등록특허 제3433207호 공보Japanese Patent No. 3433207

특허문헌 1에 기재된 발명은, 진공 밸브의 유연한 시일의 열화를 감소시키면서, 폐색 상태에 있어서 양호한 시일링을 달성하는 것을 목적으로 하고 있지만, 진공 밸브를 열 때에 파티클이 발생할 가능성이 있다.Although the invention of patent document 1 aims at achieving favorable sealing in a closed state, reducing the deterioration of the flexible seal of a vacuum valve, there exists a possibility that a particle may generate | occur | produce when opening a vacuum valve.

또한, 특허문헌 2에 기재된 발명은, 게이트 밸브를 밀봉하는 밸브체를 지지하고 있는 밸브 로드를 틸팅시킴으로써, 밸브체를 시일하거나 떼어내지만, 눌러 찌부러뜨려진 시일 부재를 단시간에 떼어내려고 하면 밸브체가 진동할 가능성이 있다.In addition, the invention described in Patent Literature 2 seals or removes the valve body by tilting the valve rod supporting the valve body for sealing the gate valve. There is a possibility of vibration.

그래서, 본 발명은, 밸브체의 진동을 억제하면서 단시간에 개방 동작시키는 게이트 밸브의 제어 방법을 제공하는 것을 목적으로 한다.Then, an object of this invention is to provide the control method of the gate valve which opens and operates for a short time, suppressing the vibration of a valve body.

상기의 과제를 해결하기 위하여, 본 발명은, 챔버의 개구부에 마련한 게이트 밸브의 제어 방법으로서, 상기 개구부를 막도록 개폐하는 밸브체와, 상기 개구부의 가장자리에 마련되어 상기 밸브체가 눌리는 밸브 시트와, 상기 밸브체와 상기 밸브 시트의 사이를 밀봉하는 시일재를 가지고, 상기 시일재를 찌부러뜨려 상기 밸브체가 상기 밸브 시트에 눌린 폐쇄 위치로부터 상기 밸브체를 개방 동작시킬 때에, 상기 밸브체를 열어 찌부러뜨려져 있던 상기 시일재가 떼어지기 직전 또는 직후의 위치에 있어서 상기 밸브체의 진동이 억제되도록 상기 밸브체를 일시 정지시키는 것을 특징으로 한다.MEANS TO SOLVE THE PROBLEM In order to solve the said subject, this invention is a control method of the gate valve provided in the opening part of a chamber, The valve body which opens and closes so that the said opening part may be blocked, The valve seat provided in the edge of the said opening part, and the said valve body may be pressed, The sealing member which seals between a valve body and the said valve seat has a sealing material, When the said sealing material is crushed and the said valve body opens the valve body from the closed position pressed by the said valve seat, the said valve body is opened and crushed, The said valve body is paused so that the vibration of the said valve body can be suppressed in the position immediately before or immediately after peeling the said sealing material.

또한, 상기 게이트 밸브의 제어 방법은, 상기 밸브체를 상기 일시 정지 후, 개방 위치에서 정지할 때까지의 동안에 추가로 일시 정지시키는 것을 특징으로 한다.The control method of the gate valve is further characterized in that the valve body is further paused until the valve body stops at the open position after the temporary stop.

또한, 상기 게이트 밸브의 제어 방법에 있어서, 상기 게이트 밸브는, 하나의 챔버와, 그것과 기압이 상이한 다른 챔버와의 사이에 개재되고, 상기 하나의 챔버와 상기 다른 챔버의 기압차를 조정하고 나서 상기 밸브체를 여는 것을 특징으로 한다.Moreover, in the control method of the said gate valve, the said gate valve is interposed between one chamber and the other chamber from which air pressure differs, and after adjusting the atmospheric pressure difference of the said one chamber and the said other chamber, The valve body is opened.

또한, 본 발명인 게이트 밸브는, 상기 제어 방법에 의해 상기 밸브체를 여는 것을 특징으로 한다.Moreover, the gate valve of this invention opens the said valve body by the said control method, It is characterized by the above-mentioned.

본 발명에 의하면, 게이트 밸브의 밸브체를 단시간에 개방 동작시켜도, 시일재의 박리에 수반되는 밸브체 자체 및 게이트 밸브 전체의 진동을 최소한으로 억제하고, 챔버 내에 파티클이 발생하여 기판이 오염되는 것을 방지할 수 있다.According to the present invention, even when the valve body of the gate valve is opened for a short time, the vibration of the valve body itself and the entire gate valve accompanying peeling of the sealing material is minimized, and particles are generated in the chamber to prevent contamination of the substrate. can do.

도 1은, 본 발명인 게이트 밸브가 설치되는 반도체 제조 장치의 개관을 나타내는 사시도이다.
도 2는, 본 발명인 게이트 밸브의 개관을 나타내는 사시도이다.
도 3은, 본 발명인 게이트 밸브의 구조를 나타내는 단면도이다.
도 4는, 본 발명인 게이트 밸브의 동작을 설명하는 단면도이다.
도 5는, 본 발명인 게이트 밸브의 제어 방법에 있어서 밸브체를 일시 정지하지 않았을 때의 결과를 나타내는 그래프이다.
도 6은, 본 발명인 게이트 밸브의 제어 방법에 있어서 밸브체를 일시 정지했을 때의 결과를 나타내는 그래프이다.
도 7은, 본 발명인 게이트 밸브의 제어 방법에 있어서 밸브체의 일시 정지를 2회 했을 때의 결과를 나타내는 그래프이다.
도 8은, 본 발명인 게이트 밸브를 2개의 챔버 사이에 배치했을 때의 제어를 설명하는 단면도이다.1 is a perspective view showing an overview of a semiconductor manufacturing apparatus provided with a gate valve according to the present invention.
2 is a perspective view showing an overview of a gate valve of the present invention.
3 is a cross-sectional view showing the structure of a gate valve of the present invention.
4 is a cross-sectional view illustrating the operation of the gate valve of the present invention.
5 is a graph showing a result when the valve body is not paused in the control method of the gate valve according to the present invention.
6 is a graph showing a result when the valve body is temporarily stopped in the control method of the gate valve according to the present invention.
Fig. 7 is a graph showing the result when the valve body is temporarily stopped twice in the control method of the gate valve according to the present invention.
8 is a cross-sectional view illustrating control when the gate valve of the present invention is disposed between two chambers.

이하에, 본 발명의 실시형태에 대하여 도면을 참조하여 상세하게 설명한다. 또한, 동일 기능을 가지는 것은 동일 부호를 붙이고, 그 반복 설명은 생략하는 경우가 있다.EMBODIMENT OF THE INVENTION Below, embodiment of this invention is described in detail with reference to drawings. In addition, the thing which has the same function attaches | subjects the same code | symbol, and the repeat description may be abbreviate | omitted.

[실시예 1]Example 1

먼저, 본 발명인 게이트 밸브가 설치되는 반도체 제조 장치에 대하여 설명한다. 도 1은, 복수의 챔버 사이에 게이트 밸브가 설치된 반도체 제조 장치의 개관을 나타내는 사시도이다.First, the semiconductor manufacturing apparatus provided with the gate valve of this invention is demonstrated. 1 is a perspective view showing an overview of a semiconductor manufacturing apparatus in which a gate valve is provided between a plurality of chambers.

도 1에 나타내는 바와 같이, 반도체 제조 장치(100)는, 복수의 챔버(110)를 구비하고, 프로세스마다 각 챔버(110)에 기판을 반송하여 처리가 행해진다. 예를 들면, 복수의 챔버(110)가 일직선으로 배열된 인라인형이나, 복수의 챔버(110)가 반송실의 둘레에 별 형상으로 배치된 클러스터형 등이 있고, 챔버(110)의 수가 많아져도 장소를 차지하지 않는 클러스터형이 주류이다.As shown in FIG. 1, the semiconductor manufacturing apparatus 100 is equipped with the some chamber 110, and conveys a board | substrate to each chamber 110 for every process, and a process is performed. For example, there may be an in-line type in which the plurality of chambers 110 are arranged in a straight line, or a cluster type in which the plurality of chambers 110 are arranged in a star shape around the transfer chamber. The cluster type which does not occupy is mainstream.

클러스터형의 반도체 제조 장치(100)에 있어서는, 반송실이 되는 트랜스퍼 챔버(110a)의 둘레에, 진공 예비실이 되는 로드 록 챔버(110b)나 처리실이 되는 프로세스 챔버(110c) 등이 배치된다.In the cluster type semiconductor manufacturing apparatus 100, a load lock chamber 110b serving as a vacuum reserve chamber, a process chamber 110c serving as a processing chamber, and the like are disposed around the transfer chamber 110a serving as a transfer chamber.

트랜스퍼 챔버(110a)와 로드 록 챔버(110b) 및 프로세스 챔버(110c)와의 사이에는 게이트 밸브(200)가 개재된다. 또한, 로드 록 챔버(110b)의 입구에는 도어 밸브(120)가 마련된다. 또한, 트랜스퍼 챔버(110a), 로드 록 챔버(110b) 및 프로세스 챔버(110c)에는, 각각 진공 펌프(130)가 배기 밸브(140)를 개재하여 장착된다.A gate valve 200 is interposed between the transfer chamber 110a, the load lock chamber 110b, and the process chamber 110c. In addition, a door valve 120 is provided at the inlet of the load lock chamber 110b. In addition, the vacuum pump 130 is attached to the transfer chamber 110a, the load lock chamber 110b, and the process chamber 110c via the exhaust valve 140, respectively.

미리, 트랜스퍼 챔버(110a) 및 프로세스 챔버(110c)는, 배기 밸브(140)를 여는 것으로 진공 펌프(130)에 의해 소정의 압력까지 감압된다. 기판은, 도어 밸브(120)를 여는 것으로 외부로부터 로드 록 챔버(110b)에 반입된다. 그리고, 로드 록 챔버(110b)는, 배기 밸브(140)를 여는 것으로 진공 펌프(130)에 의해 트랜스퍼 챔버(110a)와 동일한 압력까지 감압된다.In advance, the transfer chamber 110a and the process chamber 110c are decompressed to a predetermined pressure by the vacuum pump 130 by opening the exhaust valve 140. The substrate is loaded into the load lock chamber 110b from the outside by opening the door valve 120. The load lock chamber 110b is depressurized to the same pressure as the transfer chamber 110a by the vacuum pump 130 by opening the exhaust valve 140.

기판은, 게이트 밸브(200)를 여는 것으로 로드 록 챔버(110b)로부터 트랜스퍼 챔버(110a)에 이송되고, 추가로 프로세스에 따라 각 프로세스 챔버(110c)에 이송된다. 기판은, 어떤 프로세스 챔버(110c)에서 처리를 마치면, 트랜스퍼 챔버(110a)에 반송되고, 또 다른 프로세스 챔버(110c)에 이송된다.The substrate is transferred from the load lock chamber 110b to the transfer chamber 110a by opening the gate valve 200, and further transferred to each process chamber 110c according to the process. The substrate is transferred to the transfer chamber 110a and transferred to another process chamber 110c after the processing is completed in one process chamber 110c.

게이트 밸브(200)는, 기판을 하나의 챔버(110)로부터 반출하고, 인접하는 다른 챔버(110)에 반입할 때에 열고, 기판이 이송되면 닫는다. 게이트 밸브(200)는, 하나의 챔버(110)로부터 다른 챔버(110)로, 기체나 파티클 등이 이동하지 않도록 밀폐한다.The gate valve 200 opens when carrying out a board | substrate from one chamber 110, and carries in to another adjacent chamber 110, and closes when a board | substrate is conveyed. The gate valve 200 is sealed from one chamber 110 to another chamber 110 so that gas, particles, and the like do not move.

다음에, 본 발명인 제어 방법이 실시되는 게이트 밸브에 대하여 설명한다. 도 2는, 게이트 밸브의 개관을 나타내는 사시도이다. 도 3은, 게이트 밸브의 구조를 나타내는 단면도이다. 도 4는, 게이트 밸브의 동작을 설명하는 단면도이다. 또한, 정면측을 앞, 배면측을 뒤로 하고, 도 3 및 도 4에 있어서는, 우측이 앞이 된다.Next, the gate valve to which the control method of this invention is implemented is demonstrated. 2 is a perspective view showing an overview of a gate valve. 3 is a cross-sectional view showing the structure of a gate valve. 4 is a cross-sectional view illustrating the operation of the gate valve. In addition, the front side is the front side and the back side is the back side, and in FIG. 3 and FIG. 4, the right side becomes front.

도 2에 나타내는 바와 같이, 게이트 밸브(200)는, 챔버(110)와 연결되는 개구부(220)를 막는 밸브체(300)와, 개구부(220)의 가장자리에 마련되어 밸브체(300)가 눌리는 밸브 시트(230)와, 밸브체(300)와 밸브 시트(230)의 사이를 밀봉하는 시일재(400)를 가진다. 게이트 밸브(200)로서는, 직사각 형상의 개구부(220)에 대하여, 밸브체(300)가 상하로 이동하는 각형 등이 있다.As shown in FIG. 2, the gate valve 200 includes a valve body 300 for blocking the opening portion 220 connected to the chamber 110, and a valve provided at an edge of the opening portion 220 to press the valve body 300. The seat 230 and the sealing material 400 which seal between the valve body 300 and the valve seat 230 are provided. Examples of the gate valve 200 include a square shape in which the valve body 300 moves up and down with respect to the rectangular opening portion 220.

밸브체(300)는, 게이트 밸브(200)의 프레임체(210) 내에 수용된다. 프레임체(210)의 상부에는, 정면(및 배면)에 개구부(220)가 뚫리고, 프레임체(210)의 하부에는, 밸브체(300)를 열었을 때에 저장하는 저장부(240)를 가진다. 프레임체(210)의 하측에는, 밸브체(300)를 개폐 동작시키는 구동부(250)를 마련한다.The valve body 300 is accommodated in the frame body 210 of the gate valve 200. In the upper part of the frame body 210, the opening part 220 is drilled in the front surface (and back surface), and the lower part of the frame body 210 has the storage part 240 to store when the valve body 300 is opened. Below the frame body 210, the drive part 250 which opens and closes the valve body 300 is provided.

개구부(220)는, 예를 들면, 가로로 긴의 구멍 등 기판을 통과시키기에 필요한 폭과 높이로 뚫려 있으면 된다. 구동부(250)는, 예를 들면, 액추에이터 등으로 밸브체(300)를 상하로 이동시키는 승강 기구를 구비하고 있으면 된다. 저장부(240)는, 밸브체(300)를 하강시켰을 때에, 개구부(220)가 개방되도록, 프레임체(210) 내에 공간이 확보되어 있으면 된다.The opening part 220 should just be drilled by the width | variety and height required for allowing a board | substrate, such as a horizontally long hole, to pass through. The drive part 250 should just be equipped with the lifting mechanism which moves the valve body 300 up and down with an actuator etc., for example. The storage part 240 should just have space in the frame body 210 so that the opening part 220 may open when the valve body 300 descends.

도 3에 나타내는 바와 같이, 중공인 프레임체(210)의 전후로 뚫은 개구부(220)를 챔버(110)의 출입구에 맞닿게 한다. 밸브체(300)는, 구동부(250)로부터 프레임체(210) 내에 연장되는 밸브 로드(310)에 지지되고, 개구부(220)를 막는 위치에 배치된다. 개구부(220)의 가장자리에 마련된 밸브 시트(230)와, 밸브체(300)의 가장자리가, 일부 겹치도록, 밸브체(300)를 개구부(220)보다 큰 사이즈로 한다.As shown in FIG. 3, the opening part 220 which drilled back and forth of the hollow frame body 210 is made to contact the entrance and exit of the chamber 110. As shown in FIG. The valve body 300 is supported by the valve rod 310 extending from the drive unit 250 into the frame body 210 and is disposed at a position that blocks the opening portion 220. The valve body 300 is made larger than the opening 220 so that the valve seat 230 provided at the edge of the opening part 220 and the edge of the valve body 300 partially overlap.

밸브체(300)의 가장자리에는, 개구부(220)를 둘러싸도록 고리 형상의 시일재(400)가 장착되고, 개구부(220)를 닫을 때에는, 시일재(400)를 찌부러뜨리도록 하여 밸브체(300)가 밸브 시트(230)에 눌린다. 예를 들면, 밸브체(300) 및 밸브 시트(230)가 금속제일 때, 시일재(400)를 고무 등의 수지제로 하면, 챔버(110)의 기밀성이 유지된다.An annular seal member 400 is attached to an edge of the valve body 300 so as to surround the opening portion 220. When the opening portion 220 is closed, the sealing member 400 is crushed so that the valve body 300 is crushed. ) Is pressed against the valve seat 230. For example, when the valve body 300 and the valve seat 230 are made of metal, when the sealing material 400 is made of resin such as rubber, the airtightness of the chamber 110 is maintained.

도 4에 나타내는 바와 같이, 게이트 밸브(200)의 개방 동작은, (a) 밸브 시트(230)로부터 시일재(400)를 떼어내기 위한 밸브체(300)의 후퇴 동작과, (b) 개구부(220)를 개방하기 위한 밸브체(300)의 하강 동작 등으로 이루어진다.As shown in FIG. 4, the opening operation of the gate valve 200 includes (a) a retraction operation of the valve body 300 for removing the sealing material 400 from the valve seat 230, and (b) an opening portion ( And the lowering operation of the valve body 300 for opening 220.

시일재(400)는 밸브 시트(230)에 대하여 흡착되어 있으므로, 밸브체(300)를 후방으로 이동시켜 시일재(400)를 강한 힘으로 한번에 떼어내면, 밸브 로드(310)의 하단(下端)을 지지점으로 하여 밸브체(300)가 진동하고, 추가로 그것이 전해져 게이트 밸브(200)도 진동한다. 또한, 시일재(400)의 떼어냄과, 밸브체(300) 및 게이트 밸브(200)의 진동에 수반되어, 큰 소리도 발생한다.Since the seal member 400 is adsorbed with respect to the valve seat 230, the lower end of the valve rod 310 is moved when the valve member 300 is moved backwards and the seal member 400 is removed at a time with a strong force. The valve body 300 vibrates, and the gate valve 200 also vibrates with this as a support point. In addition, with the removal of the sealing material 400 and the vibration of the valve body 300 and the gate valve 200, a loud sound is also generated.

또한, 폐쇄 위치는, 시일재(400)가 밸브 시트(230)에 눌려 있는 상태에 있어서의 밸브체(300)의 위치, 개방 위치는, 시일재(400)가 밸브 시트(230)로부터 떼어져 후퇴한 상태에 있어서의 밸브체(300)의 위치로 한다. 또한, 찌부러뜨림량은, 개방 위치에 있어서의 시일재의 두께와, 폐쇄 위치에 있어서의 시일재(400)의 두께의 차분으로 한다.In the closed position, the seal member 400 is removed from the valve seat 230 in the position and the open position of the valve body 300 in the state where the seal member 400 is pressed against the valve seat 230. It is set as the position of the valve body 300 in a retracted state. In addition, the amount of crushing is made into the difference of the thickness of the sealing material in an open position, and the thickness of the sealing material 400 in a closed position.

밸브체(300)가 진동한 상태에서 하강시키면, 밸브 로드(310)를 승강시키는 구동부(250)에 부담이 걸려, 밸브체(300)를 저장부(240)에 수용하기 어려워지고, 추가로 게이트 밸브(200)에 진동을 전달하게 된다.When the valve body 300 is lowered in the vibrated state, the driving unit 250 for elevating the valve rod 310 is burdened, and it is difficult to accommodate the valve body 300 in the storage unit 240, and further the gate The vibration is transmitted to the valve 200.

밸브체(300)나 게이트 밸브(200)가 진동하면, 프레임체(210) 내의 파티클이 떠올라, 챔버(110) 내에 침입할 우려도 생긴다. 특히, 챔버(110) 내의 기압이 낮으면 파티클이 들어가기 쉬워지고, 챔버(110) 내에 ?재된 기판이 오염되어 제품의 품질을 열화시킬 가능성이 있다.When the valve body 300 or the gate valve 200 vibrates, particles in the frame body 210 may float and may enter the chamber 110. In particular, when the air pressure in the chamber 110 is low, particles easily enter, and there is a possibility that the substrate contained in the chamber 110 is contaminated and deteriorates the quality of the product.

밸브체(300)의 진동을 억제하기 위하여, 밸브 시트(230)로부터 시일재(400)을 떼어낸 후, 밸브체(300)가 폐쇄 위치로부터 개방 위치로 후퇴 이동할 때까지의 동안에, 밸브체(300)를 약간의 시간만큼 일시 정지시키는 제어를 행한다. 또한, 밸브체(300)의 일시 정지는, 1회의 후퇴 이동에 대해, 복수 회(예를 들면, 2회) 행해도 된다.In order to suppress the vibration of the valve body 300, after removing the sealing material 400 from the valve seat 230, the valve body 300 until the valve body 300 moves back from the closed position to the open position. Control to pause 300) is performed for some time. In addition, you may perform pause of the valve body 300 multiple times (for example, twice) with respect to one backward movement.

다음에, 본 발명인 게이트 밸브의 제어 방법에 대하여 설명한다. 도 5는, 게이트 밸브의 제어 방법에 있어서 밸브체를 일시 정지하지 않았을 때의 결과를 나타내는 그래프이다. 도 6은, 게이트 밸브의 제어 방법에 있어서 밸브체를 일시 정지했을 때의 결과를 나타내는 그래프이다. 도 7은, 게이트 밸브의 제어 방법에 있어서 밸브체의 일시 정지를 2회 했을 때의 결과를 나타내는 그래프이다.Next, the control method of the gate valve of this invention is demonstrated. 5 is a graph showing a result when the valve element is not paused in the control method of the gate valve. 6 is a graph showing a result when the valve body is temporarily stopped in the control method of the gate valve. FIG. 7 is a graph showing the result when the valve body is temporarily stopped twice in the control method of the gate valve. FIG.

도 5∼도 7은, 게이트 밸브(200)를 개방 동작시켰을 때의 밸브체(300)의 위치를 시계열로 나타낸 것이며, 게이트 밸브(200)의 정면으로부터 레이저광을 쐬는 등하여, 밸브체(300)의 표면에 있어서의 거리와, 프레임체(210)의 표면에 있어서의 거리를 측정하고, 그 차분을 밸브체(300)의 상대 위치(500)로 한 것이다.5-7 show the position of the valve body 300 in time series when the gate valve 200 was opened, and emits a laser beam from the front of the gate valve 200, and the valve body 300 is shown. The distance on the surface of) and the distance on the surface of the frame body 210 are measured, and the difference is made into the relative position 500 of the valve body 300.

밸브체(300)의 폐쇄 위치(510)는, 시일재(400)의 찌부러뜨림량(530)이 0.2mm인 상태에서 밸브 시트(230)에 눌린 위치이고, 밸브체(300)의 개방 위치(520)는, 폐쇄 위치로부터 2.0mm 떨어진 위치이다. 밸브체(300)를 폐쇄 위치(510)로부터 개방 위치(520)에 이동시킨 후, 밸브체(300)를 하강시켜 저장부(240)에 수용할 때까지가 나타내어져 있다.The closed position 510 of the valve body 300 is a position pressed by the valve seat 230 in a state where the crush amount 530 of the sealing material 400 is 0.2 mm, and the opening position of the valve body 300 ( 520 is a position 2.0 mm away from the closed position. After moving the valve body 300 from the closed position 510 to the open position 520, until the valve body 300 is lowered and accommodated in the storage part 240 is shown.

도 5의 (a)에 나타내는 바와 같이, 밸브체(300)를 폐쇄 위치(510)로부터 개방 위치(520)까지 이동시켰을 때, 시일재(400)의 찌부러뜨림량(530)의 범위에서는 밸브체(300)가 밸브 시트(230)에 흡착되어 있고, 밸브체(300)의 이동 방향과 반대측으로 당겨진 상태이다. 또한, 밸브체(300)는, 찌부러뜨림량(530)이 없어지는 위치에 도달하기 전에 빨리 시일재(400)로부터 떼어지거나, 또는 찌부러뜨림량(530)을 초과하여 늦게 시일재(400)로부터 떼어지지만, 어느 쪽이든 시일재(400)에 의해 가압된 상태가 된다.As shown in FIG. 5A, when the valve body 300 is moved from the closed position 510 to the open position 520, the valve body is within the range of the crush amount 530 of the sealing material 400. 300 is attracted to the valve seat 230 and is pulled to the side opposite to the moving direction of the valve body 300. In addition, the valve body 300 is detached from the sealing material 400 early, or later than the crushing amount 530 before reaching the position at which the crushing amount 530 disappears from the sealing member 400. Although peeled off, it will be in the state pressed by the sealing material 400 either.

밸브체(300)가 밸브 시트(230)로부터 떼어지면 힘차게 멀어져 가므로, 그 휨에 의해 개방 위치(520)까지 온 밸브체(300)는 진동(540)한 상태가 된다. 또한, 진동(540)의 폭은 약 0.4mm가 된다. 그 후, 밸브체(300)의 하강에 수반되어 시일재(400)의 부분이 계측되고, 추가로 밸브체(300)가 수납됨으로써 안쪽의 프레임체(210)의 내벽이 계측되어 있다.When the valve body 300 is detached from the valve seat 230, the valve body 300 moves away from the valve seat 230. Therefore, the valve body 300, which has been brought up to the open position 520 by the bending, is in a vibration 540 state. In addition, the width of the vibration 540 is about 0.4 mm. Then, the part of the sealing material 400 is measured with the fall of the valve body 300, and the inner wall of the inner frame body 210 is measured by accommodating the valve body 300 further.

도 5의 (b)에 나타내는 바와 같이, 밸브체(300)의 폐쇄 위치(510)로부터 개방 위치(520)까지의 이동 시간을 느리게 한 경우, 밸브체(300) 자체의 이동 속도를 다소 바꿔도, 시일재(400)에 의해 가압된 휨의 영향이 크기 때문에, 진동(540)의 폭은 0.2mm보다 커진다.As shown in FIG.5 (b), when the movement time from the closed position 510 of the valve body 300 to the open position 520 is slowed down, even if the movement speed of the valve body 300 itself is changed somewhat, Since the influence of the warpage pressed by the seal member 400 is large, the width of the vibration 540 is larger than 0.2 mm.

도 6의 (a)에 나타내는 바와 같이, 밸브체(300)를 폐쇄 위치(510)로부터 여는 방향으로 이동시켜, 시일재(400)의 찌부러뜨림량(530)이 없어지는 위치에 도달하기 전에 밸브체(300)를 소정의 시간(예를 들면, 약 200∼300밀리초)만큼 일시 정지(550)시키고, 그 후, 밸브체(300)의 이동을 재개했을 때의 밸브체(300)의 진동(540)의 폭은 0.2mm보다 작아진다.As shown to Fig.6 (a), the valve body 300 is moved to the opening direction from the closed position 510, and the valve before reaching the position which the crush amount 530 of the sealing material 400 disappears is obtained. Vibration of the valve body 300 when the sieve 300 is temporarily suspended 550 for a predetermined time (for example, about 200 to 300 milliseconds), and then the movement of the valve body 300 is resumed. The width of 540 is smaller than 0.2 mm.

또한, 도 6의 (b)에 나타내는 바와 같이, 밸브체(300)를 폐쇄 위치(510)로부터 여는 방향으로 이동시켜, 시일재(400)의 찌부러뜨림량(530)을 초과하여 떼어진 후에 밸브체(300)를 소정의 시간(예를 들면, 약 200∼300밀리초)만큼 일시 정지(550)시키고, 그 후, 밸브체(300)의 이동을 재개했을 때의 밸브체(300)의 진동(540)의 폭도 0.2mm보다 작아진다.In addition, as shown in FIG.6 (b), after moving the valve body 300 to the opening direction from the closed position 510, after removing beyond the crush amount 530 of the sealing material 400, the valve Vibration of the valve body 300 when the sieve 300 is temporarily suspended 550 for a predetermined time (for example, about 200 to 300 milliseconds), and then the movement of the valve body 300 is resumed. The width of 540 is also smaller than 0.2 mm.

즉, 밸브체(300)가 시일재(400)의 찌부러뜨림량(530)이 없어지는 위치 부근까지 와서, 시일재(400)가 떼어지기 직전 또는 직후의 위치에 있어서, 밸브체(300)를 일시 정지(550)시킴으로써, 밸브체(300)의 진동(540)이 크게 억제된다.That is, the valve body 300 comes to the vicinity of the position where the crush amount 530 of the sealing material 400 disappears, and the valve body 300 is opened at the position immediately before or immediately after the sealing material 400 is removed. By pausing 550, the vibration 540 of the valve body 300 is greatly suppressed.

도 7의 (a)에 나타내는 바와 같이, 먼저 밸브체(300)를 시일재(400)가 떼어지기 직전에 일시 정지(550)시키고, 그 후, 밸브체(300)가 개방 위치(520)에 도달하기 직전에 추가로 일시 정지(550a)시켰을 때에는, 밸브체(300)가 개방 위치(520)에 도달함으로써 생기는 진동(540)도 억제된다.As shown in FIG. 7A, first, the valve body 300 is temporarily stopped 550 immediately before the sealing member 400 is detached, and then the valve body 300 is moved to the open position 520. When the suspension 550a is further paused immediately before reaching, the vibration 540 caused by the valve body 300 reaching the open position 520 is also suppressed.

또한, 도 7의 (b)에 나타내는 바와 같이, 먼저 밸브체(300)를 시일재(400)가 떼어진 직후에 일시 정지(550)시키고, 그 후, 밸브체(300)가 개방 위치(520)에 도달하기 직전에 추가로 일시 정지(550a)시켰을 때에도, 밸브체(300)가 개방 위치(520)에 도달함으로써 생기는 진동(540)이 억제된다.In addition, as shown in FIG. 7B, first, the valve body 300 is temporarily stopped 550 immediately after the sealing member 400 is removed, and the valve body 300 is then opened in the open position 520. Even when pausing (550a) is additionally performed immediately before reaching), vibration 540 caused by the valve body 300 reaching the open position 520 is suppressed.

즉, 시일재(400)가 떼어지기 직전 또는 직후의 위치에 있어서의 밸브체(300)의 일시 정지(550)에 의해, 시일재(400)의 흡착에 수반되는 밸브체(300)의 휨에 의해 진동(540)이 커지는 것을 억제하고, 개방 위치(520)의 직전에 있어서의 밸브체(300)의 일시 정지(550a)에 의해, 밸브체(300)의 정지에 수반되는 진동(540)의 발생 자체를 억제한다.That is, by the temporary stop 550 of the valve body 300 at the position immediately before or after the sealing material 400 is removed, the bending of the valve body 300 accompanying the suction of the sealing material 400 is caused. The vibration 540 is suppressed from being increased, and by the temporary stop 550a of the valve body 300 immediately before the open position 520, the vibration 540 accompanying the stop of the valve body 300 is prevented. Suppress the occurrence itself.

[실시예 2]Example 2

도 8은, 본 발명인 게이트 밸브를 2개의 챔버 사이에 배치했을 때의 제어를 설명하는 단면도이다. 하나의 챔버와 인접하는 다른 챔버에 기압차가 있으면, 기압이 낮은 쪽에 기체가 유입되고, 파티클이 들어가기 쉬워진다.8 is a cross-sectional view illustrating control when the gate valve of the present invention is disposed between two chambers. If there is an air pressure difference in one chamber and another chamber adjacent to the gas, gas is introduced into the lower air pressure, and particles are more likely to enter.

도 8에 나타내는 바와 같이, 챔버(110a)와 챔버(110c)가 게이트 밸브(200a)를 개재하여 연결 마련되어 있는 경우에, 예를 들면, 챔버(110a)와 챔버(110c)의 사이에, 통기로(600)를 연결하고, 통기로(600)의 도중에 밸브(610)를 마련한다.As shown in FIG. 8, when the chamber 110a and the chamber 110c are connected and provided through the gate valve 200a, for example, between the chamber 110a and the chamber 110c, The connection 600 is provided and the valve 610 is provided in the middle of the ventilation path 600.

챔버(110a)로부터 챔버(110c)에 기판을 이송할 때에, 챔버(110a)와 챔버(110c)의 기압이 상이한 경우에는, 밸브(610)를 열어 통기로(600)를 통하게 함으로써, 챔버(110a)와 챔버(110c)의 기압차를 없앤 다음에, 밸브체(300)를 열면 된다.When the substrate is transferred from the chamber 110a to the chamber 110c, when the air pressure of the chamber 110a and the chamber 110c is different, the valve 110 is opened to allow the air passage 600 to pass through the chamber 110a. ), The valve body 300 may be opened after removing the pressure difference between the chamber 110c and the chamber 110c.

이와 같이, 반도체 제조 장치(100)에 있어서, 게이트 밸브(200)의 밸브체(300)를 단시간에 개방 동작시켜도, 시일재(400)의 박리에 수반되는 밸브체(300) 자체 및 게이트 밸브(200) 전체의 진동을 최소한으로 억제하고, 챔버(110) 내에 파티클이 발생하여 기판이 오염되는 것을 방지할 수 있다.Thus, in the semiconductor manufacturing apparatus 100, even when the valve body 300 of the gate valve 200 is opened and operated for a short time, the valve body 300 itself and the gate valve accompanying peeling of the sealing material 400 ( The vibration of the entirety of 200 may be minimized, and particles may be generated in the chamber 110 to prevent the substrate from being contaminated.

이상, 본 발명의 실시예를 서술하였지만, 이들에 한정되는 것은 아니다.As mentioned above, although the Example of this invention was described, it is not limited to these.

100 : 반도체 제조 장치
110 : 챔버
110a : 트랜스퍼 챔버
110b : 로드 록 챔버
110c : 프로세스 챔버
120 : 도어 밸브
130 : 진공 펌프
140 : 배기 밸브
200 : 게이트 밸브
210 : 프레임체
220 : 개구부
230 : 밸브 시트
240 : 저장부
250 : 구동부
300 : 밸브체
310 : 밸브 로드
400 : 시일재
500 : 상대 위치
510 : 폐쇄 위치
520 : 개방 위치
530 : 찌부러뜨림량
540 : 진동
550 : 일시 정지
550a : 일시 정지
600 : 통기로
610 : 밸브100: semiconductor manufacturing apparatus
110: chamber
110a: transfer chamber
110b: load lock chamber
110c: process chamber
120: door valve
130: vacuum pump
140: exhaust valve
200: gate valve
210: frame
220: opening
230: valve seat
240: storage unit
250 drive unit
300: valve body
310: valve rod
400: sealing material
500: relative position
510: closed position
520: open position
530: amount of crushing
540: vibration
550: pause
550a: pause
600: by aeration
610: Valve

Claims (4)

챔버의 개구부에 마련한 게이트 밸브의 제어 방법으로서,
상기 개구부를 막도록 개폐하는 밸브체와,
상기 개구부의 가장자리에 마련되어 상기 밸브체가 눌리는 밸브 시트와,
상기 밸브체와 상기 밸브 시트의 사이를 밀봉하는 시일재를 가지고,
상기 시일재를 찌부러뜨려 상기 밸브체가 상기 밸브 시트에 눌린 폐쇄 위치로부터 상기 밸브체를 개방 동작시킬 때에, 상기 밸브체를 열어 찌부러뜨려져 있던 상기 시일재가 떼어지기 직전 또는 직후의 위치에 있어서 상기 밸브체의 진동이 억제되도록 상기 밸브체를 일시 정지시키는 것을 특징으로 하는 게이트 밸브의 제어 방법.As a control method of the gate valve provided in the opening part of a chamber,
A valve body that opens and closes to block the opening;
A valve seat provided at an edge of the opening portion to press the valve body;
It has a sealing material which seals between the said valve body and the said valve seat,
When the sealing member is crushed to open the valve body from the closed position in which the valve body is pressed against the valve seat, the valve body is opened at the position immediately before or immediately after the sealing member is opened and the sealing material is crushed. The control method of the gate valve, characterized in that for stopping the valve body so that vibration of the. 제 1 항에 있어서,
상기 밸브체를 상기 일시 정지 후, 개방 위치에서 정지할 때까지의 동안에 추가로 일시 정지시키는 것을 특징으로 하는 게이트 밸브의 제어 방법.The method of claim 1,
And the valve body is further paused after the temporary stop until it stops at an open position. 제 1 항 또는 제 2 항에 있어서,
상기 게이트 밸브는, 하나의 챔버와, 그것과 기압이 상이한 다른 챔버와의 사이에 개재되고,
상기 하나의 챔버와 상기 다른 챔버의 기압차를 조정하고 나서 상기 밸브체를 여는 것을 특징으로 하는 게이트 밸브의 제어 방법.The method according to claim 1 or 2,
The gate valve is interposed between one chamber and another chamber having a different air pressure from the chamber,
And controlling the pressure difference between the one chamber and the other chamber, and then opening the valve body. 제 1 항 내지 제 3 항 중 어느 한 항에 기재된 제어 방법에 의해 상기 밸브체를 여는 것을 특징으로 하는 게이트 밸브.The said valve body is opened by the control method in any one of Claims 1-3, The gate valve characterized by the above-mentioned.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000074254A (en) * 1998-08-28 2000-03-14 Benkan Corp Device and method for controlling pneumatic cylinder operating valve for supplying pure water and chemical
JP2000227166A (en) * 1999-02-08 2000-08-15 Shin Meiwa Ind Co Ltd Vacuum gate valve
JP3433207B2 (en) 1999-12-09 2003-08-04 エヌオーケー株式会社 Gate valve
JP2006052846A (en) 2004-08-13 2006-02-23 Vat Holding Ag Control method of vacuum valve arranged between two vacuum spaces
KR20110063794A (en) * 2008-08-29 2011-06-14 어플라이드 머티어리얼스, 인코포레이티드 Slit valve control
KR20160030047A (en) * 2014-09-08 2016-03-16 인글라스 에스피에이 Method and apparatus for injection molding of plastic materials

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2673988B1 (en) * 1991-03-11 1993-10-22 Defontaine Sa A VALVE WITH A FLOATING SHUTTER JOINT FOR HIGH FLOW RATES.
JP2004257527A (en) * 2003-02-27 2004-09-16 Nippon Valqua Ind Ltd Vacuum gate valve and seal member mounting method
JP4406292B2 (en) * 2004-01-20 2010-01-27 株式会社フジキン Water hammerless opening method of fluid passage and water hammerless opening device using the same
US9068657B2 (en) * 2012-10-19 2015-06-30 Varian Semiconductor Equipment Associates, Inc. Gate valve with improved seal arrangement
JP2015086943A (en) * 2013-10-30 2015-05-07 Tdk株式会社 Valve

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000074254A (en) * 1998-08-28 2000-03-14 Benkan Corp Device and method for controlling pneumatic cylinder operating valve for supplying pure water and chemical
JP2000227166A (en) * 1999-02-08 2000-08-15 Shin Meiwa Ind Co Ltd Vacuum gate valve
JP3433207B2 (en) 1999-12-09 2003-08-04 エヌオーケー株式会社 Gate valve
JP2006052846A (en) 2004-08-13 2006-02-23 Vat Holding Ag Control method of vacuum valve arranged between two vacuum spaces
KR20110063794A (en) * 2008-08-29 2011-06-14 어플라이드 머티어리얼스, 인코포레이티드 Slit valve control
KR20160030047A (en) * 2014-09-08 2016-03-16 인글라스 에스피에이 Method and apparatus for injection molding of plastic materials

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