KR20180134805A - Light emitting device, light emitting device package, and light unit - Google Patents

Abstract

A light emitting device according to an embodiment includes: a light emitting structure which includes a first conductivity type semiconductor layer, an active layer below the first conductivity type semiconductor layer, and a second conductivity type semiconductor layer below the active layer; a contact part electrically connected to the first conductivity type semiconductor layer by penetrating through the active layer and the second conductivity type semiconductor layer; a first insulating layer disposed around the contact part; and a second insulating layer disposed around the first insulating layer. It is possible to improve electrical reliability.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a light emitting device, a light emitting device package,

Embodiments relate to a light emitting device, a light emitting device package, and a light unit.

Light emitting diodes (LEDs) are widely used as light emitting devices. Light emitting diodes convert electrical signals into light, such as infrared, visible, and ultraviolet, using the properties of compound semiconductors.

As the light efficiency of a light emitting device is increased, a light emitting device is applied to various fields including a display device and a lighting device.

Embodiments provide a light emitting device, a light emitting device package, and a light unit that can improve electrical reliability and improve light output.

A light emitting device according to an embodiment includes a support member including a metal, a bonding layer disposed on the support member, a second metal layer disposed on the bonding layer, and a second conductive layer disposed on the second metal layer, A light emitting structure including a first conductive semiconductor layer, a semiconductor layer, an active layer disposed on the second conductive semiconductor layer, and a first conductive semiconductor layer disposed on the active layer; A second conductive semiconductor layer, a second conductive semiconductor layer, a first groove penetrating the active layer and passing through a part of the first conductive semiconductor layer, A contact hole electrically connected to the first conductivity type semiconductor layer and the second metal layer; a second groove formed in the first groove and penetrating the active layer and penetrating a part of the first conductivity type semiconductor layer; In the first groove A first insulating layer 40 including a first portion 40a disposed in the first portion 40a and a second portion 40b extending from the first portion 40a to the side surface of the light emitting structure, 2 insulating layer 42, as shown in FIG.

And all surfaces of the first conductive semiconductor layer exposed by the second trench may be in contact with the second insulating layer.

The first metal layer may be disposed between the second portion 40b of the first insulating layer and the second insulating layer.

The second metal layer, the second portion 40b of the first insulating layer, and the second insulating layer may overlap in the vertical direction.

The support member may be formed of at least one of Ti, Cr, Ni, Al, Pt, Au, W, Cu, Mo and Cu-W.

The first insulating layer and the second insulating layer may include the same material.

The first insulating layer and the second insulating layer may be formed of at least one of SiO ₂ , Si ₃ N ₄ , Al ₂ O ₃ , and TiO ₂ .

A part of the active layer may be disposed between the second groove and the side surface of the light emitting structure.

The second groove is disposed between the first groove and the side surface of the light emitting structure and a part of the active layer 12 is branched into the light emitting region 12a and the non-emitting region 12b by the second groove. have.

The width of the light emitting region 12a may be larger than the width of the non-light emitting region 12b.

The second groove may be disposed closer to a side surface of the light emitting structure than the first groove.

The second groove may be disposed in a peripheral region spaced apart from the first groove.

The second groove may be formed as a closed loop.

The second insulating layer includes a third portion 42a disposed in the second groove and a fourth portion 42b extending from the third portion 42a to the first groove and disposed in the first groove .

The fourth portion 42b of the second insulating layer may be in contact with the first portion 40a of the first insulating layer.

All surfaces of the first conductive semiconductor layer exposed by the first trench are in contact with the contact portion, the first portion 40a of the first insulating layer and the fourth portion 42b of the second insulating layer, .

In the first groove, the first portion 40a of the first insulating layer may be disposed between the contact portion and the fourth portion 42b of the second insulating layer.

The first grooves may be formed in plural.

The second grooves may be formed in plural.

The depth of the first conductive type semiconductor layer exposed by the first groove may be deeper than the depth of the first conductive type semiconductor layer exposed by the second groove.

According to another embodiment of the present invention, there is provided a light emitting device comprising: a body; a first lead electrode and a second lead electrode which are disposed on the body and are electrically separated; a light emitting element disposed on the first lead electrode; And a wire electrically connecting the second lead electrode.

The light emitting device includes: a support member including a metal; A bonding layer disposed on the support member; A second metal layer disposed on the bonding layer; A light emitting structure including a second conductive type semiconductor layer disposed on the second metal layer, an active layer disposed on the second conductive type semiconductor layer, and a first conductive type semiconductor layer disposed on the active layer; A first metal layer electrically connected to the second conductive semiconductor layer; The second conductivity type semiconductor layer, a first groove penetrating the active layer and penetrating a part of the first conductivity type semiconductor layer; A second groove that is disposed apart from the first groove and penetrates the second conductivity type semiconductor layer, the active layer, and penetrates a part of the first conductivity type semiconductor layer; A contact disposed in the first groove and electrically connected to the first conductive type semiconductor layer and the second metal layer; A first insulating layer including a first portion disposed in the first groove and a second portion extending in a side surface of the light emitting structure in the first portion; And a second insulating layer disposed in the second groove.

And all surfaces of the first conductive semiconductor layer exposed by the second trench may be in contact with the second insulating layer.

The first metal layer may be disposed between the second portion of the first insulating layer and the second insulating layer.

The second metal layer, the second portion of the first insulating layer, and the second insulating layer may overlap in a vertical direction.

The second groove may be disposed in a circumferential area spaced outside the first groove and may be formed as a closed loop.

The light emitting device may be electrically connected to the first lead electrode by die bonding.

The support member may be formed of at least one of Ti, Cr, Ni, Al, Pt, Au, W, Cu, Mo and Cu-W.

The first insulating layer and the second insulating layer may include the same material.

The first insulating layer and the second insulating layer may be formed of at least one of SiO ₂ , Si ₃ N ₄ , Al ₂ O ₃ , and TiO ₂ .

A part of the active layer may be disposed between the second groove and the side surface of the light emitting structure.

The second groove may be disposed between the first groove and the side surface of the light emitting structure, and a part of the active layer may be branched into the light emitting region and the non-emitting region by the second groove.

The width of the light emitting region may be greater than the width of the non-emitting region.

And a part of the active layer may be disposed between the first groove and the second groove.

Wherein the second insulating layer includes a third portion disposed in the second groove and a fourth portion extending from the third portion to the first groove and disposed in the first groove, May be in contact with the first portion of the first insulating layer.

All surfaces of the first conductive type semiconductor layer exposed by the first trench may be in contact with the contact portion, the first portion of the first insulating layer, and the fourth portion of the second insulating layer.

The first portion of the first insulating layer in the first groove may be disposed between the contact portion and the fourth portion of the second insulating layer.

The depth of the first conductive type semiconductor layer exposed by the first groove may be deeper than the depth of the first conductive type semiconductor layer exposed by the second groove.

A method of manufacturing a light emitting device according to an embodiment includes forming a support member including a metal; Forming a bonding layer on the support member; Forming a second metal layer on the bonding layer; Forming a light emitting structure including a second conductive semiconductor layer on the second metal layer, an active layer disposed on the second conductive semiconductor layer, and a first conductive semiconductor layer disposed on the active layer; Forming a first metal layer electrically connected to the second conductive semiconductor layer; Removing the second conductive semiconductor layer through the active layer to form a first groove and a second groove spaced apart from each other by etching a part of the first conductive semiconductor layer; Forming a contact disposed in the first groove and electrically connected to the first conductive semiconductor layer; Forming a first insulating layer including a first portion disposed in the first groove and a second portion extending from a side of the light emitting structure in the first portion; And forming a second insulating layer disposed in the second groove.

Wherein all surfaces of the first conductive semiconductor layer exposed by the second trench are in contact with the second insulating layer and the first metal layer is between the second portion of the first insulating layer and the second insulating layer And the second metal layer, the second portion of the first insulating layer, and the second insulating layer may overlap in a vertical direction.

The semiconductor light emitting device according to the embodiment may further include: a light emitting structure including a first conductive semiconductor layer, an active layer below the first conductive semiconductor layer, and a second conductive semiconductor layer below the active layer; A contact portion electrically connected to the first conductivity type semiconductor layer through the active layer and the second conductivity type semiconductor layer; A first insulating layer disposed around the contact portion; And a second insulating layer disposed around the first insulating layer, wherein at least a part of the first insulating layer and the second insulating layer are spaced apart from each other by a predetermined distance, and the first insulating layer and the second insulating layer The first conductivity type semiconductor layer, the active layer, and the second conductivity type semiconductor layer may be disposed between the first and second insulating layers.

The light emitting device according to the embodiment includes a light emitting structure including a first conductive semiconductor layer, an active layer below the first conductive semiconductor layer, and a second conductive semiconductor layer below the active layer, A first groove penetrating the active layer and penetrating a part of the first conductivity type semiconductor layer; and a second groove, which is disposed apart from the first groove, penetrates the second conductivity type semiconductor layer, the active layer, Type semiconductor layer; a contact portion disposed in the first groove and electrically connected to the first conductivity type semiconductor layer; and a contact portion disposed in the first groove and disposed around the contact portion And a second-2 insulating layer disposed in the first groove and disposed around the first insulating layer and a second-2 insulating layer disposed in the second groove.

Further, the embodiment may further include: the first conductive semiconductor layer disposed between the first insulating layer disposed in the first groove and the second insulating layer disposed in the second groove, the active layer, Type semiconductor layer.

The second groove may be disposed around the first groove.

The 2-1 insulating layer and the 2-2 insulating layer may include the same material.

The 2-1 insulating layer and the 2-2 insulating layer may be interconnected.

And the first insulating layer disposed in the first groove may contact the second-1 insulating layer disposed in the first groove.

The first insulating layer disposed in the first groove may be spaced apart from the second insulating layer disposed in the second groove.

All surfaces of the first conductive type semiconductor layer exposed by the first trench may contact the contact portion, the first insulating layer, and the second-1 insulating layer.

And all the surfaces of the first conductive type semiconductor layer exposed by the second trench can contact the second-second insulating layer.

Also, the embodiment may include a first metal layer electrically connected to the second conductive type semiconductor layer and a second metal layer electrically connected to the contact portion.

The first insulating layer may include a region disposed between the first metal layer and the second metal layer.

Embodiments may also include a bonding layer disposed below the second metal layer.

Embodiments may also include a support member disposed below the bonding layer.

The bonding layer and the support member may include a metal.

The supporting member may be formed of at least one of Ti, Cr, Ni, Al, Pt, Au, W, Cu, Mo and Cu-W.

The 2-1 insulating layer disposed in the first groove and the 2-2 insulating layer disposed in the second groove may be integrally formed.

The contact portion and the 2-1 insulating layer may be spaced apart from each other.

The embodiment may further include the first insulating layer disposed between the contact portion and the 2-1 insulating layer.

In addition, the embodiment may include the first conductive type semiconductor layer, the active layer, and the second conductive type semiconductor layer disposed between the second groove and the outermost side of the light emitting structure.

The first insulating layer, the second-1 insulating layer, and the second-2 insulating layer may include the same material.

The first insulating layer, the second-1 insulating layer, and the second-2 insulating layer may be formed of at least one of SiO ₂ , Si ₃ N ₄ , Al ₂ O ₃ , and TiO ₂ .

According to another embodiment of the present invention, there is provided a light emitting device package including: a body; a first lead electrode and a second lead electrode which are disposed on the body and are electrically separated; a light emitting element disposed on the first lead electrode; And a wire electrically connecting the second lead electrode.

The light emitting device includes a light emitting structure including a first conductive type semiconductor layer, an active layer below the first conductive type semiconductor layer, and a second conductive type semiconductor layer below the active layer, And a second conductive type semiconductor layer formed on the first conductive type semiconductor layer, the first conductive type semiconductor layer including a first conductive type semiconductor layer, a first conductive type semiconductor layer, A contact portion electrically connected to the first conductivity type semiconductor layer and disposed in the first groove, and a second groove formed in the first groove, disposed in the first groove, An insulating layer, a second-1 insulating layer disposed in the first groove, disposed around the first insulating layer, and a second-2 insulating layer disposed in the second groove.

Further, the embodiment may further include: the first conductive semiconductor layer disposed between the first insulating layer disposed in the first groove and the second insulating layer disposed in the second groove, the active layer, Type semiconductor layer, and the body may include a metal material.

The light emitting device may be electrically connected to the first lead electrode by die bonding.

The second groove may be disposed around the first groove.

And the first insulating layer disposed in the first groove may contact the second-1 insulating layer disposed in the first groove.

The first insulating layer disposed in the first groove may be spaced apart from the second insulating layer disposed in the second groove.

All surfaces of the first conductive type semiconductor layer exposed by the first trench may contact the contact portion, the first insulating layer, and the second-1 insulating layer.

And all the surfaces of the first conductive type semiconductor layer exposed by the second trench can contact the second-second insulating layer.

Also, the embodiment may include a first metal layer electrically connected to the second conductive type semiconductor layer and a second metal layer electrically connected to the contact portion.

In an embodiment, the first insulating layer may include a region disposed between the first metal layer and the second metal layer.

Embodiments may also include a bonding layer disposed below the second metal layer.

Embodiments may also include a support member disposed below the bonding layer.

In an embodiment, the bonding layer and the supporting member may include a metal.

The supporting member may be formed of at least one of Ti, Cr, Ni, Al, Pt, Au, W, Cu, Mo and Cu-W.

The 2-1 insulating layer disposed in the first groove and the 2-2 insulating layer disposed in the second groove may be integrally formed.

The contact portion and the 2-1 insulating layer may be spaced apart from each other.

The embodiment may further include the first insulating layer disposed between the contact portion and the 2-1 insulating layer.

In addition, the embodiment may include the first conductive type semiconductor layer, the active layer, and the second conductive type semiconductor layer disposed between the second groove and the outermost side of the light emitting structure.

The first insulating layer, the second-1 insulating layer, and the second-2 insulating layer may include the same material.

The first insulating layer, the second-1 insulating layer, and the second-2 insulating layer may be formed of at least one of SiO ₂ , Si ₃ N ₄ , Al ₂ O ₃ , and TiO ₂ .

A method of manufacturing a light emitting device according to an embodiment of the present invention includes forming a light emitting structure including a first conductive semiconductor layer on a substrate, an active layer below the first conductive semiconductor layer, and a second conductive semiconductor layer below the active layer Forming a first groove and a second groove spaced apart from each other by partially removing the light emitting structure; forming a contact portion disposed in the first groove and electrically connected to the first conductivity type semiconductor layer Forming a first insulating layer disposed in the first groove and disposed around the contact portion; forming a second insulating layer disposed in the first groove, Forming an insulating layer, and forming a second-2 insulating layer disposed in the second groove.

Forming a first groove and a second groove apart from each other by partially removing the light emitting structure may include removing the second conductive semiconductor layer and the active layer through the first conductive semiconductor layer and partially etching the first conductive semiconductor layer, Thereby forming first grooves and second grooves spaced apart from each other.

The first groove may penetrate the second conductivity type semiconductor layer and the active layer and may penetrate a part of the first conductivity type semiconductor layer.

The second grooves may be spaced apart from the first grooves and penetrate the second conductivity type semiconductor layer and the active layer and may penetrate a part of the first conductivity type semiconductor layer.

A part of the light emitting structure may be disposed between the first insulating layer disposed in the first groove and the second insulating layer disposed in the second groove.

The second groove may be disposed around the first groove.

The 2-1 insulating layer and the 2-2 insulating layer include the same material and can be interconnected.

And the first insulating layer disposed in the first groove may contact the second-1 insulating layer disposed in the first groove.

The first insulating layer disposed in the first groove may be spaced apart from the second insulating layer disposed in the second groove.

The embodiment may further include forming a first metal layer electrically connected to the second conductive type semiconductor layer and a second metal layer electrically connected to the contact portion.

The first insulating layer may include a region disposed between the first metal layer and the second metal layer.

The first insulating layer, the second-1 insulating layer, and the second-2 insulating layer may include the same material.

The light emitting device, the light emitting device package, and the light unit according to the embodiments have an advantage of improving the electrical reliability and improving the light output.

1 is a view illustrating a light emitting device according to an embodiment.
2 to 7 are views showing a method of manufacturing a light emitting device according to an embodiment.
8 and 9 are views showing a modification of the light emitting device according to the embodiment.
10 is a view illustrating a light emitting device package according to an embodiment.
11 is a view showing a display device according to the embodiment.
12 is a view showing another example of the display device according to the embodiment.
13 to 15 are views showing a lighting apparatus according to an embodiment.
16 and 17 are views showing another example of the lighting apparatus according to the embodiment.

In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure may be referred to as being "on" or "under" a substrate, each layer It is to be understood that the terms " on "and " under" include both " directly "or" indirectly " do. In addition, the criteria for the top / bottom or bottom / bottom of each layer are described with reference to the drawings.

The thickness and size of each layer in the drawings may be exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

Hereinafter, a light emitting device, a light emitting device package, a light unit, and a method of manufacturing a light emitting device according to embodiments will be described in detail with reference to the accompanying drawings.

1 is a view illustrating a light emitting device according to an embodiment.

The light emitting device according to the embodiment may include the light emitting structure 10, the first insulating layer 40, the second insulating layer 42, and the contact portion 80, as shown in FIG.

The light emitting structure 10 may include a first conductivity type semiconductor layer 11, an active layer 12, and a second conductivity type semiconductor layer 13. The active layer 12 may be disposed between the first conductive semiconductor layer 11 and the second conductive semiconductor layer 13. The active layer 12 may be disposed under the first conductive semiconductor layer 11 and the second conductive semiconductor layer 13 may be disposed under the active layer 12.

For example, the first conductivity type semiconductor layer 11 is formed of an n-type semiconductor layer doped with an n-type dopant as a first conductivity type dopant, and the second conductivity type semiconductor layer 13 is formed of an n- Type semiconductor layer to which a p-type dopant is added. The first conductivity type semiconductor layer 11 may be formed of a p-type semiconductor layer, and the second conductivity type semiconductor layer 13 may be formed of an n-type semiconductor layer.

The first conductive semiconductor layer 11 may include, for example, an n-type semiconductor layer. The first conductive semiconductor layer 11 may be formed of a compound semiconductor. The first conductive semiconductor layer 11 may be formed of, for example, a Group II-VI compound semiconductor or a Group III-V compound semiconductor.

For example, the first conductivity type semiconductor layer 11 may be a semiconductor material having a composition formula of In _x Al _y Ga _1-xy N (0? X? 1, 0? _Y? 1, 0? _X + Can be implemented. The first conductive semiconductor layer 11 may be selected from among GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, An n-type dopant such as Se or Te can be doped.

The active layer 12 is formed in such a manner that electrons (or holes) injected through the first conductive type semiconductor layer 11 and holes (or electrons) injected through the second conductive type semiconductor layer 13 meet with each other, And is a layer that emits light due to a band gap difference of an energy band according to a material of the active layer 12. [ The active layer 12 may be formed of any one of a single well structure, a multi-well structure, a quantum dot structure and a quantum wire structure, but is not limited thereto.

The active layer 12 may be formed of a compound semiconductor. The active layer 12 may be formed of, for example, a Group II-VI or a Group III-V compound semiconductor. The active layer 12 may be formed of In _x Al _y Ga _1-xy N (0? , 0? Y? 1, 0? X + y? 1). When the active layer 12 is implemented in the multi-well structure, the active layer 12 may be formed by stacking a plurality of well layers and a plurality of barrier layers. For example, the InGaN well layer / GaN barrier layer . ≪ / RTI >

The second conductive semiconductor layer 13 may be formed of, for example, a p-type semiconductor layer. The second conductive semiconductor layer 13 may be formed of a compound semiconductor. The second conductive semiconductor layer 13 may be formed of, for example, a Group II-VI compound semiconductor or a Group III-V compound semiconductor.

For example, the second conductivity type semiconductor layer 13 may be a semiconductor material having a composition formula of In _x Al _y Ga _1-xy N (0? X? 1, 0? _Y? 1, 0? _X + Can be implemented. The second conductive semiconductor layer 13 may be selected from GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, A p-type dopant such as Sr, Ba or the like may be doped.

Meanwhile, the first conductive semiconductor layer 11 may include a p-type semiconductor layer and the second conductive semiconductor layer 13 may include an n-type semiconductor layer. Also, a semiconductor layer including an n-type or p-type semiconductor layer may be further formed under the second conductivity type semiconductor layer 13. Accordingly, the light emitting structure 10 may have at least one of np, pn, npn, and pnp junction structures. The doping concentration of impurities in the first conductivity type semiconductor layer 11 and the second conductivity type semiconductor layer 13 may be uniform or non-uniform. That is, the structure of the light emitting structure 10 may be variously formed, but the present invention is not limited thereto.

Also, a first conductive InGaN / GaN superlattice structure or an InGaN / InGaN superlattice structure may be formed between the first conductive semiconductor layer 11 and the active layer 12. In addition, a second conductive type AlGaN layer may be formed between the second conductive type semiconductor layer 13 and the active layer 12.

The reflective electrode 17 may be disposed below the light emitting structure 10. The reflective electrode 17 may be electrically connected to the second conductive semiconductor layer 13. An ohmic contact layer 15 may be further disposed between the light emitting structure 10 and the reflective electrode 17. The first metal layer 30 may be disposed under the light emitting structure 10 and around the ohmic contact layer 15. [ The first metal layer 30 may be disposed around the lower portion of the light emitting structure 10. The first metal layer 30 may be disposed around the reflective electrode 17.

The ohmic contact layer 15 may be formed of, for example, a transparent conductive oxide layer. The ohmic contact layer 15 may be formed of, for example, ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), AZO (Aluminum Zinc Oxide), AGZO (Aluminum Gallium Zinc Oxide), IZTO (Indium Zinc Tin Oxide) IZO (IZO Nitride), ZnO, IrOx, RuOx, NiO, Pt (indium gallium zinc oxide), IGTO (indium gallium tin oxide), ATO , Ag, and the like.

The reflective electrode 17 may be formed of a metal having a high reflectivity. For example, the reflective electrode 17 may be formed of a metal or an alloy including at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Cu, Au and Hf. The reflective electrode 17 may be formed of one of indium-tin-oxide (ITO), indium-zinc-oxide (IZO), indium-zinc- Transparent conductive materials such as IGZO (Indium-Gallium-Zinc-Oxide), IGTO (Indium-Gallium-Tin-Oxide), Aluminum-Zinc-Oxide (AZO) and ATO (Antimony-Tin-Oxide) To form a multi-layered structure. For example, in an embodiment, the reflective electrode 17 may include at least one of Ag, Al, Ag-Pd-Cu alloy, and Ag-Cu alloy.

The ohmic contact layer 15 may be formed in ohmic contact with the light emitting structure 10. In addition, the reflective electrode 17 may reflect light incident from the light emitting structure 10 to increase the amount of light extracted to the outside.

The first metal layer 30 may include at least one of Cu, Ni, Ti, W, Cr, W, Pt, V, Fe, Mo and Au. The first metal layer 30 may function as a diffusion barrier layer. The first metal layer 30 can stably support the reflective electrode 17 and the ohmic contact layer 15.

Meanwhile, the light emitting device according to the embodiment may include a contact portion 80 electrically connected to the first conductivity type semiconductor layer 11. The contact portion 80 may be disposed in contact with the first conductive semiconductor layer 11. The first region of the contact portion 80 may be disposed in the first conductivity type semiconductor layer 11. The contact portion 80 may be disposed to penetrate the second conductive semiconductor layer 13 and the active layer 12. The contact portion 80 may be in contact with the lower region of the first conductive semiconductor layer 11.

According to the embodiment, power can be applied to the light emitting structure 10 through the reflective electrode 17 and the contact portion 80. According to the embodiment, the contact portion 80 may be formed in a multi-layered structure. The contact portion 80 may be formed of a material selected from Cr, V, W, Ti, Zn, Ni, Cu, Al, Pt, and Au.

The light emitting device according to the embodiment may include a second metal layer 50 disposed under the contact portion 80. The second metal layer 50 may be electrically connected to the contact portion 80. The second metal layer 50 may be in contact with the contact portion 80. The second metal layer 50 may be disposed in contact with the lower portion of the contact portion 80. The other end of the second metal layer 50 may be connected to an external power source and external power may be applied to the contact portion 80 through the second metal layer 50.

The first insulating layer 40 may be disposed around the contact portion 80. The first insulating layer 40 may be disposed on a side surface of the contact portion 80. The first insulating layer 40 may be disposed between the light emitting structure 10 and the contact portion 80. The first insulating layer 40 may electrically isolate the contact portion 80 from the second conductive type semiconductor layer 13. [ The first insulating layer 40 may electrically insulate the contact portion 80 from the active layer 12. [ The first insulating layer 40 may include an oxide or a nitride. The first insulating layer 40 may be formed of at least one material selected from SiO ₂ , Si ₃ N ₄ , Al ₂ O ₃ , TiO _2, and the like.

If the first insulating layer 40 does not perform the insulating function normally, the contact portion 80 is electrically connected to the first conductive semiconductor layer 11, (13) or the active layer (12). If a defect is generated in the first insulation layer 40 during the formation of the first insulation layer 40, the light emitting device can not perform a normal operation.

Accordingly, in order to secure electrical reliability, the light emitting device according to the embodiment may further include a second insulating layer 42. The second insulating layer 42 may be disposed around the first insulating layer 40. The first insulating layer 40 and the second insulating layer 42 may be spaced apart from each other by a predetermined distance. The second insulating layer 42 may include an oxide or nitride. The second insulation layer 42 may be formed of at least one material selected from SiO ₂ , Si ₃ N ₄ , Al ₂ O ₃ , TiO _2, and the like.

The second insulating layer 42 may be formed of the same material as the first insulating layer 40, or may be formed of another material. The first insulating layer 40 and the second insulating layer 42 may be formed of a material independently selected from SiO ₂ , Si ₃ N ₄ , Al ₂ O ₃ , TiO _2, and the like.

The second insulating layer 42 may be formed to penetrate the second conductive semiconductor layer 13 and the active layer 12. A first region of the second insulating layer 42 may be disposed in the first conductive type semiconductor layer 11. The second insulating layer 42 may be disposed between the first metal layer 30 and the second conductive semiconductor layer 13. The first metal layer 30 may be disposed around the first insulating layer 40. A semiconductor layer 45 may be disposed between the first insulating layer 40 and the second insulating layer 42. The semiconductor layer 45 may include a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer. A second region of the second insulating layer 42 may be disposed around the first insulating layer 40. The second region of the second insulating layer 42 may be disposed in contact with the side surface of the first insulating layer 40. The first insulating layer 40 may isolate the first metal layer 30 and the second metal layer 50 from each other.

The second metal layer 50 may include at least one of Cu, Ni, Ti, W, Cr, W, Pt, V, Fe and Mo. The second metal layer 50 may function as a diffusion barrier layer. A bonding layer 60 and a support member 70 may be disposed under the second metal layer 50.

The second metal layer 50 may prevent a material contained in the bonding layer 60 from diffusing toward the reflective electrode 17 in the process of providing the bonding layer 60. The second metal layer 50 may prevent a material such as tin contained in the bonding layer 60 from affecting the reflective electrode 17. [

The bonding layer 60 may include at least one of Ti, Au, Sn, Ni, Cr, Ga, In, Bi, Cu, Ag, Nb, Pd, . The support member 70 supports the light emitting structure 10 according to the embodiment and can perform a heat dissipation function. The bonding layer 60 may be implemented as a seed layer.

The supporting member 70 may be a semiconductor substrate (for example, Si, Ge, GaN, GaAs, or the like) into which Ti, Cr, Ni, Al, Pt, Au, W, Cu, Mo, Cu- ZnO, SiC, SiGe, and the like). The support member 70 may be embodied as an insulating material, for example.

A light extracting pattern may be provided on the upper surface of the light emitting structure 10. An irregular pattern may be provided on the upper surface of the light emitting structure 10. The light extracting pattern provided in the light emitting structure 10 may be formed by a PEC (Photo Electro Chemical) etching process as an example. Accordingly, according to the embodiment, the effect of extracting external light can be increased.

The power source terminal having the first polarity is connected to the first conductivity type semiconductor layer 11 through the contact portion 80 and the second conductivity type semiconductor layer 13 is connected to the power source terminal, The power source terminal having the second polarity is connected through the electrode 17 so that the light emitting device can be operated. A power terminal having the second polarity may be connected to one end of the reflective electrode 17 or one end of the first metal layer 30. A power terminal having the first polarity may be connected to one end of the second metal layer 50 electrically connected to the contact portion 80. [

According to the embodiment, the first insulating layer 40 and the second insulating layer 42 are arranged in a double manner around the contact portion 80, so that the contact portion 80 is electrically connected to the second conductive semiconductor Layer 13 or the active layer 12 to prevent defects from being generated. According to the embodiment, it is possible to reduce the occurrence of defects in the light emitting device, thereby improving the manufacturing yield.

A method of manufacturing a light emitting device according to an embodiment will now be described with reference to FIGS. 2 to 7. FIG.

2, a first conductivity type semiconductor layer 11, an active layer 12, and a second conductivity type semiconductor layer 13 are formed on a substrate 5 in accordance with an embodiment of the present invention. do. The first conductive semiconductor layer 11, the active layer 12, and the second conductive semiconductor layer 13 may be defined as a light emitting structure 10.

The substrate 5 may be formed of at least one of, for example, a sapphire substrate (Al ₂ O ₃ ), SiC, GaAs, GaN, ZnO, Si, GaP, InP and Ge. A buffer layer may be further formed between the first conductivity type semiconductor layer 11 and the substrate 5.

For example, the first conductivity type semiconductor layer 11 is formed of an n-type semiconductor layer doped with an n-type dopant as a first conductivity type dopant, and the second conductivity type semiconductor layer 13 is formed of an n- Type semiconductor layer to which a p-type dopant is added. The first conductivity type semiconductor layer 11 may be formed of a p-type semiconductor layer, and the second conductivity type semiconductor layer 13 may be formed of an n-type semiconductor layer.

The first conductive semiconductor layer 11 may include, for example, an n-type semiconductor layer. The first conductivity type semiconductor layer 11 is formed of a semiconductor material having a composition formula of In _x Al _y Ga _1-xy N (0? X? 1, 0? _Y? 1, 0? _X + y? 1) . The first conductivity type semiconductor layer 11 may be selected from InAlGaN, GaN, AlGaN, AlInN, InGaN, AlN, InN and the like, and an n-type dopant such as Si, Ge, Sn, .

The active layer 12 is formed in such a manner that electrons (or holes) injected through the first conductive type semiconductor layer 11 and holes (or electrons) injected through the second conductive type semiconductor layer 13a meet with each other, And is a layer that emits light by a band gap difference of an energy band according to a material of the active layer 12a. The active layer 12 may be formed of any one of a single well structure, a multi-well structure, a quantum dot structure and a quantum wire structure, but is not limited thereto.

The active layer 12 may be formed of a semiconductor material having a composition formula of In _x Al _y Ga _1-xy N (0? X? 1, 0? _Y? 1, 0? _X + y? When the active layer 12 is formed in the multi-well structure, the active layer 12 may be formed by stacking a plurality of well layers and a plurality of barrier layers. For example, the active layer 12 may be formed by a periodic structure of an InGaN well layer / GaN barrier layer .

The second conductive semiconductor layer 13 may be formed of, for example, a p-type semiconductor layer. The second conductivity type semiconductor layer 13 is formed of a semiconductor material having a composition formula of In _x Al _y Ga _1-xy N (0? X? 1, 0? _Y? 1, 0? _X + y? . The second conductivity type semiconductor layer 13 may be selected from among InAlGaN, GaN, AlGaN, InGaN, AlInN, AlN and InN. The p-type dopant such as Mg, Zn, Ca, .

Meanwhile, the first conductive semiconductor layer 11 may include a p-type semiconductor layer and the second conductive semiconductor layer 13 may include an n-type semiconductor layer. In addition, a semiconductor layer including an n-type or p-type semiconductor layer may be further formed on the second conductive type semiconductor layer 13. Thus, the light emitting structure 10 may include np, pn, npn, Or a structure thereof. The doping concentration of impurities in the first conductivity type semiconductor layer 11 and the second conductivity type semiconductor layer 13 may be uniform or non-uniform. That is, the structure of the light emitting structure 10 may be variously formed, but the present invention is not limited thereto.

Also, a first conductive InGaN / GaN superlattice structure or an InGaN / InGaN superlattice structure may be formed between the first conductive semiconductor layer 11 and the active layer 12. In addition, a second conductive type AlGaN layer may be formed between the second conductive type semiconductor layer 13 and the active layer 12.

Next, as shown in FIGS. 3 and 4, the first groove 31 and the second groove 33 may be formed in the light emitting structure 10. For example, the first groove 31 may be formed in a circular column shape, but its shape may be variously modified, but is not limited thereto. The first grooves 31 and the second grooves 33 may be formed in plural numbers. Although FIG. 4 shows the case where four first grooves 31 and second grooves 33 are formed, the number of the first grooves 31 and the number of second grooves 33 may be three or less, or five or more.

The first groove 31 and the second groove 33 may be formed by dry etching or wet etching. For example, the first groove 31 and the second groove 33 may be formed by dry etching such as ICP (Inductively Coupled Plasma), but the present invention is not limited thereto.

The first groove 31 may be formed through the second conductive semiconductor layer 13 and the active layer 12. The first groove 31 may be exposed to a portion of the first conductive type semiconductor layer 11 by etching.

The second groove 33 may be formed around the first groove 31. The second groove 33 may be formed through the second conductive semiconductor layer 13 and the active layer 12. The second grooves 33 may be exposed to a portion of the first conductivity type semiconductor layer 11 by etching. For example, the first groove 31 may be formed deeper than the second groove 33.

A semiconductor layer 45 may be disposed between the first groove 31 and the second groove 33. A portion of the first conductivity type semiconductor layer 11, the active layer 12, and the second conductivity type semiconductor layer 13 are disposed between the first groove 31 and the second groove 33 .

For example, the first groove 31 may have a width of 10 micrometers to 50 micrometers, and the second groove 33 may have a width of 1 micrometer to 3 micrometers. In addition, the semiconductor layer 45 may have a width of 2 to 4 micrometers.

5, a second insulating layer 42, an ohmic contact layer 15, a reflective electrode 17, and a first metal layer 30 are formed in the second trench 33.

For example, the second insulating layer 42 may be formed to fill both the first groove 31 and the second groove 33. The ohmic contact layer 15, the reflective electrode 17, and the first metal layer 30 may be sequentially formed on the second insulating layer 42.

The second insulating layer 42 may include an oxide or nitride. The second insulation layer 42 may be formed of at least one material selected from SiO ₂ , Si ₃ N ₄ , Al ₂ O ₃ , TiO _2, and the like.

The second insulating layer 42 may be formed to penetrate the second conductive semiconductor layer 13 and the active layer 12. A first region of the second insulating layer 42 may be disposed in the first conductive type semiconductor layer 11. The second insulating layer 42 may be disposed between the first metal layer 30 and the second conductive semiconductor layer 13.

The ohmic contact layer 15 may be formed of, for example, a transparent conductive oxide layer. The ohmic contact layer 15 may be formed of, for example, ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), AZO (Aluminum Zinc Oxide), AGZO (Aluminum Gallium Zinc Oxide), IZTO (Indium Zinc Tin Oxide) IZO (IZO Nitride), ZnO, IrOx, RuOx, NiO, Pt (indium gallium zinc oxide), IGTO (indium gallium tin oxide), ATO , Ag, and the like.

The reflective electrode 17 may be formed of a metal having a high reflectivity. For example, the reflective electrode 17 may be formed of a metal or an alloy including at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Cu, Au and Hf. The reflective electrode 17 may be formed of one of indium-tin-oxide (ITO), indium-zinc-oxide (IZO), indium-zinc- Transparent conductive materials such as IGZO (Indium-Gallium-Zinc-Oxide), IGTO (Indium-Gallium-Tin-Oxide), Aluminum-Zinc-Oxide (AZO) and ATO (Antimony-Tin-Oxide) To form a multi-layered structure. For example, in an embodiment, the reflective electrode 17 may include at least one of Ag, Al, Ag-Pd-Cu alloy, and Ag-Cu alloy.

Also, as shown in FIG. 5, a first metal layer 30 may be formed on the reflective electrode 17. The first metal layer 30 may be disposed on the ohmic contact layer 15 and on the reflective electrode 17. The first metal layer 50 may include at least one of Cu, Ni, Ti, W, Cr, W, Pt, V, Fe and Mo. The first metal layer 50 may function as a diffusion barrier layer.

5, the contact portion 80 and the first insulating layer 40 may be formed.

The light emitting device according to the embodiment may include a contact portion 80 electrically connected to the first conductivity type semiconductor layer 11. The contact portion 80 may be disposed in contact with the first conductive type semiconductor layer 11. The first region of the contact portion 80 may be disposed in the first conductivity type semiconductor layer 11. The contact portion 80 may be disposed to penetrate the second conductive semiconductor layer 13 and the active layer 12. The contact portion 80 may be in contact with the upper region of the first conductive type semiconductor layer 11. According to the embodiment, the contact portion 80 may be formed in a multi-layered structure. The contact portion 80 may be formed of a material selected from Cr, V, W, Ti, Zn, Ni, Cu, Al, Pt, and Au.

The first insulating layer 40 may be disposed around the contact portion 80. The first insulating layer 40 may be disposed on a side surface of the contact portion 80. The first insulating layer 40 may be disposed between the light emitting structure 10 and the contact portion 80. The first insulating layer 40 may electrically isolate the contact portion 80 from the second conductive type semiconductor layer 13. [ The first insulating layer 40 may electrically insulate the contact portion 80 from the active layer 12. [ The first insulating layer 40 may include an oxide or a nitride. The first insulating layer 40 may be formed of at least one material selected from SiO ₂ , Si ₃ N ₄ , Al ₂ O ₃ , TiO _2, and the like.

Next, a second metal layer 50 may be formed on the contact portion 80 and the first insulating layer 40, as shown in FIG.

The second metal layer 50 may be electrically connected to the contact portion 80. The second metal layer 50 may be in contact with the contact portion 80. The second metal layer 50 may be disposed in contact with the contact portion 80. The other end of the second metal layer 50 may be connected to an external power source and external power may be applied to the contact portion 80 through the second metal layer 50.

On the other hand, the forming process of each layer described above is one example, and the process sequence can be variously modified.

Next, as shown in FIG. 6, a bonding layer 60 and a support member 70 may be formed on the second metal layer 50. The second metal layer 50 may prevent a material contained in the bonding layer 60 from diffusing toward the reflective electrode 17 in the process of providing the bonding layer 60. The second metal layer 50 may prevent a material such as tin contained in the bonding layer 60 from affecting the reflective electrode 17. [

The bonding layer 60 may include at least one of Ti, Au, Sn, Ni, Cr, Ga, In, Bi, Cu, Ag, Nb, Pd, . The support member 70 supports the light emitting structure 10 according to the embodiment and can perform a heat dissipation function. The bonding layer 60 may be implemented as a seed layer.

The supporting member 70 may be a semiconductor substrate (for example, Si, Ge, GaN, GaAs, or the like) into which Ti, Cr, Ni, Al, Pt, Au, W, Cu, Mo, Cu- ZnO, SiC, SiGe, and the like). Also, the support member 70 may be formed of an insulating material.

Next, the substrate 5 is removed from the first conductive type semiconductor layer 11. As one example, the substrate 5 may be removed by a laser lift off (LLO) process. The laser lift-off process (LLO) is a process of irradiating a laser to the lower surface of the substrate 5 to peel the substrate 5 and the first conductivity type semiconductor layer 11 from each other.

Then, as shown in FIG. 7, isolation etching may be performed to etch the side surfaces of the light emitting structure 10 and separate the individual light emitting elements. At this time, the ohmic contact layer 15 or a part of the first metal layer 30 may be exposed through the bottom of the light emitting structure 10 through the isolation etching. The isolation etching can be performed by, for example, dry etching such as ICP (Inductively Coupled Plasma), but is not limited thereto.

Also, a light extracting pattern may be provided on the upper surface of the light emitting structure 10. An irregular pattern may be provided on the upper surface of the light emitting structure 10. For example, the light extraction pattern may be formed by a PEC etch process. Accordingly, according to the embodiment, the effect of extracting external light can be increased. According to the embodiment, the upper surface of the light emitting structure 10 can be formed as an N-surface, and the surface roughness is larger than that in the case where the light emitting structure 10 is formed of a Ga surface.

The power source terminal having the first polarity is connected to the first conductivity type semiconductor layer 11 through the contact portion 80 and the second conductivity type semiconductor layer 13 is connected to the power source terminal, The power source terminal having the second polarity is connected through the electrode 17 so that the light emitting device can be operated. A power terminal having the second polarity may be connected to one end of the reflective electrode 17 or one end of the first metal layer 30. A power terminal having the first polarity may be connected to one end of the second metal layer 50 electrically connected to the contact portion 80.

The first insulation layer 40 and the second insulation layer 42 are disposed in the periphery of the contact portion 80 so that insulation failure occurs in the first insulation layer 40 The contact portion 80 is electrically connected to the second conductive type semiconductor layer 13 or the active layer 12 to prevent a defect from occurring. According to the embodiment, it is possible to reduce the occurrence of defects in the light emitting device, thereby improving the manufacturing yield.

8 is a view showing another example of the light emitting device according to the embodiment. In the following description of the light emitting device according to the embodiment shown in FIG. 8, a description of portions overlapping with those described with reference to FIG. 1 will be omitted.

The light emitting device according to the embodiment may further include a volume emitting layer 83, a Ti oxide layer 85, and a phosphor 87, as shown in FIG.

The volume emitting layer 83 may be disposed on the light emitting structure 10. The volume emitting layer 83 may be disposed in contact with the upper portion of the light emitting structure 10. The volume emitting layer 83 may emit light from the light emitting structure 10 to the outside.

The volume-emitting layer 83 may be formed of a light-transmitting material. For example, the volume-emitting layer 83 may be formed to a thickness of 10 micrometers to 500 micrometers. As a result, light can be emitted to the upper surface and the side surface of the volume-emitting layer 83, and the directivity angle can be expanded in case the light is emitted from the light-emitting structure 10.

The volume-emitting layer 83 may have a concave-convex structure on its upper portion. And the upper surface of the volume emitting layer 83 may have a curved shape. Accordingly, the efficiency of light extracted from the volume-emitter layer 83 to the outside can be improved. The concavo-convex structure may be formed, for example, at an upper width of 1 to 100 micrometers. Further, the concavo-convex structure may be formed to have a depth of 1 to 100 micrometers, for example. For example, the concavo-convex structure may have a depth of about 1/5 times the thickness of the volume-emitting layer 83.

For example, as shown in FIG. 8, the concavo-convex structure formed on the volume-emitting layer 83 may include an inclined surface, and the inclined surface may be formed to have an inclination angle of 70 to 85 degrees with respect to the horizontal surface.

The volume-emitting layer 83 may comprise, for example, an oxide. For example, the volume-emitter layer 83 may be formed of a material having a lower refractive index than the light-emitting structure 10. The volume-emitting layer 83 may comprise a SiO ₂ material. The volume-emitting layer 83 may comprise a ZnO material.

A Ti oxide layer 85 may be disposed on the volume-emitting layer 83. The Ti oxide layer 85 may be disposed on a side surface of the volume-emitter layer 83. The Ti oxide layer 85 may be disposed in contact with the volume-emitting layer 83. The Ti oxide layer 85 may be disposed along the concavo-convex structure of the volume-emitting layer 83. For example, the Ti oxide layer 85 may be arranged to have a uniform thickness over the volume-emitting layer 83. The Ti oxide layer 85 may be formed to a thickness of 1 nm to 100 nm, for example.

According to the embodiment, the phosphor 87 may be disposed on the Ti oxide layer 85. The phosphor 87 may receive the light emitted from the light emitting structure 10 and emit the wavelength-converted light. For example, when the blue light is emitted in the light emitting structure 10 and the phosphor 87 emits yellow light, white light can be emitted as a whole. The wavelength band of light emitted from the light emitting structure 10 and the wavelength band emitted from the phosphors 87 may be variously modified according to the embodiment.

According to the embodiment, the phosphor 87 may be disposed in contact with the Ti oxide layer 85. When the phosphor 87 is disposed in contact with the Ti oxide layer 85, the light absorption efficiency of the phosphor 87 can be improved. Accordingly, the light of the first wavelength band emitted from the light emitting structure 10 can be efficiently absorbed by the phosphor 87, and the light of the second wavelength band, which is wavelength-converted from the phosphor 87, is emitted . As a result, the light of the first wavelength band emitted from the light emitting structure 10 and the light of the second wavelength band emitted from the phosphors 87 are mixed to provide the target light to the outside.

The phosphor 87 may be disposed on the Ti oxide layer 85 in the form of particles. The phosphor 87 may be included in the resin and may be uniformly disposed on the Ti oxide layer 85. By way of example, the resin may comprise epoxy or silicone.

The power source terminal having the first polarity is connected to the first conductivity type semiconductor layer 11 through the contact portion 80 and the second conductivity type semiconductor layer 13 is connected to the power source terminal, The power source terminal having the second polarity is connected through the electrode 17 so that the light emitting device can be operated. A power terminal having the second polarity may be connected to one end of the reflective electrode 17 or one end of the first metal layer 30. A power terminal having the first polarity may be connected to one end of the second metal layer 50 electrically connected to the contact portion 80.

The first insulation layer 40 and the second insulation layer 42 are disposed in the periphery of the contact portion 80 so that insulation failure occurs in the first insulation layer 40 The contact portion 80 is electrically connected to the second conductive type semiconductor layer 13 or the active layer 12 to prevent a defect from occurring. According to the embodiment, it is possible to reduce the occurrence of defects in the light emitting device, thereby improving the manufacturing yield.

9 is a view showing another example of the light emitting device according to the embodiment. In the following description of the light emitting device according to the embodiment shown in FIG. 9, the description of the parts overlapping with those described with reference to FIG. 1 will be omitted.

According to the embodiment, the support portion 93 may be disposed on the light emitting structure 10. The support portion 93 may be disposed in contact with the light emitting structure 10. The support portion 93 may be disposed around the outer periphery of the light emitting structure 10, for example. The support portion 93 may be disposed in contact with the first conductive type semiconductor layer 11. The support portion 93 may be disposed on the light extracting structure provided in the light emitting structure 10. For example, the support portion 93 may be formed at a height of 10 micrometers to 500 micrometers. The support portion 93 may be formed to have a height of 10 to 500 micrometers from the upper surface of the light emitting structure 10.

For example, the support portion 93 may include an inorganic insulator or an organic insulator. The support portion 93 may include a metal. The support portion 93 may include at least one material such as Al ₂ O ₃ , SiO ₂ , photoresist, resin, metal, oxide, nitride, and the like. The resin may comprise silicon or epoxy.

The side surface of the support portion 93 may include an inclined surface. The side surface of the support portion 93 may be formed at an angle of 70 to 85 degrees from the horizontal surface of the light emitting structure 10, for example.

The reflective layer 95 may be disposed on the support portion 93. The reflective layer 95 may be disposed on the upper surface of the support portion 93. The reflective layer 95 may be disposed on the side of the support portion 93. The reflective portion 95 may include a metal material. For example, the reflective portion 95 may include at least one material selected from Ag, Al, Pt, Rh, Ir, and Au.

The light emitted from the light emitting structure 10 is reflected by the reflective layer 95 by the support portion 93 and the reflective layer 95 so that the light emitting direction of the light extracted to the outside can be adjusted. The orientation angle can be adjusted by the reflective layer 95. The reflective layer 95 may be formed on the upper surface and the side surface of the support portion 93 with a uniform thickness. Since the side surface of the support portion 93 is formed as an inclined surface, the reflective layer 95 can be disposed in an inclined plane with respect to the horizontal plane, and the direction of light emitted to the outside can be adjusted. For example, the height of the support portion 93 may be 0.3 to 1.0 times higher than the width of the light emitting structure 10. In addition, the side surface of the support portion 93 may be formed at an angle of, for example, 70 to 85 degrees with respect to the horizontal plane.

Although the support portion 93 and the reflective layer 95 are disposed around the outer circumference of the light emitting structure 10 in the embodiment, But may be disposed in the center region as well as the edges of the light emitting structure 10. [ The arrangement structure of the support portion 90 and the reflective layer 95 may be variously modified. The reflective layer 95 may be formed on the inner side surface of the support portion 93 or may be disposed on the outer side surface of the support portion 93. The outer side surface of the support portion 93 may also have an inclined surface.

In addition, according to the embodiment, the ohmic contact layer 15 or the first metal layer 30 may be exposed and disposed around the lower portion of the light emitting structure 10. At this time, a part of the support portion 90 may be disposed on the side of the light emitting structure 10. A portion of the support 90 may be disposed in contact with the ohmic contact layer 15 or the first metal layer 30.

The power source terminal having the first polarity is connected to the first conductivity type semiconductor layer 11 through the contact portion 80 and the second conductivity type semiconductor layer 13 is connected to the power source terminal, The power source terminal having the second polarity is connected through the electrode 17 so that the light emitting device can be operated. A power terminal having the second polarity may be connected to one end of the reflective electrode 17 or one end of the first metal layer 30. A power terminal having the first polarity may be connected to one end of the second metal layer 50 electrically connected to the contact portion 80.

The first insulation layer 40 and the second insulation layer 42 are disposed in the periphery of the contact portion 80 so that insulation failure occurs in the first insulation layer 40 The contact portion 80 is electrically connected to the second conductive type semiconductor layer 13 or the active layer 12 to prevent a defect from occurring. According to the embodiment, it is possible to reduce the occurrence of defects in the light emitting device, thereby improving the manufacturing yield.

10 is a view illustrating a light emitting device package to which the light emitting device according to the embodiment is applied.

10, a light emitting device package according to an embodiment includes a body 120, a first lead electrode 131 and a second lead electrode 132 disposed on the body 120, And a molding member 140 surrounding the light emitting device 100. The first and second lead electrodes 131 and 132 are electrically connected to the first and second lead electrodes 131 and 132, .

The body 120 may be formed of a silicon material, a synthetic resin material, or a metal material, and the inclined surface may be formed around the light emitting device 100.

The first lead electrode 131 and the second lead electrode 132 are electrically separated from each other to provide power to the light emitting device 100. The first lead electrode 131 and the second lead electrode 132 may increase the light efficiency by reflecting the light generated from the light emitting device 100 and the heat generated from the light emitting device 100 To the outside.

The light emitting device 100 may be disposed on the body 120 or may be disposed on the first lead electrode 131 or the second lead electrode 132.

The light emitting device 100 may be electrically connected to the first lead electrode 131 and the second lead electrode 132 by a wire, flip chip or die bonding method.

The molding member 140 may surround the light emitting device 100 to protect the light emitting device 100. In addition, the molding member 140 may include a phosphor to change the wavelength of light emitted from the light emitting device 100.

A plurality of light emitting devices or light emitting device packages according to the embodiments may be arrayed on a substrate, and a lens, a light guide plate, a prism sheet, a diffusion sheet, etc., which are optical members, may be disposed on the light path of the light emitting device package. Such a light emitting device package, a substrate, and an optical member can function as a light unit. The light unit may be implemented as a top view or a side view type and may be provided in a display device such as a portable terminal and a notebook computer, or may be variously applied to a lighting device and a pointing device. Still another embodiment may be embodied as a lighting device including the light emitting device or the light emitting device package described in the above embodiments. For example, the lighting device may include a lamp, a streetlight, an electric signboard, and a headlight.

The light emitting device according to the embodiment can be applied to a light unit. The light unit includes a structure in which a plurality of light emitting elements are arrayed, and may include the display apparatus shown in Figs. 11 and 12, and the illumination apparatus shown in Figs. 13 to 17.

11, a display device 1000 according to an embodiment includes a light guide plate 1041, a light emitting module 1031 for providing light to the light guide plate 1041, and a reflection member 1022 An optical sheet 1051 on the light guide plate 1041, a display panel 1061 on the optical sheet 1051, the light guide plate 1041, a light emitting module 1031, and a reflection member 1022 But is not limited to, a bottom cover 1011.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 can be defined as a light unit 1050.

The light guide plate 1041 serves to diffuse light into a surface light source. The light guide plate 1041 may be made of a transparent material such as acrylic resin such as polymethyl methacrylate (PET), polyethylene terephthalate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate Resin. ≪ / RTI >

The light emitting module 1031 provides light to at least one side of the light guide plate 1041, and ultimately acts as a light source of the display device.

At least one light emitting module 1031 may be provided, and light may be provided directly or indirectly from one side of the light guide plate 1041. The light emitting module 1031 may include a substrate 1033 and a light emitting device or a light emitting device package 200 according to the embodiment described above. The light emitting device package 200 may be arrayed on the substrate 1033 at predetermined intervals.

The substrate 1033 may be a printed circuit board (PCB) including a circuit pattern. However, the substrate 1033 may include not only a general PCB, but also a metal core PCB (MCPCB), a flexible PCB (FPCB), and the like. When the light emitting device package 200 is provided on the side surface of the bottom cover 1011 or on the heat dissipation plate, the substrate 1033 may be removed. Here, a part of the heat radiating plate may be in contact with the upper surface of the bottom cover 1011.

The plurality of light emitting device packages 200 may be mounted such that the light emitting surface of the light emitting device package 200 is spaced apart from the light guiding plate 1041 by a predetermined distance, but the present invention is not limited thereto. The light emitting device package 200 may directly or indirectly provide light to the light-incident portion, which is one side of the light guide plate 1041, but is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflection member 1022 reflects the light incident on the lower surface of the light guide plate 1041 so as to face upward, thereby improving the brightness of the light unit 1050. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may house the light guide plate 1041, the light emitting module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with a housing portion 1012 having a box-like shape with an opened upper surface, but the present invention is not limited thereto. The bottom cover 1011 may be coupled to the top cover, but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or a non-metal material having good thermal conductivity, but the present invention is not limited thereto.

The display panel 1061 is, for example, an LCD panel, including first and second transparent substrates facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, but the present invention is not limited thereto. The display panel 1061 displays information by light passing through the optical sheet 1051. Such a display device 1000 can be applied to various types of portable terminals, monitors of notebook computers, monitors of laptop computers, televisions, and the like.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light-transmitting sheet. The optical sheet 1051 may include at least one of a sheet such as a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The diffusion sheet diffuses incident light, and the horizontal and / or vertical prism sheet condenses incident light into a display area. The brightness enhancing sheet improves the brightness by reusing the lost light. A protective sheet may be disposed on the display panel 1061, but the present invention is not limited thereto.

Here, the optical path of the light emitting module 1031 may include the light guide plate 1041 and the optical sheet 1051 as an optical member, but the present invention is not limited thereto.

12 is a view showing another example of the display device according to the embodiment.

12, the display device 1100 includes a bottom cover 1152, a substrate 1020 on which the above-described light emitting device 100 is arrayed, an optical member 1154, and a display panel 1155.

The substrate 1020 and the light emitting device package 200 may be defined as a light emitting module 1060. The bottom cover 1152, the at least one light emitting module 1060, and the optical member 1154 may be defined as a light unit.

The bottom cover 1152 may include a receiving portion 1153, but the present invention is not limited thereto.

Here, the optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The light guide plate may be made of a PC material or a PMMA (poly methy methacrylate) material, and such a light guide plate may be removed. The diffusion sheet diffuses incident light, and the horizontal and vertical prism sheets condense incident light into a display area. The brightness enhancing sheet enhances brightness by reusing the lost light.

The optical member 1154 is disposed on the light emitting module 1060, and performs surface light source, diffusion, and light condensation of the light emitted from the light emitting module 1060.

13 to 15 are views showing a lighting apparatus according to an embodiment.

FIG. 13 is a perspective view of the illumination device according to the embodiment viewed from above, FIG. 14 is a perspective view of the illumination device shown in FIG. 13, and FIG. 15 is an exploded perspective view of the illumination device shown in FIG.

13 to 15, the lighting apparatus according to the embodiment includes a cover 2100, a light source module 2200, a heat discharger 2400, a power supply unit 2600, an inner case 2700, a socket 2800, . ≪ / RTI > Further, the illumination device according to the embodiment may further include at least one of the member 2300 and the holder 2500. The light source module 2200 may include a light emitting device or a light emitting device package according to the embodiment.

For example, the cover 2100 may have a shape of a bulb or a hemisphere, and may be provided in a shape in which the hollow is hollow and a part is opened. The cover 2100 may be optically coupled to the light source module 2200. For example, the cover 2100 may diffuse, scatter, or excite light provided from the light source module 2200. The cover 2100 may be a kind of optical member. The cover 2100 may be coupled to the heat discharging body 2400. The cover 2100 may have an engaging portion that engages with the heat discharging body 2400.

The inner surface of the cover 2100 may be coated with a milky white paint. Milky white paints may contain a diffusing agent to diffuse light. The surface roughness of the inner surface of the cover 2100 may be larger than the surface roughness of the outer surface of the cover 2100. This is for sufficiently diffusing and diffusing the light from the light source module 2200 and emitting it to the outside.

The cover 2100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance and strength. The cover 2100 may be transparent so that the light source module 2200 is visible from the outside, and may be opaque. The cover 2100 may be formed by blow molding.

The light source module 2200 may be disposed on one side of the heat discharging body 2400. Accordingly, heat from the light source module 2200 is conducted to the heat discharger 2400. The light source module 2200 may include a light source unit 2210, a connection plate 2230, and a connector 2250.

The member 2300 is disposed on the upper surface of the heat discharging body 2400 and has guide grooves 2310 through which the plurality of light source portions 2210 and the connector 2250 are inserted. The guide groove 2310 corresponds to the substrate of the light source unit 2210 and the connector 2250.

The surface of the member 2300 may be coated or coated with a light reflecting material. For example, the surface of the member 2300 may be coated or coated with a white paint. The member 2300 reflects the light reflected by the inner surface of the cover 2100 toward the cover 2100 in the direction toward the light source module 2200. Therefore, the light efficiency of the illumination device according to the embodiment can be improved.

The member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Therefore, electrical contact can be made between the heat discharging body 2400 and the connecting plate 2230. The member 2300 may be formed of an insulating material to prevent an electrical short circuit between the connection plate 2230 and the heat discharging body 2400. The heat discharger 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 to dissipate heat.

The holder 2500 blocks the receiving groove 2719 of the insulating portion 2710 of the inner case 2700. Therefore, the power supply unit 2600 housed in the insulating portion 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510. The guide protrusion 2510 has a hole 2511 through which the projection 2610 of the power supply unit 2600 passes.

The power supply unit 2600 processes or converts an electrical signal provided from the outside and provides the electrical signal to the light source module 2200. The power supply unit 2600 is housed in the receiving groove 2719 of the inner case 2700 and is sealed inside the inner case 2700 by the holder 2500.

The power supply unit 2600 may include a protrusion 2610, a guide 2630, a base 2650, and an extension 2670.

The guide portion 2630 has a shape protruding outward from one side of the base 2650. The guide portion 2630 may be inserted into the holder 2500. A plurality of components may be disposed on one side of the base 2650. The plurality of components include, for example, a DC converter for converting AC power supplied from an external power source into DC power, a driving chip for controlling driving of the light source module 2200, an ESD (ElectroStatic discharge) protective device, and the like, but the present invention is not limited thereto.

The extension portion 2670 has a shape protruding outward from the other side of the base 2650. The extension portion 2670 is inserted into the connection portion 2750 of the inner case 2700 and receives an external electrical signal. For example, the extension portion 2670 may be provided to be equal to or smaller than the width of the connection portion 2750 of the inner case 2700. One end of each of the positive wire and the negative wire is electrically connected to the extension portion 2670 and the other end of the positive wire and the negative wire are electrically connected to the socket 2800 .

The inner case 2700 may include a molding part together with the power supply part 2600. The molding part is a hardened portion of the molding liquid so that the power supply unit 2600 can be fixed inside the inner case 2700.

16 and 17 are views showing another example of the lighting apparatus according to the embodiment.

FIG. 16 is a perspective view of a lighting apparatus according to the embodiment, and FIG. 17 is an exploded perspective view of the lighting apparatus shown in FIG.

16 and 17, the illumination device according to the embodiment includes a cover 3100, a light source 3200, a heat sink 3300, a circuit portion 3400, an inner case 3500, and a socket 3600 . The light source unit 3200 may include a light emitting device or a light emitting device package according to the embodiment.

The cover 3100 has a bulb shape and is hollow. The cover 3100 has an opening 3110. The light source unit 3200 and the member 3350 can be inserted through the opening 3110. [

The cover 3100 may be coupled to the heat discharging body 3300 and surround the light source unit 3200 and the member 3350. The light source part 3200 and the member 3350 may be shielded from the outside by the combination of the cover 3100 and the heat discharging body 3300. The coupling between the cover 3100 and the heat discharging body 3300 may be combined through an adhesive, or may be combined by various methods such as a rotational coupling method and a hook coupling method. The rotation coupling method is a method in which the cover 3100 is coupled with the heat discharging body 3300 by the rotation of the cover 3100 in such a manner that the thread of the cover 3100 is engaged with the thread groove of the heat discharging body 3300 In the hook coupling method, the protrusion of the cover 3100 is inserted into the groove of the heat discharging body 3300, and the cover 3100 and the heat discharging body 3300 are coupled.

The cover 3100 is optically coupled to the light source unit 3200. Specifically, the cover 3100 may diffuse, scatter, or excite light from the light emitting device 3230 of the light source unit 3200. The cover 3100 may be a kind of optical member. Here, the cover 3100 may have a phosphor inside / outside or in the inside thereof to excite light from the light source part 3200.

The inner surface of the cover 3100 may be coated with a milky white paint. Here, the milky white paint may include a diffusing agent for diffusing light. The surface roughness of the inner surface of the cover 3100 may be larger than the surface roughness of the outer surface of the cover 3100. This is for sufficiently scattering and diffusing light from the light source part 3200.

The cover 3100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance and strength. The cover 3100 may be a transparent material that can be seen from the outside of the light source unit 3200 and the member 3350, and may be an invisible and opaque material. The cover 3100 may be formed, for example, by blow molding.

The light source unit 3200 is disposed on the member 3350 of the heat sink 3300 and may be disposed in a plurality of units. Specifically, the light source portion 3200 may be disposed on at least one of the plurality of side surfaces of the member 3350. The light source unit 3200 may be disposed at the upper end of the member 3350.

In FIG. 17, the light source portion 3200 may be disposed on three of six sides of the member 3350. However, the present invention is not limited thereto, and the light source portion 3200 may be disposed on all the sides of the member 3350. The light source unit 3200 may include a substrate 3210 and a light emitting device 3230. The light emitting device 3230 may be disposed on one side of the substrate 3210.

The substrate 3210 has a rectangular plate shape, but is not limited thereto and may have various shapes. For example, the substrate 3210 may have a circular or polygonal plate shape. The substrate 3210 may be a printed circuit pattern on an insulator. For example, the substrate 3210 may be a printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB . ≪ / RTI > In addition, a COB (Chips On Board) type that can directly bond an unpackaged LED chip on a printed circuit board can be used. In addition, the substrate 3210 may be formed of a material that efficiently reflects light, or may be formed of a color whose surface efficiently reflects light, for example, white, silver, or the like. The substrate 3210 may be electrically connected to the circuit unit 3400 housed in the heat discharging body 3300. The substrate 3210 and the circuit portion 3400 may be connected, for example, via a wire. The wire may pass through the heat discharging body 3300 to connect the substrate 3210 and the circuit unit 3400.

The light emitting device 3230 may be a light emitting diode chip that emits red, green, or blue light, or a light emitting diode chip that emits UV light. Here, the light emitting diode chip may be a lateral type or a vertical type, and the light emitting diode chip may emit blue, red, yellow, or green light. .

The light emitting device 3230 may have a phosphor. The phosphor may be at least one of a garnet system (YAG, TAG), a silicate system, a nitride system, and an oxynitride system. Alternatively, the fluorescent material may be at least one of a yellow fluorescent material, a green fluorescent material, and a red fluorescent material.

The heat discharging body 3300 may be coupled to the cover 3100 to dissipate heat from the light source unit 3200. The heat discharging body 3300 has a predetermined volume and includes an upper surface 3310 and a side surface 3330. A member 3350 may be disposed on the upper surface 3310 of the heat discharging body 3300. An upper surface 3310 of the heat discharging body 3300 can be engaged with the cover 3100. The upper surface 3310 of the heat discharging body 3300 may have a shape corresponding to the opening 3110 of the cover 3100.

A plurality of radiating fins 3370 may be disposed on the side surface 3330 of the heat discharging body 3300. The radiating fin 3370 may extend outward from the side surface 3330 of the heat discharging body 3300 or may be connected to the side surface 3330. The heat dissipation fin 3370 may increase the heat dissipation area of the heat dissipator 3300 to improve heat dissipation efficiency. Here, the side surface 3330 may not include the radiating fin 3370.

The member 3350 may be disposed on the upper surface 3310 of the heat discharging body 3300. The member 3350 may be integral with the top surface 3310 or may be coupled to the top surface 3310. The member 3350 may be a polygonal column. Specifically, the member 3350 may be a hexagonal column. The hexagonal column member 3350 has an upper surface, a lower surface, and six sides. Here, the member 3350 may be a circular column or an elliptic column as well as a polygonal column. When the member 3350 is a circular column or an elliptic column, the substrate 3210 of the light source portion 3200 may be a flexible substrate.

The light source unit 3200 may be disposed on six sides of the member 3350. The light source unit 3200 may be disposed on all six sides and the light source unit 3200 may be disposed on some of the six sides. In Fig. 15, the light source unit 3200 is disposed on three sides of six sides.

The substrate 3210 is disposed on a side surface of the member 3350. The side surface of the member 3350 may be substantially perpendicular to the upper surface 3310 of the heat discharging body 3300. Accordingly, the upper surface 310 of the substrate 3210 and the heat discharging body 3300 may be substantially perpendicular to each other.

The material of the member 3350 may be a material having thermal conductivity. This is to receive the heat generated from the light source 3200 quickly. The material of the member 3350 may be, for example, aluminum (Al), nickel (Ni), copper (Cu), magnesium (Mg), silver (Ag), tin (Sn) Or the member 3350 may be formed of a thermally conductive plastic having thermal conductivity. Thermally conductive plastics are advantageous in that they are lighter in weight than metals and have unidirectional thermal conductivity.

The circuit unit 3400 receives power from the outside and converts the supplied power to the light source unit 3200. The circuit unit 3400 supplies the converted power to the light source unit 3200. The circuit unit 3400 may be disposed on the heat discharging body 3300. Specifically, the circuit unit 3400 may be housed in the inner case 3500 and stored in the heat discharging body 3300 together with the inner case 3500. The circuit portion 3400 may include a circuit board 3410 and a plurality of components 3430 mounted on the circuit board 3410.

The circuit board 3410 has a circular plate shape, but is not limited thereto and may have various shapes. For example, the circuit board 3410 may be in the shape of an oval or polygonal plate. Such a circuit board 3410 may be one in which a circuit pattern is printed on an insulator. The circuit board 3410 is electrically connected to the substrate 3210 of the light source unit 3200. The electrical connection between the circuit board 3410 and the substrate 3210 may be connected by wire, for example. The wires may be disposed inside the heat discharging body 3300 to connect the circuit board 3410 and the substrate 3210. The plurality of components 3430 include, for example, a DC converter for converting AC power supplied from an external power source to DC power, a driving chip for controlling the driving of the light source 3200, An electrostatic discharge (ESD) protection device, and the like.

The inner case 3500 houses the circuit portion 3400 therein. The inner case 3500 may have a receiving portion 510 for receiving the circuit portion 3400. The receiving portion 3510 may have a cylindrical shape as an example. The shape of the accommodating portion 3510 may vary depending on the shape of the heat discharging body 3300. The inner case 3500 can be housed in the heat discharging body 3300. The receiving portion 3510 of the inner case 3500 may be received in a receiving portion formed on a lower surface of the heat discharging body 3300.

The inner case 3500 may be coupled to the socket 3600. The inner case 3500 may have a connection portion 3530 that engages with the socket 3600. The connection portion 3530 may have a threaded structure corresponding to the thread groove structure of the socket 3600. The inner case 3500 is nonconductive. Therefore, electrical short circuit between the circuit portion 3400 and the heat discharging body 3300 is prevented. For example, the inner case 3500 may be formed of plastic or resin.

The socket 600 may be coupled to the inner case 500. Specifically, the socket 3600 may be engaged with the connection portion 3530 of the inner case 3500. The socket 3600 may have the same structure as a conventional incandescent bulb. The circuit portion 3400 and the socket 3600 are electrically connected. The electrical connection between the circuit part 3400 and the socket 3600 may be connected via a wire. Accordingly, when external power is applied to the socket 3600, the external power may be transmitted to the circuit unit 3400. The socket 3600 may have a screw groove structure corresponding to the threaded structure of the connection portion 3550.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments can be combined and modified by other persons having ordinary skill in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

10: light emitting structure 11: first conductive type semiconductor layer
12: active layer 13: second conductivity type semiconductor layer
15: ohmic contact layer 17: reflective electrode
30: first metal layer 40: first insulating layer
42: second insulating layer 50: second metal layer
60: bonding layer 70: supporting member
80: contact portion 83: volume emitting layer
85: Ti oxide layer 87: Phosphor
93: Support part 95: Reflective layer

Claims (1)

A support member comprising a metal;
A bonding layer disposed on the support member;
A second metal layer disposed on the bonding layer;
A light emitting structure including a second conductive type semiconductor layer disposed on the second metal layer, an active layer disposed on the second conductive type semiconductor layer, and a first conductive type semiconductor layer disposed on the active layer;
A first metal layer electrically connected to the second conductive semiconductor layer;
The second conductivity type semiconductor layer, a first groove penetrating the active layer and penetrating a part of the first conductivity type semiconductor layer;
A second groove that is disposed apart from the first groove and penetrates the second conductivity type semiconductor layer, the active layer, and penetrates a part of the first conductivity type semiconductor layer;
A contact disposed in the first groove and electrically connected to the first conductive type semiconductor layer and the second metal layer;
A first insulating layer including a first portion disposed in the first groove and a second portion extending in a side surface of the light emitting structure in the first portion; And
And a second insulating layer disposed in the second groove.

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