KR20190010232A - Pressure mapping apparatus and method of cleaning a glass substrate using the same - Google Patents

Abstract

Provided is a pressure mapping device comprising: a support substrate; a plurality of pressure sensors arranged on the support substrate and capable of outputting a signal corresponding to an applied pressure; a moisture-proofing pouch surrounding the support substrate; and an analyzing device configured so as to receive a signal from the plurality of pressure sensors, and to output a pressure map on the support substrate in real-time using the input signal. According to an embodiment of the present invention, by using the pressure mapping device and the method of cleaning the glass substrate using the same, an objective and quantitative inspection is able to be performed without deviation among workers during a cleaning process, thereby greatly reducing defective products such as particle defects.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure mapping apparatus and a glass substrate cleaning method using the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure mapping apparatus and a glass substrate cleaning method using the same, and more particularly, to a pressure mapping apparatus and a glass substrate cleaning method using the pressure mapping apparatus that enable objective and quantitative inspection without deviation between workers in a cleaning process .

Consumers' demand for the surface quality of glass substrates has become increasingly demanding, and the possibility of particle defects is increasingly increasing as the size of products using glass substrates increases.

During the manufacturing process of glass substrates, there are few equipment that can be subjected to objective and quantitative inspection or evaluation, especially in equipment for cleaning processes, which is an obstacle to the reduction of particle defects. In addition, it is also required to reduce the quality nonuniformity due to the deviation between the workers in the cleaning process.

SUMMARY OF THE INVENTION The present invention provides a pressure mapping apparatus capable of performing an objective and quantitative inspection without deviation between workers in a cleaning process.

A second object of the present invention is to provide a glass substrate cleaning method capable of greatly reducing defective products such as particle defects.

The present invention, in order to achieve the first technical object, A plurality of pressure sensors arranged on the supporting substrate and capable of outputting a signal corresponding to an applied pressure; And an analyzing device configured to receive the signal from the plurality of pressure sensors and to output a pressure map on the supporting substrate using the input signal, to provide.

Wherein the pressure sensor comprises a top conductor layer and a bottom conductor layer spaced apart from the top conductor layer and disposed below the top conductor layer, the top conductor layer comprising a first conductor having a first electrode and a second conductor And the upper conductor layer may be configured to be deformable by the applied pressure to be contactable with the lower conductor layer.

The pressure mapping device may further include lead lines connected to the first electrode and the second electrode of the pressure sensor and extending to a connector provided on one side of the supporting substrate. Further, the analyzing apparatus can be configured to receive the signal through the connector and the signal cable.

In some embodiments, the first conductor portion and the second conductor portion may be configured to be deformed in proportion to applied pressure to increase the contact area with the lower conductor layer. Wherein the first conductor portion includes a plurality of parallel first fingers, the second conductor portion includes a plurality of parallel second fingers, and the plurality of first fingers and the second plurality of fingers The second fingers can be arranged to be alternately positioned with respect to each other.

In some embodiments, the pressure sensor further comprises a spacer under the first electrode and the second electrode, and spacing between the upper conductor layer and the lower conductor layer can be maintained by the spacer.

The supporting substrate may be a flexible substrate. The plurality of pressure sensors may be arranged in a lattice on the supporting substrate.

In some embodiments, the pressure mapping device may further comprise a moisture-resistant pouch surrounding the support substrate. The analyzer may be configured to output a pressure map on the support substrate in real time using the input signal.

According to another aspect of the present invention, there is provided a method for manufacturing a friction material, comprising: disposing a pressure mapping device on a lower portion of a plurality of friction modifying portions; Lowering the plurality of friction washers into a cleaning position; Mapping the pressures applied from the plurality of friction cleaners using a pressure mapping device; Tuning downward pressure characteristics of the plurality of friction modifiers based on the mapped pressures; Disposing a glass substrate under the plurality of friction cleaning units; And a step of cleaning the glass substrate using the plurality of friction cleaning units. The pressure mapping device may be as described above.

In some embodiments, mapping the applied pressures may include determining whether the pressure applied from each of the friction cleaners is outside the reference pressure value range. At this time, the step of tuning the downward pressure characteristics of the plurality of friction calipers may include adjusting the installation height for the friction caliper whose applied pressure is out of the reference pressure value range. Optionally, each of the plurality of friction modifying portions is configured to be lowered to a cleaning position by pneumatic or hydraulic pressure, and wherein tuning the downward pressure characteristics of the plurality of friction modifying portions comprises providing And adjusting the set value of the pneumatic or hydraulic pressure.

In some embodiments, the glass substrate may move in a horizontal direction while the step of cleaning the glass substrate is performed. The plurality of friction modifying units include: a first row aligned at regular intervals in a transverse direction perpendicular to a moving direction of the glass substrate; And a second row aligned at regular intervals in a transverse direction parallel to the alignment direction of the first column. At this time, one of the friction modifying portions of the second row may be disposed to be spaced apart from the adjacent two friction modifying portions of the first row in the moving direction of the glass substrate.

In some embodiments, the step of cleaning the glass substrate using the plurality of friction cleaning units may comprise the step of supplying the cleaning liquid. In some embodiments, the analyzing device can be configured to output a pressure map on the supporting substrate in real time using the input signal.

The pressure mapping apparatus according to the embodiments of the present invention and the glass substrate cleaning method using the same can provide an objectively and quantitatively inspecting without deviation between the workers in the cleaning process and greatly reduce the defective product such as particle defects have.

1 is a conceptual diagram schematically showing a pressure mapping apparatus according to an embodiment of the present invention.
2A is a conceptual view showing a pressure sensor according to an embodiment of the present invention.
FIG. 2B is a cross-sectional side view of the pressure sensor of FIG. 2A taken along line BB '.
3A and 3B are side views conceptually showing a deformation state of the first and second fingers according to an applied pressure.
4 is a schematic view showing a connection structure between pressure sensors and a connector according to an embodiment of the present invention.
5 is an exemplary block diagram of the analysis apparatus.
FIG. 6 is a pressure contour map showing the magnitude of a pressure according to an area and a position under pressure through a pressure mapping device manufactured according to an embodiment of the present invention.
7 is a conceptual view showing a pressure sensor according to another embodiment of the present invention.
8 is a side sectional view showing a pressure sensor according to another embodiment of the present invention.
9A to 9C are cross-sectional views illustrating a method of manufacturing a pressure sensor according to an embodiment of the present invention.
10 is a flowchart showing a cleaning method of a glass substrate according to an embodiment of the present invention in order.
11 is a flowchart detailing the steps of mapping the pressures applied from the plurality of friction cleaners.
12 is a schematic view showing a pressure mapping method in which a plurality of pressure sensor units are disposed under the friction cleaning part.
13 is a schematic view showing a cleaning process of a glass substrate according to an embodiment of the present invention in a plan view.
FIGS. 14 and 15 are images showing the results of performing pressure mapping using the pressure mapping apparatus according to an embodiment of the present invention with respect to the friction cleaning units composed of five rows and in a cleaning position.
16A and 16B are images showing a pressure contour map before and after tuning the downward pressure characteristic of each of the friction modifiers using the pressure mapping system according to an embodiment of the present invention.
FIG. 17 is a graph showing the number of particle defective points (locations) according to the changes in FIGS. 16A and 16B. FIG.
18A and 18B show the change in the number of defective particle positions before and after tuning downward pressure characteristics of each of the friction modifiers using a pressure mapping system according to an embodiment of the present invention with respect to other glass product manufacturing processes Graphs.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the inventive concept may be modified in various other forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. Embodiments of the inventive concept are desirably construed as providing a more complete understanding of the inventive concept to those skilled in the art. The same reference numerals denote the same elements at all times. Further, various elements and regions in the drawings are schematically drawn. Accordingly, the inventive concept is not limited by the relative size or spacing depicted in the accompanying drawings.

The terms first, second, etc. may be used to describe various components, but the components are not limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and conversely, the second component may be referred to as a first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the inventive concept. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the expressions " comprising " or " having ", etc. are intended to specify the presence of stated features, integers, steps, operations, elements, parts, or combinations thereof, It is to be understood that the invention does not preclude the presence or addition of one or more other features, integers, operations, components, parts, or combinations thereof.

Unless otherwise defined, all terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the inventive concept belongs, including technical terms and scientific terms. In addition, commonly used, predefined terms are to be interpreted as having a meaning consistent with what they mean in the context of the relevant art, and unless otherwise expressly defined, have an overly formal meaning It will be understood that it will not be interpreted.

If certain embodiments are otherwise feasible, the particular process sequence may be performed differently from the sequence described. For example, two processes that are described in succession may be performed substantially concurrently, or may be performed in the reverse order to that described.

In the accompanying drawings, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, embodiments of the present invention should not be construed as limited to any particular shape of the regions shown herein, but should include variations in shape resulting from, for example, manufacturing processes. All terms " and / or " as used herein encompass each and every one or more combinations of the recited elements. In addition, the term " substrate " as used herein can mean a substrate itself, or a laminated structure including a substrate and a predetermined layer or film formed on the surface thereof. Further, in the present specification, the term " surface of a substrate " may mean an exposed surface of the substrate itself, or an outer surface such as a predetermined layer or a film formed on the substrate.

1 is a conceptual diagram schematically showing a pressure mapping apparatus 100 according to an embodiment of the present invention.

1, the pressure mapping apparatus 100 includes a support substrate 110, a plurality of pressure sensors 120 arranged on the support substrate 110, a moisture-proof pouch 120 surrounding the support substrate 110, a pouch 130 and an analyzer 140 receiving signals from the plurality of pressure sensors and outputting a pressure map on the supporting substrate 110 in real time.

The support substrate 110 may be any substrate having flexibility and may have a film form. For example, the support substrate 110 may be formed of a material selected from the group consisting of polyethylene terephthalate (PET), polyethylenenaphthalate, polybutylene terephthalate (PBT), high density polyethylene (HDPE), low density polyethylene polyethylene, LDPE), polypropylene (PP), polycarbonate (PC), polyvinylchloride (PVC), polymethyl (meth) acrylate (PMMA), triacetylcellulose , Norbornene resin, polyester, or polystyrene (PS), but is not limited thereto. The thickness of the support substrate 110 may be between about 50 microns and about 3 mm.

A plurality of pressure sensors 120 may be arranged on the support substrate 110 at regular intervals or at uneven intervals. The pressure sensors 120 may be configured to output an electrical signal corresponding to the pressure applied to the upper portion thereof. 2A is a conceptual diagram showing a pressure sensor 120 according to an embodiment of the present invention. FIG. 2B shows a cross-sectional side view of the pressure sensor 120 of FIG. 2A taken along line B-B '.

2A and 2B, the pressure sensor 120 may include a top conductor layer 122 and a bottom conductor layer 124.

The upper conductor layer 122 may include a first conductor portion 122a and a second conductor portion 122b. The first conductive portion 122a may have a first electrode 122ae and the second conductive portion 122b may have a second electrode 122be.

The upper conductor layer 122 may be made of a metal material and may be formed of a metal such as copper (Cu), aluminum (Al), nickel (Ni), zinc (Zn), iron (Fe) ), Platinum (Pt), cobalt (Co), tungsten (W), titanium (Ti), tantalum (Ta), chromium (Cr), manganese (Mn), zirconium But is not limited thereto. In some embodiments, the upper conductor layer 122 may be formed of a conductive carbon-based material such as graphite, graphene, carbon nanotube, fullerene, and the like.

The first conductor portion 122a and the second conductor portion 122b may be spaced apart from each other by a predetermined distance. In some embodiments, the first conductor portion 122a includes a plurality of parallel first fingers 122af and a first connection portion 122ac connecting the plurality of first fingers 122af . In some embodiments, the second conductor portion 122b includes a plurality of parallel second fingers 122bf and a second connection portion 122bc connecting the plurality of second fingers 122bf .

The plurality of second fingers 122bf parallel to the plurality of first fingers 122af parallel to each other may be arranged alternately and in a straight line as shown in FIG. 2A.

The first fingers 122af and the first connection part 122ac may be deformed by the pressure applied from the upper part to contact the lower conductor layer 124. [ In addition, the second fingers 122bf and the second connection portion 122bc may be deformed by the pressure applied from the upper portion to be in contact with the lower conductor layer 124. The deformation of the first and second fingers 122af and 122bf and the first and second connection portions 122ac and 122bc may be proportional to the pressure applied to the upper portion thereof.

An upper insulating layer 128 may be provided on the upper conductive layer 122. The upper insulating layer 128 may also serve as a supporting substrate for the upper conductive layer 122 in the manufacturing process of the pressure sensor 120 and also protect the upper conductive layer 122.

In some embodiments, the area in which the first and second fingers 122af, 122bf, and / or the first and second connections 122ac, 122bc contact the lower conductor layer 124, May depend on the pressure applied to the top. More specifically, the area in which the first and second fingers 122af and 122bf and / or the first and second connection portions 122ac and 122bc are in contact with the lower conductor layer 124, It can be proportional to the pressure applied to the upper part.

3A and 3B are side views conceptually showing deformation states of the first and second fingers 122af and 122bf according to the applied pressure.

Referring to FIG. 3A, the first and second fingers 122af and 122bf may be deformed to physically contact the lower conductor layer 124 at a first pressure P1. At this time, the second fingers 122bf may contact the lower conductor layer 124 with a contact area corresponding to the width W1.

Referring to FIG. 3B, when a second pressure P2, which is a pressure higher than the first pressure P1, is applied, the first and second fingers 122af and 122bf are deformed more than in FIG. And may be in contact with the conductor layer 124. As the second fingers 122bf are further deformed, the second fingers 122bf may contact the lower conductor layer 124 with a contact area corresponding to a width W2 greater than the width W1.

As the area of contact between the first and second fingers 122af and 122bf and / or the first and second connection portions 122ac and 122bc is increased, The current flowing through the lower conductor layer 124 increases with respect to a predetermined voltage applied between the first electrode 122 and the second electrode 122be. Accordingly, the relationship between the current and the applied pressure is established and the magnitude of the applied pressure can be known by measuring the correlation current value.

The lower conductor layer 124 may be spaced apart from the upper conductor layer 122 and disposed below the upper conductor layer 122. The lower conductor layer 124 may be formed of a conductor such as a metal or a carbon-based material. The metal or carbon-based material that can be used as the material of the lower conductor layer 124 is the same as that described above with respect to the upper conductor layer 122, so that further explanation is omitted here.

2B, the bottom conductor layer 124 extends over the entire area of the support substrate 110, but in some embodiments the bottom conductor layer 124 may include one pressure sensor 120 Lt; RTI ID = 0.0 > cell region < / RTI > That is, the lower conductor layers of the two neighboring pressure sensors 120 may be electrically isolated from each other.

The upper conductor layer 122 and the lower conductor layer 124 may be electrically separated from each other by the spacers 126. The spacers 126 support spacings between the upper and lower conductor layers 122 and 124 when pressure is applied from the top of the upper conductor layer 122 so that spacers 126 are spaced apart And the upper conductor layer 122 may be deformed where the spacers 126 are not disposed.

The spacers 126 may be comprised of any electrically insulating material, such as, for example, polymeric resin, electrically insulating metal oxide, electrically insulating metal nitride, undoped silicon oxide, undoped silicon nitride, or combinations thereof ≪ / RTI >

Referring again to FIG. 1, the moisture-proof pouch 130 may be configured to surround the support substrate 110 provided with a plurality of pressure sensors 120 on its surface. The moisture-proof pouch 130 surrounds the support substrate 110 to prevent liquid components such as moisture and chemicals used for cleaning from coming into direct contact with the pressure sensors 120 .

The moisture-proof pouch 130 may be made of a flexible material. In some embodiments, the support substrate 110 may be made of the same or different material. For example, the moisture-proof pouch 130 may be made of polyethylene terephthalate (PET), polyethylenenaphthalate, polybutylene terephthalate (PBT), high density polyethylene (HDPE), low density polyethylene (LDPE), polypropylene (PP), polycarbonate (PC), polyvinylchloride (PVC), polymethyl (meth) acrylate (PMMA) But are not limited to, triacetylcellulose, norbornene resin, polyester, or polystyrene (PS).

The moisture-proof pouch 130 may expose the connector 150 for electrical connection between the plurality of pressure sensors 120 and an analyzer 140 described later. The connector 150 may be electrically connected to the plurality of pressure sensors 120 through a lead line.

4 is a schematic view showing a connection structure between the pressure sensors 120 and the connector 150 according to an embodiment of the present invention.

Referring to FIG. 4, a plurality of pressure sensors 120 may be arranged according to a predetermined rule. Although the four pressure sensors 120 are shown as being arranged in one direction in FIG. 4, the number of pressure sensors 120 may be less or greater than this, and in some embodiments, (120) may be arranged in a lattice form. However, the present invention is not limited thereto. The first electrodes of the plurality of pressure sensors 120 disposed in one column may be connected to the first lead line 160a which is common to each other. The second electrodes of the plurality of pressure sensors 120 may be connected to a common second lead line 160b.

The first lead line 160a and the second lead line 160b may be electrically connected to the terminals of the connector 150. [ The connector 150 may be one in which the connection terminals are arranged at regular intervals or a predetermined standard such as a serial advanced technology attachment (SATA) standard, a parallel advanced technology attachment (PATA) standard, or a small computer system interface And may be a connector capable of sending and receiving signals to / from an external device. Here, the SATA standard covers not only SATA-1 but also all SATA-related standards such as SATA-2, SATA-3, and e-SATA (external SATA). The PATA standard covers all IDE-related standards such as integrated drive electronics (IDE) and enhanced-IDE (E-IDE).

The analyzer 140 may receive an electrical signal from the plurality of pressure sensors 120. The electrical signal may be a current value measured at each of the pressure sensors 120, or may be secondary data obtained by processing data of these current values.

FIG. 5 is an exemplary block diagram of the analysis device 140. FIG.

5, the analyzer 140 includes a controller 2010, an input / output device (I / O) 2020, a memory 2030, and an interface 2040, each of which includes a bus 2050 .

The controller 2010 may include at least one of a microprocessor, a digital signal processor, or similar processing devices. The input / output device 2020 may include at least one of a keypad, a keyboard, and a display. The memory 2030 may be used to store instructions executed by the controller 2010. [ For example, the memory 2030 may be used to store user data.

In some embodiments, the interface 2040 may be configured to be coupled to the connector 150 (see FIG. 4).

The analyzer 140 may be configured to process a signal (or data) through the connector 150 and the interface 2040 and process the same to generate a contour map as shown in FIG. 6 . FIG. 6 is a pressure contour map showing the magnitude of a pressure according to an area and a position under pressure through a pressure mapping device manufactured according to an embodiment of the present invention. The pressure contour map may be output through an input / output device 2020 such as a display device.

The analyzer 140 may include a program and / or a routine that can generate the pressure contour map. These programs and / or routines are commercialized and therefore, the detailed description is omitted here.

7 is a conceptual diagram showing a pressure sensor 220 according to another embodiment of the present invention.

Referring to FIG. 7, the pressure sensor 120 is the same as the pressure sensor 120 shown in FIG. 2A, except that the first electrode 122ae and the second electrode 122be are connected by the bypass line 122c. Therefore, the description of common elements will be omitted, and the following description will focus on differences.

Since the bypass line 122c is present, a current may flow between the first electrode 122ae and the second electrode 122be regardless of whether the pressure is applied or not. When pressure is applied to the upper portion of the pressure sensor 220 to deform the first fingers 122af and the second fingers 122bf, the lower fingers 122f and the second fingers 122bf contact the lower conductor layer 124 . In this case, a path through which a current flows between the first electrode 122ae and the second electrode 122be is further extended in addition to the bypass line 122c, so that a path between the first electrode 122ae and the second electrode 122be The flowing current is increased.

The sensitivity of the measurement of the current value flowing between the first electrode 122ae and the second electrode 122be may be adjusted by adding the bypass line 122c as in the pressure sensor 220 of FIG.

8 is a side cross-sectional view showing a pressure sensor 320 according to another embodiment of the present invention.

Referring to FIG. 8, the pressure sensor 120 is the same as the pressure sensor 120 shown in FIG. 2B except that a dome-shaped protrusion 129 is further provided on the upper insulating layer 128. Therefore, the description of common elements will be omitted, and the following description will focus on differences.

The protruding portion 129 can promote the fingers 122af and 122bf to be deformed even when the pressure is applied from the outside to the relatively small pressure or the lateral pressure. In other words, since the projecting portion 129 can concentrate the area where the pressure is applied when the pressure is applied from the outside to the area of the projecting portion 129, deformation of the fingers 122af and 122bf can be promoted even with a relatively small pressure have.

Also, since the protruding portion 129 has a protruding shape, it is possible to transmit a force or a pressure acting in the lateral direction to the lower fingers 122af and 122bf.

Therefore, the sensitivity of the pressure sensor 320 can be increased by the protrusion 129.

9A to 9C are cross-sectional views illustrating a method of manufacturing the pressure sensor 120 according to an embodiment of the present invention.

Referring to FIG. 9A, an upper conductive layer 122 is formed on the upper insulating layer 128. Various methods may be used to form the pattern of the upper conductive layer 122. For example, after forming a conductive material film on the upper insulating film 128, patterning may be performed by photolithography or the like. Alternatively, a sacrificial layer pattern may be formed on the upper insulating layer 128, a conductive material layer may be deposited conformally by a method such as chemical vapor deposition (CVD), and the sacrificial layer pattern may be removed to remove unnecessary The patterning may be performed by lift-off the conductive material film.

In FIG. 9A, the upper conductive layer 122 is disposed on the lower surface of the upper insulating layer 128, but the vertical direction may be changed.

Referring to FIG. 9B, a spacer 126 may be formed at an appropriate position of the upper conductive layer 122. The spacer 126 may be formed by a method such as printing, screen printing, doctor blade, and the like, and is not particularly limited. When an inorganic material is used as the spacer 126, the spacer 126 may be formed by physical vapor deposition (PVD), CVD, or the like.

Referring to FIG. 9C, a lower conductor layer 124 may be formed on the support substrate 110 and combined with the structure shown in FIG. 9B. The supporting substrate 110 and the lower conductor layer 124 have been described in detail in the description of FIG. 1, and a further explanation will be omitted here. The lower conductor layer 124 may be formed on the supporting substrate 110 by a method such as coating, plating, or vapor deposition.

10 is a flowchart showing a cleaning method of a glass substrate according to an embodiment of the present invention in order.

The glass substrate can be cleaned by a plurality of friction cleaners arranged at regular intervals in the transverse direction. The friction modifiers may be, for example, at least one of a brush, a woven fabric, a nonwoven fabric, a felt, a sponge, and a fabric, but the present invention is not limited thereto.

In order to clean the glass substrate, it is first determined whether the plurality of friction cleaning units can press the glass substrate with appropriate pressure (S110, S120, S130). If the plurality of friction cleaning units can not press the glass substrate with proper pressure, the downward pressure characteristics of the respective friction washers are tuned (S140). Then, the glass substrate is placed under the plurality of friction cleaning units and a cleaning process is performed (S150, S160). Each step will be described below.

First, a pressure mapping device is disposed below the plurality of friction modifying units (S110). In particular, the pressure sensor unit of the pressure mapping device may be disposed under the plurality of friction cleaning portions, and the analyzing device may be spaced apart and connected to the pressure sensor unit through a cable. 12, if the entire width of the plurality of friction modifying portions 201 is large and is difficult to be covered by one pressure sensor unit (PSU), a plurality of pressure chambers The sensor units (PSU) can be arranged at the same time.

Subsequently, the plurality of friction cleaning units are lowered to the cleaning position to apply pressure to the pressure sensor unit (S120). Since the plurality of friction cleaning units are in the cleaning position, the pressure applied to the pressure sensor unit at this time is substantially equal to the pressure applied to the glass substrate at the time of actual cleaning of the glass substrate. Meanwhile, since the pressure sensor unit is protected by the moisture-proof pouch 130 (see FIG. 1), it is safe from moisture and chemical substances.

Subsequently, the pressures applied from the plurality of friction cleaners are mapped to determine whether the down pressure characteristic is appropriate (S130). This step is described in more detail in Fig.

Referring to FIG. 11, first, the pressure value for each position of each pressure mapping range can be calculated using the pressure mapping apparatus described above (S131). That is, the pressure at the position of each of the pressure sensors and / or the pressure between the respective pressure sensors is calculated through the data received from each of the pressure sensors.

Optionally, the pressure value applied from each of the friction regulating portions may be calculated through the pressure values at the calculated positions (S133). That is, it is determined whether or not it is proper to recognize the boundary to be pressed and identification (ID) to the friction tester, and if the ID is proper, the pressure value applied from the friction tester through the pressure distribution in the boundary Can be obtained. In some embodiments, the pressure value applied from the friction cleaner may be determined by simple averaging or weighted averaging of the pressure at each point within the boundary.

Then, it is determined whether or not the pressure value applied from the friction cleaning section is within the reference pressure value range (S135). If the pressure value applied from the friction cleaning part is within the reference pressure value range, the procedure can proceed to the procedure for cleaning the glass substrate immediately (S150 in FIG. 10) without further action. Otherwise, if the pressure value applied from the friction cleaning section is out of the reference pressure value range, the process may proceed to a procedure of tuning the downward pressure characteristic (S140 in FIG. 10) to the friction maintenance section that deviates from the reference pressure value range.

Referring again to FIG. 10, the downward pressure characteristic is tuned for each of the friction modifiers whose applied pressure is out of the reference pressure value range (S140).

If the friction caliper is fixed to a specific actuator and is configured to reciprocate in a predetermined vertical section, the tuning can be performed by changing the installation position of the friction caliper, e.g., the installation height. If the down pressure characteristic is determined according to the pneumatic pressure or the hydraulic pressure applied to the actuator from the external power source or the pneumatic pressure or the hydraulic pressure applied from the actuator to the friction cleaner, The tuning can be performed by adjusting the set values of the respective actuators.

In order to clean the glass substrate after the downward pressure characteristics of the friction cleaning part are tuned, a glass substrate is disposed at a lower portion of the plurality of friction cleaning parts (S150). Subsequently, the glass substrate is cleaned with the plurality of friction cleaning units (S160).

13 is a schematic view showing a cleaning process of a glass substrate according to an embodiment of the present invention in a plan view.

Referring to FIG. 13, a plurality of friction modifying portions 201 may be arranged according to a predetermined rule. For example, the plurality of friction modifying portions 201 may form a plurality of rows, i.e., a first row R1, a second row R2, a third row R3, and the like. The friction modifying portions 201 belonging to the respective columns R1, R2, and R3 may be arranged laterally in the x direction. Each of the columns R1, R2 and R3 may be arranged in the order of the first column R1, the second column R2, the third column R3, ... in the y direction. Although only three columns are shown in Fig. 13, fewer than three, or four or more columns may be arranged in the y direction.

The glass substrate G can be configured to advance in the y direction for cleaning. In particular, the friction modifying portions 201 arranged in the x direction may be arranged at a predetermined interval to form one row. For example, in the first row R1, the glass substrate G may not be cleaned at a portion corresponding to the interval between the friction modifying portions 201. [ Thus, in the interval between the two adjacent friction moduli of the first row Rl such that this portion of the glass substrate G is covered in the next row (e.g. the second row R2) R2 may be arranged.

When the glass substrate G passes through the rows of the scratch cleaners 201 and advances in the y direction, the scratch cleaners 201 can clean the surface of the glass substrate G while rotating. At the same time, a cleaning liquid containing water and / or a chemical cleaning agent may be sprayed to more completely remove foreign matter adhering to the glass substrate G. [

14 is an image showing the result of performing pressure mapping using the pressure mapping apparatus according to an embodiment of the present invention with respect to the friction cleaning units composed of five rows and in a cleaning position. As shown in FIG. 14, a large number of frictional washers were found in which the downward pressure was not detected even in the cleaning position. In the past, it was difficult to find the friction parts which can not be downwardly pressed on the glass substrate because the height of the friction parts was visually recognized by the naked eye and the appropriateness of the installation height was evaluated.

15 is an image showing another result of performing the pressure mapping using the pressure mapping apparatus according to the embodiment of the present invention with respect to the friction cleaning units composed of five rows and in the cleaning position.

As shown in Fig. 15, in the first column, it can be determined that almost all of the friction modifying portions are cleaned while pressurizing with appropriate pressure. However, it is observed that the downward pressing characteristics of the friction modifying portions disposed closer to the right side of the image are deteriorated toward the second row, the third row, the fourth row and the fifth row. In particular, since the distribution of the frictional pressure parts having poor downward pressure characteristics is not random but has a specific tendency, it is firstly presumed that the right and left balance of the equipment frame (frame) can do.

As shown in FIGS. 14 and 15, since it is possible to grasp the pressing characteristics of each of the entire friction modifiers in real time, it is possible to more easily grasp the cause of the subsequent product defects of the glass substrate.

16A and 16B are images showing a pressure contour map before and after tuning the downward pressure characteristic of each of the friction modifiers using the pressure mapping system according to an embodiment of the present invention.

Referring to FIG. 16A, it can be seen that the pressing characteristics of the four rows of frictional cleaning parts are extremely poor. In particular, it can be seen that the downward pressure is hardly achieved in the first row.

The pressure contour map after the downward pressure characteristic of each of the friction coefficient portions is tuned based on the identified pressure contour map is shown in FIG. As shown in FIG. 16, it can be seen that the downward pressure characteristics of the first column, the second column and the fourth column are greatly improved.

FIG. 17 is a graph showing the number of particle defective points (locations) according to the changes in FIGS. 16A and 16B. FIG. In Fig. 17, the horizontal axis represents time and the vertical axis represents the number of particle defective points.

In FIG. 17, the downward pressing characteristics of the respective friction modifying portions are tuned at the time indicated by T. Before tuning (ie, to the left of T), the number of particle defects was greater, with an average value of approximately 162. On the other hand, after tuning (i.e., to the right of T), it was confirmed that the number of particle defects decreased and an average value of about 115 was obtained.

The decrease in the number of particle defective portions can be understood as a result of the fact that the friction characteristics of the particles contributing to particle removal are further increased by tuning the pressing characteristic of the friction modifier that does not contribute to the removal of particles due to insufficient pressure characteristics.

18A and 18B are graphs showing the relationship between the number of defective portions of particles before and after tuning downward pressure characteristics of each of the friction modifiers using a pressure mapping system according to an embodiment of the present invention, Graphs showing trends.

Referring to FIG. 18A, it was confirmed that the frequency of particle defects was significantly reduced based on the point of time T. That is, approximately 1100 particle defect frequencies were observed before the time point T (ie, before tuning), but approximately 700 particle defect frequencies were observed after the time point T (ie, after tuning).

Referring to FIG. 18B, it is confirmed that the frequency of particle defects is significantly reduced based on the point of time T. FIG. That is, a particle defect frequency of about 751 was observed before the time point T (that is, before the tuning), but a particle defect frequency of about 413 was observed after the time point T (that is, after the tuning).

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. The present invention may be modified in various ways. Therefore, modifications of the embodiments of the present invention will not depart from the scope of the present invention.

110: support base 120: pressure sensor
122: upper conductor layer 122a: first conductor portion
122ac: first connection part 122ae: first electrode
122af: first finger 122b: second conductor part
122bc: second connection part 122be: second electrode
122bf: second finger 124: bottom conductor layer
126: spacer 128: upper insulating film
130: moisture-proof pouch 140: analyzer
150: connector 160: lead line
201:

Claims (18)

A support substrate;
A plurality of pressure sensors arranged on the supporting substrate and capable of outputting a signal corresponding to an applied pressure; And
An analyzer configured to receive the signals from the plurality of pressure sensors and to output a pressure map on the support substrate using the received signals;
. The method according to claim 1,
Wherein the pressure sensor comprises an upper conductor layer and a lower conductor layer spaced apart from the upper conductor layer and disposed below the upper conductor layer,
The upper conductor layer comprising a first conductor portion having a first electrode and a second conductor portion having a second electrode,
Wherein the upper conductor layer is configured to be deformable by an applied pressure to be able to contact the lower conductor layer. 3. The method of claim 2,
The pressure mapping device further comprises lead lines connected to the first and second electrodes of the pressure sensor and extending to a connector provided on one side of the supporting substrate,
Wherein the analyzing device is configured to receive the signal through the connector and the signal cable. 3. The method of claim 2,
Wherein the first conductor portion and the second conductor portion are deformed in proportion to applied pressure to increase the contact area with the lower conductor layer. 5. The method of claim 4,
The first conductor portion including a plurality of first fingers in parallel,
The second conductor portion includes a plurality of parallel second fingers,
Wherein the plurality of first fingers and the second fingers are arranged to be alternately positioned with respect to each other. 3. The method of claim 2,
Wherein the pressure sensor further comprises a spacer below the first electrode and the second electrode,
Wherein the spacers maintain the spacing between the upper conductor layer and the lower conductor layer. The method according to claim 1,
Wherein the support substrate is a flexible substrate. The method according to claim 1,
Wherein the plurality of pressure sensors are arranged in a lattice arrangement on the support substrate. The method according to claim 1,
Further comprising a moisture-resistant pouch surrounding said support substrate. 10. The method of claim 9,
Wherein the analyzing device is configured to be capable of outputting a pressure map on the supporting substrate in real time using the input signal. Disposing a pressure mapping device in a lower portion of the plurality of friction modifying portions;
Lowering the plurality of friction washers into a cleaning position;
Mapping the pressures applied from the plurality of friction cleaners using a pressure mapping device;
Tuning downward pressure characteristics of the plurality of friction modifiers based on the mapped pressures;
Disposing a glass substrate under the plurality of friction cleaning units; And
Cleaning the glass substrate using the plurality of friction cleaning units;
Lt; / RTI >
The pressure mapping apparatus comprises:
A support substrate;
A plurality of pressure sensors arranged on the supporting substrate and capable of outputting a signal corresponding to an applied pressure; And
An analyzer configured to receive the signals from the plurality of pressure sensors and to output a pressure map on the support substrate using the received signals;
And cleaning the glass substrate. 12. The method of claim 11,
Wherein the step of mapping the applied pressures comprises the step of determining whether the pressure applied from each of the friction cleaners is out of the reference pressure value range. 13. The method of claim 12,
Wherein the step of tuning the downward pressure characteristics of the plurality of friction modifying portions comprises adjusting an installation height for a friction modifying portion where the applied pressure is out of the reference pressure value range. 13. The method of claim 12,
Wherein said step of lowering comprises lowering each of said plurality of friction cleaning units by pneumatic or hydraulic pressure,
Wherein the step of tuning the downward pressure characteristics of the plurality of friction modifiers comprises adjusting a set value of pneumatic or hydraulic pressure supplied to each of the plurality of friction modifiers. 12. The method of claim 11,
Wherein the glass substrate is moved in a horizontal direction while the step of cleaning the glass substrate is performed. 16. The method of claim 15,
Wherein the plurality of friction modifiers comprise:
A first row aligned at regular intervals in a transverse direction perpendicular to a moving direction of the glass substrate; And
A second row arranged at regular intervals in a lateral direction parallel to the alignment direction of the first column;
/ RTI >
Wherein one of the friction modifying portions of the second row is disposed between the adjacent two friction modifying portions of the first row in a moving direction of the glass substrate. 12. The method of claim 11,
Wherein cleaning the glass substrate using the plurality of friction cleaning units comprises supplying cleaning liquid. 12. The method of claim 11,
Wherein the analyzer is configured to be capable of outputting a pressure map on the support substrate in real time using the input signal.

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