KR20190067485A - Photosensitive resin composition, photosensitive resin layer using the same and color filter - Google Patents

Abstract

The present invention relates to a photosensitive resin composition which is advantageous for sedimentation while maximizing a light absorption rate and a light conversion rate, to a photosensitive resin film produced by using the same, and to a color filter comprising the photosensitive resin film. The photosensitive resin composition comprises: (A) quantum dots; (B) a binder resin; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; (E) a light dispersing agent; and (F) a solvent, wherein the light dispersing agent comprises the primary particle diameter of 80 to 200 nm and the secondary particle diameter of 120 to 250 nm.

Description

TECHNICAL FIELD [0001] The present invention relates to a photosensitive resin composition, a photosensitive resin film and a color filter using the same. BACKGROUND ART < RTI ID = 0.0 >

The present invention relates to a photosensitive resin composition, a photosensitive resin film produced using the same, and a color filter comprising the photosensitive resin film.

Generally, a color filter applied to a display forms a desired pattern through an exposure process using a photoresist composition using a photosensitive resist composition, and forms a color filter through a patterning process in which an unexposed portion is dissolved and removed through a development process. The material for the color filter is alkali-soluble and requires high sensitivity, adhesion to the substrate, chemical resistance, and heat resistance. It is usual to use a pigment or a dye as a color material.

However, since the pigments are excellent in heat resistance and chemical resistance, they are not well dispersed in a solvent, and thus have poor color characteristics such as brightness. In the case of dyes, color characteristics are excellent, but durability is poor and heat resistance and chemical resistance are not excellent .

Accordingly, there is a continuing development of a novel self-luminous type photosensitive resin composition and a color filter material to which the present invention can overcome the technical limitations of a photosensitive resin composition using a pigment or a dye as a color material.

One embodiment is to provide a photosensitive resin composition which is advantageous for sedimentation while maximizing the light absorption rate and the light conversion rate by controlling the primary particle diameter and the secondary particle diameter of the light diffusing agent.

Another embodiment is to provide a photosensitive resin film produced using the photosensitive resin composition.

Another embodiment is to provide a color filter comprising the photosensitive resin film.

One embodiment includes (A) a quantum dot; (B) a binder resin; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; (E) a light diffusing agent; And (F) a solvent, wherein the light diffusing agent has a primary particle diameter of 80 to 200 nm and a secondary particle diameter of 120 to 250 nm.

The light diffusing agent may have a primary particle diameter of 80 nm to 120 nm and a secondary particle diameter of 160 nm to 230 nm.

The light diffusing agent may include barium sulfate, calcium carbonate, titanium dioxide, zirconia, or combinations thereof.

The light diffusing agent may be rutile type titanium dioxide.

The quantum dots may include a quantum dot, or a combination thereof having the maximum fluorescence wavelength (fluorescence λ _em) on the quantum dot, 580nm to 700nm with a maximum fluorescence wavelength (fluorescence λ _em) at 450nm to 580nm.

The photosensitive resin composition may further comprise (G) a thiol-based additive.

The thiol-based additive may be included in an amount of 1 wt% to 10 wt% based on the total amount of the photosensitive resin composition.

The photosensitive resin composition preferably contains 1% by weight to 30% by weight of the quantum dot (A) in the total amount of the photosensitive resin composition; 1 to 20% by weight of the binder resin (B); 1 to 20% by weight of the (C) photopolymerizable monomer; 0.1 to 5% by weight of the photopolymerization initiator (D); 2% to 15% by weight of the (E) light diffusing agent; And (F) 30% to 80% by weight of the solvent.

The photosensitive resin composition may include malonic acid; 3-amino-1,2-propanediol; Silane coupling agents; Leveling agents; A fluorine-based surfactant, or a combination thereof.

Another embodiment provides a photosensitive resin film produced using the photosensitive resin composition.

Another embodiment provides a color filter comprising the photosensitive resin film.

Other aspects of the present invention are included in the following detailed description.

The quantum dot-containing photosensitive resin composition according to an embodiment includes a light diffusing agent whose primary particle size and secondary particle size are controlled, thereby maximizing the scattering effect on the quantum dot, and redispersing it in a short period of time with a reduced density Do. Accordingly, it becomes possible to realize a high brightness and high color of a color pattern containing the photosensitive resin film produced using the above composition.

Fig. 1 is a schematic diagram showing the primary particle size and the secondary particle size of the light-diffusing agent.
2 is a scanning electron microscope (SEM) photograph of the light diffusing agent used in Example 3. Fig.
3 is a scanning electron microscope (SEM) photograph of the light diffusing agent used in Comparative Example 5. Fig.
4 is a crystalline phase X-ray analysis graph of the light diffusing agent used in Example 3. Fig.
5 is a crystalline phase X-ray analysis graph of the light diffusing agent used in Example 7. Fig.

Hereinafter, embodiments of the present invention will be described in detail. However, it should be understood that the present invention is not limited thereto, and the present invention is only defined by the scope of the following claims.

Unless otherwise specified herein, "alkyl group" means a C1 to C20 alkyl group, "alkenyl group" means a C2 to C20 alkenyl group, "cycloalkenyl group" means a C3 to C20 cycloalkenyl group Quot; means a C3 to C20 heterocycloalkenyl group, "an aryl group" means a C6 to C20 aryl group, an "arylalkyl group" means a C6 to C20 arylalkyl group, Refers to a C 1 to C 20 alkylene group, "arylene group" refers to a C6 to C20 arylene group, "alkylarylene group" refers to a C6 to C20 alkylarylene group, "heteroarylene group" refers to a C3 to C20 hetero Quot; means an arylene group, and the "alkoxysilylene group" means a C1 to C20 alkoxysilylene group.

Unless otherwise specified herein, "substituted" means that at least one hydrogen atom is replaced by a halogen atom (F, Cl, Br, I), a hydroxy group, a C1 to C20 alkoxy group, a nitro group, a cyano group, An ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid or a salt thereof, a C1-C10 alkyl group, a C1- A C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C20 aryl group, a C3 to C20 cycloalkyl group, a C3 to C20 cycloalkenyl group, a C3 to C20 cycloalkynyl group, a C2 to C20 heterocycloalkyl group, a C2 to C20 heterocycloalkyl group, To C20 heterocycloalkenyl groups, C2 to C20 heterocycloalkynyl groups, C3 to C20 heteroaryl groups, or combinations thereof.

Also, unless otherwise specified herein, "hetero" means that at least one heteroatom of N, O, S, and P is included in the formula.

&Quot; (Meth) acrylic acid "refers to both" acrylic acid "and" methacrylic acid " "It means both are possible.

"Combination" as used herein, unless otherwise specified, means mixing or copolymerization.

Unless otherwise defined in the chemical formulas in this specification, when no chemical bond is drawn at the position where the chemical bond should be drawn, it means that the hydrogen atom is bonded at the above position.

As used herein, the cadmium resin means a resin in which at least one functional group selected from the group consisting of the following Chemical Formulas 1-1 to 1-11 is contained in the main backbone of the resin.

Also, unless otherwise specified herein, "*" means the same or different atom or moiety connected to the formula.

The photosensitive resin composition according to one embodiment comprises (A) a quantum dot; (B) a binder resin; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; (E) a light diffusing agent; And (F) a solvent, wherein the light diffusing agent has a primary particle diameter of 80 nm to 200 nm and a secondary particle diameter of 120 nm to 250 nm.

In general, the photosensitive resin composition is composed of a pigment or a dye, a photopolymerizable monomer, a binder resin, a photopolymerization initiator, a solvent, an additive, etc. However, the photosensitive resin composition according to one embodiment is an inorganic compound Quantum dots are included. Since the color filter manufactured using the photosensitive resin composition according to one embodiment emits self-luminescence, it is possible to obtain a high brightness, a high efficiency for reducing power consumption, a wide viewing angle, and a high color reproducibility as compared with a color filter manufactured using a conventional photosensitive resin composition Characteristics, and ultimately contribute to the development of LCDs having the above characteristics.

The light diffusing agent helps to utilize the spontaneous emission of the quantum dot more efficiently, but has a negative effect on the reduction of the linearity of the pattern and the developability in the operation of the photoresist due to the characteristics of the inorganic material. In addition, the light diffusing agent having a larger size than the quantum dots has a disadvantage that it acts against the sedimentation of the composition due to a high specific gravity. In order to solve this problem, there have been attempts to use scattering and patterning at the same time by mixing two different kinds of light diffusing agents. However, all of them have not been enough to solve the problem of sedimentation of the composition.

According to one embodiment, the primary particle diameter and the secondary particle diameter of the light diffusing agent used together with the quantum dots are limited to 80 nm to 200 nm and 120 nm to 250 nm, respectively, to maximize the scattering effect on the quantum dots and, at the same time, I solved the problem.

Specifically, when the primary particle diameter of the light diffusing agent is controlled to be 50 nm to 200 nm, the problem of sedimentation can be solved. That is, if the dispersed composition containing the light diffusing agent whose primary particle diameter is limited to the above range is redispersed again, it can be confirmed that the composition is redispersed in a short time and the settling velocity is slowed down. If the primary particle diameter of the light diffusing agent is less than 80 nm (irrespective of secondary particle diameter control), the light absorptivity and the light conversion rate are lowered. If the primary particle diameter of the light diffusing agent exceeds 200 nm, And the surface roughness of the light diffusing agent particle surface is also negatively affected.

When the primary particle size of the light diffusing agent is controlled within the above-mentioned range and the secondary particle diameter is controlled to 120 to 250 nm, the optical characteristics, specifically the blue light absorption rate and the blue light conversion rate, can be maximized .

Each component will be described in detail below.

(E) Light Diffuser

As described above, the light-diffusing agent has a primary particle diameter of 80 nm to 200 nm and a secondary particle diameter of 120 nm to 250 nm. For example, the light diffusing agent may have a primary particle diameter of 80 nm to 120 nm and a secondary particle diameter of 160 nm to 230 nm.

For example, the photosensitive resin composition according to one embodiment may further include a light-diffusing agent dispersion in which the light-diffusing agent is dispersed. The dispersion in which the light-diffusing agent is dispersed may be any organic solvent such as PGMEA without any particular limitation.

For example, the light-diffusing material may include barium sulfate (BaSO _4), calcium carbonate (CaCO _3), titanium dioxide (TiO _2), zirconia (ZrO _2), or a combination thereof.

For example, the light diffusing agent may be titanium dioxide (TiO ₂ ), such as rutile titanium dioxide. Titanium dioxide has a relatively high refractive index and can increase self-luminous efficiency of quantum dots of photoresist. Furthermore, when the crystalline phase of the titanium dioxide is a rutile type, the optical characteristics can be increased as compared with the case of an anatase type.

The light diffusing agent reflects light not absorbed by the quantum dots and allows the quantum dots to absorb the reflected light again. That is, the light-diffusing agent can increase the amount of light absorbed in the quantum dots and increase the light conversion rate of the quantum dots in the photosensitive resin composition. That is, it is possible to prevent a decrease in the blue light conversion rate as the color filter process proceeds.

The light-diffusing agent may be contained in an amount of 2 to 15 wt%, for example 5 to 12 wt% based on the total amount of the photosensitive resin composition based on the dispersion. That is, the light-diffusing agent dispersion may be contained in an amount of 2% by weight to 15% by weight based on the total amount of the photosensitive resin composition. When the light diffusing agent is contained in an amount of less than 2% by weight based on the total amount of the photosensitive resin composition, it is difficult to expect an effect of preventing a decrease in the light conversion rate upon use of the light diffusing agent. The pattern characteristic of the photosensitive organic film is deteriorated, and as a result, the light conversion rate is lowered.

(A) Qdot

The quantum dot can absorb light in a wavelength range of 360 nm to 780 nm, for example, a wavelength range of 400 nm to 780 nm, and emit fluorescence in a wavelength range of 450 nm to 700 nm. That is, the quantum dot may have a maximum fluorescence emission wavelength (fluorescence? _Em ) at 450 nm to 700 nm.

Specifically, the quantum dot has a maximum fluorescence wavelength (fluorescence λ _em) quantum dot has a (e.g. green quantum dots), the maximum fluorescence wavelength (fluorescence λ _em) quantum dots (e. G. The red quantum dots) with at 580nm to 700nm from 450nm to 580nm or And combinations of these.

The green quantum dot may have an average particle diameter of 5 nm to 10 nm, and the red quantum dot may have an average particle diameter of 7 nm to 15 nm.

The quantum dot may have a full width at half maximum (FWHM) of 20 nm to 100 nm, for example, 20 nm to 80 nm, for example, 40 nm to 60 nm. When the quantum dots have a half width of the above range, the color purity is high when used as a color filter material as the color purity is high.

The quantum dot may be an organic material or an inorganic material or a hybrid of an organic material and an inorganic material.

The quantum dot may comprise a core and a shell surrounding the core. The core and the shell may each independently comprise a core, a core / shell, a core / a first shell / a second shell, , Alloys, alloys / shells, and the like, but the present invention is not limited thereto.

For example, the core may include at least one material selected from the group consisting of CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, GaN, GaP, GaAs, InP, InAs and alloys thereof , But is not limited thereto. The shell surrounding the core may include at least one material selected from the group consisting of CdSe, ZnSe, ZnS, ZnTe, CdTe, PbS, TiO, SrSe, HgSe and alloys thereof.

The structure of the quantum dot is not particularly limited, but in the case of quantum dots of the core / shell structure, the size (average particle size) of the entire quantum dot including the shell may be 1 nm to 15 nm, for example, 5 nm to 10 nm.

In order to improve the stability and dispersibility of the quantum dots, it is possible to stabilize quantum dots by substituting organic materials on the surface of the shell. The organic materials include thiol compounds, amine compounds, phosphine oxide compounds, acryl compounds, Si Compounds, and the like, but the present invention is not limited thereto.

In recent years, interest in the environment has greatly increased worldwide, and regulations on toxic substances have been strengthened. Therefore, instead of a luminescent material having a cadmium core, a quantum yield is lowered, but an environmentally friendly non-cadmium luminous material For example, InP / ZnS core / shell type quantum dots, InP / ZnSe / ZnS core / first shell / second shell type quantum dots However, it is not necessary to use a non-cadmium-based light emitting material.

For the dispersion stability of the quantum dot, the photosensitive resin composition according to one embodiment may further include a dispersant. The dispersant helps the quantum dots to be uniformly dispersed in the photosensitive resin composition, and both nonionic, anionic and cationic dispersants can be used. Specific examples thereof include polyalkylene glycols or esters thereof, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonic acid salts, carboxylic acid esters, carboxylic acid salts, alkylamide alkylene oxides Adducts, alkylamines, and the like, which may be used alone or in admixture of two or more. The dispersant may be used in an amount of 0.1% by weight to 100% by weight, for example, 10% by weight to 20% by weight, based on the solid content of the quantum dot.

The quantum dot may be included in an amount of 1% by weight to 30% by weight based on the total amount of the photosensitive resin composition according to one embodiment. When the quantum dots are included within the above ranges, it is possible to prevent the development of the light conversion characteristic inherent to the quantum dots and the decrease in the light conversion efficiency.

(B) binder resin

The binder resin may include an acrylic binder resin, a cadmium binder resin, or a combination thereof.

The acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable with the first ethylenically unsaturated monomer, and may be a resin containing at least one acrylic repeating unit.

The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing at least one carboxyl group, and specific examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof.

The first ethylenically unsaturated monomer may be included in an amount of 5% by weight to 50% by weight, for example, 10% by weight to 40% by weight based on the total amount of the acrylic binder resin.

The second ethylenically unsaturated monomer may be an aromatic vinyl compound such as styrene,? -Methylstyrene, vinyltoluene, or vinylbenzyl methyl ether; (Meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, benzyl (meth) acrylate, Unsaturated carboxylic acid ester compounds such as cyclohexyl (meth) acrylate and phenyl (meth) acrylate; Unsaturated carboxylic acid aminoalkyl ester compounds such as 2-aminoethyl (meth) acrylate and 2-dimethylaminoethyl (meth) acrylate; Carboxylic acid vinyl ester compounds such as vinyl acetate and vinyl benzoate; Unsaturated carboxylic acid glycidyl ester compounds such as glycidyl (meth) acrylate; A vinyl cyanide compound such as (meth) acrylonitrile; Unsaturated amide compounds such as (meth) acrylamide; These may be used singly or in combination of two or more.

Specific examples of the acrylic binder resin include polybenzyl methacrylate, (meth) acrylic acid / benzyl methacrylate copolymer, (meth) acrylic acid / benzyl methacrylate / styrene copolymer, (meth) acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, and (meth) acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, but not limited thereto, Or more may be used in combination.

The weight average molecular weight of the acrylic binder resin may be from 5,000 g / mol to 15,000 g / mol. 　 When the weight average molecular weight of the acrylic binder resin is within the above range, it has good adhesion with the substrate, good physical and chemical properties, and good viscosity.

The acid value of the acrylic binder resin may be 80 mgKOH / g to 130 mgKOH / g. When the acid value of the acrylic binder resin is within the above range, the resolution of the pixel pattern is excellent.

The cadmium binder resin may include a repeating unit represented by the following formula (1).

[Chemical Formula 1]

In Formula 1,

R ¹¹ and R ¹² are each independently a hydrogen atom or a substituted or unsubstituted (meth) acryloyloxy group,

R ¹³ and R ¹⁴ are each independently a hydrogen atom, a halogen atom or a substituted or unsubstituted C1 to C20 alkyl group,

Z ¹ is a single bond, O, CO, SO ₂ , CR ¹⁷ R ¹⁸ , SiR ¹⁹ R ²⁰ (wherein R ¹⁷ to R ²⁰ are each independently a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group) Is any one of the linking groups represented by formulas (1-1) to (1-11)

[Formula 1-1]

[Formula 1-2]

[Formula 1-3]

[Formula 1-4]

[Formula 1-5]

(In the formula (1-5)

R ^a is a hydrogen atom, an ethyl group, C ₂ H ₄ Cl, C ₂ H ₄ OH, CH ₂ CH = CH ₂ or a phenyl group.

[Chemical Formula 1-6]

[Chemical Formula 1-7]

[Chemical Formula 1-8]

[Chemical Formula 1-9]

[Chemical Formula 1-10]

[Formula 1-11]

Z ² is an acid anhydride residue,

t1 and t2 are each independently an integer of 0 to 4;

The weight average molecular weight of the cationic binder resin may be from 500 g / mol to 50,000 g / mol, such as from 1,000 g / mol to 30,000 g / mol. When the weight average molecular weight of the cationic binder resin is within the above range, pattern formation is good without residue during the production of the photosensitive organic film, no loss of film thickness during development, and good patterns can be obtained.

The cadmium-based binder resin may include a functional group represented by the following formula (2) on at least one of both terminals.

(2)

In Formula 2,

Z ³ may be represented by the following formulas (2-1) to (2-7).

[Formula 2-1]

(Wherein R ^b and R ^c are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, an ester group or an ether group)

[Formula 2-2]

[Formula 2-3]

[Chemical Formula 2-4]

[Chemical Formula 2-5]

Wherein R ^d is O, S, NH, a substituted or unsubstituted C1 to C20 alkylene group, a C1 to C20 alkylamine group, or a C2 to C20 alkenylamine group.

[Chemical Formula 2-6]

[Chemical Formula 2-7]

Examples of the cationic binder resin include fluorene-containing compounds such as 9,9-bis (4-oxiranylmethoxyphenyl) fluorene; Benzene tetracarboxylic dianhydride, benzene tetracarboxylic acid dianhydride, naphthalene tetracarboxylic dianhydride, biphenyl tetracarboxylic dianhydride, benzophenone tetracarboxylic dianhydride, pyromellitic dianhydride, cyclobutanetetracarboxylic dianhydride, Anhydride compounds such as lyrenetetracarboxylic acid dianhydride, tetrahydrofuran tetracarboxylic acid dianhydride, and tetrahydrophthalic anhydride; Glycol compounds such as ethylene glycol, propylene glycol, and polyethylene glycol; Alcohol compounds such as methanol, ethanol, propanol, n-butanol, cyclohexanol and benzyl alcohol; Propylene glycol methyl ethyl acetate, and N-methyl pyrrolidone; Phosphorus compounds such as triphenylphosphine; And an amine or an ammonium salt compound such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylamine, triethylamine, tributylamine, benzyltriethylammonium chloride, or the like.

When the binder resin is a cadmium-based binder resin, the photosensitive resin composition containing the binder resin is excellent in developability, is excellent in sensitivity upon photo-curing, and is excellent in fine pattern formation.

The binder resin may be contained in an amount of 1 wt% to 20 wt%, for example, 3 wt% to 15 wt% based on the total amount of the photosensitive resin composition. When the binder resin is contained within the above range, excellent sensitivity, residual film ratio, developability, resolution and straightness of the pattern can be obtained.

(C) Photopolymerization  Monomer

The photopolymerizable monomer may be a monofunctional or polyfunctional ester of (meth) acrylic acid having at least one ethylenically unsaturated double bond.

Since the photopolymerizable monomer has the ethylenically unsaturated double bond, sufficient polymerization is caused during exposure in the pattern formation step, whereby a pattern having excellent heat resistance, light resistance and chemical resistance can be formed.

Specific examples of the photopolymerizable monomer include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, neopentyl glycol Acrylate such as di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, bisphenol A di (meth) acrylate, pentaerythritol di (Meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol hexa (meth) acrylate, dipentaerythritol di Acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, bisphenol A epoxy (meth) acrylate, ethylene glycol There may be mentioned furnace methyl ether (meth) acrylate, trimethylolpropane tri (meth) acrylate, tris (meth) acryloyloxyethyl phosphate, novolak epoxy (meth) acrylate, and the like.

A commercially available product of the photopolymerizable monomer is exemplified as follows. The (meth) acrylic acid is one example of a polyfunctional ester, such as doah Gosei Kagaku Kogyo's (primary)社Aronix M-101 ^®, the same M-111 ^®, the same M-114 ^®; KAYARAD TC-110S ^® and TC-120S ^{® from} Nihon Kayaku Co., Ltd.; Osaka yukki the like Kagaku Kogyo (main)社of ^{V-158 ®, V-2311} ®. The (meth) transfer function of an example esters of acrylic acid are, doah Gosei Kagaku Kogyo (Note)社of Aronix M-210 ^®, copper or the like M-240 ^®, the same M-6200 ^®; KAYARAD HDDA ^® , HX-220 ^® and R-604 ^{® from} Nihon Kayaku Corporation; Osaka yukki the like Kagaku Kogyo Co., Ltd. of ^{社V-260 ®, V-} 312 ®, V-335 HP ®. Examples of the tri-functional ester of (meth) acrylic acid, doah Gosei Kagaku Kogyo (Note)社of Aronix M-309 ^®, the same M-400 ^®, the same M-405 ^®, the same M-450 ^®, Dong M -7100 ^® , copper M-8030 ^® , copper M-8060 ^® and the like; Nippon Kayaku (Note)社of KAYARAD TMPTA ^®, copper DPCA-20 ^{®, ®} copper -30, -60 ^® copper, copper ^® -120 and the like; Osaka yukki Kayaku high (primary)社of V-295 ^®, copper ^® -300, -360 ^® copper, copper -GPT ^®, copper -3PA ^®, and the like copper -400 ^®. These products may be used alone or in combination of two or more.

The photopolymerizable monomer may be treated with an acid anhydride to give better developing properties.

The photopolymerizable monomer may be contained in an amount of 1 wt% to 20 wt%, for example, 1 wt% to 15 wt% based on the total amount of the photosensitive resin composition. When the photopolymerizable monomer is contained within the above range, the pattern is formed with sufficient curing during exposure in the step of pattern formation, so that the reliability is excellent, and the heat resistance, light resistance, chemical resistance, resolution and adhesion of the pattern are also excellent.

(D) Light curing Initiator

The photopolymerization initiator is an initiator generally used in a photosensitive resin composition, for example, an acetophenone compound, a benzophenone compound, a thioxanone compound, a benzoin compound, a triazine compound, a oxime compound, Etc. may be used.

Examples of the acetophenone-based compound include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloroacetophenone, dichloro-4-phenoxyacetophenone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropanone, p-butyldichloroacetophenone, 1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one.

Examples of the benzophenone compound include benzophenone, benzoyl benzoic acid, methyl benzoyl benzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis (dimethylamino) benzophenone, '-Bis (diethylamino) benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, and 3,3'-dimethyl-2-methoxybenzophenone.

Examples of the thioxanthone compound include thioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2- Chlorothioxanthone and the like.

Examples of the benzoin compound include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyl dimethyl ketal.

Examples of the triazine-based compound include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis (trichloromethyl) -Dimethoxystyryl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4'-methoxynaphthyl) -4,6-bis (trichloromethyl) (Trichloromethyl) -s-triazine, 2- (p-tolyl) -4,6-bis (trichloromethyl) (Trichloromethyl) -6-styryl-s-triazine, 2- (naphtho-1-yl) - 4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxynaphthol-1-yl) -Bis (trichloromethyl) -6- (4-methoxystyryl) -s-triazine, and the like. .

Examples of the oxime compounds include O-acyloxime compounds, 2- (O-benzoyloxime) -1- [4- (phenylthio) phenyl] -1,2-octanedione, 1- -1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] ethanone, O-ethoxycarbonyl-a-oxyamino-1-phenylpropan- Can be used. Specific examples of the O-acyloxime-based compound include 1,2-octanedione, 2-dimethylamino-2- (4-methylbenzyl) -1- (4-morpholin- 2-oxime-O-benzoate, 1- (4-phenylsulfanylphenyl) -octane-1,2-dione -1-one oxime-O-acetate and 1- (4-phenylsulfanylphenyl) -butan-1-one oxime- O-acetate, and the like.

Examples of the aminoketone-based compound include 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone -1).

The photopolymerization initiator may be a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, or a nonimidazole compound in addition to the above compounds.

The photopolymerization initiator may be used in combination with a photosensitizer that generates a chemical reaction by absorbing light to be in an excited state and transferring its energy.

Examples of the photosensitizer include tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, dipentaerythritol tetrakis-3-mercaptopropionate and the like .

The photopolymerization initiator may be contained in an amount of 0.1 wt% to 5 wt%, for example, 0.3 wt% to 3 wt% with respect to the total amount of the photosensitive resin composition. When the photopolymerization initiator is contained within the above range, the photopolymerization initiator sufficiently undergoes curing during exposure in the pattern formation step, thereby obtaining excellent reliability, and is excellent in heat resistance, light resistance, chemical resistance, resolution and adhesion of the pattern, .

(F) Solvent

The photosensitive resin composition according to one embodiment may contain a solvent having compatibility with the quantum dots since it contains quantum dots instead of pigments or dyes as color materials. Thus, the photosensitive resin composition according to one embodiment can be cured The light conversion rate of the photosensitive resin film formed can be greatly improved.

Examples of the solvent having compatibility with the quantum dots include alkanes (R-H) such as pentane, hexane, heptane and the like; Aromatic hydrocarbons (Ar-H) such as toluene and xylene; Ethers (R-O-R) such as diisobutyl ether, dibutyl ether and the like; Alkyl halides (R-X) such as chloroform, trichloromethane and the like; Cycloalkanes such as cyclopropane, cyclobutane, cyclopentane, cyclohexane and the like; (Cyclo) alkyl acetates such as cyclohexyl acetate, pentyl acetate, hexyl acetate, dodecyl acetate, and the like; And ketones such as methyl isobutyl ketone, but are not limited thereto.

The photosensitive resin composition according to one embodiment may further contain, as a solvent, a solvent having compatibility with the quantum dots, as well as a solvent having compatibility with a binder resin, a photopolymerizable monomer, a photopolymerization initiator, a light diffusing agent and the like. However, the binder resin, the photopolymerizable monomer, the photopolymerization initiator, the light diffusing agent and the like have some compatibility with the solvent having compatibility with the quantum dots. However, the quantum dots are not limited to the binder resin, the photopolymerizable monomer, It is possible to use only a solvent having compatibility with the above quantum dots as a solvent or a solvent having compatibility with the above quantum dots And a solvent having compatibility with a binder resin, a photopolymerizable monomer, a photopolymerization initiator, a light diffusing agent, and the like may be mixed and used.

Examples of the solvent having compatibility with the above binder resin, photopolymerizable monomer, photopolymerization initiator, light diffusing agent and the like include alcohols such as methanol and ethanol; Glycol ethers such as ethylene glycol methyl ether, ethylene glycol ethyl ether and propylene glycol methyl ether; Cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate and diethyl cellosolve acetate; Carbitols such as methylethylcarbitol, diethylcarbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether and diethylene glycol diethyl ether; Propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate; Ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl- ; Saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate and isobutyl acetate; Lactic acid alkyl esters such as methyl lactate and ethyl lactate; Hydroxyacetic acid alkyl esters such as methylhydroxyacetate, ethylhydroxyacetate and butylhydroxyacetate; Alkoxyalkyl esters such as methoxy methyl acetate, methoxy ethyl acetate, methoxy butyl acetate, ethoxy methyl acetate, and ethoxy ethyl acetate; 3-hydroxypropionic acid alkyl esters such as methyl 3-hydroxypropionate and ethyl 3-hydroxypropionate; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate and methyl 3-ethoxypropionate; 2-hydroxypropionic acid alkyl esters such as methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate and propyl 2-hydroxypropionate; 2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate and methyl 2-ethoxypropionate; 2-hydroxy-2-methylpropionic acid alkyl esters such as methyl 2-hydroxy-2-methylpropionate and ethyl 2-hydroxy-2-methylpropionate; 2-alkoxy-2-methylpropionic acid alkyl esters such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; Esters such as 2-hydroxyethyl propionate, 2-hydroxy-2-methyl ethyl propionate, hydroxy ethyl acetate and methyl 2-hydroxy-3-methyl butanoate; Or ethyl pyruvate. Examples of the ketone acid esters include N-methylformamide, N, N-dimethylformamide, N-methylformanilide, N-methylacetamide, N, N-dimethylacetamide , N-methylpyrrolidone, dimethylsulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, But are not limited to, ethyl, diethyl oxalate, diethyl maleate,? -Butyrolactone, ethylene carbonate, propylene carbonate, phenyl cellosolve acetate and the like.

For example, in view of compatibility and reactivity, a solvent compatible with the binder resin, the photopolymerizable monomer, the photopolymerization initiator and the like is preferably a ketone such as cyclohexanone; Glycol ethers such as ethylene glycol monoethyl ether; Ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; Esters such as ethyl 2-hydroxypropionate; Carbitols such as diethylene glycol monomethyl ether; It is preferable to use propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate.

The solvent may be contained in an amount of 30% by weight to 80% by weight, for example, 35% by weight to 80% by weight, based on the total amount of the photosensitive resin composition. When the solvent is contained within the above range, the photosensitive resin composition has an appropriate viscosity, so that it can have excellent coating properties when it is coated with a large area using spin coating and slit.

(G) Thiol system  additive

In order to improve stability and dispersibility of the quantum dot, the photosensitive resin composition according to one embodiment may further include a thiol-based additive.

The thiol-based additive is substituted on the surface of the shell of the quantum dots to improve the dispersion stability of the quantum dots with respect to the solvent and stabilize the quantum dots.

The thiol-based additive may have 2 to 10, for example, 2 to 4 thiol (-SH) at the terminal thereof depending on its structure.

For example, the thiol-based additive may include at least two functional groups represented by the following formula (3) at the terminal.

(3)

In Formula 3,

L ³ and L ⁴ each independently represents a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C20 arylene group, Lt; RTI ID = 0.0 > C2-C20heteroarylene < / RTI >

For example, the thiol-based additive may be represented by the following general formula (4).

[Chemical Formula 4]

In Formula 4,

L ³ and L ⁴ each independently represents a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C20 arylene group, Lt; / RTI > is a C2 to C20 heteroarylene group,

n5 and n6 are each independently an integer of 0 or 1;

For example, in Formula 3 and Formula 4, each of L ³ and L ⁴ may independently be a single bond or a substituted or unsubstituted C1 to C20 alkylene group.

Specific examples of the thiol-based additive include pentaerythritol tetrakis (3-mercaptopropionate) represented by the following formula 5a, trimethylolpropane tris (3-mercaptopropionate) represented by the following formula 5b 3-mercaptopropionate), pentaerythritol tetrakis (mercaptoacetate) represented by the following formula 5c, pentaerythritol tetrakis (mercaptoacetate) represented by the following formula 5c, trimethylolpropane tris (mercaptoacetate) (2-mercaptoacetate) represented by the following formula (5e), Glycol di-3-mercaptopropionate represented by the following formula (5e), and combinations thereof. One can be said.

[Chemical Formula 5a]

[Chemical Formula 5b]

[Chemical Formula 5c]

[Chemical Formula 5d]

[Chemical Formula 5e]

The thiol-based additive may be included in an amount of 1 wt% to 10 wt%, for example, 1 wt% to 5 wt% based on the total amount of the photosensitive resin composition. If the amount of the thiol-based additive is less than 1% by weight, it is difficult to maintain the stability of each quantum dot in each process. If the amount of the thiol-based additive is more than 10% by weight, patternability of the photosensitive resin composition may be deteriorated, .

(H) Other additives

The photosensitive resin composition according to one embodiment includes malonic acid; 3-amino-1,2-propanediol; Silane coupling agents; Leveling agents; A fluorine-based surfactant, or a combination thereof.

For example, the photosensitive resin composition may further include a silane-based coupling agent having a reactive substituent such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group or an epoxy group in order to improve adhesion with a substrate or the like.

Examples of the silane-based coupling agent include trimethoxysilylbenzoic acid,? -Methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane,? -Isocyanate propyltriethoxysilane,? -Glycine (3,4-epoxycyclohexyl) ethyltrimethoxysilane, etc. These may be used singly or in combination of two or more.

The silane coupling agent may be included in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the silane coupling agent is contained within the above range, the adhesion and storage stability are excellent.

The above-mentioned photosensitive resin composition may further contain a surfactant such as a fluorine-based surfactant for the purpose of improving coatability and preventing defect formation, if necessary.

The fluorine is a surfactant, the ^{BM Chemie社BM-1000 ®,} BM-1100 ® , and the like; Mechacup F 142D ^® , copper F 172 ^® , copper F 173 ^® , copper F 183 ^® and the like manufactured by Dainippon Ink & Chemicals Incorporated; Sumitomo M. (Note)社Pro rod FC-135 ^®, the same FC-170C ^®, copper FC-430 ^®, the same FC-431 ^®, and the like; Asahi Grass Co., Saffron S-112 ^® of社, such S-113 ^®, the same S-131 ^®, the same S-141 ^®, the same S-145 ^®, and the like; Toray silicone (Note)社SH-28PA ^{®, ®} -190 copper, copper ^{-193 ®, SZ-6032 ®,} SF-8428 ® , and the like; Fluorinated surfactants commercially available under the names F-482, F-484, F-478 and F-554 of DIC Co., Ltd. can be used.

The fluorine-based surfactant may be used in an amount of 0.001 part by weight to 5 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the fluorosurfactant is contained within the above range, coating uniformity is ensured, no staining occurs, and wettability to the glass substrate is excellent.

In addition, a certain amount of other additives such as an antioxidant, a stabilizer and the like may be further added to the above photosensitive resin composition within a range that does not impair the physical properties.

Another embodiment provides a photosensitive resin film produced using the above-described photosensitive resin composition.

Another embodiment provides a color filter comprising the above-described photosensitive resin film. A method of manufacturing the color filter is as follows.

(1) Coating and Film Formation Step

The above-mentioned photosensitive resin composition is applied onto a predetermined pretreated substrate by a method such as spin or slit coat method, roll coating method, screen printing method, applicator method or the like to a desired thickness, for example, 9 to 10 탆 After coating, the solvent is removed by heating at a temperature of about 100 캜 for 1 minute to 10 minutes to form a coating film.

(2) Exposure step

In order to form a pattern necessary for the obtained coating film, a mask of a predetermined type is interposed therebetween and then an active line of 200 to 500 nm is irradiated. As the light source used for the irradiation, a low pressure mercury lamp, a high pressure mercury lamp, an ultra high pressure mercury lamp, a metal halide lamp, an argon gas laser, and the like can be used.

The exposure dose varies depending on the kind of each component of the photosensitive resin composition, the blending amount, and the dried film thickness. For example, when a high pressure mercury lamp is used, the exposure dose is 500 mJ / cm ² (By a 365 nm sensor).

(3) Development step

Following the above exposure step, an unnecessary portion is dissolved and removed by using an alkaline aqueous solution as a developing solution, so that only the exposed portion is left to form an image pattern.

(4) Post-treatment step

The image pattern obtained by the above-described development can be cured by heating again or by active ray irradiation or the like in order to obtain a pattern excellent in terms of heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength and storage stability.

By using the above-described photosensitive resin composition, it is possible to minimize a decrease in the light conversion rate due to the application and coating film formation step, the exposure step, the development step, the post-treatment step, and the like.

Hereinafter, preferred embodiments of the present invention will be described. However, the following examples are only a preferred embodiment of the present invention, and the present invention is not limited by the following examples.

(Preparation of photosensitive resin composition)

Example  1 to Example  7 and Comparative Example  1 to Comparative Example  7

The photosensitive resin compositions according to Examples 1 to 7 and Comparative Examples 1 to 4 were prepared using the following components with the compositions shown in Tables 1 and 2 below.

(1) The photopolymerization initiator is dissolved in a solvent (PGMEA). Add a photopolymerizable monomer, a binder resin, a thiol-based additive, and a fluorine-based surfactant to dissolve them sufficiently. Thereafter, the dispersion of the light diffusing agent is introduced and stirred until uniformly dispersed.

(2) The quantum dot powder and the dispersant are dissolved in a solvent (cyclohexyl acetate), and then mixed together with the binder resin to prepare a quantum dot-binder resin mixture.

(3) The solution of the above-mentioned (1) and the solution of the quantum dot-binder resin mixture of (2) were mixed thoroughly for 30 minutes and then filtered three times to remove impurities to prepare a photosensitive resin composition.

(A) Qdot

InP / ZnSe / ZnS quantum dots (fluorescence λ _em = 530 nm, FWHM = 40 nm to 60 nm, Green QD, Hansol Chemical Co.)

(B) binder resin

SM-400H (SMS社; M w = 7,000 g / mol)

(The weight average molecular weight of the binder resin was measured by gel permeation chromatography (GPC)).

(C) Photopolymerization  Monomer

Dipentaerythritol hexaacrylate (DPHA, Nippon Kayaku)

(D) Light curing Initiator

Oxime initiator (PBG-304, Tronyl)

(E) Light Diffuser

(E-1) rutile type titanium dioxide dispersion (TiO ₂ solid content 20 wt% in PGMEA, primary entrance: 100 nm, secondary entrance: 160 nm, MP414_160, Mikuni)

(E-2) rutile type titanium dioxide dispersion (TiO ₂ solid content 20 wt% in PGMEA, primary entrance: 100 nm, secondary entrance: 180 nm, MP414_180, Mikuni)

(E-3) rutile type titanium dioxide dispersion (TiO ₂ solid content 20 wt% in PGMEA, primary entrance: 100 nm, secondary entrance: 200 nm, MP414_200, Mikuni)

(E-4) rutile type titanium dioxide dispersion (TiO ₂ solid content 20 wt% in PGMEA, primary entrance: 100 nm, secondary entrance: 240 nm, MP414_240, Mikuni)

(E-5) rutile type titanium dioxide dispersion (TiO ₂ solid content 20 wt% in PGMEA, primary entrance: 80 nm, secondary entrance: 170 nm, MP386, Mikuni)

(E-6) rutile type titanium dioxide dispersion (TiO ₂ solid content 20 wt% in PGMEA, primary entrance: 500 nm, secondary entrance: 180 nm ,, MP389_240, Mikuni)

(E-7) An anatase type titanium dioxide dispersion (TiO ₂ solid content 20 wt% in PGMEA, primary entrance: 150 nm, secondary entrance: 170 nm, Aldrich)

(E-8) rutile type titanium dioxide dispersion (TiO ₂ solid content 20 wt% in PGMEA, primary entrance: 250 nm, secondary entrance: 230 nm, SDT47, Iridos)

(E-9) rutile type titanium dioxide dispersion (TiO ₂ solid content 20 wt% in PGMEA, primary entrance: 250 nm, secondary entrance: 210 nm, SDT74, Iridos)

(E-10) rutile type titanium dioxide dispersion (TiO ₂ solid content 20 wt% in PGMEA, primary entrance: 170 nm, secondary entrance: 180 nm, SDT74, Iridos)

(F) Solvent

(F-1) cyclohexyl acetate

(F-2) Propylene glycol monomethyl ether acetate (PGMEA)

(G) Thiol system  additive

Glycol di-3-mercaptopropionate ^{(THIOCURE ® GDMP, BRUNO BOCK社} )

(H) Other additives

Fluorine-based surfactant (F-554, DIC)

(Unit: wt%) Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 (A) Quantum dot 18 18 18 18 18 18 18 (B) binder resin 3 3 3 3 3 3 2.8 (C) a photopolymerizable monomer 2 2 2 2 2 2 2 (D) a photopolymerization initiator 0.3 0.3 0.3 0.3 0.3 0.3 0.3 (E) Light diffusing agent (E-1) 8 - - - - - - (E-2) - 8 - - - - - (E-3) - - 8 - - - 11 (E-4) - - - 8 - - - (E-5) - - - - 8 - - (E-6) - - - - - 8 - (F) Solvent (F-1) 30 30 30 30 30 30 28.6 (F-2) 36.5 36.5 36.5 36.5 36.5 36.5 35.1 (G) Thiol-based additives 2 2 2 2 2 2 2 (H) Other additives 0.2 0.2 0.2 0.2 0.2 0.2 0.2 Total 100 100 100 100 100 100 100

(Unit: wt%) Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 (A) Quantum dot 18 18 18 18 (B) binder resin 3 3 3 3 (C) a photopolymerizable monomer 2 2 2 2 (D) a photopolymerization initiator 0.3 0.3 0.3 0.3 (E) Light diffusing agent (E-7) 8 - - - (E-8) - 8 - - (E-9) - - 8 - (E-10) - - - 8 (F) Solvent (F-1) 30 30 30 30 (F-2) 36.5 36.5 36.5 36.5 (G) Thiol-based additives 2 2 2 2 (H) Other additives 0.2 0.2 0.2 0.2 Total 100 100 100 100

Evaluation 1: blue Light conversion rate  And Light retention rate  evaluation

Each of the photosensitive resin compositions prepared in Examples 1 to 6 and Comparative Examples 1 to 4 was coated on a glass substrate with a thickness of 6 占 퐉 using a spin coater (Mikasa, Opticoat MS-A150, 150 rpm) Then, pre-baking (PRB) was performed at 100 ° C for 2 minutes by using a hot plate and exposure was performed at 60 mJ / cm ² to 100 mJ / cm ² using an exposure machine (Ushio, ghi broadband) And the post-baking (POB) was carried out at 180 ° C for 30 minutes in a convection clean oven (jongro), and the blue light conversion rate was measured.

In the post-baking step, the light absorption rate and the light conversion rate of the blue light incident from the BLU to green were evaluated, and the results are shown in Table 3 below. Here, the blue light conversion rate was measured with a QE-5000 instrument manufactured by Otsuka, a bare glass was placed on a blue BLU covered with a diffusing film, the reference was first measured by a detector, and then the same procedure as in Examples 1 to 6 and Comparative Example (Green / Blue) was measured by calculating the increase amount of the peak converted to green against the decrease amount of the blue light absorption peak by placing a monolayer coated with the photosensitive resin composition according to Comparative Example 1 to Comparative Example 4. Then,

Evaluation 2: sedimentation evaluation

20 ml of the photosensitive resin compositions prepared in Examples 1 to 7 and Comparative Examples 1 to 4 were allowed to stand at room temperature for 6 days.

Due to the physical density of TiO ₂ , precipitation occurs naturally. Ref. (Comparative Example 3).

Blue light conversion rate (after POB) (%) Precipitation (Ref,%) Remarks Example 1 23.3 -49% Surface uniformity after development Example 2 23.9 -50% Surface uniformity after development Example 3 24.4 -46% Surface uniformity after development Example 4 24.5 -48% Surface unevenness after development Example 5 23.9 -62% Surface uniformity after development Example 6 21.8 -75% Surface uniformity after development Example 7 25.4 -47% Surface uniformity after development Comparative Example 1 22.8 -40% Surface uniformity after development Comparative Example 2 25.6 + 30% Surface unevenness after development Comparative Example 3 25.4 Ref Surface unevenness after development Comparative Example 4 25.6 -27% Surface uniformity after development

In Table 3, when the primary particle diameter and the secondary particle diameter of the light diffusing agent are controlled to 80 to 200 nm and 120 to 250 nm, respectively, a light diffusing agent having no primary particle diameter and secondary particle diameter in the above range is used It can be confirmed that the degree of sedimentation is improved. Furthermore, if the primary particle diameter or the secondary particle diameter of the light diffusing agent exceeds the specific particle diameter, the surface unevenness of the coating film after development occurs, so that the primary particle size and the secondary particle diameter of the light- It can also be verified that it is necessary. In addition, products containing the above range of particles but having a crystal phase of Anatase (Comparative Example 1) exhibited excellent sedimentation characteristics, but had a low light conversion rate. As in Example 7, by increasing the content of the dispersion, it was possible to maximize the improvement of the sedimentation degree while maintaining optical characteristics similar to those of Comparative Example 3. [

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims. As will be understood by those skilled in the art. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

Claims (11)

(A) quantum dots;
(B) a binder resin;
(C) a photopolymerizable monomer;
(D) a photopolymerization initiator;
(E) a light diffusing agent; And
(F) Solvent
Lt; / RTI >
Wherein the light diffusing agent has a primary particle diameter of 80 to 200 nm and a secondary particle diameter of 120 to 250 nm.
The method according to claim 1,
Wherein the light diffusing agent has a primary particle diameter of 80 to 120 nm and a secondary particle diameter of 160 to 230 nm.
The method according to claim 1,
Wherein the light-diffusing agent comprises barium sulfate, calcium carbonate, titanium dioxide, zirconia, or a combination thereof.
The method of claim 3,
Wherein the light diffusing agent is rutile titanium dioxide.
The method according to claim 1,
The quantum dots are 450nm to 580nm at the maximum fluorescence wavelength (fluorescence λ _em) having a quantum dot, the quantum dot from 580nm to 700nm with a maximum fluorescence wavelength (fluorescence λ _em) or a photosensitive resin composition comprising a combination of the two.
The method according to claim 1,
Wherein the photosensitive resin composition further comprises (G) a thiol-based additive.
The method according to claim 6,
Wherein the thiol-based additive is contained in an amount of 1% by weight to 10% by weight based on the total amount of the photosensitive resin composition.
The method according to claim 1,
The above-mentioned photosensitive resin composition is characterized in that the total amount of the photosensitive resin composition
1 to 30% by weight of the quantum dot (A);
1 to 20% by weight of the binder resin (B);
1 to 20% by weight of the (C) photopolymerizable monomer;
0.1 to 5% by weight of the photopolymerization initiator (D);
5% to 15% by weight of the (E) light-diffusing agent; And
30% to 80% by weight of (F)
.
The method according to claim 1,
The photosensitive resin composition may include malonic acid; 3-amino-1,2-propanediol; Silane coupling agents; Leveling agents; A fluorine-based surfactant, or a combination thereof.
A photosensitive resin film produced by using the photosensitive resin composition of any one of claims 1 to 9.
A color filter comprising the photosensitive resin film of claim 10.

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